CMOS LDO Regulators for Potable Equipments System Regulator with High Efficiency DC/DC Converters BH6172GU No.11020EAT08 ●Descriptions BH6172GU incorporates 1 DCDC+ 5 Linear LDO regulators. It is integrated in a small 2.6mm×2.6mm size package, with 16 steps adjustable Vo’s for every channel, low voltage output (0.8V~) to support almost any kind of mobile application now available. ●Features 2 1) 1ch 500mA, high efficiency Step-down Converter. (16 steps adjustable VO by I C) 2 2) 5-channel CMOS-type LDOs. (16 steps adjustable VO by I C, 150mA×3, 300mA×2) 3) Power ON/OFF control enabled by I2C interface or external pin 4) I2C compatible Interface. (Device address is “1001111”) 5) Wafer Level CSP package(2.6mm×2.6mm) for space-constrained applications 6) Discharge resistance selectable for power-down sequence ramp speed control 7) Over-current protection in all LDO regulators 8) Over-current protection in Step-down Converter 9) Over-voltage protection in Step-down Converter 10) Thermal shutdown protection ●Applications Mobile phones, Portable game systems, Portable mp3 players, Portable DVD players, Portable TV, Portable GPS, PDA, Portable electronic dictionaries, etc. ●Absolute maximum ratings (Ta=25℃) Parameter Symbol Ratings Unit Maximum Supply Voltage (VBAT) VBATMAX 6.0 V Maximum Supply Voltage (PBAT) VPBATMAX 6.0 V Maximum Supply Voltage (VUSB) VUSBMAX 6.0 V Maximum Supply Voltage (DVDD) DVDDMAX 4.5 V Maximum Input Voltage 1 (LX, FB, OUT1, OUT2, OUT3, OUT4, OUT5, EN_LD1, EN_LD2, EN_LD3, EN_LD4) VINMAX1 VBAT + 0.3 V Maximum Input Voltage 2 (NRST, CLK, DATA) VINMAX2 DVDD + 0.3 V Pd 900*1 mW Operating Temperature Range Topr -35 ～ +85 ℃ Storage Temperature Range Tstg -55 ～ +125 ℃ Power Dissipation * This is an allowable loss of the ROHM evaluation glass epoxy board(60mm×60mm×16mm). To use at temperature higher than 25℃ , derate 9.0mW per 1℃. *1 Must not exceed Pd or ASO. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 1/16 2011.03 - Rev.A Technical Note BH6172GU ●Recommended Operating Conditions (Ta=25℃) Parameter Symbol Ratings Unit VBAT Voltage VBAT 2.20 ～ 5.50*2 V PBAT Voltage VPBAT 2.20 ～ 5.50*2 V VUSB Voltage VUSB 2.20 ～ 5.50*2*3 V DVDD Voltage VDVDD 1.70 ～ 4.20*4 V *2 Whenever the VBAT or PBAT or VUSB voltage is under the LDO, SWREG output voltage, or else under certain levels, the LDO and SWREG output is not guaranteed to meet its published specifications. *3 VUSB Power Supply can be externally connected to the VBAT, PBAT Power Supply when necessary. *4 The DVDD Voltage must be under the Battery Voltage VBAT, PBAT at any times. ●Electrical Characteristics (Unless otherwise specified, Ta=25℃, VBAT=PBAT =3.6V, VUSB=5.0V) Limits Parameter Symbol Unit Condition Min. Typ. Max. Circuit Current VBAT Circuit Current 1 (OFF) IQVB1 - 0.4 1 µA VUSB Circuit Current 1 (OFF) IQUSB1 - 0 1 µA VBAT Circuit Current 2 (OFF) IQVB2 - 0.4 1 µA VBAT Circuit Current 3 (STANDBY) IQVB3 - 0.7 1.4 µA VUSB Circuit Current 2 (STANDBY) IQUSB2 - 0 1 µA VBAT Circuit Current 4 (STANDBY) IQVB4 - 0.7 1.4 µA VBAT Circuit Current 5 (Active) IQVB5 - 170 300 µA VUSB Circuit Current 3 (Active) IQUSB3 - 35 70 µA VBAT Circuit Current 6 (Active) IQVB6 - 200 350 µA LDO1～5=OFF SWREG1=OFF NRST=L DVDD=0V LDO1～5=OFF SWREG1=OFF NRST=L DVDD=0V VUSB=VBAT external connection LDO1～5=OFF SWREG1=OFF NRST=H DVDD=2.6V LDO1～5=OFF SWREG1=OFF NRST=H DVDD=2.6V VUSB=VBAT external connection LDO1～5=ON(no load, initial voltage) SWREG1=ON(no load, initial voltage) NRST=H DVDD=2.6V LDO1～5=ON(no load, initial voltage) SWREG1=ON(no load, initial voltage) NRST=H DVDD=2.6V VUSB=VBAT external connection ◎This product is not especially designed to be protected from radioactivity. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 2/16 2011.03 - Rev.A Technical Note BH6172GU ●Electrical Characteristics (Unless otherwise specified, Ta=25℃, VBAT=PBAT =3.6V, VUSB=5.0V, DVDD=2.6V) Limits Parameter Symbol Unit Condition Min. Typ. Max. Logic pin character NRST (CMOS input) EN_LD1, EN_LD2, EN_LD3, EN_LD4 (NMOS input) Input “H” level Input “L” level Input leak current Input “H” level Input “L” level Input leak current VIH1 DVDD ×0.7 - DVDD +0.3 DVDD ×0.3 VIL1 -0.3 - IIC1 0 0.3 1 µA VIH2 1.44 - - V VIL2 - - 0.4 V IIC2 -1 0 1 µA V Pin voltage: DVDD V Pin voltage: 0 V Digital characteristics (Digital pins: CLK and DATA ) Input "H" level VIH3 DVDD ×0.8 - DVDD +0.3 DVDD ×0.2 Input "L" level VIL3 -0.3 - Input leak current IIC3 -1 0 1 µA Pin voltage: DVDD DATA output "L" level voltage VOL - - 0.4 V IOL=6mA Output Voltage VOSW 0.94 1.00 1.06 V initial value Io=100mA Output current IOSW - - 500 mA Vo=1.00V Efficiency ηSW - 90 - % Oscillating Frequency fOSC - 1.7 - MHz Output Inductance LSWREG 1.5 2.2 - µH Ta= -30～75℃ Short circuit current ISHTSW - 500 - mA Ta= -30～75℃ Output Capacitance CSWREG 3.3 4.7 - µF Ta= -30～75℃ with SWREG's DC bias V V SWREG www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 3/16 Io=100mA, Vo=2.40V, VBAT=3.2V Vo=1.00V 2011.03 - Rev.A Technical Note BH6172GU ●Electrical Characteristics (Unless otherwise specified, Ta=25℃, VBAT=PBAT =3.6V, VUSB=5.0V) Limits Parameter Symbol Unit Condition Min. Typ. Max. LDO1 initial value Io=1mA@VBAT=4.5V Io=150mA@VBAT=3.4V Output Voltage VOM1 0.970 1.000 1.030 V Output current VOM1C - - 150 mA Vo=1.0V VOM1DP - 0.1 - V Io=50mA Input Voltage Stability ⊿VIM1 - 2 - mV Load Stability ⊿VLM1 - 20 - mV Ripple rejection ratio RRM1 - 60 - dB VR=-20dBV, fR=120Hz Io=50mA, Vo=2.6V BW=20Hz～20kHz Short circuit current ISHTM3 - 180 - mA Vo=0V Output Capacitor COUT1 - 1.0 - µF Ta= -30～75℃ with LDO's DC bias Output Voltage VOM2 2.522 2.600 2.678 V initial value Io=1mA@VBAT=4.5V Io=150mA@VBAT=3.4V Output current VOM2C - - 150 mA Vo=2.6V VOM2DP - 0.1 - V Io=50mA Input Voltage Stability ⊿VIM2 - 2 - mV Load Stability ⊿VLM2 - 20 - mV Ripple rejection ratio RRM2 - 60 - dB VR=-20dBV, fR=120Hz Io=50mA, Vo=2.6V BW=20Hz～20kHz Short circuit current ISHTM3 - 180 - mA Vo=0V Output Capacitor COUT2 - 1.0 - µF Ta= -30～75℃ with LDO's DC bias Output Voltage VOM3 2.716 2.800 2.884 V initial value Io=1mA@VBAT=4.5V Io=150mA@VBAT=3.4V Output current VOM3C - - 300 mA Vo=2.8V VOM3DP - 0.1 - V Io=50mA Input Voltage Stability ⊿VIM3 - 2 - mV Load Stability ⊿VLM3 - 20 - mV Ripple rejection ratio RRM3 - 60 - dB VR=-20dBV, fR=120Hz Io=50mA, Vo=2.6V BW=20Hz～20kHz Short circuit current ISHTM3 - 180 - mA Vo=0V Output Capacitor COUT3 - 1.0 - µF Ta= -30～75℃ with LDO's DC bias Dropout Voltage VBAT=3.4～4.5V, Io=50mA Vo=1.0V Io=50µA～150mA, VBAT=3.6V Vo=1.0V LDO2 Dropout Voltage VBAT=3.4～4.5V, Io=50mA Vo=2.6V Io=50µA～150mA, VBAT=3.6V Vo=2.6V LDO3 Dropout Voltage www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 4/16 VBAT=3.4～4.5V, Io=50mA Vo=2.8V Io=50µA～300mA, VBAT=3.6V Vo=2.8V 2011.03 - Rev.A Technical Note BH6172GU ●Electrical Characteristics (Unless otherwise specified, Ta=25℃, VBAT=PBAT =3.6V, VUSB=5.0V) Limits Parameter Symbol Unit Condition Min. Typ. Max. LDO4 initial value Io=1mA@VBAT=4.5V Io=300mA@VBAT=3.4V Output Voltage VOM4 1.746 1.800 1.854 V Output current VOM4C - - 300 mA Vo=1.8V VOM4DP - 0.1 - V Io=50mA Input Voltage Stability ⊿VIM4 - 2 - mV Load Stability ⊿VLM4 - 30 - mV Ripple rejection ratio RRM4 - 60 - dB VR=-20dBV, fR=120Hz Io=50mA, Vo=2.6V BW=20Hz～20kHz Short circuit current ISHTM4 - 340 - mA Vo=0V Output Capacitor COUT4 - 1.0 - µF Ta= -30～75℃ with LDO's DC bias Output Voltage VOM5 3.201 3.300 3.399 V initial value Io=1mA@VUSB=5.5V Io=150mA@VUSB=4.4V Output current VOM5C - - 150 mA Vo=3.3V VOM5DP - 0.1 - V Io=50mA Input Voltage Stability ⊿VIM5 - 2 - mV Load Stability ⊿VLM5 - 20 - mV Ripple rejection ratio RRM5 - 60 - dB VR=-20dBV, fR=120Hz Io=50mA, Vo=2.6V BW=20Hz～20kHz Short circuit current ISHTM5 - 180 - mA Vo=0V Output Capacitor COUT5 - 1.0 - µF Ta= -30～75℃ with LDO's DC bias Dropout Voltage VBAT=3.4～4.5V, Io=50mA Vo=1.8V Io=50µA～300mA, VBAT=3.6V Vo=1.8V LDO5 Dropout Voltage www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 5/16 VUSB=4.4～5.5V, Io=50mA Vo=3.3V Io=50µA～150mA, VUSB=5.5V Vo=3.3V 2011.03 - Rev.A Technical Note BH6172GU ●SWREG & LDOs Output Voltage table Usage example Power Supply Initial Output Voltage Load max Adjustable range SWREG CORE VBAT/PBAT 1.00V 500mA 0.80-2.40V LDO1 CORE VBAT 1.00V 150mA 1.00-3.30V LDO2 I/O1 VBAT 2.60V 150mA 1.00-3.30V LDO3 MEMORY VBAT 2.80V 300mA 1.20-3.30V LDO4 I/O2 VBAT 1.80V 300mA 1.20-3.30V LDO5 USB VBAT/VUSB 3.30V 150mA 1.20-3.30V Parameter Parameter Programmable Output Voltages SWREG LDO1 LDO2 LDO3 LDO4 LDO5 0.80V 1.00V 1.00V 1.20V 1.20V 1.20V 0.85V 1.10V 1.10V 1.30V 1.30V 1.30V 0.90V 1.20V 1.20V 1.40V 1.40V 1.40V 0.95V 1.30V 1.30V 1.50V 1.50V 1.50V 1.00V 1.40V 1.40V 1.60V 1.60V 1.60V 1.05V 1.50V 1.50V 1.70V 1.70V 1.70V 1.10V 1.60V 1.60V 1.80V 1.80V 1.80V 1.15V 1.70V 1.70V 1.85V 1.85V 1.85V 1.20V 1.80V 1.80V 1.90V 1.90V 1.90V 1.365V 1.85V 1.85V 2.00V 2.00V 2.00V 1.40V 2.60V 2.60V 2.60V 2.60V 2.60V 1.50V 2.70V 2.70V 2.70V 2.70V 2.70V 1.65V 2.80V 2.80V 2.80V 2.80V 2.80V 1.80V 2.85V 2.85V 2.85V 2.85V 2.85V 1.85V 3.00V 3.00V 3.00V 3.00V 3.00V 2.40V 3.30V 3.30V 3.30V 3.30V 3.30V www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 6/16 2011.03 - Rev.A Technical Note BH6172GU 4.7µF VBAT2 VBAT1 ●Block diagram, Ball matrix LDO1 DVDD 1.00-3.30V 0.1V step DATA init 1.00V OUT1 150mA 1µF EN_LD1 I2CIF CLK LDO2 1.00-3.30V 0.1V step NRST PBAT LDO3 LX 2.2µH 4.7µF PGND 1.20-3.30V 0.1V step SWREG 150mA 1µF 1µF EN_LD3 500mA init 1.00V LDO4 1.20-3.30V 0.1V step init 1.80V OUT4 VBAT2 OUT3 D OUT2 EN_LD2 EN_LD3 NRST OUT1 C GND EN_LD1 EN_LD4 CLK DVDD B REFC TEST DATA FB A OUT5 VUSB PGND LX PBAT 1 2 3 4 5 OUT4 300mA 1µF EN_LD4 (OPEN) TEST VUSB (OPEN) TEST2 1µF REFC TEST2 init 2.80V OUT3 300mA 0.8-2.40V FB VBAT1 init 2.60V OUT2 EN_LD2 4.7µF E REF LDO5 0.1µF OUT5 150mA 1µF GND 1.20-3.30V 0.1V step init 3.30V Fig.1 Block diagram Fig.2 Ball matrix ●Pin description Ball No. PIN Name Function B4 DATA Data input/output for I2C C4 CLK CLK input for I2C E1 VBAT1 Power Supply 1 E4 VBAT2 Power Supply 2 A5 PBAT A4 LX A3 PGND B5 FB D4 NRST RESET Input Pin (Low Active) D5 OUT1 LDO1 Output D1 OUT2 LDO2 Output E5 OUT3 LDO3 Output E3 OUT4 LDO4 Output A1 OUT5 LDO5 Output B1 REFC Reference Voltage Output C2 EN_LD1 LDO1 Enable Pin D2 EN_LD2 LDO2 Enable Pin D3 EN_LD3 LDO3 Enable Pin C3 EN_LD4 LDO4 Enable Pin A2 VUSB USBVBUS Power Supply*1 C5 DVDD Digital Power Supply C1 GND Analog Ground B3 TEST TEST PIN (Always keep OPEN at normal use) E2 TEST2 TEST PIN (Always keep OPEN at normal use) Power Supply for SWREG Inductor Connect pin for SWREG Ground for SWREG Voltage Feed back pin for SWREG * EST, TEST2 pin is used during our company shipment test. lease keep TEST pin and TEST2 pin “OPEN” at all times. *1 USB Power Supply can be externally connected to the VBAT Power Supply when necessary. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 7/16 2011.03 - Rev.A Technical Note BH6172GU ●I2C Bus Interface 2 The I C compatible synchronous serial interface provides access to programmable functions and register on the device. This protocol uses a two-wire interface for bi-directional communications between the LSI’s connected to the bus. The two interface lines are the Serial Data Line (DATA), and the Serial Clock Line (CLK). These lines should be connected to the power supply DVDD by a pull-up resistor, and remain high even when the bus is idle. 1. Start and Stop Conditions When CLK is high, pulling DATA low produces a start condition and pulling DATA high produces a stop condition. Every instruction is started when a start condition occurs and terminated when a stop condition occurs. During read, a stop condition causes the read to terminate and the chip enters the standby state. During write, a stop condition causes the fetching of write data to terminate, after which writing starts automatically. Upon the completion of writing, the chip enters the standby state. Two or more start conditions cannot be entered consecutively. tSU.STA tHD.STA tSU.STO CLK DATA Start condition Stop condition 2 Fig.3 I C Start, Stop condition 2. Data transmission Data on the DATA input can be modified while CLK is low. When CLK is high, modifying the DATA input means a start or stop condition. tSU.DAT tHD.DAT CLK DATA Modify data Modify data 2 Fig.4 I C Data Transmission Timing All other acknowledge, write, and read timings all conform to the I2C standard. 3. Device addressing The device address for this device is “1001111”. Read/write instruction code Device address 1 0 0 1 1 1 1 MSB R/W LSB 2 Fig.5 I C device address www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 8/16 2011.03 - Rev.A Technical Note BH6172GU ●I2C Bus AC specification Characteristics Symbol Min. Max. Unit CLK clock frequency fCLK 0 400 kHz CLK clock “low” time tLOW 1.3 - µs CLK clock “high” time tHIGH 0.6 - µs Bus free time tBUF 1.3 - µs Start condition hold time tHD.STA 0.6 - µs Start condition setup time tSU.STA 0.6 - µs Data input hold time tHD.DAT 0 - ns Data input setup time tSU.DAT 100 - ns Stop condition setup time tSU.STO 0.6 - µs tF tHIGH tR tLOW CLK tSU.STA tHD.STA tSU.STO tHD.DAT tSU.DAT DATA (INPUT) tBUF Fig.6 Bus timing 1 CLK DATA (INPUT) DO tWR Write data input Acknowledge output Stop condition Start condition Fig.7 Bus timing 2 www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 9/16 2011.03 - Rev.A Technical Note BH6172GU ●I2C Register information ○REGCNT(SWREGON, LDO*ON) Control each SWREG, LDO. 0 ON 1 OFF ○SWADJ(SWREGADJ[3:0]) Change SWREG output voltage by 16 steps. ～ 0.80V ～ “0000” “1111” 2.40V ○LDOADJ*(LDO*ADJ[3:0]) Change LDO1～5 output voltage by 16 steps. ～ 1.00V(LDO1, 2), 1.20V(LDO3, 4, 5) ～ “0000” “1111” 3.30V ○PDSEL(SWPDSEL, LDO*PDSEL) Change the discharge resistance of SWREG, LDO. 0 1kΩ 1 10kΩ ○PDCNT(SWPD, LDO*PD) Enable/disable the discharge resistance of SWREG, LDO. 0 Discharge disable 1 Discharge enable ○EN_SEL(ENLD*_EN) 2 Select either an enable pin or I C register for LDO1～4 ON/OFF control. 0 External enable pin selected 1 I2C register selected www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 10/16 2011.03 - Rev.A Technical Note BH6172GU ●Reference data(ICC) ICC(OFF) VUSB=5.0V ICC(OFF) VBAT=VUSB short 9 9 8 8 7 7 6 6 I_VBAT [uA] 10 I_VBAT [uA] 10 5 4 5 4 3 3 2 2 1 1 0 0 0 0.5 1 1.5 2 2.5 3 3.5 VBAT [V] 4 4.5 5 5.5 6 0 0.5 1 2 2.5 3 3.5 VBAT [V] 4 4.5 5 5.5 6 ICC(ACTIVE) VBAT=VUSB short ICC(STBY) VBAT=VUSB short 1 9 0.9 8 0.8 7 0.7 6 0.6 I_VBAT [mA] 10 I_VBAT [uA] 1.5 5 4 0.5 0.4 3 0.3 2 0.2 1 0.1 0 0 0 0.5 1 1.5 2 2.5 3 3.5 VBAT [V] 4 4.5 5 5.5 6 3.2 3.7 4.2 4.7 5.2 5.7 VBAT [V] ●Reference data(SWREG) SWREG L o ad Re g u lat io n V O=1.0V SWREG L in e Re g u lat io n V O=1.0V 2 6 1.9 5.5 1.8 VBAT 1.7 5 1.6 1.5 4.5 1.4 1.3 1.2 3.5 1.1 FB [V] FB [ V] 4 3 2.5 1 0.9 0.8 0.7 2 0.6 1.5 0.5 0.4 1 0.3 0.2 0.5 0.1 0 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 0 6 50 100 150 200 250 300 350 400 450 500 IO [mA] VB AT [ V] SWREG Ef f icie n cy vs Io (V o =1.365V ) V BA T=3.6V 100 90 80 Ef ficien cy[ %] 70 60 50 40 30 20 10 0 0 50 100 150 200 250 300 350 400 450 500 IO[ mA] www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 11/16 2011.03 - Rev.A Technical Note BH6172GU ●Reference data(Output stability) 4 4 4 3 3 2.5 2.5 2 OUT3 [V] 3 2.5 OUT2 [V] OUT1 [V] 3.5 3.5 2 2 1.5 1.5 1.5 1 1 1 0.5 0.5 0.5 0 0 0 0 50 100 IO [mA] 150 0 200 4 50 100 IO [mA] 150 200 150 200 0 50 100 150 IO [mA] 200 250 300 4 LDO4 Load Regulation 1.80V LDO5 Load Regulation 3.30V 3.5 3.5 3 3 2.5 2.5 OUT5 [V] OUT4 [V] LDO3 Load Regulation 3.0V LDO2 Load Regulation 2.60V LDO1 Load Regulation 1.20V 3.5 2 1.5 2 1.5 1 1 0.5 0.5 0 0 0 100 200 IO [mA] 300 400 0 50 100 IO [mA] ●Reference data(Input stability) 6 6 LDO1 Line Regulation 1.20V 5.5 5 VBAT VBAT 4.5 3.5 3.5 3.5 OUT3 [V] 4 2.5 3 2.5 3 2.5 2 2 2 1.5 1.5 1.5 1 1 1 0.5 0.5 0.5 0 0 0 0.5 1 1.5 2 2.5 3 3.5 VBAT [V] 4 4.5 5 5.5 6 0 0 6 VBAT 4.5 4 OUT2 [V] OUT1 [V] 5 4 3 LDO3 Line Regulation 3.0V 5.5 5 4.5 0.5 1 1.5 2 2.5 3 3.5 VBAT [V] 4 4.5 5 5.5 6 0 0.5 1 1.5 2 2.5 3 3.5 VBAT [V] 4 4.5 5 5.5 6 6 LDO4 Line Regulation 1.80V 5.5 LDO5 Line Regulation 3.30V 5.5 5 5 VBAT 4.5 4.5 4 4 3.5 3.5 OUT5 [V] OUT4 [V] 6 LDO2 Line Regulation 2.60V 5.5 3 2.5 3 2.5 2 2 1.5 1.5 1 1 0.5 0.5 0 VUSB 0 0 0.5 1 1.5 2 2.5 3 3.5 VBAT [V] 4 4.5 5 www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 5.5 6 0 0.5 1 1.5 2 2.5 3 3.5 VUSB [V] 12/16 4 4.5 5 5.5 6 2011.03 - Rev.A Technical Note BH6172GU ●Reference data(Load transient response) LDO1 LDO2 IO IO IO IO LDO2 LDO1 LDO1 LDO2 LDO3 LDO4 IO IO IO IO LDO3 LDO3 LDO4 LDO4 LDO5 IO IO LDO5 LDO5 ●Reference data(Rise time) LDO1 LDO2 EN_LD1 EN_LD2 LDO1 LDO2 LDO3 LDO4 EN_LD3 EN_LD4 LDO3 LDO4 www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 13/16 2011.03 - Rev.A Technical Note BH6172GU ●Reference data(VBAT line transient response) LDO1 VBAT LDO1 LDO2 VBAT VBAT VBAT LDO2 LDO4 LDO3 LDO3 LDO5 VUSB LDO4 LDO5 www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 14/16 2011.03 - Rev.A Technical Note BH6172GU ●Notes for use (1) Absolute maximum ratings If applied voltage (VBAT, VADP, VUSB), operating temperature range (Topr), or other absolute maximum ratings are exceeded, there is a risk of damage. Since it is not possible to identify short, open, or other damage modes, if special modes in which absolute maximum ratings are exceeded are assumed, consider applying fuses or other physical safety measures. (2) Recommended operating range This is the range within which it is possible to obtain roughly the expected characteristics. For electrical characteristics, it is those that are guaranteed under the conditions for each parameter. Even when these are within the recommended operating range, voltage and temperature characteristics are indicated. (3) Reverse connection of power supply connector There is a risk of damaging the LSI by reverse connection of the power supply connector. For protection from reverse connection, take measures such as externally placing a diode between the power supply and the power supply pin of the LSI. (4) Power supply lines In the design of the board pattern, make power supply and GND line wiring low impedance. When doing so, although the digital power supply and analog power supply are the same potential, separate the digital power supply pattern and analog power supply pattern to deter digital noise from entering the analog power supply due to the common impedance of the wiring patterns. Similarly take pattern design into account for GND lines as well. Furthermore, for all power supply pins of the LSI, in conjunction with inserting capacitors between power supply and GND pins, when using electrolytic capacitors, determine constants upon adequately confirming that capacitance loss occurring at low temperatures is not a problem for various characteristics of the capacitors used. (5) GND voltage Make the potential of a GND pin such that it will be the lowest potential even if operating below that. In addition, confirm that there are no pins for which the potential becomes less than a GND by actually including transition phenomena. (6) Shorts between pins and misinstallation When installing in the set board, pay adequate attention to orientation and placement discrepancies of the LSI. If it is installed erroneously, there is a risk of LSI damage. There also is a risk of damage if it is shorted by a foreign substance getting between pins or between a pin and a power supply or GND. (7) Operation in strong magnetic fields Be careful when using the LSI in a strong magnetic field, since it may malfunction. (8) Inspection in set board When inspecting the LSI in the set board, since there is a risk of stress to the LSI when capacitors are connected to low impedance LSI pins, be sure to discharge for each process. Moreover, when getting it on and off of a jig in the inspection process, always connect it after turning off the power supply, perform the inspection, and remove it after turning off the power supply. Furthermore, as countermeasures against static electricity, use grounding in the assembly process and take appropriate care in transport and storage. (9) Input pins Parasitic elements inevitably are formed on an LSI structure due to potential relationships. Because parasitic elements operate, they give rise to interference with circuit operation and may be the cause of malfunctions as well as damage. Accordingly, take care not to apply a lower voltage than GND to an input pin or use the LSI in other ways such that parasitic elements operate. Moreover, do not apply a voltage to an input pin when the power supply voltage is not being applied to the LSI. Furthermore, when the power supply voltage is being applied, make each input pin a voltage less than the power supply voltage as well as within the guaranteed values of electrical characteristics. (10) Ground wiring pattern When there is a small signal GND and a large current GND, it is recommended that you separate the large current GND pattern and small signal GND pattern and provide single point grounding at the reference point of the set so that voltage variation due to resistance components of the pattern wiring and large currents do not cause the small signal GND voltage to change. Take care that the GND wiring pattern of externally attached components also does not change. (11) Externally attached capacitors When using ceramic capacitors for externally attached capacitors, determine constants upon taking into account a lowering of the rated capacitance due to DC bias and capacitance change due to factors such as temperature. (12) Thermal shutdown circuit (TSD) When the junction temperature becomes higher than a certain specific value, the thermal shutdown circuit operates and turns the switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its operation. (13) Thermal design Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in actual states of use. (14) Rush Current Extra care must be taken on power coupling, power, ground line impedance, and PCB design while excess amount of rush current might instantly flow through the power line when powering-up a LSI which is equipped with several power supplies, depending on on/off sequence, and ramp delays. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 15/16 2011.03 - Rev.A Technical Note BH6172GU ●Ordering part number B H 6 Part No. 1 7 2 G Part No. U - Package GU: VCSP85H2 E 2 Packaging and forming specification E2: Embossed tape and reel VCSP85H2(BH6172GU) <Tape and Reel information> 0.25± 0.1 1.0MAX 2.60±0.05 1PIN MARK 2.60±0.05 3000pcs E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 0.3± 0.05 0.06 S 0.05 A B Embossed carrier tape Quantity Direction of feed S 24- φ 0.3±0.05 Tape A (φ0.15)INDEX POST B D C B A 1 0.3±0.05 2 3 4 P=0.5 × 4 E 1pin 5 P=0.5×4 www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. (Unit : mm) Reel 16/16 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 2011.03 - Rev.A Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001