SEMTECH SMDA05

SMDA05-6
Unidirectional TVS Array
for Protection of Six Lines
PROTECTION PRODUCTS
Description
Features
‹ 300 watts peak pulse power (tp = 8/20µs)
‹ Transient protection for data lines to
The SMDA series of transient voltage suppressors are
designed to protect components which are connected
to data and transmission lines from voltage surges
caused by electrostatic discharge (ESD), electrical fast
transients (EFT), and lightning.
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TVS diodes are characterized by their high surge
capability, low operating and clamping voltages, and
fast response time. This makes them ideal for use as
board level protection of sensitive semiconductor
components. The SMDA05-6 is designed to provide
transient suppression on multiple data lines and I/O
ports. It is designed to operate on 5V digital lines. The
low profile SO-8 design allows the user to protect up to
six data and I/O lines with one package.
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) 12A (8/20µs)
Protects up to 6 unidirectional lines
Low operating voltage
Low clamping voltage
Solid-state silicon avalanche technology
Mechanical Characteristics
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The SMDA05-6 TVS diode array will meet the surge
requirements of IEC 61000-4-2 (Formerly IEC 801-2),
Level 4, “Human Body Model” for air and contact
discharge.
JEDEC SO-8 package
UL 497B listed
Molding compound flammability rating: UL 94V-0
Marking : Part number, date code, logo
Packaging : Tube or Tape and Reel per EIA 481
RoHS/WEEE Compliant
Applications
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Circuit Diagram
5V data and I/O lines
Communication lines
Microprocessor based equipment
LAN/WAN equipment
Servers
Notebook and Desktop PC
Instrumentation
Peripherals
Schematic & PIN Configuration
SO-8 (Top View)
Revision 08/15/06
1
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SMDA05-6
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Symbol
Value
Units
Peak Pulse Power (tp = 8/20µs)
Pp k
300
Watts
Peak Pulse Current (tp = 8/20µs)
IP P
17
A
Lead Soldering Temperature
TL
260 (10 sec.)
°C
Operating Temperature
TJ
-55 to +125
°C
TSTG
-55 to +150
°C
Storage Temperature
Electrical Characteristics
SMDA05-6
Parameter
Symbol
Conditions
Minimum
Typical
Maximum
Units
5
V
Reverse Stand-Off Voltage
VRWM
Reverse Breakdown Voltage
V BR
It = 1mA
Reverse Leakage Current
IR
VRWM = 5V, T=25°C
20
µA
Clamping Voltage
VC
IPP = 1A, tp = 8/20µs
9.8
V
Clamping Voltage
VC
IPP = 5A, tp = 8/20µs
11
V
Junction Capacitance
Cj
Between I/O pins and
Ground
VR = 0V, f = 1MHz
400
pF
 2006 Semtech Corp.
2
6
V
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SMDA05-6
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
10
110
90
% of Rated Power or IPP
Peak Pulse Power - Ppk (kW)
100
1
0.1
80
70
60
50
40
30
20
10
0.01
0
0.1
1
10
100
0
1000
25
50
110
150
10
Clamping Voltage - VC (V)
90
80
Percent of IPP
125
11
W aveform
Parameters:
tr = 8µs
td = 20µs
100
e -t
60
50
40
100
Clamping Voltage vs. Peak Pulse Current
Pulse Waveform
70
75
Ambient Temperature - TA (oC)
Pulse Duration - tp (µs)
td = I PP /2
30
20
9
8
7
6
5
4
Waveform
Parameters:
tr = 8µs
td = 20µs
3
2
1
10
0
0
0
5
10
15
20
25
0
30
2
6
8
10
12
14
16
18
Peak Pulse Current - IPP (A)
T im e (µs)
IEC 61000-4-2 Discharge Parameters
ESD Pulse Waveform (IEC 61000-4-2)
Level
 2006 Semtech Corp.
4
3
First
Peak
Current
Peak
Current
at 30 ns
Peak
Current
at 60 ns
Test
Test
Voltage
Voltage
(Contact
(A ir
Discharge) Discharge)
(kV)
( kV )
(A )
(A )
(A )
1
7.5
4
8
2
2
2
15
8
4
4
4
3
22.5
12
6
6
8
4
30
16
8
8
15
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SMDA05-6
PROTECTION PRODUCTS
Applications Information
Device Connection for Protection of Six Data Lines
Circuit Diagram
The SMDA05-6 is designed to protect up to 6 data or
I/O lines operating at 5 volts. They are unidirectional
devices and may be used on lines where the signal
polarities are above ground (i.e. 0 to 5V).
The device is connected as follows:
z
Pins 1, 2, 3, 4, 5 and 8 are connected to the lines
that are to be protected. Pins 6 and 7 are connected to ground. The ground connections should
be made directly to the ground plane for best
results. The path length is kept as short as possible to reduce the effects of parasitic inductance
in the board traces.
Connection Diagram
Circuit Board Layout Recommendations for Suppression of ESD.
DATA IN
DATA OUT
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
z
z
z
z
z
z
Place the TVS near the input terminals or connectors to restrict transient coupling.
Minimize the path length between the TVS and the
protected line.
Minimize all conductive loops including power and
ground loops.
The ESD transient return path to ground should be
kept as short as possible.
Never run critical signals near board edges.
Use ground planes whenever possible.
8
7
6
5
1
2
3
4
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small compared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
 2006 Semtech Corp.
DATA IN
4
DATA OUT
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SMDA05-6
PROTECTION PRODUCTS
Outline Drawing - SO-8
A
h
D
e
N
h
H
2X E/2
E1 E
1
0.25
L
(L1)
e/2
DETAIL
B
01
A
D
aaa C
SEATING
PLANE
A2 A
C
SEE DETAIL
A
.053
.069
.004
.010
.049
.065
.012
.020
.010
.007
.189 .193 .197
.150 .154 .157
.236 BSC
.050 BSC
.010
.020
.016 .028 .041
(.041)
8
8°
0°
.004
.010
.008
1.75
1.35
0.10
0.25
1.25
1.65
0.31
0.51
0.17
0.25
4.80 4.90 5.00
3.80 3.90 4.00
6.00 BSC
1.27 BSC
0.25
0.50
0.40 0.72 1.04
(1.04)
8
0°
8°
0.10
0.25
0.20
SIDE VIEW
A1
bxN
bbb
DIMENSIONS
INCHES
MILLIMETERS
MIN NOM MAX MIN NOM MAX
A
A1
A2
b
c
D
E1
E
e
h
L
L1
N
01
aaa
bbb
ccc
c
GAGE
PLANE
2
ccc C
2X N/2 TIPS
DIM
C A-B D
NOTES:
1.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
4. REFERENCE JEDEC STD MS-012, VARIATION AA.
Land Pattern - SO-8
X
DIM
(C)
G
C
G
P
X
Y
Z
Z
Y
DIMENSIONS
INCHES
MILLIMETERS
(.205)
.118
.050
.024
.087
.291
(5.20)
3.00
1.27
0.60
2.20
7.40
P
NOTES:
1.
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
2. REFERENCE IPC-SM-782A, RLP NO. 300A.
 2006 Semtech Corp.
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SMDA05-6
PROTECTION PRODUCTS
Ordering Information
Part Number
Lead Finish
Qty per Reel
Reel Size
SMDA05-6.TB
SnPb
500
7 inch
SMDA05-6.TBT
Pb Free
500
7 inch
SMDA05-6
SnPb
95/Tube
N/A
SMDA05-6.T
Pb Free
95/Tube
N/A
Note: Lead-free devices are RoHS/WEEE Compliant
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Road, Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
 2006 Semtech Corp.
6
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