High Speed Characterization Report ZA1-XX-2-1.00-X-XX Description: Ultra Low Profile Micro Array, 1.0mm x 1.0mm Pitch, 1mm Stack Height Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Table of Contents Connector Overview ........................................................................................................ 1 Connector System Speed Rating .................................................................................... 1 Frequency Domain Data Summary ................................................................................. 2 Table 1 - Single-Ended 1:1 S/G Pattern Performance ................................................. 2 Table 2 - Single-Ended 2:1 S/G Pattern Performance ................................................. 3 Table 3 - Differential Optimal Horizontal Performance ................................................. 4 Table 4 - Differential Optimal Vertical Performance ..................................................... 5 Table 5 - Differential High Density Vertical Performance ............................................. 6 Bandwidth Charts – Single-Ended & Differential Insertion Loss .................................. 7 Time Domain Data Summary .......................................................................................... 8 Table 6 – Single-End Impedance () – 1:1 S/G Pattern .............................................. 8 Table 7 – Single-End Impedance () – 2:1 S/G Pattern .............................................. 8 Table 8 – Differential Impedance () – Optimal Horizontal .......................................... 9 Table 9 – Differential Impedance () – Optimal Vertical .............................................. 9 Table 10 – Differential Impedance () – High Density Vertical .................................. 10 Table 11 - Single-Ended Crosstalk (%) – 1:1 S/G Pattern ........... Error! Bookmark not defined. Table 12 - Single-Ended Crosstalk (%) – 2:1 S/G Pattern .......... Error! Bookmark not defined. Table 13 - Differential Crosstalk (%) – Optimal Horizontal .......... Error! Bookmark not defined. Table 14 - Differential Crosstalk (%) – Optimal Vertical Error! Bookmark not defined. Table 15 - Differential Crosstalk (%) – High Density Vertical ...... Error! Bookmark not defined. Table 16 - Propagation Delay (Mated Connector) ...................................................... 16 Characterization Details ................................................................................................ 17 Differential and Single-Ended Data............................................................................ 17 Connector Signal to Ground Ratio ............................................................................. 17 Frequency Domain Data ............................................................................................ 20 Time Domain Data ..................................................................................................... 20 Appendix A – Frequency Domain Response Graphs .................................................... 22 Single-Ended Application – Insertion Loss ................................................................ 22 Single-Ended Application – Return Loss ................................................................... 22 Single-Ended 1:1 S/G Pattern Application – NEXT.................................................... 23 Single-Ended 1:1 S/G Pattern Application – FEXT .................................................... 23 Single-Ended 2:1 S/G Pattern Application – NEXT.................................................... 24 Single-Ended 2:1 S/G Pattern Application – FEXT .................................................... 24 Differential Application – Insertion Loss ..................................................................... 25 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:ii Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Differential Application – Return Loss ........................................................................ 25 Differential Optimal Horizontal Application – NEXT ................................................... 26 Differential Optimal Horizontal Application – FEXT.................................................... 26 Differential Optimal Vertical Application – NEXT ....................................................... 27 Differential Optimal Vertical Application – FEXT ........................................................ 27 Differential High Density Vertical Application – NEXT ............................................... 28 Differential High Density Vertical Application – FEXT ................................................ 28 Appendix B – Time Domain Response Graphs ............................................................. 29 Single-Ended Application – Input Pulse ..................................................................... 29 Single-Ended 1:1 S/G Pattern Application – Impedance ........................................... 29 Single-Ended 1:1 S/G Pattern Application – Propagation Delay ................................ 30 Single-Ended 2:1 S/G Pattern Application – Impedance ........................................... 30 Single-Ended 2:1 S/G Pattern Application – Propagation Delay ................................ 31 Single-Ended 1:1 S/G Pattern Application – NEXT, AG15_AG17 ............................. 31 Single-Ended 1:1 S/G Pattern Application – FEXT, AG15_BG17 .............................. 32 Single-Ended 1:1 S/G Pattern Application – NEXT, AG15_AE15 .............................. 32 Single-Ended 1:1 S/G Pattern Application – FEXT, AG15_BE15 .............................. 33 Single-Ended 1:1 S/G Pattern Application – NEXT, AG15_AF14 .............................. 33 Single-Ended 1:1 S/G Pattern Application – FEXT, AG15_BF14 .............................. 34 Single-Ended 2:1 S/G Pattern Application – NEXT, AE16_AE15 .............................. 34 Single-Ended 2:1 S/G Pattern Application – FEXT, AE16_BE15 .............................. 35 Single-Ended 2:1 S/G Pattern Application – NEXT, AE16_AF16 .............................. 35 Single-Ended 2:1 S/G Pattern Application – FEXT, AE16_BF16 ............................... 36 Single-Ended 2:1 S/G Pattern Application – NEXT, AE16_AF17 .............................. 36 Single-Ended 2:1 S/G Pattern Application – FEXT, AE16_BF17 ............................... 37 Differential Application – Input Pulse ......................................................................... 37 Differential Optimal Horizontal Application – Impedance ........................................... 38 Differential Optimal Horizontal Application – Propagation Delay ............................... 38 Differential Optimal Vertical Application – Impedance ............................................... 39 Differential Optimal Vertical Application – Propagation Delay ................................... 39 Differential High Density Vertical Application – Impedance ....................................... 40 Differential High Density Vertical Application – Propagation Delay............................ 40 Diff Optimal Horizontal Application – NEXT, AE9,AE10_AE13,AE14 ........................ 41 Diff Optimal Horizontal Application – FEXT, AE9,AE10_BE13,BE14 ........................ 41 Diff Optimal Horizontal Application – NEXT, AE9,AE10_AG9,AG10 ......................... 42 Diff Optimal Horizontal Application – FEXT, AE9,AE10_BG9,BG10.......................... 42 Diff Optimal Horizontal Application – NEXT, AE9,AE10_AD11,AD12........................ 43 Diff Optimal Horizontal Application – FEXT, AE9,AE10_BD11,BD12 ........................ 43 Diff Optimal Vertical Application – NEXT, AC14,AD14_AC12,AD12 ......................... 44 Diff Optimal Vertical Application – FEXT, AC14,AD14_BC12,BD12 .......................... 44 Diff Optimal Vertical Application – NEXT, AC14,AD14_AG14,AH14 ......................... 45 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:iii Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Diff Optimal Vertical Application – FEXT, AC14,AD14_BG14,BH14 ......................... 45 Diff Optimal Vertical Application – NEXT, AC14,AD14_AE15,AF15 .......................... 46 Diff Optimal Vertical Application – FEXT, AC14,AD14_BE15,BF15 .......................... 46 Diff High Density Vertical Application – NEXT, AD16,AE16_AD18,AE18 .................. 47 Diff High Density Vertical Application – FEXT, AD16,AE16_BD18,BE18 .................. 47 Diff High Density Vertical Application – NEXT, AD16,AE16_AG16,AH16 ................. 48 Diff High Density Vertical Application – FEXT, AD16,AE16_BG16,BH16 .................. 48 Diff High Density Vertical Application – NEXT, AD16,AE16_AE15,AF15 .................. 49 Diff High Density Vertical Application – FEXT, AD16,AE16_BE15,BF15................... 49 Appendix C – Product and Test System Descriptions ................................................... 50 Product Description ................................................................................................... 50 Test System Description ............................................................................................ 50 PCB-106499-SIG-XX Test Fixtures ........................................................................... 50 PCB-106499-SIG-XX PCB Layout Panel................................................................... 51 PCB Fixtures ............................................................................................................. 52 Calibration Board ....................................................................................................... 54 Appendix D – Test and Measurement Setup................................................................. 56 N5230C Measurement Setup .................................................................................... 56 Test Instruments ........................................................................................................ 56 Test Cables & Adapters ............................................................................................. 56 DSA8200 Measurement Setup .................................................................................. 57 Test Instruments ........................................................................................................ 57 Test Cables & Adapters ............................................................................................. 57 Appendix E - Frequency and Time Domain Measurements .......................................... 58 Frequency (S-Parameter) Domain Procedures ......................................................... 58 Time Domain Procedures .......................................................................................... 58 Propagation Delay (TDT) ....................................................................................... 58 Near-End Crosstalk (TDT) & Far End Crosstalk (TDT) .......................................... 58 Impedance (TDR)................................................................................................... 59 Appendix F – Glossary of Terms ................................................................................... 60 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:iv Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Connector Overview ZA1 is an ultra-low profile, 1.0mm x 1.0mm (.0394" x .0394") pitch interconnect system for elevated high-speed board-to-board applications. The ZA1 is ideal for board stacking, module-to-board and LGA interfaces and up to 400 I/Os. This report reflects the highspeed electrical characteristics specific to a mated 1mm stack height ZA1 test system. Connector System Speed Rating ZA1 Series, 1.0mm x 1.0mm pitch interconnect, 1mm Stack Height. Signaling Speed Rating Single-Ended: 1:1 S/G 9 GHz/ 18Gbps Single-Ended: 2:1 S/G 15.5 GHz/ 31Gbps Differential: Optimal Horizontal 20 GHz/ 40Gbps Differential: Optimal Vertical 20 GHz/ 40Gbps Differential: High Density Vertical 20 GHz/ 40Gbps The Speed Rating is based on the -3 dB insertion loss point of the connector system. The -3 dB point can be used to estimate usable system bandwidth in a typical, two-level signaling environment. To calculate the Speed Rating, the measured -3 dB point is rounded up to the nearest half-GHz level. The up-rounding corrects for a portion of the test board’s trace loss, since a short length of trace loss is included in the loss data in this report. The resulting loss value is then doubled to determine the approximate maximum data rate in Gigabits per second (Gbps). For example, a connector with a -3 dB point of 7.8 GHz would have a Speed Rating of 8 GHz/ 16 Gbps. A connector with a -3 dB point of 7.2 GHz would have a Speed Rating of 7.5 GHz/15 Gbps. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:1 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Frequency Domain Data Summary Table 1 - Single-Ended 1:1 S/G Pattern Performance Test Parameter Driver Receiver Insertion Loss AG15 BG15 <-3dB to 8.51 GHz Return Loss AG15 AG15 >10dB to 7.08 GHz AG15 AG17 <-20dB to 20 GHz AG15 AE15 <-20dB to 20 GHz AG15 AF14 <-20dB to 5.56 GHz AG15 BG17 <-20dB to 20 GHz AG15 BE15 <-20dB to 20 GHz AG15 BF14 <-20dB to 8.7 GHz Near-End Crosstalk Far-End Crosstalk Single-Ended 1:1 S/G Pattern Pin Map G17 G15 F14 E15 Insertion Loss & Return Loss Crosstalk Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:2 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Table 2 - Single-Ended 2:1 S/G Pattern Performance Test Parameter Driver Receiver Insertion Loss AE16 BE16 -3dB @ 15.04 GHz Return Loss AE16 AE16 >10dB to 7.15 GHz AE16 AE15 <-20dB to 8.83 GHz AE16 AF16 <-20dB to 7.69 GHz AE16 AF17 <-20dB to 9.66 GHz AE16 BE15 <-20dB to 20 GHz AE16 BF16 <-20dB to 20 GHz AE16 BF17 <-20dB to 20 GHz Near-End Crosstalk Far-End Crosstalk Single-Ended 2:1 S/G Pattern Pin Map F16 F17 E15 E16 Insertion Loss & Return Loss Crosstalk Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:3 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Table 3 - Differential Optimal Horizontal Performance Test Parameter Driver Receiver Insertion Loss AE9,AE10 BE9,BE10 -3dB @ 20 GHz Return Loss AE9,AE10 AE9,AE10 >10dB to 2.63 GHz AE9,AE10 AE13,AE14 <-20dB to 20 GHz AE9,AE10 AG9,AG10 <-20dB to 20 GHz AE9,AE10 AD11,AD12 <-20dB to 20 GHz AE9,AE10 BE13,BE14 <-20dB to 20 GHz AE9,AE10 BG9,BG10 <-20dB to 20 GHz AE9,AE10 BD11,BD12 <-20dB to 20 GHz Near-End Crosstalk Far-End Crosstalk Differential Optimal Horizontal Pin Map G9 G10 E14 E10 E9 D11 D12 E13 Insertion Loss & Return Loss Crosstalk Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:4 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Table 4 - Differential Optimal Vertical Performance Test Parameter Driver Receiver Insertion Loss AC14,AD14 BC14,BD14 -3dB @ 20 GHz Return Loss AC14,AD14 AC14,AD14 >10dB to 3.19 GHz AC14,AD14 AC12,AD12 <-20dB to 20 GHz AC14,AD14 AG14,AH14 <-20dB to 20 GHz AC14,AD14 AE15,AF15 <-20dB to 20 GHz AC14,AD14 BC12,BD12 <-20dB to 20 GHz AC14,AD14 BG14,BH14 <-20dB to 20 GHz AC14,AD14 BE15,BF15 <-20dB to 20 GHz Near-End Crosstalk Far-End Crosstalk Differential Optimal Vertical Pin Map G14 H14 F15 D12 C12 C14 D14 E15 Insertion Loss & Return Loss Crosstalk Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:5 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Table 5 - Differential High Density Vertical Performance Test Parameter Driver Receiver Insertion Loss AD16,AE16 BD16,BE16 -3dB @ 20 GHz Return Loss AD16,AE16 AD16,AE16 >10dB to 2.89 GHz AD16,AE16 AD18,AE18 <-20dB to 20 GHz AD16,AE16 AG16,AH16 <-20dB to 20 GHz AD16,AE16 AE15,AF15 <-20dB to 20 GHz AD16,AE16 BD18,BE18 <-20dB to 20 GHz AD16,AE16 BG16,BH16 <-20dB to 20 GHz AD16,AE16 BE15,BF15 <-20dB to 20 GHz Near-End Crosstalk Far-End Crosstalk Differential High Density Vertical Pin Map F15 G16 H16 E18 E15 D16 E16 D18 Insertion Loss & Return Loss Crosstalk Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:6 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Bandwidth Charts – Single-Ended & Differential Insertion Loss ZA1 Array Series Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:7 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Time Domain Data Summary Table 6 – Single-End Impedance () – 1:1 S/G Pattern Signal Risetime 30 ps 50 ps 100 ps 250 ps 500 ps Maximum Impedance 50.51 50.36 50.06 49.56 49.36 Minimum Impedance 41.75 43.29 45.85 48.13 48.77 Table 7 – Single-End Impedance () – 2:1 S/G Pattern Signal Risetime 30 ps 50 ps 100 ps 250 ps 500 ps Maximum Impedance 49.94 49.98 49.85 49.63 49.46 Minimum Impedance 41.18 42.51 44.94 47.32 48.26 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:8 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Table 8 – Differential Impedance () – Optimal Horizontal Signal Risetime 30 ps 50 ps 100 ps 250 ps 500 ps Maximum Impedance 100.81 100.73 100.50 100.22 99.33 Minimum Impedance 68.18 71.31 78.77 89.13 93.97 Table 9 – Differential Impedance () – Optimal Vertical Signal Risetime 30 ps 50 ps 100 ps 250 ps 500 ps Maximum Impedance 100.14 99.79 99.55 99.24 98.74 Minimum Impedance 69.21 72.20 79.00 88.13 92.51 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:9 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Table 10 – Differential Impedance () – High Density Vertical Signal Risetime 30 ps 50 ps 100 ps 250 ps 500 ps Maximum Impedance 100.33 100.32 100.20 100.04 99.58 Minimum Impedance 68.55 71.54 78.78 88.73 93.42 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:10 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Table 11 - Single-Ended Crosstalk (%) – 1:1 S/G Pattern Input(tr) Driver Receiver 30 ps 50 ps 100 ps AG15 AG17 1.25 1.06 0.84 AG15 AE15 0.91 0.75 0.50 AG15 AF14 6.75 5.67 4.08 AG15 BG17 1.88 1.61 1.19 AG15 BE15 1.19 0.98 0.63 AG15 BF14 3.52 2.49 1.33 NEXT FEXT Single-Ended 1:1 S/G Pattern Crosstalk Pin Map G17 G15 F14 E15 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:11 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Table 12 - Single-Ended Crosstalk (%) – 2:1 S/G Pattern Input(tr) NEXT FEXT Driver Receiver 30 ps 50 ps 100 ps AE16 AE15 5.67 4.58 2.73 AE16 AF16 5.81 4.72 2.81 AE16 AF17 5.05 4.08 2.49 AE16 BE15 1.48 1.02 0.53 AE16 BF16 1.87 1.27 0.68 AE16 BF17 2.04 1.44 0.77 Single-Ended 2:1 S/G Pattern Crosstalk Pin Map F16 F17 E15 E16 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:12 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Table 13 - Differential Crosstalk (%) – Optimal Horizontal Input(tr) NEXT FEXT Driver Receiver 30 ps 50 ps 100 ps AE9,AE10 AE13,AE14 <0.1 <0.1 <0.1 AE9,AE10 AG9,AG10 0.43 0.31 0.15 AE9,AE10 AD11,AD12 0.13 <0.1 <0.1 AE9,AE10 BE13,BE14 <0.1 <0.1 <0.1 AE9,AE10 BG9,BG10 0.73 0.53 0.26 AE9,AE10 BD11,BD12 0.29 0.18 0.10 Differential Optimal Horizontal Crosstalk Pin Map G9 G10 E14 E10 E9 D11 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 D12 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:13 E13 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Table 14 - Differential Crosstalk (%) – Optimal Vertical Input(tr) NEXT FEXT Driver Receiver 30 ps 50 ps 100 ps AC14,AD14 AC12,AD12 0.63 0.41 0.21 AC14,AD14 AG14,AH14 <0.1 <0.1 <0.1 AC14,AD14 AE15,AF15 1.74 1.46 0.94 AC14,AD14 BC12,BD12 0.20 0.16 <0.1 AC14,AD14 BG14,BH14 <0.1 <0.1 <0.1 AC14,AD14 BE15,BF15 1.09 0.92 0.64 Differential Optimal Vertical Crosstalk Pin Map G14 H14 F15 D12 C12 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 C14 D14 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:14 E15 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Table 15 - Differential Crosstalk (%) – High Density Vertical Input(tr) NEXT FEXT Driver Receiver 30 ps 50 ps 100 ps AD16,AE16 AD18,AE18 0.53 0.33 0.15 AD16,AE16 AG16,AH16 0.17 0.11 <0.1 AD16,AE16 AE15,AF15 1.12 0.80 0.37 AD16,AE16 BD18,BE18 0.55 0.42 0.21 AD16,AE16 BG16,BH16 <0.1 <0.1 <0.1 AD16,AE16 BE15,BF15 1.59 1.17 0.64 Differential High Density Vertical Crosstalk Pin Map F15 G16 H16 E18 E15 D16 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 E16 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:15 D18 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Table 16 - Propagation Delay (Mated Connector) Single-Ended: 1:1 S/G 53 ps Single-Ended: 2:1 S/G 51 ps Differential: Optimal Horizontal 45 ps Differential: Optimal Vertical 45 ps Differential: High Density Vertical 44 ps Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:16 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Characterization Details This report presents data that characterizes the signal integrity response of a connector pair in a controlled printed circuit board (PCB) environment. All efforts are made to reveal typical best-case responses inherent to the system under test (SUT). In this report, the SUT includes the connector pair and footprint effects on a typical multi-layer PCB. PCB effects (trace loss) are de-embedded from test data. Board related effects, such as pad-to-ground capacitance, are included in the data presented in this report. Additionally, intermediate test signal connections can mask the connector’s true performance. Such connection effects are minimized by using high performance test cables and adapters. Where appropriate, calibration and de-embedding routines are also used to reduce residual effects. Differential and Single-Ended Data Most Samtec connectors can be used successfully in both differential and single-ended applications. However, electrical performance will differ depending on the signal drive type. In this report, data is presented for both differential and single-ended drive scenarios. Connector Signal to Ground Ratio Samtec connectors are often designed for generic applications and can be implemented using various signal and ground pin assignments. In high speed systems, provisions must be made in the interconnect for signal return currents. Such paths are often referred to as “ground”. In some connectors, a ground plane or blade, or an outer shield, is used as the signal return, while in others, connector pins are used as signal returns. Various combinations of signal pins, ground blades, and shields can also be utilized. Electrical performance can vary significantly depending upon the number and location of ground pins. In general, the more pins dedicated to ground, the better electrical performance will be. However dedicating pins to ground reduces signal density of a connector. Therefore, care must be taken when choosing signal/ground ratios in cost or density-sensitive applications. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:17 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height For this connector, the following array configurations are evaluated: Open pin field Signal pin field Grounded pin field G T 50 ohm termination field Single-Ended Impedance (denoted by green circles): 1:1 S/G ratio 2:1 S/G ratio Single-Ended Crosstalk (denoted by red circles): 1:1 S/G ratio 2:1 S/G ratio Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:18 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Differential Impedance (denoted by green circles): Optimal Horizontal Optimal Vertical High Density Vertical Differential Crosstalk (denoted by red circles): Optimal Horizontal Optimal Vertical High Density Vertical Only one single-ended signal or differential pair was driven for crosstalk measurements. Other configurations can be evaluated upon request. Please contact [email protected] for more information. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:19 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height In a real system environment, active signals might be located at the outer edges of the signal contacts of concern, as opposed to the ground signals utilized in laboratory testing. For example, in a single-ended system, a pin-out of “SSSS”, or four adjacent single ended signals might be encountered as opposed to the “GSG” and “GSSG” configurations tested in the laboratory. Electrical characteristics in such applications could vary slightly from laboratory results. However, in most applications, performance can safely be considered equivalent. Signal Edge Speed (Rise Time): In pulse signaling applications, the perceived performance of the interconnect can vary significantly depending on the edge rate or rise time of the exciting signal. For this report, the fastest rise time used was 30 ps. Generally, this should demonstrate the worstcase performance. In many systems, the signal edge rate will be significantly slower at the connector than at the driver launch point. To estimate interconnect performance at other edge rates, data is provided for several rise times between 30ps and 100ps for cross talk measurements and between 30ps and 500ps for impedance measurements. For this report, measured rise times were at 10%-90% signal levels. Frequency Domain Data Frequency Domain parameters are helpful in evaluating the connector system’s signal loss and crosstalk characteristics across a range of sinusoidal frequencies. In this report, parameters presented in the Frequency Domain are Insertion Loss, Return Loss, and Near-End and Far-End Crosstalk. Other parameters or formats, such as VSWR or S-Parameters, may be available upon request. Please contact our Signal Integrity Group at [email protected] for more information. Frequency performance characteristics for the SUT are generated directly from network analyzer measurements. Time Domain Data Time Domain parameters indicate impedance mismatch versus length, signal propagation time and crosstalk in a pulsed signal environment. Impedance mismatch versus length is measured by DSA8200 Digital Serial Analyzer. Board related effects, such as pad-to-ground capacitance and trace loss, are included in the data presented in this report. The impedance data is provided in Appendix E of this report. The measured S-Parameters from the network analyzer are post-processed using Agilent Advanced Design System to obtain the time domain response for signal propagaSamtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:20 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height tion time and crosstalk. The Time Domain procedure is provided in Appendix E of this report. Parameters or formats not included in this report may be available upon request. Please contact our Signal Integrity Group at [email protected] for more information. In this report, propagation delay is defined as the signal propagation time through the connector and connector footprint. It includes 21 mils PCB trace on each side of the test board. Delay is measured at 100 picoseconds signal rise-time. Delay is calculated as the difference in time measured between the 50% amplitude levels of the input and output pulses. Crosstalk or coupled noise data is provided for various signal configurations. All measurements are single disturber. Crosstalk is calculated as a ratio of the input line voltage to the coupled line voltage. The input line is sometimes described as the active or drive line. The coupled line is sometimes described as the quiet or victim line. Crosstalk ratio is tabulated in this report as a percentage. Measurements are made at both the nearend and far-end of the SUT. Data for other configurations may be available. Please contact our Signal Integrity Group at [email protected] for further information. As a rule of thumb, 10% crosstalk levels are often used as a general first pass limit for determining acceptable interconnect performance. However, modern system crosstalk tolerance can vary greatly. For advice on connector suitability for specific applications, please contact our Signal Integrity Group at [email protected]. Additional information concerning test conditions and procedures is located in the appendices of this report. Further information may be obtained by contacting our Signal Integrity Group at [email protected]. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:21 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Appendix A – Frequency Domain Response Graphs Single-Ended Application – Insertion Loss Single-Ended Application – Return Loss Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:22 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Single-Ended 1:1 S/G Pattern Application – NEXT Single-Ended 1:1 S/G Pattern Application – FEXT Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:23 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Single-Ended 2:1 S/G Pattern Application – NEXT Single-Ended 2:1 S/G Pattern Application – FEXT Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:24 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Differential Application – Insertion Loss Differential Application – Return Loss Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:25 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Differential Optimal Horizontal Application – NEXT Differential Optimal Horizontal Application – FEXT Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:26 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Differential Optimal Vertical Application – NEXT Differential Optimal Vertical Application – FEXT Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:27 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Differential High Density Vertical Application – NEXT Differential High Density Vertical Application – FEXT Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:28 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Appendix B – Time Domain Response Graphs Single-Ended Application – Input Pulse Single-Ended 1:1 S/G Pattern Application – Impedance Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:29 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Single-Ended 1:1 S/G Pattern Application – Propagation Delay Single-Ended 2:1 S/G Pattern Application – Impedance Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:30 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Single-Ended 2:1 S/G Pattern Application – Propagation Delay Single-Ended 1:1 S/G Pattern Application – NEXT, AG15_AG17 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:31 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Single-Ended 1:1 S/G Pattern Application – FEXT, AG15_BG17 Single-Ended 1:1 S/G Pattern Application – NEXT, AG15_AE15 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:32 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Single-Ended 1:1 S/G Pattern Application – FEXT, AG15_BE15 Single-Ended 1:1 S/G Pattern Application – NEXT, AG15_AF14 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:33 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Single-Ended 1:1 S/G Pattern Application – FEXT, AG15_BF14 Single-Ended 2:1 S/G Pattern Application – NEXT, AE16_AE15 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:34 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Single-Ended 2:1 S/G Pattern Application – FEXT, AE16_BE15 Single-Ended 2:1 S/G Pattern Application – NEXT, AE16_AF16 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:35 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Single-Ended 2:1 S/G Pattern Application – FEXT, AE16_BF16 Single-Ended 2:1 S/G Pattern Application – NEXT, AE16_AF17 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:36 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Single-Ended 2:1 S/G Pattern Application – FEXT, AE16_BF17 Differential Application – Input Pulse 3 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:37 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Differential Optimal Horizontal Application – Impedance Differential Optimal Horizontal Application – Propagation Delay Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:38 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Differential Optimal Vertical Application – Impedance Differential Optimal Vertical Application – Propagation Delay Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:39 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Differential High Density Vertical Application – Impedance Differential High Density Vertical Application – Propagation Delay Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:40 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Diff Optimal Horizontal Application – NEXT, AE9,AE10_AE13,AE14 Diff Optimal Horizontal Application – FEXT, AE9,AE10_BE13,BE14 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:41 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Diff Optimal Horizontal Application – NEXT, AE9,AE10_AG9,AG10 Diff Optimal Horizontal Application – FEXT, AE9,AE10_BG9,BG10 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:42 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Diff Optimal Horizontal Application – NEXT, AE9,AE10_AD11,AD12 Diff Optimal Horizontal Application – FEXT, AE9,AE10_BD11,BD12 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:43 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Diff Optimal Vertical Application – NEXT, AC14,AD14_AC12,AD12 Diff Optimal Vertical Application – FEXT, AC14,AD14_BC12,BD12 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:44 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Diff Optimal Vertical Application – NEXT, AC14,AD14_AG14,AH14 Diff Optimal Vertical Application – FEXT, AC14,AD14_BG14,BH14 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:45 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Diff Optimal Vertical Application – NEXT, AC14,AD14_AE15,AF15 Diff Optimal Vertical Application – FEXT, AC14,AD14_BE15,BF15 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:46 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Diff High Density Vertical Application – NEXT, AD16,AE16_AD18,AE18 Diff High Density Vertical Application – FEXT, AD16,AE16_BD18,BE18 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:47 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Diff High Density Vertical Application – NEXT, AD16,AE16_AG16,AH16 Diff High Density Vertical Application – FEXT, AD16,AE16_BG16,BH16 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:48 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Diff High Density Vertical Application – NEXT, AD16,AE16_AE15,AF15 Diff High Density Vertical Application – FEXT, AD16,AE16_BE15,BF15 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:49 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Appendix C – Product and Test System Descriptions Product Description Product test samples are 1mm stack height ZA1 Series connectors. The part number is ZA1-40-2-1.00-Z-10. The ZA1 Series is an ultra-low profile micro array connector designed for single-ended signals with various options for differential signaling configurations. The micro array is 10 row providing 40 signal pins per row. A photo of the test articles mounted to SI test boards is shown below. Test System Description The test fixtures are composed of four-layer FR-4 material with 50Ω signal trace and pad configurations designed for the electrical characterization of Samtec high speed connector products. A PCB mount SMA connector is used to interface the VNA test cables to the test fixtures. Optimization of the SMA launch was performed using full wave simulation tools to minimize reflections. Ten test fixtures are specific to the ZA1 Series connector set and identified by part numbers PCB-106499-SIG-01A and B to PCB106499-SIG-05A and B. Calibration standards specific to the ZA1 Series are located on the calibration boards PCB-106499-SIG-09. To keep trace lengths short, five different test board sets were required to access the necessary signal pins. PCB-106499-SIG-XX Test Fixtures Shown below is a photograph of one of the five test board sets together with the ZA1 connector. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:50 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height PCB-106499-SIG-XX PCB Layout Panel Artwork of the PCB design is shown below. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:51 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height PCB Fixtures The test fixtures used are as follows: PCB-106499-SIG-01A – ZA1 Series Test Board for SE 1:1 S/G Pattern PCB-106499-SIG-01B – ZA1 Series Test Board for SE 1:1 S/G Pattern PCB-106499-SIG-02A – ZA1 Series Test Board for SE 2:1 S/G Pattern PCB-106499-SIG-02B – ZA1 Series Test Board for SE 2:1 S/G Pattern PCB-106499-SIG-03A – ZA1 Series Test Board for Differential Optimal Horizontal PCB-106499-SIG-03B – ZA1 Series Test Board for Differential Optimal Horizontal PCB-106499-SIG-04A – ZA1 Series Test Board for Differential Optimal Vertical PCB-106499-SIG-04B – ZA1 Series Test Board for Differential Optimal Vertical PCB-106499-SIG-05A – ZA1 Series Test Board for Differential High Density Vertical PCB-106499-SIG-05B – ZA1 Series Test Board for Differential High Density Vertical Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:52 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:53 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Calibration Board Test fixture losses and test point reflections were removed from the data by use of Automatic Fixture Removal (AFR) application. The calibration board is shown below. The measurements were performed under SOLT calibration and the test board effects were included in the measurements. AFR application extracts fixture S-parameters from 2X THRU measurement and performs de-embedding on the DUT+Fixture measurement to characterize only the DUT. Thru line – 2958 mils Open Reflect – 1479 mils Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:54 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height All traces on the test boards are length matched to 1.5" measured from the edge of the pad to the SMA. The AFR application effectively removes 1.479" of test board trace effects. This means that 21 mils of test board trace length effects are included in the measurement. The S-Parameter measurement includes: A- The ZA1 Series connector B- Test board vias and pads (footprint effects) C- 21 mils of 10.2 mil wide microstrip trace The figure below shows the location of the measurement reference plane. Measurement reference plane C B Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:55 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Appendix D – Test and Measurement Setup For frequency domain measurements, the test instrument is the Agilent N5230C PNA-L network analyzer. Frequency domain data and graphs are extracted from the instrument by AFR application. Post-processed time domain data and graphs are generated using convolution algorithms within Agilent ADS. The network analyzer is configured as follows: Start Frequency – 300 KHz Stop Frequency – 20 GHz Number of points -1601 IFBW – 1 KHz With these settings, the measurement time is approximately 20 seconds. N5230C Measurement Setup Test Instruments QTY Description 1 Agilent N5230C PNA-L Network Analyzer (300 KHz to 20 GHz) 1 Agilent N4433A ECAL Module (300 KHz to 20 GHz) Test Cables & Adapters QTY Description 4 Gore OWD01D02039-4 (DC-26.5 GHz) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:56 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height For impedance measurements, the test instrument is the Tektronix DSA8200 Digital Serial Analyzer mainframe and 80E04 sampling module. The impedance data and profiles are obtained directly from the instrument. The Digital Analyzer is configured as follows: Vertical Scale: Offset: Horizontal Scale: Record Length: Averages: Single-Ended Signal 5 ohm / Div: Default / Scroll 200ps/ Div 4000 ≥ 16 Differential Signal 10 ohm / Div: Default / Scroll 200ps/ Div 4000 ≥ 16 DSA8200 Measurement Setup Test Instruments QTY Description 1 Tektronix DSA8200 Digital Serial Analyzer 2 Tektronix 80E04 Dual Channel 20 GHz TDR Sampling Module Test Cables & Adapters QTY Description 2 Samtec RF405-01SP1-01SP1-0305 (DC-20 GHz) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:57 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Appendix E - Frequency and Time Domain Measurements Frequency (S-Parameter) Domain Procedures The quality of any data taken with a network analyzer is directly related to the quality of the calibration standards and the use of proper test procedures. For this reason, extreme care is taken in the design of the through calibration standards, the SI test boards, and the selection of the PCB vendor. A coaxial SOLT calibration is performed using a N4433A ECAL module. Then DUT measurements are performed under SOLT calibration. The measurements include the effect of test fixture. The measurements of the 2X THRU line standards are required in order to remove the test fixture effect. Time Domain Procedures Mathematically, Frequency Domain data can be transformed to obtain a Time Domain response. Perfect transformation requires Frequency Domain data from DC to infinity Hz. Fortunately, a very accurate Time Domain response can be obtained with bandwidth-limited data, such as measured with modern network analyzer. The Time Domain responses were generated using Agilent ADS 2009 update 1. This tool has a transient convolution simulator, which can generate a Time Domain response directly from the measured S-Parameters. An example of a similar methodology is provided in the Samtec Technical Note on domain transformation. http://www.samtec.com/Technical_Library/reference/articles/pdfs/tech-note_usingPLTS-for-time-domain-data_web.pdf Propagation Delay (TDT) The Propagation Delay is a measure of the Time Domain delay through the connector and footprint. A step pulse is applied to the touchstone model of the connector and the transmitted voltage is monitored. The same pulse is also applied to a reference channel with zero loss, and the Time Domain pulses are plotted on the same graph. The difference in time, measured at the 50% point of the step voltage is the propagation delay. Near-End Crosstalk (TDT) & Far End Crosstalk (TDT) A step pulse is applied to the touchstone model of the connector and the coupled voltage is monitored. The amplitude of the peak-coupled voltage is recorded and reported as a percentage of the input pulse. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:58 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Impedance (TDR) Measurements involving digital pulses are performed using either Time Domain Reflectometer (TDR) or Time Domain Transmission (TDT) methods. The TDR method is used for the impedance measurements in this report. The signal line(s) of the SUT’s is energized with a TDR pulse and the far-end of the energized signal line is terminated in the test systems characteristic impedance (e.g.; 50Ω or 100Ω terminations). By terminating the adjacent signal lines in the test systems characteristic impedance, the effects on the resultant impedance shape of the waveform is limited. The “best case” signal mapping was tested and is presented in this report. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:59 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved High Speed Characterization Report Series: ZA1 Micro Array Series Description: 1.0mm x 1.0mm Grid Interconnect System, 1mm Stack Height Appendix F – Glossary of Terms ADS – Advanced Design Systems AFR – Automatic Fixture Removal BC – Best Case crosstalk configuration DUT – Device under test, term used for TDA IConnect & Propagation Delay waveforms FD – Frequency domain FEXT – Far-End Crosstalk GSG – Ground–Signal-Ground; geometric configuration GSSG - Ground–Signal-Signal-Ground; geometric configuration HDV – High Density Vertical NEXT – Near-End Crosstalk OV – Optimal Vertical OH – Optimal Horizontal PCB – Printed Circuit Board PPO – Pin Population Option SE – Single-Ended SI – Signal Integrity SUT – System Under Test S – Static (independent of PCB ground) SOLT – acronym used to define Short, Open, Load & Thru Calibration Standards TD – Time Domain TDA – Time Domain Analysis TDR – Time Domain Reflectometry TDT – Time Domain Transmission WC – Worst Case crosstalk configuration Z – Impedance (expressed in ohms) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:60 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 11/14/2014 All Rights Reserved