Product Specification Series: BEC5C 0,50 mm (.0197”) Low Cost High Density High Speed Edge Card Connector, Vertical BEC5C Series – 1,57 mm (.062”) Card Thickness Other configurations available for: 2.36 mm (.093”) Card Thickness Three Weld Tab Options See www.samtec.com for more information. Revision: C Date: August 27, 2015 Page 1 © Samtec, Inc. Product Specification Series: BEC5C 0,50 mm (.0197”) Low Cost High Density High Speed Edge Card Connector, Vertical 1.0 SCOPE 1.1 This specification covers performance, testing and quality requirements for Samtec’s BEC5C Series 0,50 mm (.0197”) pitch Low Cost High Density High Speed Edge Card Connector in a Vertical orientation. All information contained in this specification is for a 1,57 mm (.062”) card thickness configuration unless otherwise noted. 2.0 DETAILED INFORMATION 2.1 Product prints, footprints, catalog pages, test reports and other specific, detailed information can be found at www.samtec.com?BEC5C. 3.0 TESTING 3.1 3.2 3.3 3.4 3.5 Current Rating: 1.5A (4 Pins Powered) Voltage Rating: 200 VAC Operating Temperature Range: -55°C to +125°C Operating Humidity Range: 90% to 95% (Per EIA-364-31) Electrical: ITEM TEST CONDITION REQUIREMENT STATUS Withstanding Voltage EIA-364-20 (No Flashover, Sparkover, or Breakdown) 600 VAC Pass Insulation Resistance EIA-364-21 (1000 MΩ minimum) 5,000 MΩ Pass Contact Resistance (LLCR) EIA-364-23 Δ 15 mΩ maximum (Samtec defined)/ No damage Pass REQUIREMENT STATUS 3.6 Mechanical: ITEM TEST CONDITION Durability EIA-364-09C 25 cycles Pass Random Vibration EIA-364-28 Condition V, Letter B 7.56 G 'RMS', 50 to 2000 Hz, 2 hours per axis, 3 axis total , PSD 0.04 Visual Inspection: No Damage LLCR: Δ 15 mΩ maximum Pass Mechanical Shock EIA-364-27 100 G, 6 milliseconds, sawtooth wave, 11.3 fps, 3 shocks/direction, 3 axis (18 total shocks) Visual Inspection: No Damage LLCR: Δ 15 mΩ maximum Pass Normal Force EIA-364-04 30 grams minimum for gold interface Pass Revision: C Date: August 27, 2015 Page 2 © Samtec, Inc. Product Specification Series: BEC5C 0,50 mm (.0197”) Low Cost High Density High Speed Edge Card Connector, Vertical 3.7 Environmental: ITEM TEST CONDITION REQUIREMENT STATUS Thermal Shock EIA-364-32 Thermal Cycles: 100 (30 minute dwell) Hot Temp: +85°C Cold Temp: -55°C Hot/Cold Transition: Immediate Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 600 VAC IR: >5,000 MΩ Pass Thermal Aging (Temp Life) EIA-364-17 Test Condition 4 @ 105°C Condition B for 250 hours Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 600 VAC IR: >5,000 MΩ Pass Cyclic Humidity EIA-364-31 Test Temp: +25°C to +65°C Relative Humidity: 90 to 95% Test Duration: 240 hours Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 600 VAC IR: >5,000 MΩ Pass Gas Tight EIA-364-36 Gas Exposure: Nitric Acid Vapor Duration: 60 min. Drying Temp.: 50°C +/- 3°C Measurements: Within 1 hour of Exposure LLCR: Δ 15 mΩ Pass 4.0 MATED SYSTEM Mated view information can be found at link below: http://www.samtec.com/documents/webfiles/cpdf/BEC5C%20MATED%20DOCUMENT-MKT.pdf Revision: C Date: August 27, 2015 Page 3 © Samtec, Inc. Product Specification Series: BEC5C 0,50 mm (.0197”) Low Cost High Density High Speed Edge Card Connector, Vertical 5.0 POLARIZING FEATURES 6.0 HIGH SPEED PERFORMANCE 6.1 Based on a 3 dB insertion loss Short Row Long Row Single-Ended Signaling 6.5 GHz / 13 Gbps 6 GHz / 12 Gbps Differential Pair Signaling 7 GHz / 14 Gbps 7.5 GHz / 15 Gbps 6.2 System Impedance: 50 ohm for single-ended and 100 ohm for differential pair 7.0 PROCESSING RECOMMENDATIONS 7.1 Mating Alignment Requirements: 7.1.1 Revision: C The parts can be rigidly misaligned by no more than 0,08 mm (.003”) in the X- and 0,10 mm (.004”) in the Y- direction to ensure a good mate. Date: August 27, 2015 Page 4 © Samtec, Inc. Product Specification Series: BEC5C 0,50 mm (.0197”) Low Cost High Density High Speed Edge Card Connector, Vertical 7.2 Due to variances in equipment, solder pastes and applications (board design, component density, etc.), Samtec does not specify a recommended reflow profile for our connectors. The processing parameters provided by the solder paste manufacturer should be employed and can usually be found on their website. All of Samtec’s surface mount components are lead free reflow compatible and compliant with the profile parameters detailed in IPC/JEDEC J-STD-020E which requires that components be capable of withstanding a peak temperature of 260°C as well as 30 seconds above 255°C. Samtec Recommended Temperature Profile Ranges (SMT) Sn-Pb Eutectic Assembly Preheat/Soak (100°C-150°C) Max Ramp Up Rate Reflow Time (above 183°C) Peak Temp Time within 5°C of 235°C Max Ramp Down Rate Time 25°C to Peak Temp 60-120 sec. 3°C/s max. 40-150 sec. 235°C 20 sec. max. 6°C/s max. 6 min. max. Preheat/Soak (150°C-200°C) Max Ramp Up Rate Reflow Time (above 217°C) Peak Temp Time within 5°C of 260°C Max Ramp Down Rate Time 25°C to Peak Temp 60-120 sec. 3°C/s max. 40-150 sec. 260°C 30 sec. max. 6°C/s max. 8 min. max. Pb-Free Assembly 7.2.1 These guidelines should not be considered design requirements for all applications. Samtec recommends testing interconnects on your boards in your process to guarantee optimum results. Revision: C Date: August 27, 2015 Page 5 © Samtec, Inc. Product Specification Series: BEC5C 0,50 mm (.0197”) Low Cost High Density High Speed Edge Card Connector, Vertical 7.3 Maximum Reflow Passes: The parts can withstand three reflow passes at a maximum component temperature of 260°C. 7.4 Stencil Thickness: The stencil thickness is 0,15 mm (.006”). 7.5 Placement: Machine placement of the parts is recommended. 7.6 Reflow Environment: Samtec recommends the use of a low level oxygen environment (typically achieved through nitrogen gas infusion) in the reflow process to improve solderability. 7.7 Cleaning: Samtec, Inc. has verified that our connectors may be cleaned in accordance with the solvents and conditions designated in the EIA-364-11A standard. 7.8 Rework Guidelines: Samtec recommends following these rework guidelines as needed: Reworking Grid Array Connectors 7.8.1 Samtec recommends a minimum spacing of 3,18 mm (.125”) between adjacent connectors to allow adequate room for hot-air rework equipment. 7.9 Solder Screen Printing Process: 7.9.1 Complete solder pad coverage is critical to ensure successful results. Automated inspection of each print is recommended. If solder paste does not completely cover the solder pad, the assembly should be rejected, cleaned and re-printed. 7.9.2 Stencil cleaning may need to be monitored more frequently to ensure complete solder pad coverage is maintained. 7.9.3 Solder crimp location relative to solder print. Notice good contact between solder crimp and solder paste. Revision: C Date: August 27, 2015 Page 6 © Samtec, Inc. Product Specification Series: BEC5C 0,50 mm (.0197”) Low Cost High Density High Speed Edge Card Connector, Vertical 7.10 Handling: 7.10.1 These connectors are typically packaged in tape-and-reel which protects the solder crimps from damage. They should be handled like any other BGA or IC device. 7.10.2 Avoid resting the connector on the solder crimps except during final placement onto the board. 7.10.3 When using tape-and-reel packaging, ensure the bottom of the pocket is protected as it travels through the feeder. 7.10.4 Avoid touching the solder crimps. 8.0 ADDITIONAL RESOURCES 8.1 For additional mechanical testing or product information, contact our Customer Engineering Support Group at [email protected] 8.2 For additional information on high speed performance testing, contact our Signal Integrity Group at [email protected] 8.3 For additional processing information, contact our Interconnect Processing Group at [email protected]. 8.4 For RoHS, REACH or other environmental compliance information, contact our Product Environmental Compliance Group at [email protected] USE OF PRODUCT SPECIFICATION SHEET This Product Specification Sheet (“PSS”) is a brief summary of information related to the Product identified. As a summary, it should only be used for the limited purpose of considering the purchase/use of Product. For specific, detailed information, including but not limited to testing and Product footprint, refer to Section 2.0 of this document and the links there provided to test reports and prints. This PSS is the property of Samtec, Inc. (“Samtec”) and contains proprietary information of Samtec, our various licensors, or both. Samtec does not grant express or implied rights or license under any patent, copyright, trademark or other proprietary rights and the use of the PSS for building, reverse engineering or replication is strictly prohibited. By using the PSS, the user agrees to not infringe, directly or indirectly, upon any intellectual property rights of Samtec and acknowledges that Samtec, our various licensors, or both own all intellectual property therein. The PSS is presented “AS IS”. While Samtec makes every effort to present excellent information, the PSS is only provided as a guideline and does not, therefore, warrant it is without error or defect or that the PSS contains all necessary and/or relevant information about the Product. The user agrees that all access and use of the PSS is at its own risk. NO WARRANTIES EXPRESSED OR IMPLIED, INCLUDING ANY WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR OF ANY KIND WHATSOEVER ARE PROVIDED. Revision: C Date: August 27, 2015 Page 7 © Samtec, Inc.