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Create
i510x
CompactFlash Memory Card
Controller Datasheet
Version 1.3
iCreate Technologies Corporation
Release date: 12/9/2004
© 2004 iCreate Technologies Corporation
iCreate Technologies Corporation reserves the right to change the specification in any manner without notice.
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© Copyright 2004 iCreate Technologies Corporation
Information contained in this publication is intended through suggestion only and may be superseded by
updates. No liability is assumed by iCreate Technologies Corporation with respect to the use of such
information or otherwise and no representation or warranty is given. Use of iCreate’s products as critical
components in life support systems is not authorized.
No part of this document may be reproduced or transmitted in any form or by any means for any purpose
without the permission of iCreate. No licenses are conveyed, implicitly or otherwise, under any intellectual
property rights. The iCreate logo and name are registered trademarks of iCreate Technologies Corporation.
All rights reserved. All other trademarks mentioned herein are the property of their respective companies.
Data sheet marking
iCreate uses various markings in the data sheet to designate each document phase as it relates to the
product development stage.
Marking
Description
Objective Specification
The objective specification contains data for new product development.
Advance Information
The information is on products in the design phase. Your designs should not be
finalized with this information.
Preliminary
This is preliminary information on new products but not yet fully characterized.
The specifications in these data sheets are subject to change in any manner
without notice.
No Marking
Information contained in the data sheet is on products in full production.
For more information please contact:
iCreate Technologies Corporation
2F, No. 26, R&D 2nd Road, Science-Based Industrial Park,
Hsinchu, Taiwan 30077, R.O.C.
Phone +886-3-579-0000
Fax
+886-3-579-0077
e-mail [email protected]
Page 2
Release date: 12/9/2004
© 2004 iCreate Technologies Corporation
iCreate Technologies Corporation reserves the right to change the specification in any manner without notice.
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1. Introduction
General description
i510X is a high performance flash memory controller for CompactFlash/ATA interface memory devices.
This chip is based on iCreate 2nd-generation flash engine to achieve high data transfer rate. The enhanced
designs include high-speed RISC CPU, multi-bank flash access, 8/16-bit flash interface, and ECC capability.
Power-on-reset, RC oscillator and LDO regulator are integrated to reduce BOM cost and PCB area. Typical
applications of i510X are CompactFlash memory card, IDE flash disk module/chip and PCMCIA flash card.
Features
Š
Compliant to CompactFlash, PCMCIA, and ATA standards
Š
8-bit/16-bit host data transfer
Š
Support PIO mode 4
Š
5V and 3.3V host interface
Š
Integrated power-on-reset, RC oscillator and LDO regulator
Š
On-the-fly ECC
Š
Wear-leveling mechanism
Š
Support Samsung 2KB/page BLC NAND flash
Š
Number of flash chips:
Š
„
i5100: 8 chips
„
i5101: 16 chips
Package:
„
i5100: TQFP 100 pin
„
i5101: TQFP 128 pin
Block diagram
POR
RC-OSC
Program memory
(Mask ROM )
MCU Core
Data memory
(SRAM)
Attribute
Memory
Data Mux
Flash Interface
ECC
CF Interface
Buffer Interface
Buffer Banks
Figure 1. Block diagram
Release date: 12/9/2004
© 2004 iCreate Technologies Corporation
iCreate Technologies Corporation reserves the right to change the specification in any manner without notice.
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2. Pin configuration and definition
GNDA
ROSC
VDDA
RESET#
VDDCLK
NC
CLKI
GNDCLK
FWP#
FWE#
FALE
FCLE
FRE#
FRDY
SEL_CLK
VDDQ
GNDQ
FCE7#
FCE5#
FCE3#
FCE1#
TEST
GNDC
SEL_RST
FCE6#
2.1. Pin diagrams
FCE4#
FCE2#
FCE0#
FD0
FD1
FD2
FD3
FD4
FD5
FD6
VDDC
VDDQ
FD7
GNDQ
FD8
FD9
FD10
FD11
FD12
FD13
FD14
FD15
VDD3
VDD5
GNDR
HRDY
HA6
HCSEL#
HA5
HA4
HRST
GNDC
HA3
HWAIT#
HA2
HINPACK#
HA1
HREG#
HA0
HBVD2
VDDPQ
HD0
HBVD1
HD1
HD8
GNDPQ
HD2
HD9
HWP
HD10
HD3
HD11
HD4
HD12
HD5
GNDC
HD13
GNDPQ
HD6
VDDPQ
HD14
HD7
HD15
HCE1#
VDDC
HCE2#
HA10
HOE#
HIORD#
HA9
HIOWR#
HA8
GNDPQ
HWE#
HA7
Figure 2. 100-pin configuration
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Figure 3. 128-pin configuration
2.2. Pin function
Host interface
Pin Name
HA0 ~ HA10
HBVD1
HBVD2
Pin No. (100pin)
Pin No. (128pin)
17, 20, 22, 25, 27,
20, 25, 29, 33, 35,
29, 30, 33, 35, 37,
37, 38, 41, 43, 45,
39
47
43
52
40
48
Type
5V/3.3V In,
Schmitt Trigger
Function
(Refer to CF Specification)
HA0 ~ HA10 (PC Card Memory Mode)
HA0 ~ HA10 (PC Card I/O Mode)
HA0 ~ HA2 (True IDE Mode)
5V/3.3V In/Out,
BVD1 (PC Card Memory Mode)
Schmitt Trigger,
STSCHG# (PC Card I/O Mode)
4mA
PDIAG# (True IDE Mode)
5V/3.3V In/Out,
BVD2 (PC Card Memory Mode)
Schmitt Trigger,
SPKR# (PC Card I/O Mode)
4mA
DASP# (True IDE Mode)
Release date: 12/9/2004
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iCreate Technologies Corporation reserves the right to change the specification in any manner without notice.
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HCE1#,
HCE2#
5V/3.3V In,
14, 16
Schmitt Trigger,
Pull up
HCSEL#
HD0 ~ HD15
15, 18
28
36,
1, 2, 3, 4, 5, 7, 9,
1, 2, 3, 4, 5, 7, 9, 11,
11, 12, 13, 42, 44,
12, 13, 50, 54, 56,
45, 47, 48, 50
59, 61, 65
36
44
HINPACK#
HIORD#
19
HIOWR#
21
HOE#
18
HRDY
26
HREG#
38
HRST
31
23
27
22
34
46
39
34
HWE#
24
HWP
49
42
32
63
CE1#, CE2# (PC Card I/O Mode)
Card Enable
CS0#, CS1# (True IDE Mode)
5V/3.3V In,
CSEL# (PC Card Memory Mode)
Schmitt Trigger,
CSEL# (PC Card I/O Mode)
Pull up
CSEL# (True IDE Mode)
5V/3.3V In/Out,
HD0 ~ HD15 (PC Card Memory Mode)
Schmitt Trigger,
HD0 ~ HD15 (PC Card I/O Mode)
8mA
HD0 ~ HD15 (True IDE Mode)
5V/3.3V Output,
4mA
INPACK# (PC Card Memory Mode)
INPACK# (PC Card I/O Mode)
INPACK# (True IDE Mode)
5V/3.3V In,
IORD# (PC Card Memory Mode)
Schmitt Trigger,
IORD# (PC Card I/O Mode)
Pull up
IORD# (True IDE Mode)
5V/3.3V In,
IOWR# (PC Card Memory Mode)
Schmitt Trigger,
IOWR# (PC Card I/O Mode)
Pull up
IOWR# (True IDE Mode)
5V/3.3V In,
OE# (PC Card Memory Mode)
Schmitt Trigger,
OE# (PC Card I/O Mode)
Pull up
ATASEL# (True IDE Mode)
5V/3.3V Output,
4mA
RDY/BSY# (PC Card Memory Mode)
IREQ# (PC Card I/O Mode)
INTRQ (True IDE Mode)
5V/3.3V In,
REG# (PC Card Memory Mode)
Schmitt Trigger,
REG# (PC Card I/O Mode)
Pull up
REG# (True IDE Mode)
5V/3.3V In,
RESET (PC Card Memory Mode)
Schmitt Trigger,
RESET (PC Card I/O Mode)
Pull up
HWAIT#
CE1#, CE2# (PC Card Memory Mode)
RESET# (True IDE Mode)
5V/3.3V Output,
4mA
WAIT# (PC Card Memory Mode)
WAIT# (PC Card I/O Mode)
IORDY (True IDE Mode)
5V/3.3V In,
WE# (PC Card Memory Mode)
Schmitt Trigger,
WE# (PC Card I/O Mode)
Pull up
WE# (True IDE Mode)
5V/3.3V In,
Schmitt Trigger
WP (PC Card Memory Mode)
IOIS16# (PC Card I/O Mode)
IOIS16# (True IDE Mode)
Flash interface
Pin Name
Pin No. (100)
Pin No. (128)
Type
Function
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54, 55, 56, 57, 58,
FD0 ~ FD15
59, 60, 61, 63, 66,
67, 68, 69, 70, 71,
72
Flash Data Bus 0 ~ 7. Connect to flash memory
70, 71, 72, 73, 74, 75,
76, 77, 80, 83, 84, 85,
In/Out, 3mA
86, 87, 88, 89
FALE
90
118
Out, 3mA
FCLE
89
117
Out, 3mA
FRE#, FWE#
88 , 91
116, 119
Out, 3mA
FCE0# ~
73, 74, 75, 76, 80,
93, 94, 96, 97, 104,
FCE7#
81, 82, 83
105, 106, 108
FCE8# ~
FCE15#
-
pins FD0 ~ FD7.
91, 92, 99, 100, 103,
110, 111, 112,
Out, 2mA
Out, 2mA
FWP#
92
120
Out, 3mA
FRDY
87
115
In
Flash Address Latch Enable. Connect to flash
memory pin ALE
Flash Command Latch Enable. Connect to flash
memory pin CLE
Flash Read/Write Enable. Connect to flash
memory pin RE/WE.
Flash Chip Enable. Connect to flash memory pin
CE.
Flash Chip Enable. Connect to flash memory pin
CE.
Flash Write-Protect. Connect to flash memory pin
WP.
Flash Ready/BSY signal. Connect to flash memory
pin Ready/Busy#.
System interface & power pins
Pin Name
Pin No. (100)
Pin No. (128)
Type
Function
SEL_CLK
86
114
In
SEL_RST
77
98
In
TEST
79
102
In
Test mode enable pin. Connected to GND.
RX
-
95
In
Test pin. Connected to 3.3V or GND.
TX
-
107
Out, 3mA
CLKI
94
122
In
Connected to 3.3V to select internal oscillator, or
GND for external clock.
Connected to 3.3V to select internal power-onreset or GND for external reset
Test pin. Not connected.
Clock input
Reset input if reset is provided externally. If
RESET#
97
125
In
SEL_RST is high, this pin is connected to GND
through a capacitor.
Connected to the same power source as VDDA
ROSC
99
127
Analog In
REG_EN
-
67
In
Regulator enable
IROM_SEL
-
90
In
Test pin. Connected to 3.3V or NC.
through a resistor to configure oscillator frequency
Release date: 12/9/2004
© 2004 iCreate Technologies Corporation
iCreate Technologies Corporation reserves the right to change the specification in any manner without notice.
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VDDPQ
10, 41
10, 49,
Power for CF interface (3.3V or 5V)
GNDPQ
8, 23, 46
8, 30, 57
Ground for CF interface
VDDQ
64, 85
81, 113
3.3V power for flash interface
GNDQ
62, 84
78, 101, 109
VDDC
15, 65,
17, 82
GNDC
6, 32, 78
6, 40, 79
VDD5
52
68
VDD3
53
69
GNDR
51
66
Ground for LDO regulator
VDDA
98
126
3.3V power for reset circuit
GNDA
100
128
Ground for analog circuit
VDDCLK
96
124
3.3V power for oscillator
GNDCLK
93
121
Ground for oscillator
Ground for flash interface
3.3V power for core
Ground for core
Power input for LDO regulator (3.3V or 5V)
O
3.3V LDO regulator output
Page 6
Release date: 12/9/2004
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3. Reset voltage detector and RC oscillator
Power-on-reset and brown-out-reset
The internal reset control unit has power-on-reset (POR) and brown-out-reset (BOR) functions. To use
internal POR, set SEL_RST to 1 and RESET# must be connected to an external capacitor as shown in Fig. 3.
To use external reset signal, set SEL_RST to 0 and RESET# becomes the reset signal input.
3.3V Vdd
SEL_RST
RESET#
Cext
Figure 3. Pin connection to use internal power-on-reset/brown-out-reset
Internal RC oscillator
An integrated RC oscillator can be used to reduce BOM cost. When the internal oscillator is enabled,
ROSC must be connected to 3.3V through a resistor, as shown in Figure 4, while CLKI is not connected. The
value of Rext determines the oscillator frequency. The relationship of Rext and typical oscillator frequency is
as follows.
Rext
15KΩ
22KΩ
30KΩ
58KΩ
Fosc
50MHz
40MHz
33MHz
20MHz
3.3V Vdd
Rext
CLKI
ROSC
3.3V Vdd
SEL_CLK
Figure 4. Pin connection to use internal Oscillator
Release date: 12/9/2004
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iCreate Technologies Corporation reserves the right to change the specification in any manner without notice.
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4. Electrical specifications
Absolute maximum ratings
Symbol
Description
Value
Unit
Notes
VCC
VCC Voltage
- 0.3 to +6.5
V
VDDPQ
VDD
VDD Voltage
- 0.3 to +4.6
V
VDDC, VDDQ
- 0.3 to VCC + 0.3
V
CF interface
- 0.3 to VDD + 0.3
V
Other I/O except CF interface
- 25 to +125
°C
VIN, VOUT
All input/output voltages
VIN, VOUT
Tstg
Storage temperature range
Recommended operating conditions
Symbol
Parameter
VCC
VCC voltage
VDD
VDD voltage
TOPR
Operating temperature
Min.
Typ.
Max.
Unit
4.5
5
5.5
V
3.15
3.3
3.45
V
3.15
3.3
3.45
0
70
V
o
C
DC characteristics
Symbol
Parameter
Min.
VIH3
High level input voltage for 3.3V
domain
2.4
VIL3
Low level input voltage for 3.3V
domain
VOH3
High level output voltage for 3.3V
domain
VOL3
Low level output voltage for 3.3V
domain
VIH53
High level input voltage for 5V
domain under 3.3V
VIL53
Low level input voltage for 5V
domain under 3.3V
VOH53
High level output voltage for 5V
domain under 3.3V
VOL53
Low level output voltage for 5V
domain under 3.3V
Typ.
Max.
Unit
V
0.6
2.4
V
V
0.4
2.4
V
V
0.6
Vcc-0.8
V
V
0.4
V
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VIH55
High level input voltage for 5V
domain under 5V
VIL55
Low level input voltage for 5V
domain under 5V
VOH55
High level output voltage for 5V
domain under 5V
VOL55
Low level output voltage for 5V
domain under 5V
4.0
V
0.8
Vcc-0.8
V
V
0.4
V
Typ.
Unit
Power-on-reset characteristics
Symbol
Parameter
VT(POR)
Threshold voltage of power-on-reset
2.8
V
VT(BOR)
Threshold voltage for brown-out-reset
2.6
V
CF attribute memory read and write AC characteristics
For the definitions of parameters, please refer to CompactFlash Specification Rev. 2.1.
Symbol
Parameter
Min.
Max.
300
Unit
tcR
Read cycle time
Ns
ta(A)
Address access time
300
Ns
ta(CE)
Card Enable access time
300
ns
ta(OE)
Output Enable access time
150
ns
tdis(CE)
Output disable time from CE
100
ns
tdis(OE)
Output disable time from OE
100
ns
tsu(A)
Address setup time
30
ns
ten(CE)
Output enable time from CE
5
ns
ten(OE)
Output enable time from OE
5
ns
tv(A)
Data valid time from address change
0
ns
tcW
Write cycle time
250
ns
tw(WE)
Write pulse width
150
ns
trec(WE)
Write recovery time
30
ns
tsu(D-WEH)
Data setup time for WE
80
ns
th(D)
Data hold time
30
ns
Release date: 12/9/2004
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Common memory read and write AC characteristics
For the definitions of parameters, please refer to CompactFlash Specification Rev. 2.1.
Symbol
Parameter
Min.
Max.
Unit
ta(OE)
Output Enable access time
125
ns
tdis(OE)
Output disable time from OE
100
ns
tsu(A)
Address setup time
30
ns
th(A)
Address hold time
20
ns
tsu(CE)
Card Enable setup time
0
ns
th(CE)
Card Enable hold time
20
ns
tw(WT)
Wait width time
tw(WE)
Write pulse time
150
ns
tsu(D-WEH)
Data setup time for WE
80
ns
th(D)
Data hold time
30
ns
trec(WE)
Write recover time
30
ns
tv(WT-OE)
Wait delay falling from OE
35
ns
tv(D-WT)
Data setup for wait release
0
Ns
tv(WT-WE1)
Wait delay falling from WE
35
ns
tv(WT-WE2)
WE high from wait release
3000
0
ns
ns
I/O access read and write AC characteristics
For the definitions of parameters, please refer to CompactFlash Specification Rev. 2.1.
Symbol
Parameter
td(IORD)
Data delay after IORD
th(IORD)
Data hold time following IORD
tw(IORD)
Min.
Max.
Unit
100
ns
0
ns
IORD pulse width
165
ns
tsuA(IORD)
Address setup time for IORD
70
ns
thA(IORD)
Address hold time from IORD
20
ns
tsuCE(IORD)
Card Enable setup time for IORD
5
ns
thCE(IORD)
Card Enable hold time from IORD
20
ns
tsuREG(IORD)
REG setup time for IORD
5
ns
thREG(IORD)
REG hold time from IORD
0
ns
tdfINP(IORD)
INPACK delay falling from IORD
0
tdrINP(IORD)
45
ns
INPACK delay rising from IORD
45
ns
tdfIO16(IORD)
IOIS16 delay falling from address
35
ns
tdrIO16(IORD)
IOIS16 delay rising from address
35
ns
tdWT(IORD)
Wait delay falling from IORD
35
ns
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td(WT)
Data delay from wait rising
0
tsu(IOWR)
Data setup time for IOWR
60
ns
th(IOWR)
Data hold time from IOWR
30
ns
tw(IOWR)
IOWR pulse width
165
ns
tsuA(IOWR)
Address setup time for IOWR
70
ns
thA(IOWR)
Address hold time from IOWR
20
ns
tsuCE(IOWR)
Card Enable setup time for IOWR
5
ns
thCE(IOWR)
Card Enable hold time from IOWR
20
ns
tsuREG(IOWR)
REG setup time for IOWR
5
ns
thREG(IOWR)
REG hold time from IOWR
0
ns
tdWT(IOWR)
Wait delay falling from IOWR
tdrIOWR(WT)
IOWR high from wait high
tw(WT)
Wait width time
35
0
ns
ns
ns
3000
ns
True-IDE mode I/O access read and write AC characteristics
For the definitions of parameters, please refer to CompactFlash Specification Rev. 2.1.
Symbol
Parameter
Min.
Max.
Unit
t0
Cycle time
120
ns
t1
Address valid to IORD/IOWR setup
25
ns
t2
IORD/IOWR
70
ns
t2
IORD/IOWR register (8bit)
70
ns
t3
IOWR data setup
20
ns
t4
IOWR data hold
10
ns
t5
IORD data setup
20
ns
t6
IORD data hold
5
ns
t6Z
t9
IORD data tri-state
30
ns
IORD/IOWR to address valid hold
10
ns
Read data valid to IORDY active, if IORDY
initially low after tA
0
ns
tA
IORDY setup time
35
ns
tB
IORDY pulse width
tC
IORDY assertion to release
tRD
1250
ns
5
ns
Read/write timing for NAND type flash
For the definition of parameters, please refer to Toshiba flash datasheet.
Release date: 12/9/2004
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Symbol
Parameter
Min.
Max.
Unit
tCLS
FCLE setup time
0
ns
tCLH
FCLE hold time
10
ns
tCS
FCE# setup time
0
ns
tCH
FCE# hold time
10
ns
tCEH
FCE# high hold time
100
ns
tWP
FWE# pulse width
25
ns
tALS
FALE setup time
0
ns
tALH
FALE hold time
10
ns
tDS
Data Setup time
20
ns
tDH
Data hold time
10
ns
tWH
FWE# high hold time
15
ns
tWW
FWP high to FWE# low
100
ns
tRR
Ready-to-FRE# Falling edge
20
ns
tRP
FRE# pulse width
25
ns
tREH
FRE# high hold time
15
ns
tRHW
FRE# high to FWE# low
0
ns
tWHC
FWE# high to FCE# low
30
ns
tWHR
FWE# high to FRE# low
60
ns
tAR
FALE low to FRE# low
10
ns
tCLR
FCLE low to FRE# low
10
ns
Page 12
Release date: 12/9/2004
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5. Package dimensions
100 Pin package
Release date: 12/9/2004
© 2004 iCreate Technologies Corporation
iCreate Technologies Corporation reserves the right to change the specification in any manner without notice.
Page 13
i510x
Create
128 Pin package
Page 14
Release date: 12/9/2004
© 2004 iCreate Technologies Corporation
iCreate Technologies Corporation reserves the right to change the specification in any manner without notice.