Product Specification Series: ERF5 / ERM5 0,50 mm (.0197”) Edge Rate™ Rugged High Speed Socket / Terminal Strip ERF5 Series – Socket, Vertical Orientation ERM5 Series – Terminal, Vertical Orientation Other configurations available for: Perpendicular board-to-board applications Rugged features / end options Packaging options See www.samtec.com for more information. Revision: D Date: September 23, 2015 Page 1 © 2013 Samtec, Inc. Product Specification Series: ERF5 / ERM5 0,50 mm (.0197”) Edge Rate™ Rugged High Speed Socket / Terminal Strip 1.0 SCOPE 1.1 This specification covers performance, testing and quality requirements for Samtec’s ERF5/ERM5 Series 0,50 mm (.0197”) pitch Edge Rate™ Rugged High Speed Socket and Terminal Strip. All information contained in this specification is for a 7 mm mated height vertical configuration unless otherwise noted. 2.0 DETAILED INFORMATION 2.1 Product prints, footprints, catalog pages, test reports and other specific, detailed information can be found at www.samtec.com?ERF5 and www.samtec.com?ERM5. 3.0 TESTING 3.1 3.2 3.3 3.4 3.5 Current Rating: 1.5A (One Pin Powered Per Row) Voltage Rating: 190 VAC Operating Temperature Range: -55°C to +125°C Operating Humidity Range: 90% to 95% (Per EIA-364-31) Electrical: ITEM TEST CONDITION REQUIREMENT STATUS Withstanding Voltage EIA-364-20 (No Flashover, Sparkover, or Breakdown) 575 VAC Pass Insulation Resistance EIA-364-21 (1000 MΩ minimum) 5,000 MΩ Pass Contact Resistance (LLCR) EIA-364-23 Δ 15 mΩ maximum (Samtec defined)/ No damage Pass REQUIREMENT STATUS 3.6 Mechanical: ITEM TEST CONDITION Durability EIA-364-09C 100 cycles Pass Random Vibration EIA-364-28 Condition V, Letter B 7.56 G 'RMS', 50 to 2000 Hz, 2 hours per axis, 3 axis total , PSD 0.04 Visual Inspection: No Damage LLCR: Δ 15 mΩ maximum Event Detection: No interruption > 50 nanoseconds Pass Mechanical Shock EIA-364-27 100 G, 6 milliseconds, sawtooth wave, 11.3 fps, 3 shocks/direction, 3 axis (18 total shocks) Visual Inspection: No Damage LLCR: Δ 15 mΩ maximum Event Detection: No interruption > 50 nanoseconds Pass Normal Force EIA-364-04 30 grams minimum for gold interface Pass Revision: D Date: September 23, 2015 Page 2 © 2013 Samtec, Inc. Product Specification Series: ERF5 / ERM5 0,50 mm (.0197”) Edge Rate™ Rugged High Speed Socket / Terminal Strip 3.7 Environmental: ITEM REQUIREMENT STATUS Thermal Shock EIA-364-32 Thermal Cycles: 100 (30 minute dwell) Hot Temp: +85°C Cold Temp: -55°C Hot/Cold Transition: Immediate Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 575 VAC IR: >100,000 MΩ Pass Thermal Aging (Temp Life) EIA-364-17 Test Condition 4 @ 105°C Condition B for 250 hours Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 575 VAC IR: >100,000 MΩ Pass Cyclic Humidity EIA-364-31 Test Temp: +25°C to +65°C Relative Humidity: 90 to 95% Test Duration: 240 hours Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 575 VAC IR: >100,000 MΩ Pass Gas Tight EIA-364-36 Gas Exposure: Nitric Acid Vapor Duration: 60 min. Drying Temp.: 50°C +/- 3°C Measurements: Within 1 hour of Exposure LLCR: Δ 15 mΩ Pass Revision: D TEST CONDITION Date: September 23, 2015 Page 3 © 2013 Samtec, Inc. Product Specification Series: ERF5 / ERM5 0,50 mm (.0197”) Edge Rate™ Rugged High Speed Socket / Terminal Strip 4.0 MATED SYSTEM 4.1 Mated Views Mated view information can be found at link below: http://cloud.samtec.com/Prints/ERX5%20MATED%20DOCUMENT-MKT.pdf 5.0 POLARIZING FEATURES 6.0 HIGH SPEED PERFORMANCE 6.1 Based on a 3 dB insertion loss Stack Height Single-Ended Signaling Differential Pair Signaling 7 mm 13.5 GHz / 27 Gbps 20 GHz / 40 Gbps 10 mm 9 GHz / 18 Gbps 8.5 GHz / 17 Gbps 6.2 System Impedance: 50 ohm for single-ended and 100 ohm for differential pair Revision: D Date: September 23, 2015 Page 4 © 2013 Samtec, Inc. Product Specification Series: ERF5 / ERM5 0,50 mm (.0197”) Edge Rate™ Rugged High Speed Socket / Terminal Strip 7.0 PROCESSING RECOMMENDATIONS 7.1 Mating Alignment Requirements: 7.1.1 Maximum guidance/capture in applications where at least one half of the interface is free to float. 7.1.2 The parts can be rigidly misaligned by no more than 0,06mm (.002”) in the X- and 0,05mm (.002”) in the Y-direction to ensure a good mate. Revision: D Date: September 23, 2015 Page 5 © 2013 Samtec, Inc. Product Specification Series: ERF5 / ERM5 0,50 mm (.0197”) Edge Rate™ Rugged High Speed Socket / Terminal Strip 7.2 Mating Angle Requirements: The connector can be zippered in the longitudinal direction only. 7.2.1 7.2.2 Revision: D Date: September 23, 2015 Page 6 © 2013 Samtec, Inc. Product Specification Series: ERF5 / ERM5 0,50 mm (.0197”) Edge Rate™ Rugged High Speed Socket / Terminal Strip 7.3 Due to variances in equipment, solder pastes and applications (board design, component density, etc.), Samtec does not specify a recommended reflow profile for our connectors. The processing parameters provided by the solder paste manufacturer should be employed and can usually be found on their website. All of Samtec’s surface mount components are lead free reflow compatible and compliant with the profile parameters detailed in IPC/JEDEC J-STD-020E which requires that components be capable of withstanding a peak temperature of 260°C as well as 30 seconds above 255°C. Samtec Recommended Temperature Profile Ranges (SMT) Sn-Pb Eutectic Assembly Preheat/Soak (100°C-150°C) Max Ramp Up Rate Reflow Time (above 183°C) Peak Temp Time within 5°C of 235°C Max Ramp Down Rate Time 25°C to Peak Temp 60-120 sec. 3°C/s max. 40-150 sec. 235°C 20 sec. max. 6°C/s max. 6 min. max. Preheat/Soak (150°C-200°C) Max Ramp Up Rate Reflow Time (above 217°C) Peak Temp Time within 5°C of 260°C Max Ramp Down Rate Time 25°C to Peak Temp 60-120 sec. 3°C/s max. 40-150 sec. 260°C 30 sec. max. 6°C/s max. 8 min. max. Pb-Free Assembly 7.3.1 These guidelines should not be considered design requirements for all applications. Samtec recommends testing interconnects on your boards in your process to guarantee optimum results. 7.4 Maximum Reflow Passes: The parts can withstand three reflow passes at a maximum component temperature of 260°C. Revision: D Date: September 23, 2015 Page 7 © 2013 Samtec, Inc. Product Specification Series: ERF5 / ERM5 0,50 mm (.0197”) Edge Rate™ Rugged High Speed Socket / Terminal Strip 7.5 Stencil Thickness: The stencil thickness is .006” (0,15 mm). 7.6 Placement: Machine placement of the parts is strongly recommended. 7.7 Reflow Environment: Samtec recommends the use of a low level oxygen environment (typically achieved through Nitrogen gas infusion) in the reflow process to improve solderability. 7.8 Hardware: Board-to-board standoffs are recommended to provide a robust mechanical connection. Samtec offers two different types: 7.8.1 Traditional Standoffs (SO) – Rigid design to statically support board-to-board applications. See options here: SO - Board Stacking Standoff 7.8.2 Jack Screw Standoffs (JSO) – Serve same function as traditional standoffs but unique, nested construction facilitates the mating and unmating process. This is especially helpful for multiple connector applications where the mating and unmating forces increase with the number of connectors used. See options here: JSO - Jack Screw Standoffs 7.9 Cleaning: Samtec, Inc. has verified that our connectors may be cleaned in accordance with the solvents and conditions designated in the EIA-364-11A standard. 8.0 ADDITIONAL RESOURCES 8.1 For additional mechanical testing or product information, contact our Customer Engineering Support Group at [email protected] 8.2 For additional information on high speed performance testing, contact our Signal Integrity Group at [email protected] 8.3 For additional processing information, contact our Interconnect Processing Group at [email protected]. 8.4 For RoHS, REACH or other environmental compliance information, contact our Product Environmental Compliance Group at [email protected] USE OF PRODUCT SPECIFICATION SHEET This Product Specification Sheet (“PSS”) is a brief summary of information related to the Product identified. As a summary, it should only be used for the limited purpose of considering the purchase/use of Product. For specific, detailed information, including but not limited to testing and Product footprint, refer to Section 2.0 of this document and the links there provided to test reports and prints. This PSS is the property of Samtec, Inc. (“Samtec”) and contains proprietary information of Samtec, our various licensors, or both. Samtec does not grant express or implied rights or license under any patent, copyright, trademark or other proprietary rights and the use of the PSS for building, reverse engineering or replication is strictly prohibited. By using the PSS, the user agrees to not infringe, directly or indirectly, upon any intellectual property rights of Samtec and acknowledges that Samtec, our various licensors, or both own all intellectual property therein. The PSS is presented “AS IS”. While Samtec makes every effort to present excellent information, the PSS is only provided as a guideline and does not, therefore, warrant it is without error or defect or that the PSS contains all necessary and/or relevant information about the Product. The user agrees that all access and use of the PSS is at its own risk. NO WARRANTIES EXPRESSED OR IMPLIED, INCLUDING ANY WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR OF ANY KIND WHATSOEVER ARE PROVIDED Revision: D Date: September 23, 2015 Page 8 © 2013 Samtec, Inc.