PR36MF51NSZF Series IT(rms)≤0.6A, Non-Zero Cross type DIP 8pin Triac output SSR PR36MF51NSZF Series *Zero cross type is also available. (PR36MF2xNSZ Series) ■ Description ■ Agency approvals/Compliance PR36MF51NSZF Series Solid State Relays (SSR) are an integration of an infrared emitting diode (IRED), a Phototriac Detector and a main output Triac. These devices are ideally suited for controlling high voltage AC loads with solid state reliability while providing 4kV isolation (Viso(rms)) from input to output. 1. Recognized by UL508 file No. E94758 (as model No. R36MF5) 2. Approved by CSA 22.2 No.14, file No. LR63705 (as model No. R36MF5) 3. Optionary available VDE approved (DIN EN 60747-52)(∗), file No. 40008898 (as model No. R36MF5) 4. Package resin : UL flammability grade (94V-0) ■ Features (∗) 1. Output current, IT(rms)≤0.6A 2. Non-zero crossing functionary 3. 8 pin DIP package (SMT gullwing also available) 4. High repetitive peak off-state voltage (VDRM : 600V) 5. Superior noise immunity (dV/dt : MIN. 100V/μs) 6. Response time, ton : MAX. 100μs 7. High isolation voltage between input and output (Viso(rms) : 4kV) 8. Lead free and RoHS directive compliant DIN EN60747-5-2 : successor standard of DIN VDE0884. ■ Applications 1. Isolated interface between high voltage AC devices and lower voltage DC control circuitry. 2. Switching motors, fans, heaters, solenoids, and valves. 3. Phase or power control in applications such as lighting and temperature control equipment. Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D4-A04001EN Date Sep. 1. 2006 © SHARP Corporation PR36MF51NSZF Series ■ Internal Connection Diagram 8 5 6 1 2 3 4 2 3 5 6 8 Gate Output (T1) Output (T2) 4 ■ Outline Dimensions (Unit : mm) 1.2±0.3 1.2±0.3 1.05±0.20 6 Model No. 5 R36MF5 SHARP mark "S" Rank mark CSA mark 3 5 Model No. R36MF5 Rank mark CSA mark 4 Date code (2 digit) Factory identification mark 1 7.62±0.30 9.66±0.50 3 4 Date code (2 digit) Factory identification mark 9.66±0.50 0.5TYP. 3.5±0.5 3.25±0.50 2.54±0.25 2 Anode mark 7.62±0.30 Epoxy resin 0.26±0.10 0.5±0.1 θ θ : 0 to 13˚ 2.54±0.25 1.0+0.4 −0 Epoxy resin θ Product mass : approx. 0.54g 3. Through-Hole VDE option [ex. PR36MF51YSZF] 4. SMT Gullwing Lead-Form VDE option [ex. PR36MF51YIPF] 1.2±0.3 6 Model No. 5 R36MF5 4 2 Anode mark R36MF1 Model No. Rank mark VDE identification mark 4 1 2 3 4 Date code (2 digit) Factory identification mark Anode mark 7.62±0.30 9.66±0.50 9.66±0.50 0.5TYP. 3.5±0.5 2.54±0.25 5 CSA mark VDE identification mark Date code (2 digit) Factory identification mark 3 6 Epoxy resin 0.26±0.10 0.5±0.1 θ θ : 0 to 13˚ 7.62±0.30 0.26±0.10 1 8 4 Rank mark CSA mark 3.25±0.50 SHARP mark "S" 2.54±0.25 3.5±0.5 8 1.05±0.20 6.5±0.5 1.05±0.20 6.5±0.5 SHARP mark "S" 1.0+0.4 −0 10.0+0 −0.5 Product mass : approx. 0.56g 1.2±0.3 0.35±0.25 2 6 0.26±0.10 1 Anode mark 8 1.05±0.20 3.5±0.5 8 6.5±0.5 SHARP mark "S" 2. SMT Gullwing Lead-Form [ex. PR36MF51NIPF] 6.5±0.5 1. Through-Hole [ex. PR36MF51NSZF] 1.0+0.4 −0 Epoxy resin 0.35±0.25 1 Cathode Anode Cathode Cathode 1.0+0.4 −0 10.0+0 −0.5 θ Product mass : approx. 0.56g Product mass : approx. 0.54g Plating material : SnCu (Cu : TYP. 2%) Sheet No.: D4-A04001EN 2 PR36MF51NSZF Series Date code (2 digit) A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 1st digit Year of production Mark A.D. A 2002 B 2003 C 2004 D 2005 E 2006 F 2007 H 2008 J 2009 K 2010 L 2011 M 2012 N : 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D Mark P R S T U V W X A B C : repeats in a 20 year cycle Factory identification mark Factory identification Mark Country of origin no mark Japan * This factory marking is for identification purpose only. Please contact the local SHARP sales representative to see the actural status of the production. Rank mark Please refer to the Model Line-up table. Sheet No.: D4-A04001EN 3 ■ Absolute Maximum Ratings Parameter Forward current Input Reverse voltage RMS ON-state current Output Peak one cycle surge current Repetitive peak OFF-state voltage *1 Isolation voltage Operating temperature Storage temperature *2 Soldering temperature Symbol Rating IF 50∗3 VR 6 IT(rms) 0.6∗3 Isurge 6∗4 600 VDRM Viso(rms) 4 Topr −30 to +85 Tstg −40 to +125 Tsol 270 (Ta=25˚C) Unit mA V A A V kV ˚C ˚C ˚C 1mm PR36MF51NSZF Series Soldering area *1 40 to 60%RH, AC for 1minute, f=60Hz *2 For 10s *3 Refer to Fig.1, Fig.2 *4 f=50Hz sine wave ■ Electro-optical Characteristics Parameter Forward voltage Input Reverse current Repentitive peak OFF-state current ON-state voltage Output Holding current Critical rate of rise of OFF-state voltage Transfer Minimum trigger current charac- Isolation resistance teristics Turn-on time Symbol VF IR IDRM VT IH dV/dt IFT RISO tON Condition IF=20mA VR=3V VD=VDRM IT=0.6A VD=6V − VD=1/√ 2 ·VDRM VD=6V, RL=100Ω DC500V, 40 to 60%RH VD=6V, RL=100Ω, IF=20mA MIN. − − − − − 100 − 5×1010 − TYP. 1.2 − − − − − − 1011 − MAX. 1.4 10 100 3 25 − 10 − 100 (Ta=25˚C) Unit V μA μA V mA V/μs mA Ω μs Sheet No.: D4-A04001EN 4 PR36MF51NSZF Series ■ Model Line-up Lead Form Through-Hole SMT Gullwing Shipping Sleeve Taping Package 50 pcs/sleeve 1 000 pcs/reel DIN Approved Approved − − EN60747-5-2 Model No. PR36MF51NSZF PR36MF51YSZF PR36MF51NIPF PR36MF51YIPF VDRM [V] Rank mark IFT[mA] (VD=6V, RL=100Ω) 600 1 MAX.10 Please contact a local SHARP sales representative to inquire about production status. Sheet No.: D4-A04001EN 5 PR36MF51NSZF Series Fig.2 RMS ON-state Current vs. Ambient Temperature 70 0.7 60 0.6 RMS ON-state current IT (rms) (A) Forward current IF (mA) Fig.1 Forward Current vs. Ambient Temperature 50 40 30 20 10 0 −30 0 50 0.5 0.4 0.3 0.2 0.1 0 −30 100 0 Ambient temperature Ta (˚C) 50 100 Ambient temperature Ta (˚C) Fig.3 Forward Current vs. Forward Voltage Fig.4 Minimum Trigger Current vs. Ambient Temperature 12 25˚C Minimum trigger current IFT (mA) 100 Forward current IF (mA) Ta=75˚C −25˚C 50˚C 10 1 0 0.5 1 1.5 2 2.5 10 8 6 4 2 0 −40 3 Forward voltage VF (V) 0 20 40 60 80 100 Fig.6 Relative Holding Current vs. Ambient Temperature 1.4 Relative holding current IH (t˚C) / IH (25˚C)×100% 1 000 IT(rms)=0.6A 1.3 ON-state voltage VT (V) −20 Ambient temperature Ta (C) Fig.5 ON-state Voltage vs. Ambient Temperature 1.2 1.1 1 0.9 0.8 −30 VD=6V RL=100 0˚C 0 20 40 60 80 VD=6V 100 10 −30 100 Ambient temperature Ta (˚C) 0 20 40 60 80 100 Ambient temperature Ta (˚C) Sheet No.: D4-A04001EN 6 PR36MF51NSZF Series Fig.7 ON-state Current vs. ON-state Voltage Fig.8 Turn-on Time vs. Forward Current 100 1.2 Turn-on time tON (μs) 1 ON-state current IT (A) VD=6V RL=100Ω Ta=25˚C IF=20mA Ta=25˚C 0.8 0.6 0.4 10 0.2 1 10 0 0 0.5 1 1.5 2 100 Forward current IF (mA) ON-state voltage VT (V) Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. Sheet No.: D4-A04001EN 7 PR36MF51NSZF Series ■ Design Considerations ● Recommended Operating Conditions Input Parameter Input signal current at ON state Input signal current at OFF state Load supply voltage Output Load supply current Frequency Operating temperature Symbol IF(ON) IF(OFF) VOUT(rms) IOUT(rms) f Topr Condition − − − Locate snubber circuit between output terminals (Cs=0.022μF, Rs=47Ω) − − MIN. 20 0 − − 50 −20 MAX. 25 0.1 240 IT(rms)× 80%(*) 60 80 Unit mA mA V A Hz ˚C (*) See Fig.2 about derating curve (IT(rms) vs. ambient temperature). ● Degradation In order for the SSR to turn off, the triggering current (IF) must be 0.1mA or less In phase control applications or where the SSR is being by a pulse signal, please ensure that the pulse width is a minimum of 1ms. When the input current (IF) is below 0.1mA, the output Triac will be in the open circuit mode. However, if the voltage across the Triac, VD, increases faster than rated dV/dt, the Triac may turn on. To avoid this situation, please incorporate a snubber circuit. Due to the many different types of load that can be driven, we can merely recommend some circuit values to start with : Cs=0.022μF and Rs=47Ω. The operation of the SSR and snubber circuit should be tested and if unintentional switching occurs, please adjust the snubber circuit component values accordingly When making the transition from On to Off state, a snubber circuit should be used ensure that sudden drops in current are not accompanied by large instantaneous changes in voltage across the Triac. This fast change in voltage is brought about by the phase difference between current and voltage. Primarily, this is experienced in driving loads which are inductive such as motors and solenods. Following the procedure outlined above should provide sufficient results. Any snubber or Varistor used for the above mentioned scenarios should be located as close to the main output triac as possible. All pins shall be used by soldering on the board. (Socket and others shall not be used.) ● Degradation In general, the emission of the IRED used in SSR will degrade over time. In the case where long term operation and / or constant extreme temperature fluctuations will be applied to the devices, please allow for a worst case scenario of 50% degradation over 5years. Therefore in order to maintain proper operation, a design implementing these SSRs should provide at least twice the minimum required triggering current from initial operation. Sheet No.: D4-A04001EN 8 PR36MF51NSZF Series ● Recommended Foot Print (reference) SMT Gullwing Lead-form 1.7 2.54 2.54 2.54 8.2 2.2 (Unit : mm) ● Standard Circuit R1 +VCC 2 SSR D1 3 V1 Load 8 ZS AC Line 6 Tr1 ZS : Surge absorption circuit (Snubber) ✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: D4-A04001EN 9 PR36MF51NSZF Series ■ Manufacturing Guidelines ● Soldering Method Reflow Soldering : Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak (package surface : 250˚C peak) 200 Reflow 220˚C or more, 60s or less Preheat 150 to 180˚C, 120s or less 100 0 0 1 2 3 4 (min) Flow Soldering (No Solder bathing) Flow soldering should be completed below 270˚C and within 10s. Preheating is within the bounds of 100 to 150˚C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400̊C. Please don't solder more than twice. Other notice Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D4-A04001EN 10 PR36MF51NSZF Series ● Cleaning instructions Solvent cleaning : Solvent temperature should be 45˚C or below. Immersion time should be 3minutes or less. Ultrasonic cleaning : The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials : Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. ● Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this device. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBB and PBDE are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). •Lead(*), Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). ( ) * High melting temperature type solders (i.e. tin-lead solder alloys containing more than 85% lead) is exempted from the requirements. Sheet No.: D4-A04001EN 11 PR36MF51NSZF Series ■ Package specification ● Sleeve package Through-Hole Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 50pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. 20 sleeves in one case. Sleeve outline dimensions 12 ±2 5.8 10.8 520 (Unit : mm) 6.7 Sheet No.: D4-A04001EN 12 PR36MF51NSZF Series ● Tape and Reel package SMT Gullwing Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F J D E G MA X. H H A B C I 5˚ K Dimensions List A B 16.0±0.3 7.5±0.1 H I ±0.1 10.4 0.40±0.05 C 1.75±0.10 J 4.2±0.1 D 12.0±0.1 K 10.2±0.1 E 2.0±0.1 (Unit : mm) F G +0.1 4.0±0.1 φ1.5−0 Reel structure and Dimensions e d c g Dimensions List a b φ330 17.5±1.5 e f φ23±1 2.0±0.5 f a b (Unit : mm) c d φ100±1 φ13.5±0.5 g 2.0±0.5 Direction of product insertion Pull-out direction [Packing : 1 000pcs/reel] Sheet No.: D4-A04001EN 13 PR36MF51NSZF Series ■ Important Notices with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. [N078] Sheet No.: D4-A04001EN 14