SMS3.3 Datasheet

SMS3.3
3.3 Volt TVS Array
For ESD and Latch-Up Protection
PROTECTION PRODUCTS
Description
Features
‹ Transient protection for data lines to
The SMS series of TVS arrays are designed to protect
sensitive electronics from damage or latch-up due to
ESD, lightning, and other voltage-induced transient
events. Each device will protect up to four lines operating
at 3.3 volts.
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The SMS3.3 is a solid-state device designed specifically
for transient suppression. It is constructed using
Semtech’s proprietary EPD process technology. The EPD
process provides low standoff voltages with significant
reductions in leakage currents and capacitance over
traditional pn junction processes. They offer desirable
characteristics for board level protection including fast
response time, low clamping voltage and no device
degradation.
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) 12A (8/20µs)
Protects four I/O lines
Working voltage: 3.3V
Low leakage current (<1µA)
Low clamping voltage
Low capacitance (35pF typical)
Solid-state EPD TVS technology
Mechanical Characteristics
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The SMS3.3 may be used to meet the immunity requirements of IEC 61000-4-2, level 4 (±15kV air, ±8kV
contact discharge). The low cost SOT23-6L package
makes them ideal for use in portable electronics such
as cell phones, PDA’s, and notebook computers.
EIAJ SOT23-6L package
Molding compound flammability rating: UL 94V-0
Marking : Marking Code
Packaging : Tape and Reel per EIA 481
Applications
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Equivalent Circuit Diagram
Cell phone Handsets and Accessories
Microprocessor Based Equipment
Personal Digital Assistants (PDA’s) and Pagers
Desktops PC and Servers
Notebook, Laptop, and Palmtop Computers
Portable Instrumentation
Peripherals
MP3 Players
Cordless Phones
Schematic & PIN Configuration
SOT23-6L (Top View)
Revision 08/11/04
1
United States Patent No.
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SMS3.3
PROTECTION PRODUCTS
Absolute Maximum Rating
Rating
Symbol
Value
Units
Peak Pulse Power (tp = 8/20µs)
Ppk
200
Watts
Peak Pulse Current (tp = 8/20µs)
IPP
12
A
ESD per IEC 61000-4-2 (Air)
ESD per IEC 61000-4-2 (Contact)
VESD
>25
>15
kV
Soldering Temperature
TL
260 (10 seconds)
o
Operating Temperature
TJ
-55 to +125
o
TSTG
-55 to +150
o
Storage Temperature
C
C
C
Electrical Characteristics
SMS3.3
Par ame te r
Reverse Stand-Off Voltage
Symbo l
Co nditio ns
Minimum
Typical
V RWM
Maximum
Units
3.3
V
Punch-Through Voltage
V PT
IPT = 2µ A
3.5
V
Snap -Back Voltage
V SB
ISB = 50mA
2.8
V
Reverse Leakage Current
IR
V RWM = 3.3V, T=25°C
Clamp ing Voltage
VC
Clamp ing Voltage
0.5
µA
IPP = 1A , tp = 8/20µ s
A ny I/O to Ground
4.5
V
VC
IPP = 5A , tp = 8/20µ s
A ny I/O to Ground
6.8
V
Clamp ing Voltage
VC
IPP = 12A , tp = 8/20µ s
A ny I/O to Ground
8.7
V
Steering Diode Forward Voltage
(Reverse Clamp ing Voltage)
VF
IPP = 1A , tp = 8/20µ s
A ny I/O to Ground
1.7
V
Junction Cap acitance
Cj
Each I/O p in and
Ground
V R = 0V, f = 1MHz
40
pF
 2004 Semtech Corp.
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0.05
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SMS3.3
PRODUCTS
PROTECTION PRODUCTS
Power Derating
Non-Repetitive Peak Pulse Power vs. Pulse Time
10
110
90
% of Rated Power or IPP
Peak Pulse Power - PPk (kW)
100
1
0.1
80
70
60
50
40
30
20
10
0.01
0
0.1
1
10
100
0
1000
25
50
Pulse Waveform
125
150
10
Waveform
Parameters:
tr = 8µs
td = 20µs
90
80
70
9
Clamping Voltage - VC (V)
100
PP
100
Clam
ping V
oltage vs. P
eak Pulse Current
Clamping
Voltage
Peak
110
Percent of I
75
Ambient Temperature - TA (oC)
Pulse Duration - tp (µs)
e-t
60
50
40
td = IPP/2
30
20
8
7
6
5
4
Waveform
Parameters:
tr = 8µs
td = 20µs
3
2
10
1
0
0
5
10
15
20
25
0
30
0
2
4
Time (µs)
6
8
10
12
14
Peak Pulse Current - IPP (A)
Capacitance vs. R
ever
se V
oltage
Re
erse
Voltage
For
w ar
d V
oltage vs. FFor
or
w ar
d Current
orw
ard
Voltage
orw
ard
10
40
I/O to GND
f = 1MHz
9
30
7
Capacitance - Cj (pF)
Forward Voltage- VF (V)
8
6
5
4
Waveform
Parameters:
tr = 8µs
td = 20µs
3
2
1
20
10
0
0
0
2
4
6
8
10
12
14
0
Forward Current - IF (A)
 2004 Semtech Corp.
1
2
3
4
Reverse Voltage - VR (V)
3
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SMS3.3
PROTECTION PRODUCTS
Applications Information
Device Connection for Protection of Four Data Lines
SMS3.3 Circuit Diagram
The SMS3.3 is designed to protect up to four unidirectional data lines. The device is connected as follows:
1. Unidirectional protection of four I/O lines is
achieved by connecting pins 1, 3, 4 and 6 to the
data lines. Pin 2 and 5 are connected to ground.
The ground connections should be made directly to
the ground plane for best results. The path length
is kept as short as possible to reduce the effects
of parasitic inductance in the board traces.
Circuit Board Layout Recommendations for Suppression of ESD
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
z
z
z
z
z
z
Protection of Four Unidirectional Lines
Place the TVS near the input terminals or connectors to restrict transient coupling.
Minimize the path length between the TVS and the
protected line.
Minimize all conductive loops including power and
ground loops.
The ESD transient return path to ground should be
kept as short as possible.
Never run critical signals near board edges.
Use ground planes whenever possible.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small compared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
 2004 Semtech Corp.
4
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SMS3.3
PRODUCTS
PROTECTION PRODUCTS
Typical Applications
 2004 Semtech Corp.
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SMS3.3
PROTECTION PRODUCTS
Outline Drawing
Drawing -SOT23
- SO-8 6L
Outline
A
e1
2X E/2
D
DIM
N
EI
1
H
H
E
ccc C
2X N/2 TIPS
c
GAGE
PLANE
2
A
A1
A2
b
c
D
E1
E
e
e1
L
L1
N
01
aaa
bbb
ccc
0.25
L
e
01
(L1)
B
DETAIL
A
D
aaa C
A2
SEATING
PLANE
C
A
SEE DETAIL
A1
bxN
bbb
A
DIMENSIONS
INCHES
MILLIMETERS
MIN NOM MAX MIN NOM MAX
.057
.035
.000
.006
.035 .045 .051
.010
.020
.003
.009
.110 .114 .118
.060 .063 .069
.110 BSC
.037 BSC
.075 BSC
.012 .018 .024
(.024)
6
0°
10°
.004
.008
.008
1.45
0.90
0.00
0.15
.90 1.15 1.30
0.25
0.50
0.08
0.22
2.80 2.90 3.00
1.50 1.60 1.75
2.80 BSC
0.95 BSC
1.90 BSC
0.30 0.45 0.60
(0.60)
6
0°
10°
0.10
0.20
0.20
SIDE VIEW
C A-B D
NOTES:
1.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
Land Pattern -SOT23 6L
X
DIM
(C)
G
C
G
P
X
Y
Z
Z
Y
DIMENSIONS
MILLIMETERS
INCHES
(.098)
.055
.037
.024
.043
.141
(2.50)
1.40
0.95
0.60
1.10
3.60
P
NOTES:
1.
 2004 Semtech Corp.
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
6
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SMS3.3
PRODUCTS
PROTECTION PRODUCTS
Marking
Ordering Information
Part Number
Lead Finish
Qty per
Reel
R eel Size
SMS3.3.TC
SnPb
3,000
7 Inch
SMS3.3.TCT
Pb free
3,000
7 Inch
Note:
(1) No suffix indicates tube pack.
Top Side Mark
Tape and Reel Specification
Device Orientation in Tape:
Direction of Feed
Tape Specifications (per EIA 481)
Reel Material:
Tape Material:
Tape Width:
Component Pitch (max.):
Component Cavity Play:
Static Dissipative
Static Dissipative
8mm +/- 0.30mm
4mm +/- 0.10mm
20°
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Tel: 81-3-6408-0950
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Tel: 82-2-527-4377
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Tel: 44-1794-527-600
Fax: 44-1794-527-601
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Semtech Corporation, which has its headquarters in the U.S.A.
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Fax: 49-(0)8161-140-124
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