High Speed Characterization Report SEAFP-XX-05.0-X-XX Mates with SEAM-XX-02.0-X-XX-2-A Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch 7 mm Stack Height Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Table of Contents Connector Overview ........................................................................................................ 1 Connector System Speed Rating .................................................................................... 1 Frequency Domain Data Summary ................................................................................. 2 Table 1 - Single-Ended 1:1 S/G Pattern Performance ................................................. 2 Table 2 - Single-Ended 2:1 S/G Pattern Performance ................................................. 3 Table 3 - Differential Optimal Horizontal Performance ................................................. 4 Table 4 - Differential Optimal Vertical Performance ..................................................... 5 Table 5 - Differential High Density Vertical Performance ............................................. 6 Bandwidth Charts – Single-Ended & Differential Insertion Loss .................................. 7 Time Domain Data Summary .......................................................................................... 8 Table 6 – Single-End Impedance () – 1:1 S/G Pattern .............................................. 8 Table 7 – Single-End Impedance () – 2:1 S/G Pattern .............................................. 8 Table 8 – Differential Impedance () – Optimal Horizontal .......................................... 9 Table 9 – Differential Impedance () – Optimal Vertical .............................................. 9 Table 10 – Differential Impedance () – High Density Vertical .................................. 10 Table 11 - Single-Ended Crosstalk (%) – 1:1 S/G Pattern .......................................... 11 Table 12 - Single-Ended Crosstalk (%) – 2:1 S/G Pattern ......................................... 12 Table 13 - Differential Crosstalk (%) – Optimal Horizontal ......................................... 13 Table 14 - Differential Crosstalk (%) – Optimal Vertical ............................................. 14 Table 15 - Differential Crosstalk (%) – High Density Vertical ..................................... 15 Table 16 - Propagation Delay (Mated Connector) ...................................................... 16 Characterization Details ................................................................................................ 17 Differential and Single-Ended Data............................................................................ 17 Connector Signal to Ground Ratio ............................................................................. 17 Frequency Domain Data ............................................................................................ 20 Time Domain Data ..................................................................................................... 20 Appendix A – Frequency Domain Response Graphs .................................................... 22 Single-Ended Application – Insertion Loss ................................................................ 22 Single-Ended Application – Return Loss ................................................................... 22 Single-Ended 1:1 S/G Pattern Application – NEXT.................................................... 23 Single-Ended 1:1 S/G Pattern Application – FEXT .................................................... 23 Single-Ended 2:1 S/G Pattern Application – NEXT.................................................... 24 Single-Ended 2:1 S/G Pattern Application – FEXT .................................................... 24 Differential Application – Insertion Loss ..................................................................... 25 Differential Application – Return Loss ........................................................................ 25 Differential Optimal Horizontal Application – NEXT ................................................... 26 Differential Optimal Horizontal Application – FEXT.................................................... 26 Differential Optimal Vertical Application – NEXT ....................................................... 27 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:ii Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Differential Optimal Vertical Application – FEXT ........................................................ 27 Differential High Density Vertical Application – NEXT ............................................... 28 Differential High Density Vertical Application – FEXT ................................................ 28 Appendix B – Time Domain Response Graphs ............................................................. 29 Single-Ended Application – Input Pulse ..................................................................... 29 Single-Ended 1:1 S/G Pattern Application – Impedance ........................................... 30 Single-Ended 1:1 S/G Pattern Application – Propagation Delay ................................ 30 Single-Ended 2:1 S/G Pattern Application – Impedance ........................................... 31 Single-Ended 2:1 S/G Pattern Application – Propagation Delay ................................ 31 Single-Ended 1:1 S/G Pattern Application – NEXT, SEAM A18_SEAM C18 ............ 32 Single-Ended 1:1 S/G Pattern Application – FEXT, SEAM A18_SEAFP C18 ........... 32 Single-Ended 1:1 S/G Pattern Application – NEXT, SEAM C16_SEAM C18 ............ 33 Single-Ended 1:1 S/G Pattern Application – FEXT, SEAM C16_SEAFP C18 ........... 33 Single-Ended 1:1 S/G Pattern Application – NEXT, SEAM C16_SEAM D15 ............ 34 Single-Ended 1:1 S/G Pattern Application – FEXT, SEAM C16_SEAFP D15 ........... 34 Single-Ended 2:1 S/G Pattern Application – NEXT, SEAM E10_SEAM F10 ............. 35 Single-Ended 2:1 S/G Pattern Application – FEXT, SEAM E10_SEAFP F10 ............ 35 Single-Ended 2:1 S/G Pattern Application – NEXT, SEAM E10_SEAM F11 ............. 36 Single-Ended 2:1 S/G Pattern Application – FEXT, SEAM E10_SEAFP F11 ............ 36 Single-Ended 2:1 S/G Pattern Application – NEXT, SEAM F10_SEAM F11 ............. 37 Single-Ended 2:1 S/G Pattern Application – FEXT, SEAM F10_SEAFP F11 ............ 37 Differential Application – Input Pulse ......................................................................... 38 Differential Optimal Horizontal Application – Impedance ........................................... 39 Differential Optimal Horizontal Application – Propagation Delay ............................... 39 Differential Optimal Vertical Application – Impedance ............................................... 40 Differential Optimal Vertical Application – Propagation Delay ................................... 40 Differential High Density Vertical Application – Impedance ....................................... 41 Differential High Density Vertical Application – Propagation Delay............................ 41 Diff Optimal Horizontal Application – NEXT, SEAM A15,A16_SEAM C15,C16 ......... 42 Diff Optimal Horizontal Application – FEXT, SEAM A15,A16_SEAFP C15,C16 ........ 42 Diff Optimal Horizontal Application – NEXT, SEAM C15,C16_SEAM D17,D18 ........ 43 Diff Optimal Horizontal Application – FEXT, SEAM C15,C16_SEAFP D17,D18 ....... 43 Diff Optimal Horizontal Application – NEXT, SEAM D17,D18_SEAM D21,D22 ........ 44 Diff Optimal Horizontal Application – FEXT, SEAM D17,D18_SEAFP D21,D22 ....... 44 Diff Optimal Vertical Application – NEXT, SEAM A16,B16_SEAM E16,F16.............. 45 Diff Optimal Vertical Application – FEXT, SEAM A16,B16_SEAFP E16,F16 ............ 45 Diff Optimal Vertical Application – NEXT, SEAM C19,D19_SEAM E18,F18 ............. 46 Diff Optimal Vertical Application – FEXT, SEAM C19,D19_SEAFP E18,F18 ............ 46 Diff Optimal Vertical Application – NEXT, SEAM E16,F16_SEAM E18,F18 .............. 47 Diff Optimal Vertical Application – FEXT, SEAM E16,F16_SEAFP E18,F18............. 47 Diff High Density Vertical Application – NEXT, SEAM B15,C15_SEAM B17,C17 ..... 48 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:iii Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Diff High Density Vertical Application – FEXT, SEAM B15,C15_SEAFP B17,C17 .... 48 Diff High Density Vertical Application – NEXT, SEAM B17,C17_SEAM D18,E18 ..... 49 Diff High Density Vertical Application – FEXT, SEAM B17,C17_SEAFP D18,E18 .... 49 Diff High Density Vertical Application – NEXT, SEAM D18,E18_SEAM E17,F17 ..... 50 Diff High Density Vertical Application – FEXT, SEAM D18,E18_SEAFP E17,F17 .... 50 Appendix C – Product and Test System Descriptions ................................................... 51 Product Description ................................................................................................... 51 Test System Description ............................................................................................ 51 PCB-105043-TST-XX Test Fixtures........................................................................... 51 PCB-105043-TST-XX PCB Layout Panel .................................................................. 52 PCB Fixtures ............................................................................................................. 53 Calibration Board ....................................................................................................... 55 Appendix D – Test and Measurement Setup................................................................. 57 N5230C Measurement Setup .................................................................................... 57 Test Instruments ........................................................................................................ 57 Test Cables & Adapters ............................................................................................. 57 DSA8200 Measurement Setup .................................................................................. 58 Test Instruments ........................................................................................................ 58 Test Cables & Adapters ............................................................................................. 58 Appendix E - Frequency and Time Domain Measurements .......................................... 59 Frequency (S-Parameter) Domain Procedures ......................................................... 59 Time Domain Procedures .......................................................................................... 59 Propagation Delay (TDT) ....................................................................................... 59 Near-End Crosstalk (TDT) & Far End Crosstalk (TDT) .......................................... 60 Impedance (TDR)................................................................................................... 60 Appendix F – Glossary of Terms ................................................................................... 61 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:iv Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Connector Overview SEAFP/SEAM is a 1.27mm x 1.27mm pitch interconnects system for elevated highspeed board-to-board applications. The open pin field design allows for dual signaling. The SEAFP/SEAM Series is designed in 4, 6, 8, and 10 row open pin field arrays. Pins per row selections designed include 10, 20, 30, 40, or 50. This report reflects only the hi-speed electrical characteristics specific to a mated 7mm stack height SEAFP/SEAM test system. Connector System Speed Rating SEAFP/SEAM Series, 1.27mm x 1.27mm (.050" x .050") pitch interconnect, 7mm Stack Height. Signaling Speed Rating Single-Ended: 1:1 S/G 11.5 GHz/ 23Gbps Single-Ended: 2:1 S/G 11 GHz/ 22Gbps Differential: Optimal Horizontal 11 GHz/ 22Gbps Differential: Optimal Vertical 11 GHz/ 22Gbps Differential: High Density Vertical 11.5 GHz/ 23Gbps The Speed Rating is based on the -3 dB insertion loss point of the connector system. The -3 dB point can be used to estimate usable system bandwidth in a typical, two-level signaling environment. To calculate the Speed Rating, the measured -3 dB point is rounded up to the nearest half-GHz level. The up rounding corrects for a portion of the test board’s trace loss, since a short length of trace loss is included in the loss data in this report. The resulting loss value is then doubled to determine the approximate maximum data rate in Gigabits per second (Gbps). For example, a connector with a -3 dB point of 7.8 GHz would have a Speed Rating of 8 GHz/ 16 Gbps. A connector with a -3 dB point of 7.2 GHz would have a Speed Rating of 7.5 GHz/15 Gbps. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:1 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Frequency Domain Data Summary Table 1 - Single-Ended 1:1 S/G Pattern Performance Test Parameter Driver Receiver Insertion Loss SEAM_C16 SEAFP_C16 3dB@ 11.1 GHz Return Loss SEAM_C16 SEAM_C16 >10dB to 6.9 GHz SEAM_A18 SEAM_C18 <-20dB to 20.0 GHz SEAM_C16 SEAM_C18 <-20dB to 20.0 GHz SEAM_C16 SEAM_D15 <-20dB to 20.0 GHz SEAM_A18 SEAFP_C18 <-20dB to 20.0 GHz SEAM_C16 SEAFP_C18 <-20dB to 20.0 GHz SEAM_C16 SEAFP_D15 <-20dB to 20.0 GHz Near-End Crosstalk Far-End Crosstalk Single-Ended 1:1 S/G Pattern Pin Map Pin A18 Pin C16 Pin D15 Pin E12 Pin C18 Pin F15 Pin F13 Insertion Loss & Return Loss Crosstalk Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:2 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Table 2 - Single-Ended 2:1 S/G Pattern Performance Test Parameter Driver Receiver Insertion Loss SEAM_E10 SEAFP_E10 3dB@ 10.9 GHz Return Loss SEAM_E10 SEAM_E10 >10dB to 7 GHz SEAM_E10 SEAM_F10 <-20dB to 2 GHz SEAM_E10 SEAM_F11 <-20dB to 20 GHz SEAM_F10 SEAM_F11 <-20dB to 1 GHz SEAM_E10 SEAFP_F10 <-20dB to 18.3 GHz SEAM_E10 SEAFP_F11 <-20dB to 20 GHz SEAM_F10 SEAFP_F11 <-20dB to 4.9 GHz Near-End Crosstalk Far-End Crosstalk Single-Ended 2:1 S/G Pattern Pin Map Pin A15 Pin A14 Pin C17 Pin E10 Pin D18 Pin D17 Pin F11 Pin F10 Insertion Loss & Return Loss Crosstalk Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:3 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Table 3 - Differential Optimal Horizontal Performance Test Parameter Driver Receiver Insertion Loss SEAM_D17,D18 SEAFP_D17,D18 3dB@ 10.9 GHz Return Loss SEAM_D17,D18 SEAM_D17,D18 >10dB to 7.5 GHz SEAM_A15,A16 SEAM_C15,C16 <-20dB to 20.0 GHz SEAM_C15,C16 SEAM_D17,D18 <-20dB to 20.0 GHz SEAM_D17,D18 SEAM_D21,D22 <-20dB to 20.0 GHz SEAM_A15,A16 SEAFP_C15,C16 <-20dB to 20.0 GHz SEAM_C15,C16 SEAFP_D17,D18 <-20dB to 20.0 GHz SEAM_D17,D18 SEAFP_D21,D22 <-20dB to 20.0 GHz Near-End Crosstalk Far-End Crosstalk Differential Optimal Horizontal Pin Map Pin C16 Pin D22 Pin A16 Pin D21 Pin A15 Pin D18 Pin C15 Pin D17 Insertion Loss & Return Loss Crosstalk Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:4 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Table 4 - Differential Optimal Vertical Performance Test Parameter Driver Receiver Insertion Loss SEAM_C19,D19 SEAFP_C19,D19 3dB@ 10.7 GHz Return Loss SEAM_C19,D19 SEAM_C19,D19 >10dB to 7.2 GHz SEAM_A16,B16 SEAM_E16,F16 <-20dB to 20.0 GHz SEAM_C19,D19 SEAM_E18,F18 <-20dB to 20.0 GHz SEAM_E16,F16 SEAM_E18,F18 <-20dB to 20.0 GHz SEAM_A16,B16 SEAFP_E16,F16 <-20dB to 20.0 GHz SEAM_C19,D19 SEAFP_E18,F18 <-20dB to 20.0 GHz SEAM_E16,F16 SEAFP_E18,F18 <-20dB to 20.0 GHz Near-End Crosstalk Far-End Crosstalk Differential Optimal Vertical Pin Map Pin C19 Pin D19 Pin A16 Pin E18 Pin F18 Pin F16 Pin B16 Pin E16 Insertion Loss & Return Loss Crosstalk Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:5 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Table 5 - Differential High Density Vertical Performance Test Parameter Driver Receiver Insertion Loss SEAM_D18,E18 SEAFP_D18,E18 3dB@ 11.1 GHz Return Loss SEAM_D18,E18 SEAM_D18,E18 >10dB to 7.6 GHz SEAM_B15,C15 SEAM_B17,C17 <-20dB to 20.0 GHz SEAM_B17,C17 SEAM_D18,E18 <-20dB to 20.0 GHz SEAM_D18,E18 SEAM_E17,F17 <-20dB to 16.8 GHz SEAM_B15,C15 SEAM_B17,C17 <-20dB to 20.0 GHz SEAM_B17,C17 SEAM_D18,E18 <-20dB to 18.8 GHz SEAM_D18,E18 SEAFP_E17,F17 <-20dB to 18.8 GHz Near-End Crosstalk Far-End Crosstalk Differential High Density Vertical Pin Map Pin B17 Pin C17 Pin B15 Pin C15 Pin E17 Pin D18 Pin E18 Pin F17 Insertion Loss & Return Loss Crosstalk Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:6 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Bandwidth Charts – Single-Ended & Differential Insertion Loss SEAFP/SEAM Array Series Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:7 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Time Domain Data Summary Table 6 – Single-End Impedance () – 1:1 S/G Pattern Signal Risetime 30 ps 50 ps 100 ps 250 ps 500 ps Maximum Impedance 58.3 56.2 52.7 52.1 51.8 Minimum Impedance 47.2 48.1 49.6 50 50 Table 7 – Single-End Impedance () – 2:1 S/G Pattern Signal Risetime 30 ps 50 ps 100 ps 250 ps 500 ps Maximum Impedance 59.4 57.4 53.8 52.4 52 Minimum Impedance 47.9 48.3 49.4 50 50 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:8 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Table 8 – Differential Impedance () – Optimal Horizontal Signal Risetime 30 ps 50 ps 100 ps 250 ps 500 ps Maximum Impedance 103.2 103.6 103.5 103.2 101.3 Minimum Impedance 83.3 86.2 91.1 95.9 98.8 Table 9 – Differential Impedance () – Optimal Vertical Signal Risetime 30 ps 50 ps 100 ps 250 ps 500 ps Maximum Impedance 103 103.4 103.3 103 101.3 Minimum Impedance 85.9 88.9 94.2 97.7 99.4 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:9 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Table 10 – Differential Impedance () – High Density Vertical Signal Risetime 30 ps 50 ps 100 ps 250 ps 500 ps Maximum Impedance 104.6 104.6 104.6 104.2 102 Minimum Impedance 87.1 90.1 94.6 97.8 99.3 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:10 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Table 11 - Single-Ended Crosstalk (%) – 1:1 S/G Pattern Input(tr) NEXT FEXT Driver Receiver 30 ps 50 ps 100 ps 250 ps 500 ps SEAM_A18 SEAM_C18 0.37 0.31 0.25 0.13 <0.1 SEAM_C16 SEAM_C18 0.67 0.57 0.38 0.17 0.11 SEAM_C16 SEAM_D15 2.50 2.32 1.77 0.89 0.53 SEAM_A18 SEAFP_C18 0.313 0.27 0.197 <0.1 <0.1 SEAM_C16 SEAFP_C18 0.332 0.284 0.183 <0.1 <0.1 SEAM_C16 SEAFP_D15 1.178 0.988 0.642 0.277 0.13 Single-Ended 1:1 S/G Pattern Crosstalk Pin Map Pin A18 Pin C16 Pin D15 Pin E12 Pin C18 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 Pin F15 Pin F13 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:11 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Table 12 - Single-Ended Crosstalk (%) – 2:1 S/G Pattern Input(tr) NEXT FEXT Driver Receiver 30 ps 50 ps 100 ps 250 ps 500 ps SEAM_E10 SEAM_F10 9.36 8.29 6.94 3.68 1.90 SEAM_E10 SEAM_F11 4.05 3.72 3.05 1.65 0.86 SEAM_F10 SEAM_F11 16.18 14.93 12.36 6.66 3.37 SEAM_E10 SEAFP_F10 3.18 2.69 1.845 0.956 0.484 SEAM_E10 SEAFP_F11 2.456 2.201 1.661 0.871 0.439 SEAM_F10 SEAFP_F11 5.61 4.85 3.61 1.9 0.93 Single-Ended 2:1 S/G Pattern Crosstalk Pin Map Pin A15 Pin A14 Pin C17 Pin E10 Pin D18 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 Pin D17 Pin F11 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:12 Pin F10 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Table 13 - Differential Crosstalk (%) – Optimal Horizontal Input(tr) NEXT FEXT Driver Receiver 30 ps 50 ps 100 ps 250 ps 500 ps SEAM_A15,A16 SEAM_C15,C16 0.15 0.11 <0.1 <0.1 <0.1 SEAM_C15,C16 SEAM_D17,D18 0.95 0.85 0.65 0.31 0.16 SEAM_D17,D18 SEAM_D21,D22 <0.1 <0.1 <0.1 <0.1 <0.1 SEAM_A15,A16 SEAFP_C15,C16 0.20 0.17 0.12 <0.1 <0.1 SEAM_C15,C16 SEAFP_D17,D18 0.26 0.18 <0.1 <0.1 <0.1 SEAM_D17,D18 SEAFP_D21,D22 0.23 0.17 0.10 <0.1 <0.1 Differential Optimal Horizontal Crosstalk Pin Map Pin C16 Pin D22 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 Pin A16 Pin D21 Pin A15 Pin D18 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:13 Pin C15 Pin D17 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Table 14 - Differential Crosstalk (%) – Optimal Vertical Input(tr) NEXT FEXT Driver Receiver 30 ps 50 ps 100 ps 250 ps 500 ps SEAM_A16,B16 SEAM_E16,F16 <0.1 <0.1 <0.1 <0.1 <0.1 SEAM_C19,D19 SEAM_E18,F18 1.31 1.16 0.84 0.37 0.18 SEAM_E16,F16 SEAM_E18,F18 0.86 0.69 0.45 0.21 0.11 SEAM_A16,B16 SEAFP_E16,F16 <0.1 <0.1 <0.1 <0.1 <0.1 SEAM_C19,D19 SEAFP_E18,F18 0.53 0.43 0.25 0.12 <0.1 SEAM_E16,F16 SEAFP_E18,F18 0.85 0.65 0.37 0.15 <0.1 Differential Optimal Vertical Crosstalk Pin Map Pin C19 Pin D19 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 Pin E18 Pin F18 Pin A16 Pin F16 Pin B16 Pin E16 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:14 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Table 15 - Differential Crosstalk (%) – High Density Vertical Input(tr) NEXT FEXT Driver Receiver 30 ps 50 ps 100 ps 250 ps 500 ps SEAM_B15,C15 SEAM_B17,C17 0.64 0.61 0.50 0.27 0.14 SEAM_B17,C17 SEAM_D18,E18 1.07 0.91 0.70 0.34 0.17 SEAM_D18,E18 SEAM_E17,F17 2.73 2.51 2.16 1.14 0.59 SEAM_B15,C15 SEAM_B17,C17 0.98 0.69 0.44 0.23 0.13 SEAM_B17,C17 SEAM_D18,E18 0.45 0.29 0.12 <0.1 <0.1 SEAM_D18,E18 SEAFP_E17,F17 1.41 1.06 0.57 0.27 0.13 Differential High Density Vertical Crosstalk Pin Map Pin B17 Pin C17 Pin B15 Pin C15 Pin E17 Pin D18 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 Pin E18 Pin F17 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:15 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Table 16 - Propagation Delay (Mated Connector) Single-Ended: 1:1 S/G 73 ps Single-Ended: 2:1 S/G 77 ps Differential: Optimal Horizontal 69 ps Differential: Optimal Vertical 72 ps Differential: High Density Vertical 72 ps Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:16 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Characterization Details This report presents data that characterizes the signal integrity response of a connector pair in a controlled printed circuit board (PCB) environment. All efforts are made to reveal typical best-case responses inherent to the system under test (SUT). In this report, the SUT includes the connector pair and footprint effects on a typical multi-layer PCB. PCB effects (trace loss) are de-embedded from test data. Board related effects, such as pad-to-ground capacitance, are included in the data presented in this report. Additionally, intermediate test signal connections can mask the connector’s true performance. Such connection effects are minimized by using high performance test cables and adapters. Where appropriate, calibration and de-embedding routines are also used to reduce residual effects. Differential and Single-Ended Data Most Samtec connectors can be used successfully in both differential and single-ended applications. However, electrical performance will differ depending on the signal drive type. In this report, data is presented for both differential and single-ended drive scenarios. Connector Signal to Ground Ratio Samtec connectors are most often designed for generic applications and can be implemented using various signal and ground pin assignments. In high-speed systems, provisions must be made in the interconnect for signal return currents. Such paths are often referred to as “ground”. In some connectors, a ground plane or blade, or an outer shield, is used as the signal return, while in others, connector pins are used as signal returns. Various combinations of signal pins, ground blades, and shields can also be utilized. Electrical performance can vary significantly depending upon the number and location of ground pins. In general, the more pins dedicated to ground, the better electrical performance will be. However, dedicating pins to ground reduces signal density of a connector. Therefore, care must be taken when choosing signal/ground ratios in cost or density-sensitive applications. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:17 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height For this connector, the following array configurations are evaluated: Open pin field Signal pin field Grounded pin field G T 50 ohm termination field Single-Ended Impedance (denoted by green circles): 1:1 S/G ratio 2:1 S/G ratio Single-Ended Crosstalk (denoted by red circles): 1:1 S/G ratio 2:1 S/G ratio Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:18 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Differential Impedance (denoted by green circles): Optimal Horizontal Optimal Vertical High Density Vertical Differential Crosstalk (denoted by red circles): Optimal Horizontal Optimal Vertical High Density Vertical Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:19 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Only one single-ended signal or differential pair was driven for crosstalk measurements. Other configurations can be evaluated upon request. Please contact [email protected] for more information. In a real system environment, active signals might be located at the outer edges of the signal contacts of concern, as opposed to the ground signals utilized in laboratory testing. For example, in a single-ended system, a pin-out of “SSSS”, or four adjacent single ended signals might be encountered as opposed to the “GSG” and “GSSG” configurations tested in the laboratory. Electrical characteristics in such applications could vary slightly from laboratory results. However, in most applications, performance can safely be considered equivalent. Signal Edge Speed (Rise Time): In pulse signaling applications, the perceived performance of the interconnect can vary significantly depending on the edge rate or rise time of the exciting signal. For this report, the fastest rise time used was 30 ps. Generally, this should demonstrate worstcase performance. In many systems, the signal edge rate will be significantly slower at the connector than at the driver launch point. To estimate interconnect performance at other edge rates, data is provided for several rise times between 30ps and 500ps. For this report, measured rise times were at 10%-90% signal levels. Frequency Domain Data Frequency Domain parameters are helpful in evaluating the connector system’s signal loss and crosstalk characteristics across a range of sinusoidal frequencies. In this report, parameters presented in the Frequency Domain are Insertion Loss, Return Loss, and Near-End and Far-End Crosstalk. Other parameters or formats, such as VSWR or S-Parameters, may be available upon request. Please contact our Signal Integrity Group at [email protected] for more information. Frequency performance characteristics for the SUT are generated directly from network analyzer measurements. Time Domain Data Time Domain parameters indicate Impedance mismatch versus length, signal propagation time, and crosstalk in a pulsed signal environment. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:20 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Impedance mismatch versus length is measured by DSA8200 Digital Serial Analyzer. Board related effects, such as pad-to-ground capacitance and trace loss, are included in the data presented in this report. The impedance data is provided in Appendix E of this report. The measured S-Parameters from the network analyzer are post-processed using Agilent Advanced Design System to obtain the time domain response for signal propagation time and crosstalk. The Time Domain procedure is provided in Appendix E of this report. Parameters or formats not included in this report may be available upon request. Please contact our Signal Integrity Group at [email protected] for more information. In this report, propagation delay is defined as the signal propagation time through the connector and connector footprint. It includes 10 mils of PCB trace on each end of the connector. Delay is measured at 100 picoseconds signal rise-time. Delay is calculated as the difference in time measured between the 50% amplitude levels of the input and output pulses. Crosstalk or coupled noise data is provided for various signal configurations. All measurements are single disturber. Crosstalk is calculated as a ratio of the input line voltage to the coupled line voltage. The input line is sometimes described as the active or drive line. The coupled line is sometimes described as the quiet or victim line. Crosstalk ratio is tabulated in this report as a percentage. Measurements are made at both the nearend and far-end of the SUT. Data for other configurations may be available. Please contact our Signal Integrity Group at [email protected] for further information. As a rule of thumb, 10% crosstalk levels are often used as a general first pass limit for determining acceptable interconnect performance. However, modern system crosstalk tolerance can vary greatly. For advice on connector suitability for specific applications, please contact our Signal Integrity Group at [email protected]. Additional information concerning test conditions and procedures is located in the appendices of this report. Further information may be obtained by contacting our Signal Integrity Group at [email protected]. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:21 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Appendix A – Frequency Domain Response Graphs Single-Ended Application – Insertion Loss Single-Ended Application – Return Loss Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:22 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Single-Ended 1:1 S/G Pattern Application – NEXT Single-Ended 1:1 S/G Pattern Application – FEXT Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:23 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Single-Ended 2:1 S/G Pattern Application – NEXT Single-Ended 2:1 S/G Pattern Application – FEXT Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:24 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Differential Application – Insertion Loss Differential Application – Return Loss Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:25 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Differential Optimal Horizontal Application – NEXT Differential Optimal Horizontal Application – FEXT Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:26 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Differential Optimal Vertical Application – NEXT Differential Optimal Vertical Application – FEXT Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:27 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Differential High Density Vertical Application – NEXT Differential High Density Vertical Application – FEXT Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:28 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Appendix B – Time Domain Response Graphs Single-Ended Application – Input Pulse Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:29 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Single-Ended 1:1 S/G Pattern Application – Impedance Single-Ended 1:1 S/G Pattern Application – Propagation Delay Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:30 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Single-Ended 2:1 S/G Pattern Application – Impedance Single-Ended 2:1 S/G Pattern Application – Propagation Delay Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:31 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Single-Ended 1:1 S/G Pattern Application – NEXT, SEAM A18_SEAM C18 Single-Ended 1:1 S/G Pattern Application – FEXT, SEAM A18_SEAFP C18 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:32 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Single-Ended 1:1 S/G Pattern Application – NEXT, SEAM C16_SEAM C18 Single-Ended 1:1 S/G Pattern Application – FEXT, SEAM C16_SEAFP C18 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:33 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Single-Ended 1:1 S/G Pattern Application – NEXT, SEAM C16_SEAM D15 Single-Ended 1:1 S/G Pattern Application – FEXT, SEAM C16_SEAFP D15 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:34 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Single-Ended 2:1 S/G Pattern Application – NEXT, SEAM E10_SEAM F10 Single-Ended 2:1 S/G Pattern Application – FEXT, SEAM E10_SEAFP F10 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:35 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Single-Ended 2:1 S/G Pattern Application – NEXT, SEAM E10_SEAM F11 Single-Ended 2:1 S/G Pattern Application – FEXT, SEAM E10_SEAFP F11 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:36 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Single-Ended 2:1 S/G Pattern Application – NEXT, SEAM F10_SEAM F11 Single-Ended 2:1 S/G Pattern Application – FEXT, SEAM F10_SEAFP F11 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:37 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Differential Application – Input Pulse Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:38 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Differential Optimal Horizontal Application – Impedance Differential Optimal Horizontal Application – Propagation Delay Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:39 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Differential Optimal Vertical Application – Impedance Differential Optimal Vertical Application – Propagation Delay Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:40 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Differential High Density Vertical Application – Impedance Differential High Density Vertical Application – Propagation Delay Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:41 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Diff Optimal Horizontal Application – NEXT, SEAM A15,A16_SEAM C15,C16 Diff Optimal Horizontal Application – FEXT, SEAM A15,A16_SEAFP C15,C16 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:42 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Diff Optimal Horizontal Application – NEXT, SEAM C15,C16_SEAM D17,D18 Diff Optimal Horizontal Application – FEXT, SEAM C15,C16_SEAFP D17,D18 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:43 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Diff Optimal Horizontal Application – NEXT, SEAM D17,D18_SEAM D21,D22 Diff Optimal Horizontal Application – FEXT, SEAM D17,D18_SEAFP D21,D22 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:44 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Diff Optimal Vertical Application – NEXT, SEAM A16,B16_SEAM E16,F16 Diff Optimal Vertical Application – FEXT, SEAM A16,B16_SEAFP E16,F16 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:45 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Diff Optimal Vertical Application – NEXT, SEAM C19,D19_SEAM E18,F18 Diff Optimal Vertical Application – FEXT, SEAM C19,D19_SEAFP E18,F18 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:46 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Diff Optimal Vertical Application – NEXT, SEAM E16,F16_SEAM E18,F18 Diff Optimal Vertical Application – FEXT, SEAM E16,F16_SEAFP E18,F18 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:47 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Diff High Density Vertical Application – NEXT, SEAM B15,C15_SEAM B17,C17 Diff High Density Vertical Application – FEXT, SEAM B15,C15_SEAFP B17,C17 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:48 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Diff High Density Vertical Application – NEXT, SEAM B17,C17_SEAM D18,E18 Diff High Density Vertical Application – FEXT, SEAM B17,C17_SEAFP D18,E18 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:49 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Diff High Density Vertical Application – NEXT, SEAM D18,E18_SEAM E17,F17 Diff High Density Vertical Application – FEXT, SEAM D18,E18_SEAFP E17,F17 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:50 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Appendix C – Product and Test System Descriptions Product Description Product test samples are 7 mm (0.276") stack height SEAFP/SEAM Series connectors. The part numbers are SEAFP-30-05.0-L-06 and SEAM-30-02.0-L-06-2-A-K-TR. The SEAFP/SEAM Series is an open pin field connector designed for single-ended signals with various options for differential signaling configurations. The open pin field array is 6 row providing 30 signal pins per row. A photo of the test articles mounted to SI test boards is shown below. Test System Description The test fixtures are composed of four-layer FR4 material with 50Ω signal trace and pad configurations designed for the electrical characterization of Samtec high speed connector products. A PCB mount SMA connector is used to interface the VNA test cables to the test fixtures. Optimization of the SMA launch was performed using full wave simulation tools to minimize reflections. Ten test fixtures are specific to the SEAFP/SEAM Series connector set and identified by part numbers PCB-105043-TST-01-A and C to PCB-105043-TST-05 A and C. Calibration standards specific to the SEAFP/SEAM Series are located on the calibration board PCB-105043-TST-07. To keep trace lengths short, five different test board sets were required to access the necessary signal pins. PCB-105043-TST-XX Test Fixtures Shown below is a photograph of one of the five test board sets. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:51 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height PCB-105043-TST-XX PCB Layout Panel Artwork of the PCB design is shown below. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:52 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height PCB Fixtures The test fixtures used are as follows: PCB-105043 -TST-01-A – SEAFP Series Test Board for SE 1:1 S/G Pattern. PCB-105043 -TST-01-C – SEAM Series Test Board for SE 1:1 S/G Pattern. PCB-105043 -TST-02-A – SEAFP Series Test Board for SE 2:1 S/G Pattern PCB-105043 -TST-02-C – SEAM Series Test Board for SE 2:1 S/G Pattern PCB-105043 -TST-03-A – SEAFP Series Test Board for Differential Optimal Horizontal PCB-105043 -TST-03-C – SEAM Series Test Board for Differential Optimal Horizontal PCB-105043 -TST-04-A – SEAFP Series Test Board for Differential Optimal Vertical PCB-105043-TST-04-C – SEAM Series Test Board for Differential Optimal Vertical PCB-105043 -TST-05-A – SEAFP Series Test Board for Differential High Density Vertical PCB-105043 -TST-05-C – SEAM Series Test Board for Differential High Density Vertical Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:53 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:54 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Calibration Board Test fixture losses and test point reflections were removed from the data by use of TRL calibration. The calibration board is shown below. Prior to making any measurements, the calibration board is characterized to obtain parameters required to define the calibration kit. Once a cal kit is defined, calibration using the standards on the calibration board can be performed. Finally, the device can be measured and the test board effects are automatically removed. Thru line – 2980 mils Open Reflect – 1490 mils Line 1 – 6526 mils Line 2 – 3689 mils Line 3 – 3122 mils Match – 1490 mils Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:55 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height All traces on the test boards are length matched to 1.5” measured from the edge of the pad to the SMA. The TRL calibration effectively removes 1.490” of test board trace effects. This means that 10 mils of test board trace length effects are included in the measurement. The S-Parameter measurement includes: A- The SEAFP/SEAM Series connector set B- Test board vias, pads (footprint effects) C- 10 mils of 9.5 mil wide microstrip trace The figure below shows the location of the measurement reference plane. C B Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 Measurement reference plane WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:56 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Appendix D – Test and Measurement Setup For frequency domain measurements, the test instrument is the Agilent N5230C PNA-L network analyzer. Frequency domain data and graphs are obtained directly from the instrument. Post-processed time domain data and graphs are generated using convolution algorithms within Agilent ADS. The network analyzer is configured as follows: Start Frequency – 300 KHz Stop Frequency – 20 GHz Number of points -1601 IFBW – 1 KHz With these settings, the measurement time is approximately 20 seconds. N5230C Measurement Setup Test Instruments QTY Description 1 Agilent N5230C PNA-L Network Analyzer (300 KHz to 20 GHz) 1 Agilent N4433A ecal module (300 KHz to 20 GHz) Test Cables & Adapters QTY Description 4 Gore 0WD01D02039-4 (DC-50 GHz) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:57 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height For impedance measurements, the test instrument is the Tektronix DSA8200 Digital Serial Analyzer mainframe and 80E04 sampling module. The impedance data and profiles are obtained directly from the instrument. The Digital Analyzer is configured as follows: Vertical Scale: Offset: Horizontal Scale: Record Length: Averages: Single-Ended Signal 5 ohm / Div: Default / Scroll 200ps/ Div 4000 ≥ 16 Differential Signal 5 ohm / Div: Default / Scroll 200ps/ Div 4000 ≥ 16 DSA8200 Measurement Setup Test Instruments QTY Description 1 Tektronix DSA8200 Digital Serial Analyzer 2 Tektronix 80E04 Dual Channel 20 GHz TDR Sampling Module Test Cables & Adapters QTY Description 2 Samtec RF405-01SP1-01SP1-0305 (DC-20 GHz) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:58 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Appendix E - Frequency and Time Domain Measurements Frequency (S-Parameter) Domain Procedures The quality of any data taken with a network analyzer is directly related to the quality of the calibration standards and the use of proper test procedures. For this reason, extreme care is taken in the design of the LRM calibration standards, the SI test boards, and the selection of the PCB vendor. The measurement process begins with a measurement of the LRM calibration standards. A coaxial SOLT calibration is performed using an N4433A ecal module. This measurement is required in order to obtain precise values of the line standard offset delay and frequency bandwidths. Measurements of the reflect and 2x through line standard can be used to determine the maximum frequency for which the calibration standards are valid. For the SEAFP/SEAM Series test boards, this is greater than 20 GHz. From the LRM calibration standard measurements, a user defined calibration kit is developed and stored in the network analyzer. Calibration is then performed on all 4 ports following the calibration wizard within the Agilent N5230C. This calibration is saved and can be recalled at any time. Calibration takes roughly 30 minutes to perform. Time Domain Procedures Mathematically, Frequency Domain data can be transformed to obtain a Time Domain response. Perfect transformation requires Frequency Domain data from DC to infinity Hz. Fortunately, a very accurate Time Domain response can be obtained with bandwidth-limited data, such as measured with modern network analyzer. The Time Domain responses were generated using Agilent ADS 2009 update 1. This tool has a transient convolution simulator, which can generate a Time Domain response directly from measured S-Parameters. An example of a similar methodology is provided in the Samtec Technical Note on domain transformation. http://www.samtec.com/Technical_Library/reference/articles/pdfs/tech-note_usingPLTS-for-time-domain-data_web.pdf Propagation Delay (TDT) The Propagation Delay is a measure of the Time Domain delay through the connector and footprint. A step pulse is applied to the touchstone model of the connector and the transmitted voltage is monitored. The same pulse is also applied to a reference channel with zero loss, and the Time Domain pulses are plotted on the same graph. The difference in time, measured at the 50% point of the step voltage is the propagation delay. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:59 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Near-End Crosstalk (TDT) & Far End Crosstalk (TDT) A step pulse is applied to the touchstone model of the connector and the coupled voltage is monitored. The amplitude of the peak-coupled voltage is recorded and reported as a percentage of the input pulse. Impedance (TDR) Measurements involving digital pulses are performed using either Time Domain Reflectometer (TDR) or Time Domain Transmission (TDT) methods. The TDR method is used for the impedance measurements in this report. The signal line(s) of the SUT’s is energized with a TDR pulse and the far-end of the energized signal line is terminated in the test systems characteristic impedance (e.g.; 50Ω or 100Ω terminations). By terminating the adjacent signal lines in the test systems characteristic impedance, the effects on the resultant impedance shape of the waveform is limited. The “best case” signal mapping was tested and is presented in this report. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:60 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved High Speed Characterization Report Series: SEAFP/SEAM Description: 1.27mm x 1.27mm grid interconnect system, 7 mm Stack Height Appendix F – Glossary of Terms ADS – Advanced Design Systems BC – Best Case crosstalk configuration DUT – Device under test, term used for TDA IConnect & Propagation Delay waveforms FD – Frequency domain FEXT – Far-End Crosstalk GSG – Ground–Signal-Ground; geometric configuration GSSG - Ground–Signal-Signal-Ground; geometric configuration HDV – High Density Vertical NEXT – Near-End Crosstalk OV – Optimal Vertical OH – Optimal Horizontal PCB – Printed Circuit Board PPO – Pin Population Option SE – Single-Ended SI – Signal Integrity SUT – System Under Test S – Static (independent of PCB ground) SOLT – acronym used to define Short, Open, Load & Thru Calibration Standards TD – Time Domain TDA – Time Domain Analysis TDR – Time Domain Reflectometry TDT – Time Domain Transmission WC – Worst Case crosstalk configuration Z – Impedance (expressed in ohms) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:61 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/30/2013 All Rights Reserved