Product Specification Series: QSE / QTE 0,80 mm (.0315”) Q Strip® High Speed Ground Plane Socket / Terminal Strips QSE Series – Socket, Vertical Orientation QTE Series – Terminal, Vertical Orientation Other configurations available for: Co-planar and perpendicular board-to-board applications Rugged features / end options Packaging options See www.samtec.com for more information. Revision: B Date: March 17, 2015 Page 1 © Samtec, Inc. Product Specification Series: QSE / QTE 0,80 mm (.0315”) Q Strip® High Speed Ground Plane Socket / Terminal Strips 1.0 SCOPE 1.1 This specification covers performance, testing and quality requirements for Samtec QSE/QTE Series 0,80 mm ® (.0315”) Q Strip High Speed Socket/Terminal Strip connector system. These socket and terminal strips are available in Vertical and Edge Mount configurations for parallel, perpendicular and co-planar board-to-board applications. All information contained in this specification is for a 5 mm mated height vertical configuration unless otherwise noted. 2.0 DETAILED INFORMATION 2.1 Product prints, footprints, catalog pages, test reports and other specific, detailed information can be found at www.samtec.com?QSE and www.samtec.com?QTE. 3.0 TESTING 3.1 3.2 3.3 3.4 3.5 Current Rating: Signal: 2A (One Pin Powered Per Row); Ground: 11.6A (One Pin Powered Per Row) Voltage Rating: 225 VAC Operating Temperature Range: -55°C to +125°C Operating Humidity Range: 90% to 95% (Per EIA-364-31) Electrical: ITEM TEST CONDITION REQUIREMENT STATUS Withstanding Voltage EIA-364-20 (No Flashover, Sparkover, or Breakdown) 675 VAC Pass Insulation Resistance EIA-364-21 (1000 MΩ minimum) 5,000 MΩ Pass Contact Resistance (LLCR) EIA-364-23 Δ 15 mΩ maximum (Samtec defined)/ No damage Pass REQUIREMENT STATUS 3.6 Mechanical: ITEM TEST CONDITION Durability EIA-364-09C 500 cycles (10µ" Au) Pass Random Vibration EIA-364-28 Condition V, Letter B 7.56 G 'RMS', 50 to 2000 Hz, 2 hours per axis, 3 axis total , PSD 0.04 Visual Inspection: No Damage LLCR: Δ 15 mΩ maximum Event Detection: No interruption > 50 Nanoseconds Pass Mechanical Shock EIA-364-27 100 G, 6 milliseconds, sawtooth wave, 11.3 fps, 3 shocks/direction, 3 axis (18 total shocks) Visual Inspection: No Damage LLCR: Δ 15 mΩ maximum Event Detection: No interruption > 50 Nanoseconds Pass Normal Force EIA-364-04 30 grams minimum for gold interface Pass Revision: B Date: March 17, 2015 Page 2 © Samtec, Inc. Product Specification Series: QSE / QTE 0,80 mm (.0315”) Q Strip® High Speed Ground Plane Socket / Terminal Strips 3.7 Environmental: ITEM REQUIREMENT STATUS Thermal Shock EIA-364-32 Thermal Cycles: 100 (30 minute dwell) Hot Temp: +85°C Cold Temp: -55°C Hot/Cold Transition: Immediate Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 675 VAC IR: >50,000 MΩ Pass Thermal Aging (Temp Life) EIA-364-17 Test Condition 4 @ 105°C Condition B for 250 hours Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 675 VAC IR: >50,000 MΩ Pass Cyclic Humidity EIA-364-31 Test Temp: +25°C to +65°C Relative Humidity: 90 to 95% Test Duration: 240 hours Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 675 VAC IR: >50,000 MΩ Pass Gas Tight EIA-364-36 Gas Exposure: Nitric Acid Vapor Duration: 60 min. Drying Temp.: 50°C +/- 3°C Measurements: Within 1 hour of Exposure LLCR: Δ 15 mΩ Pass Revision: B TEST CONDITION Date: March 17, 2015 Page 3 © Samtec, Inc. Product Specification Series: QSE / QTE 0,80 mm (.0315”) Q Strip® High Speed Ground Plane Socket / Terminal Strips 4.0 MATED SYSTEM 4.1 Mated Views Mated view information can be found at link below: http://cloud.samtec.com/Prints/QXE%20Mated%20Document.pdf 5.0 POLARIZING FEATURES 6.0 HIGH SPEED PERFORMANCE 6.1 Based on a 3 dB insertion loss Stack Height 5mm Single-Ended Signaling 9.0 GHz / 18.0 Gbps Differential Pair Signaling 14.0 GHz / 28.0 Gbps 6.2 System Impedance: 50 ohm for single-ended and 100 ohm for differential pair Revision: B Date: March 17, 2015 Page 4 © Samtec, Inc. Product Specification Series: QSE / QTE 0,80 mm (.0315”) Q Strip® High Speed Ground Plane Socket / Terminal Strips 7.0 PROCESSING RECOMMENDATIONS 7.1 Mating Alignment Requirements: 7.1.1 The parts can be rigidly misaligned by no more than .004” (0,10 mm) in the X- and .004” (0,10 mm) in the Y-direction to ensure a good mate. 7.2 Mating Angle Requirements: The connector can be zippered in the longitudinal direction only. 7.2.1 7.2.2 Revision: B Date: March 17, 2015 Page 5 © Samtec, Inc. Product Specification Series: QSE / QTE 0,80 mm (.0315”) Q Strip® High Speed Ground Plane Socket / Terminal Strips 7.3 Due to variances in equipment, solder pastes and applications (board design, component density, etc.), Samtec does not specify a recommended reflow profile for our connectors. The processing parameters provided by the solder paste manufacturer should be employed and can usually be found on their website. All of Samtec’s surface mount components are lead free reflow compatible and compliant with the profile parameters detailed in IPC/JEDEC J-STD-020D which requires that components be capable of withstanding a peak temperature of 260°C as well as 30 seconds above 255°C. Due to their weight and/or offset center of gravity, right angle (-RA) components cannot be run through the reflow oven while inverted. Samtec Recommended Temperature Profile Ranges (SMT) Sn-Pb Eutectic Assembly Preheat/Soak (100°C-150°C) Max Ramp Up Rate Reflow Time (above 183°C) Peak Temp Time within 5°C of 235°C Max Ramp Down Rate Time 25°C to Peak Temp 60-120 sec. 3°C/s max. 40-150 sec. 235°C 20 sec. max. 6°C/s max. 6 min. max. Preheat/Soak (150°C-200°C) Max Ramp Up Rate Reflow Time (above 217°C) Peak Temp Time within 5°C of 260°C Max Ramp Down Rate Time 25°C to Peak Temp 60-120 sec. 3°C/s max. 40-150 sec. 260°C 30 sec. max. 6°C/s max. 8 min. max. Pb-Free Assembly 7.3.1 These guidelines should not be considered design requirements for all applications. Samtec recommends testing interconnects on your boards in your process to guarantee optimum results. Revision: B Date: March 17, 2015 Page 6 © Samtec, Inc. Product Specification Series: QSE / QTE 0,80 mm (.0315”) Q Strip® High Speed Ground Plane Socket / Terminal Strips 7.4 Maximum Reflow Passes: Parts can withstand three reflow passes at a peak component temperature of 260°C. 7.5 Stencil Thickness: The recommended stencil thickness is .006” (0,15 mm). 7.6 Placement: Machine placement of the parts is recommended. 7.7 Reflow Environment: Samtec recommends the use of a low level oxygen environment (typically achieved through Nitrogen gas infusion) in the reflow process to improve solderability. 7.8 Rework Guidelines: Samtec recommends following these rework guidelines as needed: QXX/BXX Connector Rework Methods 7.9 Hardware: Board-to-board standoffs are recommended to provide a robust mechanical connection. Samtec offers two different types: 7.9.1 Traditional Standoffs (SO) – Rigid design to statically support board-to-board applications. See options here: SO - Board Stacking Standoff 7.9.2 Jack Screw Standoffs (JSO) – Serve same function as traditional standoffs but unique, nested construction facilitates the mating and unmating process. This is especially helpful for multiple connector applications where the mating and unmating forces increase with the number of connectors used. See options here: JSO - Jack Screw Standoffs 8.0 DIRECTION OF BOARD TRAVEL THROUGH REFLOW OVEN 8.1 To minimize the potential for connector warpage, Samtec recommends the layout configuration shown below left. This allows the connectors to heat more evenly. 9.0 ADDITIONAL RESOURCES 9.1 For additional mechanical testing or product information, contact our Customer Engineering Support Group at [email protected] 9.2 For additional information on high speed performance testing, contact our Signal Integrity Group at [email protected] 9.3 For additional processing information, contact our Interconnect Processing Group at [email protected]. 9.4 For RoHS, REACH or other environmental compliance information, contact our Product Environmental Compliance Group at [email protected] Revision: B Date: March 17, 2015 Page 7 © Samtec, Inc.