ZETEX MLP832

Package information - MLP832
Surface mounted, 8 pin package
Package outline
DIM
A
A1
A2
A3
b
b1
D
Millimeters
Min.
Max.
0.80
1.00
0.00
0.05
0.65
0.75
0.15
0.25
0.24
0.34
0.17
0.30
3.00 BSC
Inches
Min.
Max.
0.0315 0.0394
0.00
0.002
0.0256 0.0295
0.006
0.0098
0.0095 0.0134
0.0068 0.0118
0.118 BSC
D2
D3
0.82
1.01
0.0323
0.0398
1.02
1.21
DIM
e
E
E2
L
L2
r
⍜
0.0402
0.0476
-
Millimeters
Min.
Max.
0.65 BSC
2.00 BSC
0.43
0.63
0.20
0.45
0.00
0.125
0.075 BSC
0°
12°
-
Inches
Min.
Max.
0.0256 BSC
0.0787 BSC
0.017
0.0248
0.0079 0.0177
0.00
0.005
0.0029 BSC
0°
12°
-
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
Soldering footprint
0.65
0.025
0.40
0.015
0.75
0.029
0.10
0.004
0.9
0.035
0.35
0.013
0.80
0.031
1.30
0.051
1.20
0.047
Issue 2 - October 2005
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Package information - MLP832
Nominal weight
Nominal weight per device 12.9mg.
Tape and reel information
Orientation
Tape width
(mm)
Reel size
(inches)
No. of
components
Tape option
indicator
8
7
3,000
TA
8
13
10,000
TC
Pin 1
Embossed carrier tape configuration
10 pitches culmulative
tolerance on tape
±0.2mm (±0.008”)
P0
K
D
P2
t
E
Top cover
tape
See Note 1
A0
F
See Note 1
B1
W
B0
K0
See Note 1
P
D1
Center lines
of cavity
Embossment
User direction of feed
Dimensions
mm (inches)
Tape size (mm)
8
A0, B0, K0
See note
12
*
See note
16
*
See note
24
*
See note*
B1 (max.)
4.55 (0.179)
8.20 (0.323)
12.10 (0.476)
20.10 (0.791)
D
1.50 + 0.10 - 0.00
1.50 + 0.10 - 0.00
1.50 + 0.10 - 0.00
1.50 + 0.10 - 0.00
D1 (max.)
1.00 (0.039)
1.50 (0.059)
1.50 (0.059)
1.50 (0.059)
E
1.75 ± 0.10
1.75 ± 0.10
1.75 ± 0.10
1.75 ± 0.10
F
3.50 ± 0.10
(0.138 ± 0.004)
5.50 ± 0.05
(0.217 ± 0.002)
7.50 ± 0.10
(0.295 ± 0.004)
11.50 ± 0.10
(0.453 ± 0.004)
P
4.00 ±0.10
(0.157 ± 0.004)
4.00 ±0.10
(0.157 ± 0.004)
8.00 ±0.10
(0.315 ± 0.004)
4.00 ± 0.10
(0.157 ± 0.004)
8.00 ±0.10
(0.315 ± 0.004)
12.00 ± 0.10
(0.472 ± 0.004)
4.00 ± 0.10
(0.157 ± 0.004)
to 20.00 ± 0.10
(0.787 ± 0.004)
in 4.00 (0.157)
increments
P0
4.00 ± 0.10
4.00 ± 0.10
4.00 ± 0.10
4.00 ± 0.10
P2
2.00 ± 0.05
2.00 ± 0.05
2.00 ± 0.05
2.00 ± 0.05
t (max.)
0.40
0.40
0.40
0.40
W
8.00 (0.315)
12.00 ± 0.30
(0.472 ± 0.012)
16.30 (0.642)
24.30 (0.957)
Issue 2 - October 2005
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Package information - MLP832
NOTES:
* A0, B0 and K0 dimensions are determined with respect to EIA/JEDEC rotational and lateral movement requirements
(see fig. 1).
20° maximum
0.5mm
maximum
0.5mm
maximum
Component
cavity
center line
B0
20° maximum
Component
center line
Component
lateral movement
Component rotation - side view
A0
Component rotation - top view
Figure 1 - rotational and lateral movement
Reel configuration
Tape slot in core
for tape start.
2.5mm min. width,
10mm min. depth
T
B
A
D
C
N
Full radius
G
Tape
size
8mm
12mm
16mm
24mm
A (max.)
179
(7.047)
330
(12.992)
330
(12.992)
330
(12.992)
B
(min.)
1.5
(0.06)
1.5
(0.06)
1.5
(0.06)
1.5
(0.06)
C
13.00 ±0.02
(0.512 ±0.008)
13.00 ±0.02
(0.512 ±0.008)
13.00 ±0.02
(0.512 ±0.008)
13.00 ±0.02
(0.512 ±0.008)
D
(min.)
25.0
(0.984)
20.2
(0.795)
20.2
(0.795)
20.2
(0.795)
N
(min.)
50
(1.969)
50
(1.969)
50
(1.969)
60
(2.362)
G
8.4 +1.5 –0.0
(0.33 +0.06 – 0.00)
12.4 +2.0 –0.0
(0.49 +0.079 – 0.00)
16.4 +2.0 –0.0
(0.65 +0.079 – 0.00)
24.4 +2.0 –0.0
(0.96 +0.079 –0.00)
T
(max.)
14.4
(0.567)
18.4
(0.724)
22.4
(0.882)
30.4
(1.197)
This publication is issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or
reproduced for any purpose or form part of any order or contact or be regarded as a representation relating to the products or services concerned.
The company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.
Issue 2 - October 2005
© Zetex Semiconductors plc 2005
3
www.zetex.com