SM802xxx1.12 MB

SM802XXX
Flexible Ultra-Low Jitter Clock Synthesizer
Clockworks™ FLEX
General Description
Features
The SM802xxx series is a member of the ClockWorks™
family of devices from Micrel and provide an extremely
low-noise timing solution for applications such as (1-100)
Gigabit Ethernet, SONET, Wireless base station, Satellite
communication, Fibre Channel, SAS/SATA and PCI-e. It is
based upon a unique PLL architecture that provides less
than 250fs phase jitter.
• 115fs at 156.25MHz (1.875MHz to 20MHz)
• 245fs at 156.25MHz (12kHz to 20MHz)
• On chip power supply regulation for excellent board
level power supply noise immunity
• Generates up to 8 combinations of differential or 16
single-ended clock outputs.
− LVPECL, LVDS, HCSL, LVCMOS (SE or Diff)
• Selectable input:
− Crystal: 11MHz to 30MHz
− Reference input: 11MHz to 80MHz
• No external crystal oscillator capacitors required
• 2.5V or 3.3V operating power supply
• Available in Industrial Temperature range
• Available in Green, RoHS, and PFOS compliant QFN
packages:
− 44-pin, 7mm × 7mm
− 32-pin, 5mm × 5mm
− 24-pin, 4mm × 4mm
− 16-pin, 3mm × 3.5mm
The devices operate from a 2.5V or 3.3V power supply
and synthesize up to 8 different combinations (LVPECL,
LVDS, HCSL) of differential or 16 single ended output
clocks. The devices accept an external reference clock or
crystal input.
The SM802xxx series is fully programmable and a web
tool is available to configure a part for samples at:
http://clockworks.micrel.com/micrel/
Datasheets and support documentation are available on
Micrel’s web site at: www.micrel.com.
Block Diagram
Applications
•
•
•
•
•
•
•
1/10/40/100 Gigabit Ethernet – (GbE)
SONET/SDH
PCI-Express
CPRI/OBSAI – Wireless base station
Fibre Channel
SAS/SATA
DIMM
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com
June 6, 2013
Revision 1.0
[email protected] or (408) 955-1690
Micrel, Inc.
SM802XXX
Ordering Information
Part Number
Marking
Shipping
Ambient Temperature Range
Package
SM802xxxUMG
802xxx
Tray
–40°C to +85°C
See Package Options
SM802xxxUMGTR
802xxx
Tape and Reel
–40°C to +85°C
See Package Options
Package Options
Package
(1)
Option
QFN Package
# of
Outputs
Crystal
Reference
Input
XTAL_SEL
FSEL
OE1
OE2
PLL
Bypass
#1
44-pin, 7mm × 7mm
8 diff.
Yes
Yes
Yes
Yes
Yes
Yes
#2
32-pin, 5mm × 5mm
4 diff.
Yes
Yes
Yes
Yes
Yes
Yes
#3
24-pin, 4mm × 4mm
4 diff.
Yes
Yes
Yes
No
No
Yes
#4
24-pin, 4mm × 4mm
2 diff.
Yes
Yes
Yes
Yes
Yes
Yes
#5
16-pin, 3mm × 3.5mm
2 diff.
No
Yes
No
Yes
No
No
#6
16-pin, 3mm × 3.5mm
2 diff.
Yes
No
No
No
No
No
Note:
1. Use the web tool at http://clockworks.micrel.com/micrel/ to determine the desired configuration.
June 6, 2013
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SM802XXX
Pin Configurations
June 6, 2013
Option #1
44-Pin 7mm x 7mm QFN (QFN-44L)
Option #2
32-Pin 5mm x 5mm QFN
Option #3
24-Pin 4mm x 4mm QFN
Option #4
24-Pin 4mm x 4mm QFN
Option #5
16-Pin 3mm x 3.5mm QFN
Option #6
16-Pin 3mm x 3.5mm QFN
3
Revision 1.0
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SM802XXX
Pin Description
Pin Numbers by Package Option
9
6
XIN
11
10
7
XOUT
I, O
(SE)
9
8
7
REF_IN
I, (SE)
LVCMOS Reference Clock input
6
6
FSEL
I, (SE)
Frequency Select, divides output
LVCMOS frequencies by 2.
0 = FREQ, 1 = FREQ/2, 45kΩ pull-up
4
-
-
XTAL SEL
I, (SE)
XTAL Select, selects between XTAL and
LVCMOS REF_IN
0 = REF_IN, 1 = XTAL, 45kΩ pull-up
-
PLL
BYPASS
#3
24-Pin
#4
24-Pin
18
13
10
19
14
17
12
14
10
10
6
5
Pin
Level
Pin Name
#2
32-Pin
9
Pin
Type
#6
16-Pin
#1
44-Pin
6
5
3
#5
16-Pin
-
I, (SE)
Pin Function
Crystal connections
LVCMOS
Bypasses the PLL and switches the XTAL
or REF_IN frequency to all outputs
0 = PLL mode, 1 = Bypass mode, 45kΩ
pull-down
Clock Outputs from Bank 1
25
-
-
28
21
16
29
22
17
-
35
36
/QA
-
-
-
-
-
-
-
-
-
-
25
20
19
14
14
/QD
26
21
20
15
15
QD
41
30
23
22
42
31
24
23
-
-
-
4
3
3
5
4
4
-
26
32
33
QA
/QB
QB
/QC
QC
O
Various
O
Various
O
Various
O
Various
Each output can be programmed to its
own logic type: LVPECL, LVDS, HCSL, or
(2)
LVCMOS
Clock Outputs from Bank 2
1
2
7
8
31
37
38
16
43
44
23
27
1
32
/QE
Each output can be programmed to its
own logic type: LVPECL, LVDS, HCSL, or
(2)
LVCMOS
-
-
1
1
/QF
2
2
QF
-
-
-
-
-
-
-
18
17
16
16
VDDO1
PWR
Power Supply for the outputs on Bank 1.
1
24
16
16
VDDO2
PWR
Power Supply for the outputs on Bank 2.
QE
/QG
QG
/QH
QH
O
Various
O
Various
O
Various
O
Various
Note:
2. In the case of LVCMOS, an output pair can provide two single-ended LVCMOS outputs.
June 6, 2013
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SM802XXX
Pin Numbers by Package Option
#3
24-Pin
#4
24-Pin
#5
16-Pin
#6
16-Pin
Pin Name
Pin
Type
22
21
-
-
VSSO1
PWR
Power Supply Ground for the outputs on
Bank 1.
2
2
-
-
VSSO2
PWR
Power Supply Ground for the outputs on
Bank 2.
7
7
5
4
4
15
12
11
8
8
20
15
16
11
11
24
19
18
13
13
8
1
5
5
3
3
9
9
10
10
12
12
#1
44-Pin
#2
32-Pin
24
19
39
28
3
2
6
29
40
11
20
27
30
34
12
8
13
9
21
17
13
23
18
14
13
14
15
Pin
Level
Pin Function
Used for production test.
TEST
Do not connect anything to these pins.
VDD
PWR
Core Power Supply.
VSS
PWR
Core Power Supply Ground.
-
-
-
-
-
-
EXPOSED
PAD
-
The exposed pad must be connected to
the VSS ground plane.
15
11
-
7
-
-
OE1
I, (SE)
Output Enable 1, OUT1−8 disables to
LVCMOS tri-state,
0 = Disabled, 1 = Enabled, 45kΩ pull-up
22
16
-
12
-
-
OE2
I, (SE)
Output Enable 2, OUT9−16 disables to
LVCMOS tri-state,
0 = Disabled, 1 = Enabled, 45kΩ pull-up
Truth Table
Control Pin
(3)
Internal Resistor
0 Level (Low)
1 Level (High)
OE1
Pull-Up
Outputs QA~QD disabled to Hi Z (Tri-State)
Outputs QA~QD enabled
OE2
Pull-Up
Outputs QE~QH disabled to Hi Z (Tri-State)
Outputs QE~QH enabled
XTAL_SEL
Pull-Up
External reference clock input is selected
Crystal is selected
Pull-Up
Output = Target Frequency X2 or /2
Output = Target Frequency
Pull-Down
PLL frequency is connected to outputs
PLL is bypassed, Crystal or Ref-in is
connected to outputs
FSEL
(4)
PLL_BYPASS
Notes:
3. The internal resistor sets the default logic level on the control pin when the pin is left open. Pull up will set default logic 1 and pull down will set
default logic 0. When the pin is not available on a specific configuration, the level will be the default logic level.
4. The FSEL pin behavior can be programmed between two types:
-
At FSEL=0 (low), the output frequency changes to multiply by 2.
-
At FSEL=0 (low), the output frequency changes to divide by 2.
The FSEL function affects all outputs the same way, all outputs change when the FSEL pin level changes.
June 6, 2013
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SM802XXX
Absolute Maximum Ratings(5)
Operating Ratings(6)
Supply Voltage (VDD, VDDO1/2) ...................................... +4.6V
Input Voltage (VIN) ................................ −0.5V to VDD + 0.5V
Lead Temperature (soldering, 20s) ............................ 260°C
Case Temperature ..................................................... 115°C
Storage Temperature (Ts)......................... –65°C to +150°C
Supply Voltage (VDD, VDDO1/2) ............... +2.375V to +3.465V
Ambient Temperature (TA) .......................... –40°C to +85°C
(7)
Junction Thermal Resistance
QFN (θJA), Still-Air
44-pin ................................................................ 24°C/W
32-pin ................................................................ 34°C/W
24-pin ................................................................ 50°C/W
16-pin ................................................................ 60°C/W
DC Electrical Characteristics(8)
VDD = VDDO1/2 = 3.3V ±5% or 2.5V ±5%
VDD = 3.3V ±5%, VDDO1/2 = 3.3V ±5% or 2.5V ±5%
TA = −40°C to +85°C
Symbol
VDD, VDDO1/2
Parameter
Condition
Min.
Typ.
Max.
Units
3.3V Operating Voltage
VDDO1 = VDDO2
3.135
3.3
3.465
V
VDDO1 = VDDO2
2.375
2.5
2.625
V
275
345
mA
150
185
mA
70
90
mA
2.5V Operating Voltage
8 LVPECL, 312.5MHz (44-pin QFN)
Outputs open
IDD
Total supply current, VDD + VDDO
4 HCSL (PCIe), 100MHz (32-pin or 24-pin
QFN)
Outputs 50Ω to VSS
2 LVCMOS, 125MHz (16-pin QFN)
Outputs open
LVCMOS Inputs (OE1, OE2, PLL_BYPASS, XTAL_SEL, FSEL)
DC Electrical Characteristics(8)
VDD = 3.3V ±5% or 2.5V ±5%, TA = −40°C to +85°C
Symbol
Parameter
Condition
Min.
VIH
Input High Voltage
VIN
Input Low Voltage
IIH
Input High Current
VDD = VIN = 3.465V
IIL
Input Low Current
VDD = 3.465V, VIN = 0V
Typ.
Max.
Units
2
VDD + 0.3
V
−0.3
0.8
V
150
µA
−150
µA
Notes:
5. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied
at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
6. The datasheet limits are not guaranteed if the device is operated beyond the operating ratings.
7. Package thermal resistance assumes the exposed pad is soldered (or equivalent) to the device’s most negative potential on the PCB.
8. The circuit is designed to meet the AC and DC specifications shown in the Electrical Characteristics tables after thermal equilibrium has been
established.
June 6, 2013
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SM802XXX
LVDS Output DC Electrical Characteristics(8)
VDD = VDDO1/2 = 3.3V ±5% or 2.5V ±5%
VDD = 3.3V ±5%, VDDO1/2 = 3.3V ±5% or 2.5V ±5%
TA = −40°C to +85°C. RL = 100Ω across Q1 and /Q1.
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
VOD
Differential Output Voltage
Figure 6
275
350
475
mV
ΔVOD
VOD Magnitude Change
40
mV
VOS
Offset Voltage
ΔVOS
VOS Magnitude Change
1.15
1.25
1.50
V
50
mV
HCSL Output DC Electrical Characteristics(8)
VDD = VDDO1/2 = 3.3V ±5% or 2.5V ±5%
VDD = 3.3V ±5%, VDDO1/2 = 3.3V ±5% or 2.5V ±5%
TA = −40°C to +85°C. RL = 50Ω to VSS
Symbol
Parameter
VOH
Condition
Min.
Typ.
Max.
Units
Output High Voltage
660
700
850
mV
VOL
Output Low Voltage
−150
0
27
mV
VSWING
Output Voltage Swing
250
350
550
mV
Min.
Typ.
Max.
Units
LVPECL Output DC Electrical Characteristics(8)
VDD = VDDO1/2 = 3.3V ±5% or 2.5V ±5%
VDD = 3.3V ±5%, VDDO1/2 = 3.3V ±5% or 2.5V ±5%
TA = −40°C to +85°C. RL = 50Ω to VDDO − 2V
Symbol
Parameter
Condition
VOH
Output High Voltage
VDDO – 1.145
VDDO – 0.97
VDDO – 0.845
V
VOL
Output Low Voltage
VDDO – 1.945
VDDO – 1.77
VDDO – 1.645
V
VSWING
Output Voltage Swing
0.6
0.8
1.0
V
Min.
Typ.
Max.
Units
LVCMOS Output DC Electrical Characteristics(8)
VDD = VDDO1/2 = 3.3V ±5% or 2.5V ±5%
VDD = 3.3V ±5%, VDDO1/2 = 3.3V ±5% or 2.5V ±5%
TA = −40°C to +85°C. RL = 50Ω to VDDO/2
Symbol
Parameter
Condition
VOH
Output High Voltage
Figure 7
VOL
Output Low Voltage
Figure 7
June 6, 2013
VDDO – 0.7
V
0.6
7
V
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SM802XXX
REF_IN DC Electrical Characteristics(8)
VDD = 3.3V ±5% or 2.5V ±5%, TA = −40°C to +85°C
Symbol
Parameter
VIH
Input High Voltage
VIL
Input Low Voltage
IIN
Input Current
Condition
Min.
XTAL_SEL = VIL, VIN = 0V to VDD
Typ.
Max.
Units
1.1
VDD + 0.3
V
−0.3
0.6
V
−5
5
µA
XTAL_SEL = VIH, VIN = VDD
20
µA
Crystal Characteristics
VDD = 3.3V ±5% or 2.5V ±5%, TA = −40°C to +85°C
Parameter
Condition
Min.
Mode of Oscillation
10pF load capacitance
Typ.
Max.
Units
Fundamental, parallel resonant
Frequency
11
Equivalent Series Resistance (ESR)
30
MHz
40
Ω
Shunt Capacitance, C0
2
5
pF
Correlation Drive Level
10
100
µW
LVPECL AC Electrical Characteristics(8, 9, 11, 15)
VDDA = VDD = 3.3V ±5% or 2.5V ±5%, VDDO = 2.5V or 3.3V ±5%, TA = –40°C to +85°C, unless otherwise noted.
Symbol
Parameter
FOUT
Output Frequency
TR/TF
LVPECL Output Rise/Fall Time
ODC
Output Duty Cycle
TSKEW
Output-to-Output Skew
TLOCK
PLL Lock Time
Tjit(∅)
RMS Phase Jitter @ 156.25MHz
Condition
Min.
Typ.
11
Max.
Units
840
MHz
20% – 80%
80
175
350
ps
< 350MHz
48
50
52
%
≥ 350MHz
45
50
Note 10
55
%
45
ps
20
ms
Integration Range (12kHz to 20MHz)
245
fs
Integration Range (1.875MHz to 20MHz)
115
fs
Notes:
9. See Figures 4 to 7 for load test circuit examples.
10. Defined as skew between outputs at the same supply voltage and with equal load conditions; Measured at the output differential crossing points.
11. All phase noise measurements were taken with an Agilent 5052B phase noise system.
June 6, 2013
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SM802XXX
LVDS AC Electrical Characteristics(8, 9, 11, 12)
VDDA = VDD = 3.3V ±5% or 2.5V ±5%, VDDO = 2.5V or 3.3V ±5%, TA = –40°C to +85°C, unless otherwise noted.
Symbol
Parameter
FOUT
Output Frequency
TR/TF
LVDS Output Rise/Fall Time
ODC
Output Duty Cycle
TSKEW
Output-to-Output Skew
TLOCK
PLL Lock Time
Tjit(∅)
RMS Phase Jitter @ 156.25MHz
Condition
Min.
Typ.
11
Max.
Units
840
MHz
20% – 80%
100
160
400
ps
< 350MHz
48
50
52
%
≥ 350MHz
45
50
55
%
45
ps
20
ms
Note 10
Integration Range (1.875MHz to 20MHz)
99
fs
HCSL AC Electrical Characteristics(8, 9, 11, 13)
VDDA = VDD = 3.3V ±5% or 2.5V ±5%, VDDO = 2.5V or 3.3V ±5%, TA = –40°C to +85°C, unless otherwise noted.
Symbol
Parameter
FOUT
Output Frequency
TR/TF
Output Rise/Fall Time
ODC
Output Duty Cycle
TSKEW
Output-to-Output Skew
TLOCK
PLL Lock Time
Tjit(∅)
RMS Phase Jitter @ 100MHz
Condition
Min.
Typ.
11
Max.
Units
840
MHz
20% – 80%
150
300
450
ps
< 350MHz
48
50
52
%
≥ 350MHz
45
50
55
%
50
ps
20
ms
Note 10
Integration Range (12kHz to 20MHz)
254
fs
Integration Range (1.875MHz to 20MHz)
115
fs
LVCMOS AC Electrical Characteristics(8, 9, 11, 14)
VDDA = VDD = 3.3V ±5% or 2.5V ±5%, VDDO = 2.5V or 3.3V ±5%, TA = –40°C to +85°C, unless otherwise noted.
Symbol
Parameter
FOUT
Output Frequency
FREF
REF_IN Frequency
TR/TF
Output Rise/Fall Time
ODC
Output Duty Cycle
TSKEW
Output-to-Output Skew
TLOCK
PLL Lock Time
Tjit(∅)
RMS Phase Jitter @ 125MHz
Condition
Min.
20% – 80%
Max.
Units
11
250
MHz
11
80
MHz
100
500
ps
55
%
60
ps
20
ms
45
Typ.
50
Note 10
Integration Range: 1.875MHz to 20MHz
114
fs
Notes:
12. Outputs terminated 100Ω between Q and /Q. All unused outputs must be terminated.
13. Output load is 50Ω to VSS.
14. Output load is 50Ω to VDD / 2.
15. Output load is 50Ω to VDD - 2V.
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SM802XXX
Phase Noise Plots
100MHz HCSL, 254fs rms for 12kHz to 20MHz integration range
125MHz LVCMOS, 114fs rms for 1.875MHz to 20MHz integration range
June 6, 2013
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SM802XXX
156.25MHz LVPECL, 245fs rms for 12kHz to 20MHz integration range
644.53125MHz LVDS, 293fs rms for 12kHz to 20MHz integration range
June 6, 2013
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SM802XXX
Power Supply Filtering Recommendations
Preferred filter, using Micrel MIC94300 or MIC94310 Ripple Blocker:
Alternative, traditional filter, using a ferrite bead:
Application Information
Input Reference
When operating with a crystal input reference, do not apply
a switching signal to REF_IN.
The impedance value of the Ferrite Bead (FB) needs to be
between 240Ω and 600Ω with a saturation current
≥150mA.
The VDDO1 and VDDO2 pins connect directly to the VDD
Plane. All VDD pins on the SM802XXX connect to VDD
after the power supply filter.
Crystal Layout
Keep the layers under the crystal as open as possible and
do not place switching signals or noisy supplies under the
crystal. Crystal load capacitance is built inside the die so
no external capacitance is needed. See the Selecting a
Quartz Crystal for the Clockworks Flex I Family of
Precision Synthesizers application note for more details.
Output Traces
Design the traces for the output signals according to the
output logic requirements. If LVCMOS is unterminated,
add a 30Ω resistor in series with the output, as close as
possible to the output pin and start a 50Ω trace on the
other side of the resistor.
If you need help selecting a suitable crystal for your
application, contact Micrel’s HBW applications group at:
[email protected].
For differential traces you can either use a differential
design or two separate 50Ω traces. For EMI reasons it is
better to use a differential design.
Power Supply Decoupling
Place the smallest value decoupling capacitor (4.7nF
above) between the VDD and VSS pins, as close as
possible to those pins and at the same side of the PCB as
the IC. The shorter the physical path from VDD to
capacitor and back from capacitor to VSS, the more
effective the decoupling. Use one 4.7nF capacitor for each
VDD pin on the SM802XXX.
June 6, 2013
12
LVDS can be AC-coupled or DC-coupled to its termination.
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SM802XXX
Figure 1. Duty Cycle Timing
Figure 2. All Outputs Rise/Fall Time
Figure 3. RMS Phase/Noise/Jitter
Figure 4. LVPECL Output Load and Test Circuit
June 6, 2013
Figure 5. HCSL Output Load and Test Circuit
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SM802XXX
Figure 6. LVDS Output Load and Test Circuit
Figure 7. LVCMOS Output Load and Test Circuit
Figure 8. Crystal Input Interface
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SM802XXX
Package Information and Recommended Land Pattern for 44-Pin QFN(15)
NOTE: 1, 2, 3
NOTE: 1, 2, 3
NOTE: 1, 2, 3
3.6±0.02
0.5 BSC
3.6±0.02
0.25±0.02
0.8±0.02
5.6±0.05
7.2±0.05
NOTE: 4, 5
44-Pin QFN
Note:
16. Package information is correct as of the publication date. For updates and most current information, go to www.micrel.com.
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SM802XXX
Package Information and Recommended Land Pattern for 32-Pin QFN(15)
NOTE: 1, 2, 3
NOTE: 1, 2, 3
NOTE: 1, 2, 3
NOTE: 4, 5
32-Pin QFN
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SM802XXX
Package Information and Recommended Land Pattern for 24-Pin QFN(15)
NOTE: 1, 2, 3
NOTE: 1, 2, 3
+0.03
−0.00
NOTE: 1, 2, 3
NOTE: 4, 5
24-Pin QFN
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SM802XXX
Package Information and Recommended Land Pattern for 16-Pin QFN(15)
NOTE: 1, 2, 3
NOTE: 1, 2, 3
NOTE: 1, 2, 3
NOTE: 4, 5
16-Pin QFN
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
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Micrel makes no representations or warranties with respect to the accuracy or completeness of the information furnished in this data sheet. This
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Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product
can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant
into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A
Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk and Purchaser agrees to fully
indemnify Micrel for any damages resulting from such use or sale.
© 2013 Micrel, Incorporated.
June 6, 2013
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Revision 1.0
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