BVDSS = 900 V RDS(on) typ ȍ HFA10N90Z ID = 10 A 900V N-Channel MOSFET TO-247 FEATURES Originative New Design Superior Avalanche Rugged Technology Robust Gate Oxide Technology 1 2 3 1.Gate 2. Drain 3. Source Very Low Intrinsic Capacitances Excellent Switching Characteristics Unrivalled Gate Charge : 72 nC (Typ.) Extended Safe Operating Area Lower RDS(ON) ȍ7\S#9GS=10V Built-in ESD Diode 100% Avalanche Tested Absolute Maximum Ratings Symbol VDSS TC=25 unless otherwise specified Parameter Drain-Source Voltage Value Units 900 V Drain Current – Continuous (TC = 25) 10 A Drain Current – Continuous (TC = 100) 6.3 A IDM Drain Current – Pulsed 40 A VGS Gate-Source Voltage ρ30 V EAS Single Pulsed Avalanche Energy (Note 2) 900 mJ IAR Avalanche Current (Note 1) 10 A EAR Repetitive Avalanche Energy (Note 1) 11.5 mJ dv/dt Peak Diode Recovery dv/dt (Note 3) 4.0 V/ns PD Power Dissipation (TC = 25) - Derate above 25 115 W TJ, TSTG Operating and Storage Temperature Range TL Maximum lead temperature for soldering purposes, 1/8” from case for 5 seconds ID (Note 1) 0.92 W/ -55 to +150 300 Thermal Resistance Characteristics Symbol Parameter Typ. Max. RșJC Junction-to-Case -- 1.08 RșJA Junction-to-Ambient -- 40 Units /W క͑΄Ͷ;ͺΈ͑Ͷ·͟Ͳ͡͝ͻΒΟ͑ͣͦ͑͢͡ HFA10N90Z Jan 2015 Symbol Parameter unless otherwise specified Test Conditions Min Typ Max Units 2.5 -- 4.5 V -- 1.0 1.3 900 -- -- V ID = 250 Ꮃ, Referenced to25 -- 0.99 -- V/ VDS = 900 V, VGS = 0 V -- -- 10 Ꮃ VDS = 720 V, TC = 125 -- -- 100 Ꮃ On Characteristics VGS RDS(ON) Gate Threshold Voltage VDS = VGS, ID = 250 Ꮃ Static Drain-Source On-Resistance VGS = 10 V, ID = 5 A Off Characteristics BVDSS Drain-Source Breakdown Voltage ǻBVDSS Breakdown Voltage Temperature /ǻTJ Coefficient IDSS Zero Gate Voltage Drain Current VGS = 0 V, ID = 250 Ꮃ IGSSF Gate-Body Leakage Current, Forward VGS = 30 V, VDS = 0 V -- -- 10 Ꮃ IGSSR Gate-Body Leakage Current, Reverse VGS = -30 V, VDS = 0 V -- -- -10 Ꮃ -- 2700 3510 Ꮔ -- 200 260 Ꮔ -- 15 20 Ꮔ -- 75 160 Ꭸ -- 85 180 Ꭸ -- 210 430 Ꭸ -- 85 180 Ꭸ -- 72 94 nC -- 16 -- nC -- 32 -- nC Dynamic Characteristics Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance VDS = 25 V, VGS = 0 V, f = 1.0 MHz Switching Characteristics td(on) Turn-On Time tr Turn-On Rise Time td(off) Turn-Off Delay Time tf Turn-Off Fall Time Qg Total Gate Charge Qgs Gate-Source Charge Qgd VDS = 450 V, ID = 10 A, RG = 25 (Note 4,5) VDS = 720V, ID = 10 A, VGS = 10 V (Note 4,5) Gate-Drain Charge Source-Drain Diode Maximum Ratings and Characteristics IS Continuous Source-Drain Diode Forward Current -- -- 10 ISM Pulsed Source-Drain Diode Forward Current -- -- 40 VSD Source-Drain Diode Forward Voltage IS = 10 A, VGS = 0 V -- -- 1.4 V trr Reverse Recovery Time -- 700 -- Ꭸ Qrr Reverse Recovery Charge IS = 10 A, VGS = 0 V diF/dt = 100 A/ȝV (Note 4) -- 8.2 -- ȝ& A Notes ; 1. Repetitive Rating : Pulse width limited by maximum junction temperature 2. L=28mH, IAS=10A, VDD=50V, RG=25:, Starting TJ =25qC 3. ISD$GLGW$ȝV9DD%9DSS , Starting TJ =25 qC 4. Pulse Test : Pulse Width ȝV'XW\&\FOH 5. Essentially Independent of Operating Temperature క͑΄Ͷ;ͺΈ͑Ͷ·͟Ͳ͡͝ͻΒΟ͑ͣͦ͑͢͡ HFA10N90Z Electrical Characteristics TC=25 qC HFA10N90Z Typical Characteristics VGS 15.0 V 10.0 V 8.0 V 7.0 V 6.5 V 6.0 V 5.5 V Bottom : 5.0 V 101 101 100 ID, Drain Current [A] ID, Drain Current [A] Top : * Notes : 1. 250us Pulse Test 2. TC = 25oC 100 150oC 100 10-1 101 -55oC 25oC * Notes : 1. VDS = 50V 2. 250us Pulse Test 2 4 6 8 10 VGS, Gate-Source Voltage [V] VDS, Drain-Source Voltage [V] Figure 1. On Region Characteristics Figure 2. Transfer Characteristics IDR, Reverse Drain Current [A] RDS(ON)>ȍ @ Drain-Source On-Resistance 3.0 2.5 VGS = 10V 2.0 VGS = 20V 1.5 1.0 101 100 25oC 150oC * Notes : 1. VGS = 0V 2. 250us Pulse Test * Note : TJ = 25oC 10-1 0.2 0.5 0 5 10 15 20 25 30 0.4 0.6 ID, Drain Current [A] Capacitance [pF] Ciss 3000 2000 Coss 1000 Crss 1.2 1.4 * Notes : 1. VGS = 0 V 2. f = 1 MHz 12 VDS = 180V VGS, Gate-Source Voltage [V] Ciss = Cgs + Cgd (Cds = shorted) Coss = Cds + Cgd Crss = Cgd 4000 1.0 Figure 4. Body Diode Forward Voltage Variation with Source Current and Temperature Figure 3. On Resistance Variation vs Drain Current and Gate Voltage 5000 0.8 VSD, Source-Drain voltage [V] 10 VDS = 450V VDS = 720V 8 6 4 2 * Note : ID = 10A 0 10-1 100 101 0 0 10 20 30 40 50 60 70 VDS, Drain-Source Voltage [V] QG, Total Gate Charge [nC] Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics 80 క͑΄Ͷ;ͺΈ͑Ͷ·͟Ͳ͡͝ͻΒΟ͑ͣͦ͑͢͡ (continued) 1.2 3.0 RDS(ON), (Normalized) Drain-Source On-Resistance BVDSS, (Normalized) Drain-Source Breakdown Voltage HFA10N90Z Typical Characteristics 1.1 1.0 * Notes : 1. VGS = 0 V 2. ID = 250 uA 0.9 0.8 -100 -50 0 50 100 150 2.5 2.0 1.5 1.0 * Notes : 1. VGS = 10 V 2. ID = 5 A 0.5 0.0 -100 200 -50 0 50 100 150 200 TJ, Junction Temperature [oC] o TJ, Junction Temperature [ C] Figure 8. On-Resistance Variation vs Temperature Figure 7. Breakdown Voltage Variation vs Temperature 10 Operation in This Area is Limited by R DS(on) 10 Ps 8 10 ID, Drain Current [A] 100 Ps 1 1 ms 10 ms 0 10 DC 10-1 * Notes : 1. TC = 25 oC 6 4 2 2. TJ = 150 oC 3. Single Pulse 10-2 100 101 102 0 25 103 50 75 VDS, Drain-Source Voltage [V] 100 125 150 TC, Case Temperature [oC] Figure 9. Maximum Safe Operating Area Figure 10. Maximum Drain Current vs Case Temperature 100 ZTJC(t), Thermal Response ID, Drain Current [A] 102 D=0.5 * Notes : 1. ZTJC(t) = 1.08 oC/W Max. 2. Duty Factor, D=t1/t2 3. TJM - TC = PDM * ZTJC(t) 0.2 10-1 0.1 0.05 PDM 0.02 0.01 10-2 10-5 single pulse 10-4 10-3 t1 10-2 10-1 t2 100 101 t1, Square Wave Pulse Duration [sec] Figure 11. Transient Thermal Response Curve క͑΄Ͷ;ͺΈ͑Ͷ·͟Ͳ͡͝ͻΒΟ͑ͣͦ͑͢͡ HFA10N90Z Fig 12. Gate Charge Test Circuit & Waveform .ȍ 12V VGS Same Type as DUT Qg 200nF 10V 300nF VDS VGS Qgs Qgd DUT 3mA Charge Fig 13. Resistive Switching Test Circuit & Waveforms RL VDS VDS 90% VDD RG ( 0.5 rated VDS ) Vin DUT 10V 10% tr td(on) td(off) t on tf t off Fig 14. Unclamped Inductive Switching Test Circuit & Waveforms BVDSS 1 EAS = ---- LL IAS2 -------------------2 BVDSS -- VDD L VDS VDD ID BVDSS IAS RG 10V ID (t) DUT VDS (t) VDD tp Time క͑΄Ͷ;ͺΈ͑Ͷ·͟Ͳ͡͝ͻΒΟ͑ͣͦ͑͢͡ HFA10N90Z Fig 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms DUT + VDS _ IS L Driver RG VGS VGS ( Driver ) Same Type as DUT VDD • dv/dt controlled by RG • IS controlled by pulse period Gate Pulse Width D = -------------------------Gate Pulse Period 10V IFM , Body Diode Forward Current IS ( DUT ) di/dt IRM Body Diode Reverse Current VDS ( DUT ) Body Diode Recovery dv/dt Vf VDD Body Diode Forward Voltage Drop క͑΄Ͷ;ͺΈ͑Ͷ·͟Ͳ͡͝ͻΒΟ͑ͣͦ͑͢͡ HFA10N90Z Package Dimension {vTY[^G క͑΄Ͷ;ͺΈ͑Ͷ·͟Ͳ͡͝ͻΒΟ͑ͣͦ͑͢͡