1/4 Structure Silicon Monolithic Integrated Circuit Product Name Power supply for CCD camera / White LED driver / RGB LED driver for mobile phone Type BD6025GU Features A system power supply for the CCD camera module Built-in white LED driver and RGB LED driver o ○Absolute Maximum Ratings (Ta=25 C) Parameter Symbol Rating Unit Condition Maximum Applied Voltage 1 VMAX1 20(*1) V Maximum Applied Voltage 2 VMAX2 16(*2) V Maximum Applied Voltage 3 VMAX3 15(*3) V Maximum Applied Voltage 4 VMAX4 -13.5(*4) V Maximum Applied Voltage 5 VMAX5 6(*5) V Power Dissipation Pd 2413(*6) mW o Operating Temperature Range Topr -30 to 85 C o Storage Temperature Range Tstg -55 to 150 C (*1) VPLUS11, VPLUS12, SBD, SBDSENS, VPLUS2 pin (*2) CAMP, CAMPS pin (*3) LEDR, LEDG, LEDB, BKLED, FLED1 pin (*4) VNEG, CAMN, CAMNS pin (*5) Except Note1~Note4 pin (*6) Power dissipation deleting is 19.3mW/ oC, when it’s used in over 25 oC. (It’s deleting is on the board that is ROHM’s standard)） o ○Recommended operating conditions (VBAT≥VIO, Ta=-30 to 85 C) Rating Min. Typ. Max. VBAT input voltage VBAT 2.7 3.6 4.5 VIO input voltage VIO 1.62 3.3 This product isn’t designed to protect itself against radioactive rays. Parameter Symbol REV. C Unit V V Condition 2/4 ○Electrical Characteristics o Unless otherwise specified, Ta=25 C, VBAT=3.6V, VIO=1.8V/3.0V, VCC=2.45V Parameter Symbol Min. Spec Typ. Max. Unit Circuit Current VBAT Circuit current 1 VBAT Circuit current 2 VBAT Circuit current 3 IQ1 IQ2 IQ3 - 0.5 0.1 6.2 3.0 3.0 9.3 µA µA µA VBAT Circuit current 5 IQ5 - 11 16 µA Condition RSTB=0V RSTB=0V, VIO=0V REGVCC ON (Energy save mode) REGVCC ON (Energy save mode) REG1 ON (Energy save mode) REG2 ON (Energy save mode) REGVCC ON (Nomal Mode) VBAT Circuit current 8 IQ8 - 17 26 mA SWREG1 ON (Vo=14V, Io=1mA) (Add 30h=01h, Add 80h=01h) REGCP ON, REGCN ON SWREG1 ( DC/DC for White LED and Power supply for Camera ) FLED1 drive current 3 IFLED13 27.0 30.0 33.0 BKLED drive current 3 IBKLED3 27.0 30.0 33.0 SWREG2 ( DC/DC for RGB LED ) LEDR Drive current ILEDR22 135 150 165 (Large current) LEDG Drive current ILEDG22 135 150 165 (Large current) LEDB Drive current ILEDB22 135 150 165 (Large current) REGCP (15V/13V/12V LDO) mA mA mA mA mA Output voltage 1 VO151 14.5 15.0 15.5 V Output voltage 2 VO152 12.5 13.0 13.5 V Output voltage 3 VO153 11.5 12.0 12.5 V REGCN Add=80h Data=1Eh Add=90h Data=1Eh Add=A0h Data=0Ch Add=50h Data=1Eh Add=A0h Data=0Ah Add=60h Data=1Eh Add=A0h Data=09h Add=70h Data=1Eh Io=60mA, VPLUS12=16V REGCPVSEL1=0, REGCPVSEL2=0 Io=60mA, VPLUS12=15V REGCPVSEL1=1, REGCPVSEL2=0 Io=60mA, VPLUS12=15V REGCPVSEL1=1, REGCPVSEL2=1 (-8V/-7.5/-7V LDO) Io=50mA, VNEG=-10V Output voltage 1 VO81 -8.5 -8.0 -7.5 V Output voltage 2 VO82 -8.0 -7.5 -7.0 V Output voltage 3 VO83 -7.5 -7.0 -6.5 V VO12 3.04 3.1 3.16 V Io=150mA, REG1VSEL=1,REG1MD=1 VO22 1.74 1.8 1.86 V Io=100mA, REG2VSEL=H,REG2MD=1 REG1 (3.0V/3.1V LDO) Output voltage 2 REG2 (1.2V/1.8V LDO) Output voltage 3 REV. C REGCNVSEL1=0, REGCNVSEL2=0 Io=50mA, VNEG=-10V REGCNVSEL1=1/0, REGCNVSEL2=1 Io=50mA, VNEG=-9V REGCNVSEL1=1, REGCNVSEL2=0 3/4 ○External dimensions ○Terminals PIN PIN Name A1 PIN PIN Name PIN PIN Name T1 C9 CAMPS J1 VIO A2 GND2 C10 CAMP J2 TESTI A3 VBAT1 D1 REG2CNT J3 REG2VSEL A4 LEDR D2 SENSN2 J4 VCC A5 GND3 D9 TESTO J5 GND12 A6 LEDB D10 REG2O J6 FLED1 A7 CAMN E1 VBAT8 J7 TRSW1 A8 VNEG E2 TESTVCC J8 SENSP1 Type BD6025GU LOT No. A9 GND6 E9 VBAT4 J9 GND9 A10 T2 E10 VBAT3 J10 SBD B1 VPLUS2 F1 LEDCTL K1 T4 B2 GND1 F2 REG1CNT K2 GND13 B3 VBAT2 F9 VREF K3 VBAT7 B4 TRSW2 F10 REG1O K4 BKLED (Ф0.15) INDEX POST VCSP85H5 (64PIN) B5 LEDG G1 RSTB K5 GND11 B6 GND4 G2 CLK K6 VBAT6 B7 CAMNS G9 SBDSENS K7 GND10 B8 GND5 G10 IREF K8 VPLUS11 B9 GND7 H1 DATA K9 SENSN1 B10 VPLUS12 H2 STRB K10 T3 C1 SENSP2 H9 GND8 - - C2 GND14 H10 VBAT5 - - (Unit : mm) ○Block diagram VBAT1～8 SWREG1 SWREG2 Driver TRSW2 PWM Comp SENSP2 SENSN2 SENSP1 - + Current Limiter OSC Over Voltage DET VPLUS2 Driver + - Current Limiter + - TRSW1 PWM Comp OSC - + + ERR Amp + - + - SENSN1 Over Voltage DET ERR Amp + VPLUS11 SEL LEDB SEL LEDG LEDR BKLED FLED1 TESTO VREF Reference Voltage VREF IREF Reference Current IREF VCC LDO 2.45V VPLUS12 VPLUS11 CPU I/F Clamp LDO SBD SBDSENS Power Supply RSTB VNEG VIO REG1CNT VPLUS12 CPU I/F REG2CNT REGCP LDO 15V/13V/12V CAMP CAMPS REG2VSEL VNEG CPU I/F REGCN LDO -8V/-7.5V/-7V Level CLK DATA STRB CAMN CAMNS CPU I/F REG1 LDO 3.0V/3.1V CPU I/F REG2 LDO 1.2V/1.8V Shift Control Logic REG1O REG2O LEDCTL T1 T2 TESTI T3 TESTVCC T4 GND1～14 REV. C 4/4 ○Cautions on use (1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Power supply and GND line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. Pay attention to the interference by common impedance of layout pattern when there are plural power supplies and GND lines. Especially, when there are GND pattern for small signal and GND pattern for large current included the external circuits, please separate each GND pattern. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use a capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (3) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. (4) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. (5) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (6) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (7) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (8) Thermal shutdown circuit (TSD) This LSI builds in a thermal shutdown (TSD)circuit. A thermal shutdown circuit works when the junction temperature is beyond detection temperature. Then, a part of the LSI or all is made a state of off. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its operation. (9) Thermal design Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in actual states of use. (10) LDO Use each output of LDO by the independence. Don’t use under the condition that each output is short-circuited because it has the possibility that a operation becomes unstable. (11) DC/DC converter Please select the low DCR inductors to decrease power loss for DC/DC converter. Please choose the external parts not to exceed "Maximum Ratings" of the coil, the switching transistor, the diode and the resistance for the electric current detection". (12) Other cautions on use Please consult supplementary documents such as technical notebook, function manual and application notebook of this LSI. REV. C Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. 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