Product Specification Series: ERF8 / ERM8 0,80 mm (.0315”) Edge Rate™ Rugged High Speed Socket / Terminal Strip ERF8 Series – Socket, Vertical Orientation ERM8 Series – Terminal, Vertical Orientation Other configurations available for: Coplanar and perpendicular board-to-board applications Rugged features / end options Packaging options See www.samtec.com for more information. Revision: D Date: May 12, 2015 Page 1 © 2013 Samtec, Inc. Product Specification Series: ERF8 / ERM8 0,80 mm (.0315”) Edge Rate™ Rugged High Speed Socket / Terminal Strip 1.0 SCOPE 1.1 This specification covers performance, testing and quality requirements for Samtec’s ERF8/ERM8 Series 0,80 mm pitch Edge Rate™ Rugged High Speed connectors. All information contained in this specification is for a 10 mm mated height vertical configuration unless otherwise noted. 2.0 DETAILED INFORMATION 2.1 Product prints, footprints, catalog pages, test reports and other specific, detailed information can be found at www.samtec.com?ERF8 and www.samtec.com?ERM8. 3.0 TESTING 3.1 3.2 3.3 3.4 3.5 Current Rating: 1.4A Voltage Rating: 300 VAC Operating Temperature Range: -55°C to +125°C Operating Humidity Range: 90% to 95% (Per EIA-364-31) Electrical: ITEM TEST CONDITION REQUIREMENT STATUS Withstanding Voltage EIA-364-20 (No Flashover, Sparkover, or Breakdown) 900 VAC Pass Insulation Resistance EIA-364-21 (1000 MΩ minimum) 50,000 MΩ Pass Contact Resistance (LLCR) EIA-364-23 Δ 15 mΩ maximum (Samtec defined)/ No damage Pass REQUIREMENT STATUS 3.6 Mechanical: ITEM TEST CONDITION Durability EIA-364-09C 500 cycles (30µ Au) Pass Random Vibration EIA-364-28 Condition V, Letter B 7.56 G 'RMS', 50 to 2000 Hz, 2 hours per axis, 3 axis total , PSD 0.04 Visual Inspection: No Damage LLCR: Δ 15 mΩ maximum Event Detection: No interruption > 50 nanoseconds Pass Mechanical Shock EIA-364-27 100 G, 6 milliseconds, sawtooth wave, 11.3 fps, 3 shocks/direction, 3 axis (18 total shocks) Visual Inspection: No Damage LLCR: Δ 15 mΩ maximum Event Detection: No interruption > 50 nanoseconds Pass Normal Force EIA-364-04 30 grams minimum for gold interface Pass Revision: D Date: May 12, 2015 Page 2 © 2013 Samtec, Inc. Product Specification Series: ERF8 / ERM8 0,80 mm (.0315”) Edge Rate™ Rugged High Speed Socket / Terminal Strip 3.7 Environmental: ITEM TEST CONDITION REQUIREMENT STATUS Thermal Shock EIA-364-32 Thermal Cycles: 100 (30 minute dwell) Hot Temp: +85°C Cold Temp: -55°C Hot/Cold Transition: Immediate Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 900 VAC IR: >50,000 MΩ Pass Thermal Aging (Temp Life) EIA-364-17 Test Condition 4 @ 105°C Condition B for 250 hours Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 900 VAC IR: >50,000 MΩ Pass Cyclic Humidity EIA-364-31 Test Temp: +25°C to +65°C Relative Humidity: 90 to 95% Test Duration: 240 hours Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 900 VAC IR: >50,000 MΩ Pass Gas Tight EIA-364-36 Gas Exposure: Nitric Acid Vapor Duration: 60 min. Drying Temp.: 50°C +/- 3°C Measurements: Within 1 hour of Exposure LLCR: Δ 15 mΩ Pass 4.0 MATED SYSTEM 4.1 Mated Views Mated view information can be found at link below: http://www.samtec.com/documents/webfiles/cpdf/ERX8%20Mated%20Document-MKT.pdf Revision: D Date: May 12, 2015 Page 3 © 2013 Samtec, Inc. Product Specification Series: ERF8 / ERM8 0,80 mm (.0315”) Edge Rate™ Rugged High Speed Socket / Terminal Strip 5.0 POLARIZING FEATURES 6.0 HIGH SPEED PERFORMANCE 6.1 Based on a 3 dB insertion loss Stack Height Single-Ended Signaling Differential Pair Signaling 7 mm 12.00 GHz / 24 Gbps 15.50 GHz / 31 Gbps 10 mm 16.00 GHz / 32 Gbps 20.00 GHz / 40 Gbps 16 mm 16.00 GHz / 32 Gbps 20.00 GHz / 40 Gbps ERM8-EM/ERF8 13.50 GHz / 27 Gbps 14.00 GHz / 28 Gbps 17.00 GHz / 34 Gbps 17.50 GHz / 35 Gbps 8.00 GHz / 16 Gbps 7.50 GHz / 15 Gbps ERM8-RA/ERF8 (Short Row) ERM8-RA/ERF8-RA (Short Row) 6.2 System Impedance: 50 ohm for single-ended and 100 ohm for differential pair Revision: D Date: May 12, 2015 Page 4 © 2013 Samtec, Inc. Product Specification Series: ERF8 / ERM8 0,80 mm (.0315”) Edge Rate™ Rugged High Speed Socket / Terminal Strip 7.0 PROCESSING RECOMMENDATIONS 7.1 Mating Alignment Requirements: 7.1.1 Maximum guidance/capture in applications where at least one half of the interface is free to float. 7.1.2 The parts can be rigidly misaligned by no more than 0,040mm(.0016”) in the X- and 0,050mm(.0020”) in the Y-direction to ensure a good mate. Revision: D Date: May 12, 2015 Page 5 © 2013 Samtec, Inc. Product Specification Series: ERF8 / ERM8 0,80 mm (.0315”) Edge Rate™ Rugged High Speed Socket / Terminal Strip 7.2 Mating Angle Requirements: The connector can be zippered in the longitudinal direction only. 7.2.1 7.2.2 Revision: D Date: May 12, 2015 Page 6 © 2013 Samtec, Inc. Product Specification Series: ERF8 / ERM8 0,80 mm (.0315”) Edge Rate™ Rugged High Speed Socket / Terminal Strip 7.3 Due to variances in equipment, solder pastes and applications (board design, component density, etc.), Samtec does not specify a recommended reflow profile for our connectors. The processing parameters provided by the solder paste manufacturer should be employed and can usually be found on their website. All of Samtec’s surface mount components are lead free reflow compatible and compliant with the profile parameters detailed in IPC/JEDEC J-STD-020D which requires that components be capable of withstanding a peak temperature of 260°C as well as 30 seconds above 255°C. Samtec Recommended Temperature Profile Ranges (SMT) Sn-Pb Eutectic Assembly Preheat/Soak (100°C-150°C) Max Ramp Up Rate Reflow Time (above 183°C) Peak Temp Time within 5°C of 235°C Max Ramp Down Rate Time 25°C to Peak Temp 60-120 sec. 3°C/s max. 40-150 sec. 235°C 20 sec. max. 6°C/s max. 6 min. max. Preheat/Soak (150°C-200°C) Max Ramp Up Rate Reflow Time (above 217°C) Peak Temp Time within 5°C of 260°C Max Ramp Down Rate Time 25°C to Peak Temp 60-120 sec. 3°C/s max. 40-150 sec. 260°C 30 sec. max. 6°C/s max. 8 min. max. Pb-Free Assembly 7.3.1 These guidelines should not be considered design requirements for all applications. Samtec recommends testing interconnects on your boards in your process to guarantee optimum results. Revision: D Date: May 12, 2015 Page 7 © 2013 Samtec, Inc. Product Specification Series: ERF8 / ERM8 0,80 mm (.0315”) Edge Rate™ Rugged High Speed Socket / Terminal Strip 7.4 Maximum Reflow Passes: The parts can withstand three reflow passes at a maximum oven temperature of 260°C. 7.5 Stencil Thickness: The stencil thickness is 0.15 [.006]. 7.6 Placement: Machine placement of the parts in the Z-axis is strongly recommended. 7.7 Reflow Environment: Samtec recommends the use of a low level oxygen environment (typically achieved through Nitrogen gas infusion) in the reflow process to improve solderability. 7.8 Hardware: Board-to-board standoffs are recommended to provide a robust mechanical connection. Samtec offers two different types: 7.8.1 Traditional Standoffs (SO) – Rigid design to statically support board-to-board applications. See options here: SO - Board Stacking Standoff 7.8.2 Jack Screw Standoffs (JSO) – Serve same function as traditional standoffs but unique, nested construction facilitates the mating and unmating process. This is especially helpful for multiple connector applications where the mating and unmating forces increase with the number of connectors used. See options here: JSO - Jack Screw Standoffs 7.9 Cleaning: Samtec, Inc. has verified that our connectors may be cleaned in accordance with the solvents and conditions designated in the EIA-364-11A standard. 8.0 ADDITIONAL RESOURCES 8.1 For additional mechanical testing or product information, contact our Customer Engineering Support Group at [email protected] 8.2 For additional information on high speed performance testing, contact our Signal Integrity Group at [email protected] 8.3 For additional processing information, contact our Interconnect Processing Group at [email protected]. 8.4 For RoHS, REACH or other environmental compliance information, contact our Product Environmental Compliance Group at [email protected] Revision: D Date: May 12, 2015 Page 8 © 2013 Samtec, Inc.