Project Number:

Project Number: Design Qualification Test Report
Requested by: Hardy Tain
Tracking Code: 132820_Report_Rev_1
Date: 7/21/2011
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Product Rev: 0
Lot #: N/A
Tech: Peter Chen
Part description: QSFP8
Test Start: 4/10/2011
Eng: Vico Zhao
Qty to test: 45
Test Completed: 5/5/2011
Design Qualification Test Report
QSFP8
QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Page 1 of 47
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
CERTIFICATION
All instruments and measuring equipment were calibrated to National Institute for Standards and Technology (NIST)
traceable standards according to IS0 10012-l and ANSI/NCSL 2540-1, as applicable.
All contents contained herein are the property of Samtec. No portion of this report, in part or in full shall be
reproduced without prior written approval of Samtec.
SCOPE
To perform the following tests: Design Qualification Test, Please see test plan.
APPLICABLE DOCUMENTS
Standards: EIA Publication 364
TEST SAMPLES AND PREPARATION
1)
2)
3)
4)
5)
All materials were manufactured in accordance with the applicable product specification.
All test samples were identified and encoded to maintain traceability throughout the test sequences.
After soldering, the parts to be used for LLCR and DWV/IR testing were cleaned according to TLWI-0001.
Either an automated cleaning procedure or an ultrasonic cleaning procedure may be used.
The automated procedure is used with aqueous compatible soldering materials.
6) Parts not intended for testing LLCR and DWV/IR are visually inspected and cleaned if necessary.
7) Any additional preparation will be noted in the individual test sequences.
8) Solder Information: Lead free
9) Re-Flow Time/Temp: See accompanying profile.
10) Samtec Test PCBs used: PCB-102894-TST-01A
Page 2 of 47
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
TYPICAL OVEN PROFILE (Soldering Parts to Test Boards)
Page 3 of 47
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
FLOWCHARTS
Gas Tight
TEST
STEP
GROUP A
01
02
03
LLCR-1
Gas Tight
LLCR-2
192 Points
Gas Tight = EIA-364-36A
LLCR = EIA-364 -23, LLCR
use Keithley 580 in the dry circuit mode, 10 mA Max
IR & DWV
TEST
GROUP A1
STEP
2 Mated Sets
01
GROUP A2
2 Unmated
of Part #
Being Tested
GROUP A3
GROUP B1
2 Unmated of Mating
Part #
2 Mated Sets
Break Down
Pin-to-Pin
Break Down
Pin-to-Pin
Break Down
Pin-to-Pin
Pin-to-Pin
DW V/Break Down
Voltage
DWV/Break Down
Voltage
DWV/Break Down
Voltage
IR & DWV at test voltage
(on both mated sets and on each
connector unmated)
02
Thermal Shock
(Mated and Undisturbed)
03
IR & DWV at test voltage
(on both mated sets and on each
connector unmated)
04
Cyclic Humidity
(Mated and Undisturbed)
05
IR & DWV at test voltage
(on both mated sets and on each
connector unmated)
DWV on Group B1 to be performed at Test Voltage
DWV test voltage is equal to 75% of the lowest break down voltage from Groups A1, A2 or A3
Thermal Shock = EIA-364-32, Table II, Test Condition I:
-55o C to +85o C 1/2 hour dw ell, 100 cycles
Hum idity = EIA-364-31, Test Condition B (240 Hours)
and Method III (+25°C to +65°C @ 90% RH to 98% RH)
ambient pre-condition and delete steps 7a and 7b
IR = EIA-364-21
DWV = EIA-364-20, Test Condition 1
Page 4 of 47
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
FLOWCHARTS Continued
TEST
GROUP B1
STEP
8 Boards
(largest position submitted)
01
02
Contact Gaps
LLCR-1
03
Forces - Mating / Unmating
04
25 Cycles
05
06
Forces - Mating / Unmating
07
25 Cycles (50 Total)
Forces - Mating / Unmating
08
25 Cycles (75 Total)
09
10
Forces - Mating / Unmating
11
12
Forces - Mating / Unmating
Clean w/Compressed Air
13
Contact Gaps
14
LLCR-2
15
Thermal Shock
(Mated and Undisturbed)
16
LLCR-3
17
Cyclic Humidity
(Mated and Undisturbed)
25 Cycles (100 Total)
LLCR-4
18
19
Forces - Mating / Unmating
Thermal Shock = EIA-364-32, Table II, Test Condition I:
o
o
-55 C to +85 C 1/2 hour dw ell, 100 cycles
Hum idity = EIA-364-31, Test Condition B (240 Hours)
and Method III (+25°C to +65°C @ 90% RH to 98% RH)
ambient pre-condition and delete steps 7a and 7b
Mating / Unm ating Forces = EIA-364-13
Contact Gaps / Height - No standard method. Usually measured optically.
Gaps to be taken on a minimum of 20% of each part tested
LLCR = EIA-364-23, LLCR
20 mV Max, 100 mA Max
Use Keithley 580 or 3706 in 4 wire dry circuit mode
Page 5 of 47
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
FLOWCHARTS Continued
Thermal Aging
TEST
STEP
GROUP A1
8 Boards
Thermal Aging (Mated)
01
Contact Gaps
02
Forces - Mating / Unmating
03
LLCR-1
04
Thermal Aging
(Mated and Undisturbed)
05
LLCR-2
06
Forces - Mating / Unmating
07
Contact Gaps
Thermal Aging = EIA-364-17, Test Condition 4 (105°C)
Time Condition 'B' (250 Hours)
Mating / Unm ating Forces = EIA-364-13
Contact Gaps / Height - No standard method. Usually m easured optically.
Gaps to be taken on a minimum of 20% of each part tested
LLCR = EIA-364-23, LLCR
20 mV Max, 100 mA Max
Use Keithley 580 or 3706 in 4 wire dry circuit mode
Page 6 of 47
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
FLOWCHARTS Continued
Normal Force
TEST
01
GROUP A1
Individual Contacts
(8-10 min)
Contact Gaps
GROUP A2
Individual Contacts
(8-10 min)
Contact Gaps
02
Setup Approved
Thermal Aging
(Mated and Undisturbed)
03
Normal Force
(in the body and soldered on PCB
unless otherwise specified)
Contact Gaps
STEP
04
Setup Approved
05
Normal Force
(in the body and soldered on PCB
unless otherwise specified)
Thermal Aging = EIA-364-17, Test Condition 4 (105°C)
Time Condition 'B' (250 Hours)
Normal Force = EIA-364-04
(Perpendicular) Displacement Force = 12.7 mm/m in ± 6 mm /min
Spec is 50 N @ 1 mm displacement
Contact Gaps / Height - No standard method. Usually m easured optically
Gaps to be taken on a minimum of 20% of each part tested
Page 7 of 47
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
FLOWCHARTS Continued
Mechanical Shock / Vibration / LLCR
TEST
GROUP A1
STEP
192 Points
01
LLCR-1
02
03
Shock
04
Vibration
LLCR-2
Mechanical Shock = EIA 364-27 Half Sine,
100 g's, 6 m illiSeconds (Condition "C") each axis
V ibration = EIA 364-28, Random Vibration
7.56 g RMS, Condition VB --- 2 hours/axis
LLCR = EIA-364-23, LLCR
20 mV Max, 100 mA Max
Use Keithley 580 or 3706 in 4 wire dry circuit mode
Shock / Vibration / nanoSecond Event Detection
TEST
GROUP A1
STEP
60 Points
01
Event Detection,
Shock
02
Event Detection,
Vibration
Mechanical Shock = EIA 364-27 Half Sine,
100 g' s, 6 m illiSeconds (Condition "C") each axis
V ibration = EIA 364-28, Random Vibration
7.56 g RMS, Condition VB --- 2 hours/axis
E vent detection requirement during Shock / Vibration is 50 nanoseconds minimum
Current Carrying Capacity - Double Row
TEST
STEP
GROUP B1
3 Mated Assemblies
2 Contacts Powered
GR OUP B2
3 Mated Assemblies
4 Contacts Powered
GROUP B3
3 Mated Assemblies
6 Contacts Powered
GROUP B4
3 Mated Assemblies
8 Contacts Powered
GROUP B 5
3 Mated Assemblies
All Contacts Powered
01
CCC
CCC
CCC
CCC
CCC
(TIN P LATING) - Tabulate calculated current at RT, 65°C, 75°C and 95°C
after derating 20% and based on 105°C
(GOLD PLATING) - Tabulate calculated current at RT, 85°C, 95°C and 115°C
after derating 20% and based on 125°C
CCC, Tem p rise = EIA-364-70
Page 8 of 47
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
ATTRIBUTE DEFINITIONS
The following is a brief, simplified description of attributes.
THERMAL SHOCK:
1)
2)
3)
4)
5)
6)
EIA-364-32, Thermal Shock (Temperature Cycling) Test Procedure for Electrical Connectors.
Test Condition 1: -55°C to +85°C
Test Time: ½ hour dwell at each temperature extreme
Number of Cycles: 100
All test samples are pre-conditioned at ambient.
All test samples are exposed to environmental stressing in the mated condition.
THERMAL:
1)
2)
3)
4)
5)
EIA-364-17, Temperature Life with or without Electrical Load Test Procedure for Electrical Connectors.
Test Condition 4 at 105° C.
Test Time Condition B for 250 hours.
All test samples are pre-conditioned at ambient.
All test samples are exposed to environmental stressing in the mated condition.
HUMIDITY:
1)
2)
3)
4)
5)
Reference document: EIA-364-31, Humidity Test Procedure for Electrical Connectors.
Test Condition B, 240 Hours.
Method III, +25° C to + 65° C, 90% to 98% Relative Humidity excluding sub-cycles 7a and 7b.
All samples are pre-conditioned at ambient.
All test samples are exposed to environmental stressing in the mated condition.
MECHANICAL SHOCK (Specified Pulse):
1)
2)
3)
4)
5)
6)
7)
Reference document: EIA-364-27, Mechanical Shock Test Procedure for Electrical Connectors
Test Condition C
Peak Value: 100 G
Duration: 6 Milliseconds
Wave Form: Half Sine
Velocity: 12.3 ft/s
Number of Shocks: 3 Shocks / Direction, 3 Axis (18 Total)
VIBRATION:
1)
2)
3)
4)
5)
6)
Reference document: EIA-364-28, Vibration Test Procedure for Electrical Connectors
Test Condition V, Letter B
Power Spectral Density: 0.04 G² / Hz
G ‘RMS’: 7.56
Frequency: 50 to 2000 Hz
Duration: 2.0 Hours per axis (3 axis total)
NANOSECOND-EVENT DETECTION:
1) Reference document: EIA-364-87, Nanosecond-Event Detection for Electrical Connectors
2) Prior to test, the samples were characterized to assure the low nanosecond event being monitored will trigger
the detector.
3) After characterization it was determined the test samples could be monitored for 50 nanosecond events
CONTACT GAPS:
1) Gaps above the surrounding plastic surface were measured before and after stressing the contacts (e.g.
thermal aging, mechanical cycling, etc.).
2) Typically, all contacts on the connector are measured.
Page 9 of 47
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
ATTRIBUTE DEFINITIONS
The following is a brief, simplified description of attributes.
MATING/UNMATING:
1) Reference document: EIA-364-13, Mating and Unmating Forces Test Procedure for Electrical Connectors.
2) The full insertion position was to within 0.003” to 0.004” of the plug bottoming out in the receptacle to
prevent damage to the system under test.
3) One of the mating parts is secured to a floating X-Y table to prevent damage during cycling.
NORMAL FORCE (FOR CONTACTS TESTED IN THE HOUSING):
1) Reference document: EIA-364-04, Normal Force Test Procedure for Electrical Connectors.
2) The contacts shall be tested in the connector housing.
3) If necessary, a “window” shall be made in the connector body to allow a probe to engage and deflect the
contact at the same attitude and distance (plus 0.05 mm [0.002”]) as would occur in actual use.
4) The connector housing shall be placed in a holding fixture that does not interfere with or otherwise influence
the contact force or deflection.
5) Said holding fixture shall be mounted on a floating, adjustable, X-Y table on the base of the Dillon TC2,
computer controlled test stand with a deflection measurement system accuracy of 5.0 µm (0.0002”).
6) The nominal deflection rate shall be 5 mm (0.2”)/minute.
7) Unless otherwise noted a minimum of five contacts shall be tested.
8) The force/deflection characteristic to load and unload each contact shall be repeated five times.
9) The system shall utilize the TC2 software in order to acquire and record the test data.
10) The permanent set of each contact shall be measured within the TC2 software.
11) The acquired data shall be graphed with the deflection data on the X-axis and the force data on the Y-axis
and a print out will be stored with the Tracking Code paperwork.
INSULATION RESISTANCE (IR):
To determine the resistance of insulation materials to leakage of current through or on the surface of these
materials when a DC potential is applied.
1) PROCEDURE:
a. Reference document: EIA-364-21, Insulation Resistance Test Procedure for Electrical Connectors.
b. Test Conditions:
i. Between Adjacent Contacts or Signal-to-Ground
ii. Electrification Time 2.0 minutes
iii. Test Voltage (500 VDC) corresponds to calibration settings for measuring resistances.
2) MEASUREMENTS:
3) When the specified test voltage is applied (VDC), the insulation resistance shall not be less than 5000
megohms.
Page 10 of 47
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
ATTRIBUTE DEFINITIONS
The following is a brief, simplified description of attributes.
DIELECTRIC WITHSTANDING VOLTAGE (DWV):
To determine if the sockets can operate at its rated voltage and withstand momentary over potentials due to
switching, surges, and other similar phenomenon. Separate samples are used to evaluate the effect of
environmental stresses so not to influence the readings from arcing that occurs during the measurement
process.
1) PROCEDURE:
a. Reference document: EIA-364-20, Withstanding Voltage Test Procedure for Electrical Connectors.
b. Test Conditions:
i. Between Adjacent Contacts or Signal-to-Ground
ii. Rate of Application 500 V/Sec
iii. Test Voltage (VAC) until breakdown occurs
2) MEASUREMENTS/CALCULATIONS
a. The breakdown voltage shall be measured and recorded.
b. The dielectric withstanding voltage shall be recorded as 75% of the minimum breakdown voltage.
c. The working voltage shall be recorded as one-third (1/3) of the dielectric withstanding voltage (onefourth of the breakdown voltage)..
TEMPERATURE RISE (Current Carrying Capacity, CCC):
1) EIA-364-70, Temperature Rise versus Current Test Procedure for Electrical Connectors and Sockets.
2
2) When current passes through a contact, the temperature of the contact increases as a result of I R (resistive)
heating.
3) The number of contacts being investigated plays a significant part in power dissipation and therefore
temperature rise.
4) The size of the temperature probe can affect the measured temperature.
5) Copper traces on PC boards will contribute to temperature rise:
a. Self heating (resistive)
b. Reduction in heat sink capacity affecting the heated contacts
6) A de-rating curve, usually 20%, is calculated.
7) Calculated de-rated currents at three temperature points are reported:
a. Ambient
о
b. 80 C
о
c. 95 C
о
d. 115 C
8) Typically, neighboring contacts (in close proximity to maximize heat build up) are energized.
9) The thermocouple (or temperature measuring probe) will be positioned at a location to sense the maximum
temperature in the vicinity of the heat generation area.
10) A computer program, TR 803.exe, ensures accurate stability for data acquisition.
11) Hook-up wire cross section is larger than the cross section of any connector leads/PC board traces, jumpers,
etc.
12) Hook-up wire length is longer than the minimum specified in the referencing standard.
Page 11 of 47
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
ATTRIBUTE DEFINITIONS
The following is a brief, simplified description of attributes.
LLCR:
1) EIA-364-23, Low Level Contact Resistance Test Procedure for Electrical Connectors and Sockets.
2) A computer program, LLCR 221.exe, ensures repeatability for data acquisition.
3) The following guidelines are used to categorize the changes in LLCR as a result from stressing
a. <= +5.0 mOhms: --------------------------- Stable
b. +5.1 to +10.0 mOhms:--------------------- Minor
c. +10.1 to +15.0 mOhms: ------------------- Acceptable
d. +15.1 to +50.0 mOhms: ------------------- Marginal
e. +50.1 to +2000 mOhms: ------------------ Unstable
f. >+2000 mOhms:---------------------------- Open Failure
GAS TIGHT:
1)
2)
3)
4)
To provide method for evaluating the ability of the contacting surfaces in preventing penetration of harsh
vapors which might lead to oxide formation that may degrade the electrical performance of the contact
system.
EIA-364-23, Low Level Contact Resistance Test Procedure for Electrical Connectors and Sockets.
A computer program, LLCR 221.exe, ensures repeatability for data acquisition.
The following guidelines are used to categorize the changes in LLCR as a result from stressing
a. <= +5.0 mOhms: --------------------------- Stable
b. +5.1 to +10.0 mOhms:--------------------- Minor
c. +10.1 to +15.0 mOhms: ------------------- Acceptable
d. +15.1 to +50.0 mOhms: ------------------- Marginal
e. +50.1 to +2000 mOhms: ------------------ Unstable
f. >+2000 mOhms:---------------------------- Open Failure
Procedure:
a. Reference document: EIA-364-36, Test Procedure for Determination of Gas-Tight Characteristics
for Electrical Connectors, Sockets and/or Contact Systems.
b. Test Conditions:
i. Class II--- Mated pairs of contacts assembled to their plastic housings.
ii. Reagent grade Nitric Acid shall be used of sufficient volume to saturate the test chamber
iii. The ratio of the volume of the test chamber to the surface area of the acid shall be 10:1.
iv. The chamber shall be saturated with the vapor for at least 15 minutes before samples are
added.
v. Exposure time, 55 to 65 minutes.
vi. The samples shall be no closer to the chamber walls than 1 inches and no closer to the
surface of the acid than 3 inches.
vii. The samples shall be dried after exposure for a minimum of 1 hour.
о
viii. Drying temperature 50 C
ix. The final LLCR shall be conducted within 1 hour after drying.
Page 12 of 47
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
RESULTS
Temperature Rise, CCC at a 20% de-rating
• CCC for a 30°C Temperature Rise ---------------1.6 A per contact
• CCC for a 30°C Temperature Rise ---------------1.3 A per contact
• CCC for a 30°C Temperature Rise ---------------1.1 A per contact
• CCC for a 30°C Temperature Rise ---------------0.9 A per contact
• CCC for a 30°C Temperature Rise ---------------0.6 A per contact
Contact Gaps
Mating&Unmating durability
• Initial
o Min-------------------------------------------------- 0.324 mm
o Max ------------------------------------------------- 0.420 mm
• After 100 Cycles
o Min-------------------------------------------------- 0.386 mm
o Max ------------------------------------------------- 0.470 mm
Thermal aging
• Initial
o Min-------------------------------------------------- 0.328 mm
o Max ------------------------------------------------- 0.404 mm
• After thermal aging
o Min-------------------------------------------------- 0.408 mm
o Max ------------------------------------------------- 0.500 mm
Page 13 of 47
with 2 adjacent contacts powered
with 4 adjacent contacts powered
with 6 adjacent contacts powered
with 8 adjacent contacts powered
with all adjacent contacts powered
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
RESULTS Continued
Mating – Unmating force
Mating&Unmating durability
• Initial
o Mating
ƒ Min --------------------------------------- 3.57 Lbs
ƒ Max--------------------------------------- 6.31 Lbs
o Unmating
ƒ Min --------------------------------------- 2.05 Lbs
ƒ Max--------------------------------------- 2.95 Lbs
• After 25 Cycles
o Mating
ƒ Min --------------------------------------- 3.13 Lbs
ƒ Max--------------------------------------- 5.73 Lbs
o Unmating
ƒ Min --------------------------------------- 1.87 Lbs
ƒ Max--------------------------------------- 2.58 Lbs
• After 50 Cycles
o Mating
ƒ Min --------------------------------------- 3.06 Lbs
ƒ Max--------------------------------------- 5.34 Lbs
o Unmating
ƒ Min --------------------------------------- 1.68 Lbs
ƒ Max--------------------------------------- 2.51 Lbs
• After 75 Cycles
o Mating
ƒ Min --------------------------------------- 3.04 Lbs
ƒ Max--------------------------------------- 4.56 Lbs
o Unmating
ƒ Min --------------------------------------- 1.72 Lbs
ƒ Max--------------------------------------- 2.43 Lbs
• After 100 Cycles
o Mating
ƒ Min --------------------------------------- 3.09 Lbs
ƒ Max--------------------------------------- 4.04 Lbs
o Unmating
ƒ Min --------------------------------------- 1.81 Lbs
ƒ Max--------------------------------------- 2.16 Lb
• After Humidity
o Mating
ƒ Min --------------------------------------- 1.96 Lbs
ƒ Max--------------------------------------- 3.31 Lbs
o Unmating
ƒ Min --------------------------------------- 1.14 Lbs
ƒ Max--------------------------------------- 1.92 Lbs
Page 14 of 47
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
RESULTS Continued
Thermal aging
• Initial
o Mating
ƒ Min --------------------------------------- 5.51 Lbs
ƒ Max--------------------------------------- 6.50 Lbs
o Unmating
ƒ Min --------------------------------------- 2.58 Lbs
ƒ Max--------------------------------------- 3.33 Lbs
• After thermal aging
o Mating
ƒ Min --------------------------------------- 2.60 Lbs
ƒ Max--------------------------------------- 4.59 Lbs
o Unmating
ƒ Min --------------------------------------- 1.57 Lbs
ƒ Max--------------------------------------- 3.45 Lbs
LLCR Durability (192 pin LLCR test points)
• Initial --------------------------------------------------------------- 30.1 mOhms Max
• After 100 Cycles
o <= +5.0 mOhms ----------------------------------- 192 Points ------------------------- Stable
o +5.1 to +10.0 mOhms -----------------------------------0 Points ------------------------- Minor
o +10.1 to +15.0 mOhms ---------------------------------0 Points ------------------------- Acceptable
o +15.1 to +50.0 mOhms ---------------------------------0 Points ------------------------- Marginal
o +50.1 to +2000 mOhms---------------------------------0 Points ------------------------- Unstable
o >+2000 mOhms ------------------------------------------0 Points ------------------------- Open Failure
• After thermal shock
o <= +5.0 mOhms ----------------------------------- 192 Points ------------------------- Stable
o +5.1 to +10.0 mOhms -----------------------------------0 Points ------------------------- Minor
o +10.1 to +15.0 mOhms ---------------------------------0 Points ------------------------- Acceptable
o +15.1 to +50.0 mOhms ---------------------------------0 Points ------------------------- Marginal
o +50.1 to +2000 mOhms---------------------------------0 Points ------------------------- Unstable
o >+2000 mOhms ------------------------------------------0 Points ------------------------- Open Failure
• After humidity
o <= +5.0 mOhms ----------------------------------- 188 Points ------------------------- Stable
o +5.1 to +10.0 mOhms -----------------------------------4 Points ------------------------- Minor
o +10.1 to +15.0 mOhms ---------------------------------0 Points ------------------------- Acceptable
o +15.1 to +50.0 mOhms ---------------------------------0 Points ------------------------- Marginal
o +50.1 to +2000 mOhms---------------------------------0 Points ------------------------- Unstable
o >+2000 mOhms ------------------------------------------0 Points ------------------------- Open Failure
LLCR Thermal Aging (192 pin LLCR test points)
• Initial --------------------------------------------------------------- 29.5 mOhms Max
• Thermal aging
o <= +5.0 mOhms ----------------------------------- 192 Points ------------------------- Stable
o +5.1 to +10.0 mOhms -----------------------------------0 Points ------------------------- Minor
o +10.1 to +15.0 mOhms ---------------------------------0 Points ------------------------- Acceptable
o +15.1 to +50.0 mOhms ---------------------------------0 Points ------------------------- Marginal
o +50.1 to +2000 mOhms---------------------------------0 Points ------------------------- Unstable
o >+2000 mOhms ------------------------------------------0 Points ------------------------- Open Failure
Page 15 of 47
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
RESULTS Continued
LLCR Gas Tight (192 pin LLCR test points)
• Initial --------------------------------------------------------------- 29.0 mOhms Max
• Gas-Tight
o <= +5.0 mOhms ----------------------------------- 189 Points ------------------------- Stable
o +5.1 to +10.0 mOhms -----------------------------------3 Points ------------------------- Minor
o +10.1 to +15.0 mOhms ---------------------------------0 Points ------------------------- Acceptable
o +15.1 to +50.0 mOhms ---------------------------------0 Points ------------------------- Marginal
o +50.1 to +2000 mOhms---------------------------------0 Points ------------------------- Unstable
o >+2000 mOhms ------------------------------------------0 Points ------------------------- Open Failure
LLCR Mechanical shock&Vibration (192 pin LLCR test points)
• Initial --------------------------------------------------------------- 30.2mOhms Max
• Shock&Vibration:
o <= +5.0 mOhms ----------------------------------- 192 Points ------------------------- Stable
o +5.1 to +10.0 mOhms -----------------------------------0 Points ------------------------- Minor
o +10.1 to +15.0 mOhms ---------------------------------0 Points ------------------------- Acceptable
o +15.1 to +50.0 mOhms ---------------------------------0 Points ------------------------- Marginal
o +50.1 to +2000 mOhms---------------------------------0 Points ------------------------- Unstable
o >+2000 mOhms ------------------------------------------0 Points ------------------------- Open Failure
Insulation Resistance minimums, IR
• Initial
o Mated------------------------------------------------- 5810Meg Ω ------------------------- Pass
o Unmated --------------------------------------------- 5800Meg Ω ------------------------ Pass
• Thermal
o Mated------------------------------------------------- 6540Meg Ω ------------------------ Pass
o Unmated --------------------------------------------- 5680Meg Ω ------------------------ Pass
• Humidity
o Mated------------------------------------------------- 6758Meg Ω ------------------------ Pass
o Unmated --------------------------------------------- 6550Meg Ω ------------------------ Pass
Dielectric Withstanding Voltage minimums, DWV
• Minimums
o Breakdown Voltage ----------------------------------950VAC
o Test Voltage -------------------------------------------713VAC
o Working Voltage -------------------------------------238VAC
• Initial DWV --------------------------------------------------Passed
• Thermal DWV-----------------------------------------------Passed
• Humidity DWV----------------------------------------------Passed
Mechanical Shock & Random Vibration:
o Shock
ƒ No Damage ----------------------------------- ---------------------------------- Passed
ƒ 50 Nanoseconds ------------------------------ ---------------------------------- Passed
o Vibration
ƒ No Damage ----------------------------------- ---------------------------------- Passed
ƒ 50 Nanoseconds ------------------------------ ---------------------------------- Passed
Page 16 of 47
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
DATA SUMMARIES
TEMPERATURE RISE (Current Carrying Capacity, CCC):
1) High quality thermocouples whose temperature slopes track one another were used for temperature
monitoring.
2) The thermocouples were placed at a location to sense the maximum temperature generated during testing.
3) Temperature readings recorded are those for which three successive readings, 15 minutes apart, differ less
than 1° C (computer controlled data acquisition).
4) Adjacent contacts were powered:
a. Linear configuration with 2 adjacent conductors/contacts powered
Base Curve
132820
2(2x1) Contacts in Linear series
Part Numbers: QSFP-038-01-L-D-RA1/QSFP-Mating Board
Derated 20 %
RT Peak Amp
RT Derated Amp
Measured Current
85 ° C
Current Rating per Contact (30 Deg. Rise, 20% Derated) = 1.6 Amps
4.0
85 ° C Peak Amp
Room Temp= 22.8 C
85 ° C Derated Amp
3.6
95 ° C
3.5
95 ° C Peak Amp
Maximum Current, Amp per Contact
95 ° C Derated Amp
Limit
3.0
115 ° C Peak Amp
2.9
115 ° C Derated Amp
115 ° C
2.5
Room Temp
125° C
Limit
2.3
2.0
1.9
1.8
1.6
1.5
1.1
1.0
0.9
Useful Range
0.5
0.0
20
40
60
80
100
120
140
Ambient Temperature, ° C
b. Linear configuration with 4 adjacent conductors/contacts powered
Base Curve
132820
4(2x2) Contacts in Linear series
Part Numbers: QSFP-038-01-L-D-RA1/QSFP-Mating Board
Derated 20 %
RT Peak Amp
RT Derated Amp
Measured Current
85 ° C
Current Rating per Contact (30 Deg. Rise, 20% Derated) = 1.3 Amps
3.5
85 ° C Peak Amp
Room Temp= 23.7 C
85 ° C Derated Amp
95 ° C
Maximum Current, Amp per Contact
3.0
95 ° C Peak Amp
3.0
95 ° C Derated Amp
Limit
115 ° C Peak Amp
2.5
115 ° C Derated Amp
2.4
115 ° C
Room Temp
125° C
Limit
2.0
1.8
1.6
1.5
1.5
1.3
1.0
0.9
0.7
Useful Range
0.5
0.0
20
40
60
80
Ambient Temperature, ° C
Page 17 of 47
100
120
140
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
DATA SUMMARIES
c. Linear configuration with 6 adjacent conductors/contacts powered
Base Curve
132820
6(2x3) Contacts in Linear series
Part Numbers: QSFP-038-01-L-D-RA1/QSFP-Mating Board
Derated 20 %
RT Peak Amp
RT Derated Amp
Measured Current
85 ° C
Current Rating per Contact (30 Deg. Rise, 20% Derated) = 1.1 Amps
3.0
85 ° C Peak Amp
Room Temp= 23.2 C
85 ° C Derated Amp
95 ° C
2.5
Maximum Current, Amp per Contact
95 ° C Peak Amp
2.5
95 ° C Derated Amp
Limit
115 ° C Peak Amp
115 ° C Derated Amp
2.0
2.0
115 ° C
Room Temp
125° C
Limit
1.6
1.5
1.4
1.3
1.1
1.0
0.8
0.6
0.5
Useful Range
0.0
20
40
60
80
100
120
140
Ambient Temperature, ° C
d. Linear configuration with 8 adjacent conductors/contacts powered
Base Curve
132820
8(2x4) Contacts in Linear series
Part Numbers: QSFP-038-01-L-D-RA1/QSFP-Mating Board
Derated 20 %
RT Peak Amp
RT Derated Amp
Measured Current
85 ° C
Current Rating per Contact (30 Deg. Rise, 20% Derated) = 0.9 Amps
2.5
85 ° C Peak Amp
Room Temp= 23.6 C
85 ° C Derated Amp
95 ° C
2.2
95 ° C Peak Amp
95 ° C Derated Amp
Maximum Current, Amp per Contact
2.0
Limit
115 ° C Peak Amp
1.8
115 ° C Derated Amp
115 ° C
1.5
Room Temp
125° C
Limit
1.4
1.2
1.1
1.0
0.9
0.7
0.5
0.5
Useful Range
0.0
20
40
60
80
Ambient Temperature, ° C
Page 18 of 47
100
120
140
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
DATA SUMMARIES
e. Linear configuration with all adjacent conductors/contacts powered
Base Curve
132820
38(All) Contacts in Linear series
Part Numbers: QSFP-038-01-L-D-RA1/QSFP-Mating Board
Derated 20 %
RT Peak Amp
RT Derated Amp
Measured Current
Current Rating per Contact (30 Deg. Rise, 20% Derated) = 0.6 Amps
85 ° C
1.6
85 ° C Peak Amp
Room Temp= 23.7 C
85 ° C Derated Amp
95 ° C
1.4
95 ° C Peak Amp
1.4
Maximum Current, Amp per Contact
95 ° C Derated Amp
Limit
1.2
115 ° C Peak Amp
115 ° C Derated Amp
1.1
115 ° C
1.0
Room Temp
125° C
Limit
0.9
0.8
0.7
0.7
0.6
0.6
0.4
0.4
0.3
Useful Range
0.2
0.0
20
40
60
80
Ambient Temperature, ° C
Page 19 of 47
100
120
140
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
DATA SUMMARIES
CONTACT GAPS:
Mating&Unmating durability:
Initial
Units:
Minimum
Maximum
Average
St. Dev.
Count
mm
0.3240
0.4200
0.3552
0.0197
64
After 100 Cycles
Units:
mm
0.3860
Minimum
0.4700
Maximum
0.4129
Average
0.0190
St. Dev.
64
Count
mm
0.3280
0.4040
0.3557
0.0164
64
After Thermal
Units:
mm
0.4080
Minimum
0.5000
Maximum
0.4596
Average
0.0190
St. Dev.
64
Count
Thermal aging:
Initial
Units:
Minimum
Maximum
Average
St. Dev.
Count
MATING/UNMATING FORCE:
Mating/Unmating durability:
Initial
After 25 Cycles
Mating
Minimum
Maximum
Average
S t Dev
Count
Unmating
Mating
Newtons
Force (Lbs)
Newtons
Force (Lbs)
Newtons
Force (Lbs)
Newtons
Force (Lbs)
15.89
28.05
22.01
3.57
6.31
4.95
9.12
13.14
11.11
2.05
2.95
2.50
13.93
25.50
19.46
3.13
5.73
4.37
8.34
11.48
9.81
1.87
2.58
2.21
4.39
8
0.99
8
1.45
8
0.33
8
4.26
8
0.96
8
1.11
8
0.25
8
After 50 Cycles
Mating
Minimum
Maximum
Average
S t Dev
Count
Unm ating
After 75 Cycles
Unmating
Mating
Unm ating
Newtons
Force (Lbs)
Newtons
Force (Lbs)
Newtons
Force (Lbs)
Newtons
Force (Lbs)
13.63
23.73
17.20
3.06
5.34
3.87
7.45
11.18
9.02
1.68
2.51
2.03
13.53
20.30
16.22
3.04
4.56
3.65
7.65
10.79
8.86
1.72
2.43
1.99
3.77
8
0.85
8
1.28
8
0.29
8
2.61
8
0.59
8
1.01
8
0.23
8
After 100 C ycles
Mating
After Humidity
Unmating
Mating
Unm ating
Newtons
Force (Lbs)
Newtons
Force (Lbs)
Newtons
Force (Lbs)
Newtons
Force (Lbs)
Minimum
13.73
3.09
8.04
1.81
8.73
1.96
5.07
1.14
Maximum
17.95
15.57
1.65
8
4.04
3.50
0.37
8
9.61
8.72
0.59
8
2.16
1.96
0.13
8
14.71
12.46
2.17
8
3.31
2.80
0.49
8
8.53
7.67
1.17
8
1.92
1.72
0.26
8
Average
S t Dev
Count
Page 20 of 47
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
DATA SUMMARIES
Thermal aging:
Initial
After Thermals
Mating
Minimum
Maximum
Average
S t Dev
Count
Unmating
Mating
Unm ating
Newtons
Force (Lbs)
Newtons
Force (Lbs)
Newtons
Force (Lbs)
Newtons
Force (Lbs)
24.52
28.93
27.36
5.51
6.50
6.15
11.48
14.81
13.36
2.58
3.33
3.00
11.57
20.40
17.54
2.60
4.59
3.94
6.96
15.35
9.34
1.57
3.45
2.10
1.65
8
0.37
8
1.27
8
0.29
8
3.10
8
0.70
8
2.91
8
0.65
8
INSULATION RESISTANCE (IR):
Pin to Pin
Minimum
Mated
QSFP/Mating Board
Unmated
QSFP
Unmated
Mating Board
5810
6540
5800
5680
Not Tested
Not Tested
6758
6550
Not Tested
Initial
Thermal
Humidity
DIELECTRIC WITHSTANDING VOLTAGE (DWV):
Voltage R ating Summary
Minimum
QSFP/Mating Board
950
Break Down Voltage
Test Voltage
713
238
Working Voltage
Pin to Pin
Initial Test Voltage
After Thermal Test Voltage
After Humidity Test Voltage
Page 21 of 47
Passed
Passed
Passed
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
DATA SUMMARIES
LLCR Durability:
1)
2)
3)
4)
A total of 192 points were measured.
EIA-364-23, Low Level Contact Resistance Test Procedure for Electrical Connectors and Sockets.
A computer program, LLCR 221.exe, ensures repeatability for data acquisition.
The following guidelines are used to categorize the changes in LLCR as a result from stressing.
a. <= +5.0 mOhms: --------------------------- Stable
b. +5.1 to +10.0 mOhms:--------------------- Minor
c. +10.1 to +15.0 mOhms: ------------------- Acceptable
d. +15.1 to +50.0 mOhms: ------------------- Marginal
e. +50.1 to +2000 mOhms ------------------- Unstable
f. >+2000 mOhms:---------------------------- Open Failure
Date
Room Temp C
RH
Name
mOhm values
Average
St. Dev.
Min
Max
Count
4/6/2011
23
45%
Peter Chen
Actual
Initial
25.0
2.5
19.4
30.1
192
4/11/2011
24
50%
Peter Chen
Delta
100 Cycles
-0.2
1.2
-4.4
4.5
192
4/23/2011
23
50%
Peter Chen
Delta
Thermal
0.3
1.4
-3.7
4.3
192
How many samples are being tested?
How many contacts are on each board?
100 Cycles
Thermal
Humidity
Stable
192
192
188
Minor
0
0
4
Acceptable
0
0
0
Page 22 of 47
Marginal
0
0
0
5/3/2011
23
51%
Peter Chen
Delta
Humidity
0.9
1.6
-3.5
5.5
192
8
24
Unstable
0
0
0
Open
0
0
0
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
DATA SUMMARIES Continued
GAS TIGHT:
1)
2)
3)
4)
A total of 192 points were measured.
EIA-364-23, Low Level Contact Resistance Test Procedure for Electrical Connectors and Sockets.
A computer program, LLCR 221.exe, ensures repeatability for data acquisition.
The following guidelines are used to categorize the changes in LLCR as a result from stressing.
a. <= +5.0 mOhms: --------------------------- Stable
b. +5.1 to +10.0 mOhms:--------------------- Minor
c. +10.1 to +15.0 mOhms: ------------------- Acceptable
d. +15.1 to +50.0 mOhms: ------------------- Marginal
e. +50.1 to +2000 mOhms: ------------------ Unstable
f. >+2000 mOhms:---------------------------- Open Failure
Date
Room Temp C
RH
Name
mOhm values
Average
St. Dev.
Min
Max
Count
4/25/2011
23
45%
Peter Chen
Actual
Initial
23.8
2.5
18.2
29.0
192
How many samples are being tested?
How many contacts are on each board?
Gas Tight
Stable
189
Minor
3
Acceptable
0
Marginal
0
Page 23 of 47
5/5/2011
23
50%
Peter Chen
Delta
Gas Tight
1.9
1.5
-2.6
6.3
192
8
24
Unstable
0
Open
0
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
DATA SUMMARIES Continued
Thermal Aging:
5)
6)
7)
8)
A total of 192 points were measured.
EIA-364-23, Low Level Contact Resistance Test Procedure for Electrical Connectors and Sockets.
A computer program, LLCR 221.exe, ensures repeatability for data acquisition.
The following guidelines are used to categorize the changes in LLCR as a result from stressing.
a. <= +5.0 mOhms: --------------------------- Stable
b. +5.1 to +10.0 mOhms:--------------------- Minor
c. +10.1 to +15.0 mOhms: ------------------- Acceptable
d. +15.1 to +50.0 mOhms: ------------------- Marginal
e. +50.1 to +2000 mOhms: ------------------ Unstable
f. >+2000 mOhms:---------------------------- Open Failure
Date
Room Temp C
RH
Name
mOhm values
Average
St. Dev.
Min
Max
Count
4/18/2011
23
50%
Peter Chen
Actual
Initial
25.4
2.6
19.7
29.5
192
4/27/2011
23
46%
Peter Chen
Delta
Thermal Age
-0.7
0.8
-4.3
1.4
192
How many samples are being tested?
How many contacts are on each board?
Thermal Age
Stable
192
Minor
0
Acceptable
0
Page 24 of 47
Marginal
0
8
24
Unstable
0
Open
0
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
DATA SUMMARIES Continued
LLCR Shock/Vibration:
9) A total of 192 points were measured.
10) EIA-364-23, Low Level Contact Resistance Test Procedure for Electrical Connectors and Sockets.
11) A computer program, LLCR 221.exe, ensures repeatability for data acquisition.
12) The following guidelines are used to categorize the changes in LLCR as a result from stressing.
a. <= +5.0 mOhms: --------------------------- Stable
b. +5.1 to +10.0 mOhms:--------------------- Minor
c. +10.1 to +15.0 mOhms: ------------------- Acceptable
d. +15.1 to +50.0 mOhms: ------------------- Marginal
e. +50.1 to +2000 mOhms: ------------------ Unstable
f. >+2000 mOhms:---------------------------- Open Failure
Date
Room Temp C
RH
Name
mOhm values
Average
St. Dev.
Min
Max
Count
5/25/2011
23
48%
Tony Wagoner
Actual
Initial
24.5
2.4
18.9
30.2
192
5/31/2011
22
45%
Tony Wagoner
Delta
Shock / Vibe
-0.3
0.4
-2.8
0.9
192
How many samples are being tested?
How many contacts are on each board?
Shock / Vibe
Stable
192
Minor
0
Acceptable
0
Marginal
0
Page 25 of 47
8
24
Unstable
0
Open
192
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
DATA
CONTACT GAPS
Mating&Unmating durability
Initial
Units: mm
Pos.# B1
B2
0.3540
0.4020
1
0.3520
0.3620
2
0.3540
0.3460
3
0.3480
0.3460
4
0.3340
0.3420
5
0.3440
0.3540
6
0.3240
0.3660
7
0.3840
0.3580
8
After 100 cycles
Units: mm
Pos.# B1
B2
0.464
0.47
1
0.45
0.448
2
0.438
0.424
3
0.424
0.42
4
0.424
0.42
5
0.428
0.392
6
0.424
0.402
7
0.4
0.406
8
B3
0.3640
0.3520
0.3520
0.3540
0.3420
0.3420
0.3580
0.4040
B4
0.4000
0.3680
0.3380
0.3420
0.3460
0.3480
0.3560
0.3680
B5
0.3520
0.3420
0.3420
0.3340
0.3260
0.3420
0.3520
0.3840
B6
0.4060
0.3520
0.3380
0.3640
0.3400
0.4200
0.3520
0.3620
B7
0.3860
0.3420
0.3440
0.3400
0.3480
0.3440
0.3460
0.3600
B8
0.3820
0.3540
0.3360
0.3520
0.3340
0.3440
0.3540
0.3560
B3
0.422
0.414
0.41
0.406
0.388
0.406
0.396
0.402
B4
0.406
0.396
0.396
0.388
0.386
0.386
0.422
0.436
B5
B6
0.438
0.424
0.422
0.416
0.42
0.402
0.406
0.45
B7
B8
0.412
0.4
0.394
0.392
0.394
0.392
0.4
0.402
0.4
0.404
0.396
0.402
0.404
0.404
0.396
0.405
0.44
0.404
0.428
0.4
0.406
0.428
0.418
0.43
Thermal aging
Pos.#
1
2
3
4
5
6
7
8
Pos.#
1
2
3
4
5
6
7
8
Initial
Units: mm
B1
B2
0.4040
0.3480
0.3640
0.3380
0.3500
0.3480
0.3480
0.3600
0.3400
0.3560
0.3400
0.3540
0.3380
0.3980
0.3520
0.3600
After Thermal
Units: mm
B1
B2
0.4760
0.4780
0.4560
0.4560
0.4500
0.4780
0.4640
0.4580
0.4380
0.4640
0.4400
0.4680
0.4360
0.4540
0.4640
0.4600
B3
0.3760
0.3360
0.3440
0.3440
0.3360
0.3440
0.3460
0.3740
B4
0.3500
0.3500
0.3540
0.3440
0.3300
0.3380
0.3540
0.3880
B5
0.3900
0.3540
0.3420
0.3540
0.3500
0.3640
0.3560
0.3500
B6
0.3600
0.3460
0.3500
0.3520
0.3480
0.3540
0.3380
0.3460
B7
0.3720
0.3960
0.3660
0.3280
0.3420
0.3620
0.3520
0.3660
B8
0.3780
0.3660
0.3680
0.3600
0.3440
0.3580
0.3580
0.3880
B3
0.4640
0.4580
0.4440
0.4420
0.4320
0.4460
0.4440
0.4400
B4
0.4920
0.4720
0.4500
0.4520
0.4560
0.4420
0.4500
0.4480
B5
0.4600
0.4120
0.4080
0.4900
0.4880
0.4720
0.4720
0.4640
B6
0.4220
0.4940
0.4840
0.4600
0.4720
0.4660
0.4540
0.4640
B7
0.5000
0.4780
0.4720
0.4600
0.4760
0.4740
0.4660
0.4560
B8
0.4080
0.4840
0.4700
0.4660
0.4580
0.4740
0.4700
0.4660
Page 26 of 47
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
DATA continued
MATING/UNMATING FORCE
Mating/Unmating durability:
After 75 Cycles
After 100 Cycles
Sample#
Mating
Initial
Unmating
Mating
After 25 Cycles
Unmating
Mating
After 50 Cycles
Unmating
Mating
Unmating
Mating
Unmating
Mating
Unmating
1
3.70
2.05
3.33
2.03
3.06
1.90
3.04
1.92
3.09
2.09
2.87
1.14
2
4.48
2.47
3.13
2.29
3.44
1.68
3.29
1.72
3.31
1.81
2.62
1.57
3
5.91
2.95
5.73
2.51
5.34
2.51
4.56
2.43
4.04
2.01
2.29
1.81
4
3.57
2.14
3.46
1.87
3.44
1.87
3.35
1.87
3.31
1.83
1.96
1.76
5
5.16
2.54
4.43
2.25
4.19
2.18
3.97
1.98
3.79
1.81
2.84
1.81
6
4.92
2.37
4.96
2.07
3.20
1.76
3.18
1.83
3.20
1.98
3.20
1.87
7
6.31
2.93
4.83
2.03
3.37
2.01
3.37
1.96
3.31
1.98
3.31
1.92
8
5.53
2.54
5.12
2.58
4.90
2.32
4.41
2.23
3.97
2.16
3.31
1.92
Thermal aging:
Initial
After Thermals
Sample#
1
Mating
Unmating
Mating
Unmating
5.89
2.58
3.35
1.57
2
3
6.42
6.20
3.02
2.91
4.30
2.60
1.85
1.76
4
5
6
5.51
6.50
5.82
2.62
3.20
3.06
3.90
3.77
4.45
1.57
2.18
2.65
7
8
6.37
6.50
3.31
3.33
4.59
4.59
1.76
3.45
Page 27 of 47
After Humidity
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
DATA continued
DIELECTRIC WITHSTANDING VOLTAGE (DWV):
Initial Breakdown Voltage
Test Voltage Until Breakdown Occurs
Mated
Sample# QSFP/Mating Board
132820-001
950
132820-002
1000
Pin to Pin
A Unmated B
X
QSFP
Mating Board
1200
1200
Initial DWV
Test Voltage= 713
Mated
Sample# QSFP/Mating Board
713
132820-005
132820-006
713
Pin to Pin
A Unmated B
QSFP
Mating Board
713
713
Thermal Test Voltage
Test Voltage= 713
Mated
Sample# QSFP/Mating Board
132820-005
713
713
132820-006
Pin to Pin
A Unmated B
QSFP
Mating Board
713
713
Humidity Test Voltage
Test Voltage= 713
Mated
Sample# QSFP/Mating Board
132820-005
713
713
132820-006
Pin to Pin
A Unmated B
QSFP
Mating Board
713
713
Page 28 of 47
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
DATA continued
INSULATION RESISTANCE (IR):
Initial Insulation Resistance
Measured In Meg Ohms
Mated
X
Sample# QSFP/Mating Board
132820-005
5875
132820-006
5810
Pin to Pin
A Unmated B
X
QSFP
Mating Board
5888
5800
Thermal Insulation Resistance
Measured In Meg Ohms
Mated
X
Sample# QSFP/Mating Board
6540
132820-005
7100
132820-006
Pin to Pin
A Unmated B
X
QSFP
Mating Board
5680
6000
Humidity Insulation Resistance
Measured In Meg Ohms
Mated
X
Sample# QSFP/Mating Board
6758
132820-005
7546
132820-006
Pin to Pin
A Unmated B
X
QSFP
Mating Board
6900
6550
Page 29 of 47
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
DATA Continued
LLCR Durability:
Board
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
mOhm
values
Position
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
P24
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
Actual
Initial
20.3
20.0
20.3
26.0
25.7
25.3
25.5
25.2
25.2
25.1
25.4
25.2
25.3
25.3
25.2
25.4
25.2
25.4
25.4
25.3
25.4
25.7
19.4
19.6
20.8
20.7
21.7
29.7
26.3
28.3
26.4
29.2
26.1
27.6
25.9
25.9
25.8
30.0
27.1
26.0
28.0
26.7
26.0
26.4
27.0
Delta
100 Cycles
-0.2
0.3
0.9
0.6
-0.1
0.3
1.7
-0.1
0.6
0.1
-0.1
0.1
0.0
-0.1
0.0
-0.2
0.0
0.1
-0.1
0.3
0.4
0.2
0.5
0.0
1.0
0.6
-0.2
-3.5
0.1
-2.0
-0.1
-2.9
0.3
-1.5
0.0
0.2
-0.4
-4.4
-1.0
0.4
-2.6
-1.3
-0.2
-0.7
-1.3
Page 30 of 47
Delta
Thermal
0.3
0.7
0.9
3.2
3.0
3.4
4.2
3.8
2.4
0.2
0.0
0.1
-0.1
-0.3
-0.1
-0.6
-0.3
-0.2
-0.5
0.1
0.5
-0.3
0.4
0.7
4.3
-0.1
-0.6
-3.6
-0.2
-2.3
-0.3
-2.4
2.1
-0.5
0.7
1.4
0.0
-3.3
1.9
0.4
-2.0
-0.7
2.5
-0.5
-1.4
Delta
Humidity
1.3
3.3
3.4
0.1
-0.4
0.2
0.6
0.1
-0.1
0.1
-0.1
0.0
0.0
0.2
0.1
0.8
3.3
0.3
1.0
0.1
0.2
0.8
3.0
0.2
5.1
0.1
-0.4
-0.6
2.9
-1.3
1.1
1.5
5.4
-0.1
5.0
5.3
2.3
-3.5
2.3
0.1
-1.9
-1.1
3.6
-0.3
-1.2
Tracking Code: 132820_Report_Rev_1
2
2
2
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
P22
P23
P24
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
P24
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
26.6
20.4
20.1
20.3
20.3
21.4
26.4
25.7
26.2
27.5
26.2
26.3
25.8
26.8
25.8
25.7
27.0
25.8
25.9
25.9
25.5
25.8
26.0
26.3
26.0
20.3
20.1
20.3
20.0
20.5
25.8
25.6
25.5
25.5
25.9
25.5
25.5
25.5
25.4
25.6
25.5
25.6
25.5
25.6
25.4
25.5
25.5
25.8
25.9
20.0
-0.5
0.0
0.1
0.0
0.3
-0.2
-1.3
1.3
-0.4
-1.5
0.4
-0.9
-0.3
-0.5
0.7
1.4
-1.5
-0.3
-0.6
-0.3
0.1
0.2
-0.1
-0.4
-0.1
0.1
0.1
0.0
0.0
0.0
0.1
0.1
0.4
0.0
-0.5
-0.1
-0.1
-0.1
-0.2
-0.2
0.2
0.0
0.0
0.1
0.3
0.1
0.7
0.0
0.4
0.1
Page 31 of 47
0.8
-0.5
-0.2
0.0
-0.1
-0.6
-1.3
2.6
0.0
-1.6
0.8
-1.0
0.4
-0.1
2.4
1.8
-1.4
-0.6
-0.9
-0.6
-0.3
0.2
-0.1
-0.6
-0.4
0.3
-0.2
0.6
1.0
1.3
1.0
0.4
0.9
0.4
-0.3
1.9
0.1
0.0
0.0
0.2
0.2
0.4
0.7
0.0
1.0
2.7
0.9
0.3
1.2
-0.1
1.1
-0.2
-0.3
1.2
0.6
0.3
-0.1
1.5
1.0
-0.5
0.6
0.0
1.0
0.3
0.8
1.1
-0.7
1.0
-0.1
0.5
0.4
0.0
0.4
0.2
0.1
0.3
1.6
0.0
0.2
0.6
2.2
1.1
3.2
0.0
-0.4
3.7
0.5
0.1
0.3
0.3
0.2
0.0
0.8
-0.3
0.1
1.9
0.2
0.6
1.0
-0.1
Tracking Code: 132820_Report_Rev_1
4
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
7
P24
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
P24
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
P24
P1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
19.8
20.7
21.7
21.4
26.0
25.8
26.5
26.4
25.9
26.7
25.8
26.4
26.3
26.5
27.3
27.9
26.6
26.9
26.8
26.4
26.8
26.7
26.1
20.0
20.1
20.1
20.0
20.6
25.5
26.1
25.4
25.8
25.5
25.4
26.0
25.7
25.6
25.5
25.5
25.5
25.4
25.6
25.5
25.4
25.7
25.7
25.9
19.9
20.2
21.0
0.1
0.3
-0.9
0.3
-0.1
-0.2
-1.2
-1.1
-0.5
-0.7
-0.2
-0.6
-0.7
-0.5
-1.3
-1.4
-0.9
-0.4
-1.1
-0.9
-1.3
-0.7
0.4
0.5
-0.1
3.8
1.4
0.3
-0.3
0.0
0.5
0.1
1.4
1.1
0.0
1.5
1.4
1.8
1.1
3.0
0.6
1.9
4.5
1.6
1.8
3.3
1.2
0.4
0.3
-0.5
Page 32 of 47
-0.1
0.6
-0.8
-0.2
0.0
-0.2
-1.3
-1.4
-0.6
-0.5
-0.4
-0.1
-0.5
-0.6
-0.6
-1.7
-1.3
-0.5
0.4
-1.2
-1.7
-0.8
0.4
0.4
0.9
0.3
1.7
0.5
0.9
1.8
1.0
0.9
0.9
0.7
1.8
2.0
1.5
1.6
1.8
0.8
0.9
1.4
3.1
2.4
0.5
1.7
0.1
0.9
0.5
0.8
0.0
0.6
-0.8
0.2
0.5
5.0
0.6
-0.3
0.3
0.6
-0.1
4.3
5.5
-0.4
2.8
0.4
-1.0
2.9
-0.9
-0.6
0.5
0.2
3.8
0.5
0.2
2.4
0.9
1.3
3.1
0.2
0.8
4.8
3.2
2.7
2.7
3.3
2.9
2.3
4.9
3.8
2.1
2.6
3.5
2.2
2.8
4.5
2.0
1.0
2.3
0.7
Tracking Code: 132820_Report_Rev_1
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
P24
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
P24
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
21.1
21.6
26.1
26.2
26.5
25.9
26.3
28.9
26.0
25.5
25.9
25.7
25.8
28.1
26.5
27.2
28.0
29.8
25.1
26.2
26.6
20.4
20.2
20.5
20.6
20.7
25.7
25.6
25.4
25.9
26.9
25.7
25.9
25.5
30.1
25.7
26.2
26.7
26.1
27.3
27.1
26.1
26.2
27.1
25.8
19.7
19.6
-0.6
-0.3
0.2
0.1
-0.7
-0.9
-0.7
-3.2
-0.6
-0.1
-0.4
-0.1
-0.6
-2.6
-1.3
-1.7
-2.4
-4.0
0.6
-0.5
0.8
0.0
-0.4
-0.7
-0.7
-0.2
0.1
-0.1
0.0
-0.6
-1.7
-0.7
-0.7
-0.2
-4.4
-0.6
-0.8
-1.3
-1.0
-2.2
-2.2
0.6
-1.2
-2.1
0.9
0.2
-0.2
Page 33 of 47
0.2
0.4
2.7
2.1
0.1
0.7
0.4
-2.4
3.5
1.1
1.2
2.0
1.3
-0.6
2.8
2.6
0.2
-1.8
3.2
2.9
2.9
3.4
0.2
-0.1
-0.8
-0.1
0.1
0.0
0.2
-0.4
-1.5
-0.5
-0.6
0.5
-3.7
-0.5
-0.2
-1.5
-1.0
-1.6
-1.6
-0.5
-1.3
-2.1
0.7
0.3
0.0
0.6
0.5
1.2
1.6
1.0
1.2
1.5
-1.8
1.2
0.0
0.6
1.2
1.0
-1.2
0.2
0.4
-0.9
-2.8
1.8
1.1
3.7
3.3
0.6
0.4
-0.6
-0.2
-0.2
1.6
2.3
3.0
-1.0
0.3
0.3
1.0
-2.3
-0.2
0.9
-0.5
-0.5
-1.9
-1.5
0.0
-0.6
-2.0
2.4
0.3
-0.1
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
DATA Continued
LLCR Gas Tight
Board
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
mOhm
values
Position
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
P24
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
Actual
Initial
19.7
19.6
20.6
25.6
25.2
27.2
25.2
28.1
25.0
26.5
24.8
24.8
24.7
28.9
26.0
24.9
26.9
25.6
24.8
25.3
25.9
25.5
19.3
19.0
19.2
18.9
19.2
24.9
24.6
24.2
24.4
24.1
24.1
24.0
24.3
24.0
24.2
24.2
24.1
24.3
24.1
24.2
24.2
24.2
24.3
Page 34 of 47
Delta
Gas Tight
0.8
1.4
1.5
0.7
1.2
-0.6
0.8
-2.4
0.9
-0.3
4.0
2.8
2.2
-2.5
-0.3
1.0
-1.3
0.4
1.0
1.0
0.3
0.4
1.1
1.0
1.9
3.4
3.0
-0.9
0.5
2.8
3.0
3.5
3.0
4.3
5.3
4.7
2.4
3.8
3.6
3.6
3.0
3.7
2.4
3.1
0.8
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
2
2
2
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
P22
P23
P24
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
P24
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
24.6
18.2
18.5
19.2
18.9
19.4
24.7
24.5
24.4
24.4
24.8
24.4
24.4
24.4
24.3
24.5
24.4
24.5
24.4
24.5
24.3
24.4
24.4
24.7
24.8
18.9
18.7
19.2
19.2
20.3
25.3
24.6
25.0
26.4
25.0
25.1
24.7
25.7
24.7
24.6
25.8
24.7
24.8
24.8
24.4
24.7
24.9
25.2
24.8
19.2
Page 35 of 47
-0.3
2.2
3.8
2.6
3.5
3.6
4.6
1.8
3.0
1.6
2.4
5.5
1.0
4.2
2.5
3.6
2.9
4.4
4.0
1.7
2.0
3.6
2.6
2.4
2.1
3.6
2.1
3.2
2.9
1.3
4.4
4.2
2.5
1.4
2.1
1.4
3.3
0.4
2.0
1.6
0.3
1.8
2.8
3.6
4.1
2.9
1.0
1.9
3.3
1.6
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
4
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
7
P24
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
P24
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
P24
P1
19.0
19.4
19.5
19.6
24.6
24.5
24.3
24.8
25.8
24.6
24.8
24.4
29.0
24.6
25.1
25.5
25.0
26.2
26.0
24.9
25.1
25.9
24.7
18.6
18.5
19.0
18.9
19.5
24.4
25.0
24.3
24.7
24.4
24.3
24.9
24.6
24.5
24.4
24.4
24.4
24.3
24.5
24.4
24.3
24.6
24.6
24.8
18.8
19.1
19.9
Page 36 of 47
1.3
2.0
2.9
2.9
-0.3
3.7
3.5
2.5
1.7
2.4
1.0
3.1
-2.6
0.9
3.3
1.5
2.4
0.4
-1.3
1.5
1.4
3.1
2.1
2.1
2.7
1.0
1.0
1.8
2.9
0.0
0.8
0.9
0.7
1.1
0.4
0.9
2.7
1.6
1.6
1.9
2.6
2.2
4.0
2.5
1.8
1.2
0.7
1.0
0.3
2.3
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
P24
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
P24
20.0
20.5
25.0
25.1
25.4
24.8
25.2
27.8
24.9
24.4
24.8
24.6
24.7
27.0
25.4
26.1
26.9
28.7
24.0
25.1
25.5
19.3
19.1
19.6
20.6
20.3
24.9
24.7
25.4
25.3
24.7
25.6
24.6
25.3
25.2
25.4
26.2
26.8
25.5
25.7
25.7
25.3
25.7
25.6
24.9
18.9
18.9
Page 37 of 47
1.4
1.7
1.5
1.6
1.3
1.5
3.1
0.2
1.9
4.1
3.6
2.0
3.2
-1.0
0.9
2.5
1.2
-1.3
2.7
2.8
3.3
1.9
1.4
1.6
0.4
6.3
2.7
1.1
0.6
1.8
1.4
0.5
1.9
1.5
2.0
2.3
1.9
1.7
1.1
1.6
1.6
2.2
1.2
-0.3
1.9
3.7
1.9
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
DATA Continued
LLCR Thermal Aging:
mOhm values
Board Position
1 P1
1 P2
1 P3
1 P4
1 P5
1 P6
1 P7
1 P8
1 P9
1 P10
1 P11
1 P12
1 P13
1 P14
1 P15
1 P16
1 P17
1 P18
1 P19
1 P20
1 P21
1 P22
1 P23
1 P24
2 P1
2 P2
2 P3
2 P4
2 P5
2 P6
2 P7
2 P8
2 P9
2 P10
2 P11
2 P12
2 P13
2 P14
2 P15
2 P16
2 P17
2 P18
2 P19
2 P20
2 P21
2 P22
Actual
Initial
20.2
20.4
21.0
26.1
26.9
27.4
25.7
25.4
25.8
27.2
28.4
29.5
29.2
28.9
27.3
28.5
26.6
28.3
26.7
26.1
26.2
26.3
20.1
19.9
21.9
21.5
22.1
27.7
26.8
26.9
26.7
27.3
26.2
26.9
27.1
26.4
27.2
26.5
26.0
26.1
26.0
26.1
26.2
27.1
26.5
26.7
Page 38 of 47
Delta
Thermal Age
-0.6
-0.7
-0.8
-0.9
-1.5
-1.6
-0.3
-0.3
-0.9
-2.3
-3.3
-4.3
-4.2
-3.5
-2.2
-3.0
-1.4
-2.7
-1.1
-0.8
-0.7
-1.0
-0.5
-0.4
-1.3
-1.1
-1.3
-0.6
-1.2
-1.1
-1.0
-0.7
-0.7
-1.1
-0.9
-1.0
-0.9
-1.2
-0.8
-0.9
-0.7
-0.9
-0.8
-1.0
-1.0
0.3
Tracking Code: 132820_Report_Rev_1
2
2
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
P23
P24
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
P24
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
P24
19.7
20.5
20.1
19.9
20.5
25.5
27.4
26.5
25.8
26.3
26.6
26.4
27.9
26.9
27.5
26.2
26.8
25.8
26.3
25.3
27.5
27.1
27.9
27.9
20.1
20.4
21.2
21.1
21.3
26.1
26.1
25.7
26.1
26.2
25.8
26.4
26.0
26.1
25.8
25.5
25.5
25.9
25.7
25.5
25.7
25.7
26.0
25.9
21.6
21.0
Page 39 of 47
-0.2
-0.6
0.5
0.2
0.2
0.8
-0.4
1.4
0.5
-0.1
-0.8
-0.7
-1.2
-1.1
-1.6
-0.1
-0.5
-0.1
0.3
0.0
-0.3
0.1
-1.4
-0.9
0.0
-0.5
-0.4
-0.2
-0.8
-0.3
0.2
-0.5
-0.7
-0.7
-0.5
-0.6
-0.4
-0.7
-0.8
-0.6
-0.4
-0.7
-0.7
-0.7
-0.8
-0.7
-0.9
-1.0
-1.2
-0.6
Tracking Code: 132820_Report_Rev_1
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
7
7
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
P24
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
P24
P1
P2
21.1
21.5
21.6
29.0
27.0
26.6
27.3
29.5
27.5
26.2
26.2
25.6
25.5
25.6
26.5
29.3
27.6
26.3
28.7
27.4
27.4
27.2
20.8
20.4
19.9
20.1
21.0
28.1
26.9
27.0
26.3
26.8
28.5
27.4
27.0
26.5
26.6
27.2
26.8
26.5
27.2
26.5
26.3
26.6
26.9
26.9
19.8
19.7
20.4
21.4
Page 40 of 47
-0.6
-0.9
-0.9
0.4
0.4
0.9
-1.3
-2.9
-1.4
-0.5
-0.6
-0.7
-0.6
-0.6
-1.0
-3.6
-2.0
-1.0
-3.2
-1.7
-1.5
-2.0
-0.5
-0.4
0.1
-0.4
0.4
-1.0
-0.2
-0.8
0.0
-0.5
-1.5
-0.7
0.4
-0.3
-0.2
-0.6
-0.5
-0.7
-0.4
-0.8
-0.5
-0.4
-0.7
-0.3
0.1
0.3
-0.4
-1.0
Tracking Code: 132820_Report_Rev_1
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
P24
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
P24
20.9
25.7
26.7
26.8
26.0
26.2
25.7
26.5
25.7
26.0
27.9
27.3
26.2
25.7
25.6
25.4
25.3
25.8
25.8
25.7
20.1
19.7
21.5
20.4
22.3
27.0
26.3
27.2
26.2
27.2
26.2
26.1
26.0
26.1
26.1
26.8
25.7
26.5
25.9
26.2
25.7
25.7
25.6
25.8
20.5
20.6
Page 41 of 47
-0.4
-0.1
-1.0
-1.2
-0.1
-0.4
0.2
-0.4
-0.3
-0.6
-1.8
-1.3
-0.3
-0.1
-0.1
0.1
0.0
-0.4
-0.4
-0.2
-0.1
0.0
0.0
0.1
-0.3
-0.3
0.3
0.0
0.6
0.0
-0.4
-0.2
-0.3
-0.3
-0.5
-0.4
-0.2
-0.8
-0.6
-0.8
-0.5
-0.5
-0.4
-0.7
-0.1
0.1
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
Data Continued
LLCR shock/vibration:
Board
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
mOhm
values
Actual
Position
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
P24
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
Initial
19.2
19.1
19.6
19.7
20.2
25.3
25.4
24.8
24.3
25.5
25.5
25.0
25.2
25.0
25.9
25.3
25.4
25.0
25.4
25.4
25.6
25.3
25.5
25.4
20.2
20.3
20.1
20.3
19.8
26.5
25.7
25.7
25.3
26.0
26.1
26.2
26.5
25.9
25.9
26.3
25.7
25.6
25.8
25.7
Page 42 of 47
Delta
Shock /
Vibe
-0.3
-0.1
-0.3
-0.5
-0.8
-0.3
-0.3
-0.2
0.6
-0.6
-0.5
-0.4
-0.3
-0.1
-0.6
-0.4
-0.4
-0.3
-0.4
-0.4
-0.7
-0.4
-0.5
-0.4
0.2
-0.2
0.1
-0.4
-0.1
-0.6
-0.4
-0.5
-0.2
-0.8
-0.7
-0.5
-0.9
-0.3
-0.1
-0.2
-0.3
-0.2
-0.4
-0.7
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
2
2
2
2
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
P21
P22
P23
P24
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
P24
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
25.7
25.4
25.4
25.5
19.9
20.1
20.2
20.6
20.3
26.0
26.5
26.4
26.5
26.2
25.7
25.9
25.7
25.2
25.7
25.5
25.8
25.8
25.6
25.7
25.6
25.7
25.5
25.6
19.8
20.3
20.2
19.8
19.9
25.6
25.9
25.7
26.2
25.7
26.4
26.2
25.9
26.0
26.0
25.9
26.0
25.5
25.5
25.4
25.9
25.7
Page 43 of 47
0.2
-0.3
0.0
-0.1
-0.6
-0.6
-0.9
-1.2
-0.9
-0.8
-0.8
-0.8
-0.8
-0.5
-0.4
-0.3
-0.2
0.1
-0.7
-0.4
-0.2
-0.5
-0.5
-0.1
-0.3
-0.1
0.1
-0.6
0.1
0.0
0.2
0.1
-0.1
-0.2
-0.4
-0.1
-0.7
-0.6
-0.7
-0.8
-0.5
-0.6
-0.6
-0.6
-0.5
0.1
-0.1
-0.1
-0.4
-0.3
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
4
4
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
P23
P24
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
P24
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
P24
26.1
25.5
19.3
19.1
18.9
18.9
19.1
26.1
25.9
25.7
25.8
25.5
26.3
25.7
26.3
26.1
25.7
26.4
26.3
26.2
26.0
26.0
25.7
25.9
25.5
25.8
19.9
19.9
19.9
20.0
20.2
24.5
24.7
24.7
24.7
24.7
25.1
25.2
25.1
25.1
25.0
25.2
25.1
25.2
25.2
24.9
24.9
25.1
25.1
24.9
Page 44 of 47
0.4
-0.2
-0.5
0.9
0.1
0.3
0.7
-0.1
-0.1
-0.2
-0.3
-0.1
-0.4
0.0
-0.2
-0.3
0.1
-0.6
0.2
-0.3
-0.3
-0.2
0.6
-0.4
-0.3
0.0
0.0
-0.1
-0.1
-0.4
-0.1
-0.1
0.5
0.2
0.1
0.1
0.1
-0.1
0.1
0.2
0.2
0.0
0.2
0.3
-0.2
0.2
0.3
0.1
0.2
0.3
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
P24
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
P24
20.4
20.6
20.7
20.8
20.4
26.7
26.6
27.2
26.1
26.8
26.4
30.2
26.1
26.1
26.0
25.9
26.0
25.9
25.4
25.7
25.4
25.3
25.2
25.8
21.0
21.0
20.4
20.5
20.1
25.3
25.0
26.3
25.6
26.3
26.0
25.7
25.6
26.0
25.6
26.2
25.5
25.6
25.9
25.5
25.7
25.4
25.6
25.5
Page 45 of 47
-0.3
-0.1
-0.3
-0.3
0.0
-0.8
-0.4
-1.2
-0.5
-0.9
-0.5
-2.8
-0.2
-0.7
-0.4
-0.2
-0.1
-0.2
-0.1
-0.2
-0.1
-0.2
-0.1
-0.5
0.0
-0.4
0.6
0.7
-0.1
-0.5
-0.1
0.4
-0.3
-0.1
-0.4
0.3
-0.4
-0.7
-0.5
-1.0
-0.4
-0.3
-0.5
-0.3
-0.5
-0.2
-0.4
-0.1
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
EQUIPMENT AND CALIBRATION SCHEDULES
Equipment #: HZ-TSC-01
Description: Vertical Thermal Shock Chamber
Manufacturer: Cincinnati Sub Zero
Model: VTS-3-6-6-SC/AC
Serial #: 10-VT14993
Accuracy: See Manual
… Last Cal: 05/18/2010, Next Cal: 05/18/2011
Equipment #: HZ-MO-01
Description: Micro-ohmmeter
Manufacturer: Keithley
Model: 580
Serial #: 0772740
Accuracy: Last Cal: 2010-4-30, Next Cal: 2011-4-30
Equipment #: HZ-THC-01
Description: Temperature/Humidity Chamber
Manufacturer: Thermotron
Model: SM-8-7800
Serial #: 30676
Accuracy: See Manual
… Last Cal: 08/16/2010, Next Cal: 02/16/2011
Equipment #: HZ-OV-02
Description: Cascade Tek Forced Air Oven
Manufacturer: Cascade Tek
Model: TFO-5
Serial #: 0500100
Accuracy: Temp. Stability: +/-.1C/C change in ambient
Last Cal: 06/16/2010, Next Cal: 206/16/2011
Equipment #: HZ-TCT-01
Description: Normal force analyzer
Manufacturer: Mecmesin Multitester
Model: Mecmesin Multitester 2.5-i
Serial #: 04-1041-04
Accuracy: Last Cal: 05/21/2010, Next Cal: 05/20/2011
Equipment #: HZ-MO-05
Description: Multimeter /Data Acquisition System
Manufacturer: Keithley
Model: 2700
Serial #: 0798688
Accuracy: See Manual
… Last Cal: 4/30/2010, Next Cal: 4/30/2011
Page 46 of 47
Tracking Code: 132820_Report_Rev_1
Part #: QSFP8-038-01-L-D-RA1/QSFP8-Mating Board
Part description: QSFP8
Equipment #: ED-03
Description: Event Detector
Manufacturer: Analysis Tech
Model: 32EHD
Serial #: 1100604
Accuracy: See Manual
… Last Cal: 06/04/2010, Next Cal: 06/04/2011
Equipment #: HZ-TCT-07
Description: Automated Test Stand
Manufacturer: Chatillon/Lloyd
Model: LF Plus
Serial #: LF1310
Accuracy: See Manual
… Last Cal: 07/15/2010, Next Cal: 07/15/2011
Equipment #: ACLM-01
Description: Accelerometer
Manufacturer: PCB Piezotronics
Model: 352C03
Serial #: 115819
Accuracy: See Manual
… Last Cal: 07/09/2010, Next Cal: 07/09/2011
Equipment #: SVC-01
Description: Shock & Vibration Table
Manufacturer: Data Physics
Model: LE-DSA-10-20K
Serial #: 10037
Accuracy: See Manual
… Last Cal: 11/31/2009, Next Cal: 11/31/2010
Equipment #: HZ-MO-03
Description: Multimeter /Data Acquisition System
Manufacturer: Keithley
Model: 2700
Serial #: 0791975
Accuracy: See Manual
… Last Cal: 06/16/2010, Next Cal: 06/16/2011
Page 47 of 47