uClamp0505A µClampTM 5-Line ESD protection Array PROTECTION PRODUCTS - MicroClampTM Description Features The µClampTM series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD. They are designed for use in applications where board space is at a premium. Each device requires less than 2.9mm2 of PCB area and will protect up to five lines. They are unidirectional devices and may be used on lines where the signal polarities are above ground. TVS diodes are solid-state devices designed specifically for transient suppression. They feature large cross-sectional area junctions for conducting high transient currents. They offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. The uClampTM0505A may be used to meet the immunity requirements of IEC 61000-4-2, level 4. The small SC89 package makes them ideal for use in portable electronics such as cell phones, PDA’s, notebook computers, and digital cameras. These devices feature a lead-free, matte tin lead finish. They are compatible with both lead free and SnPb assembly techniques. Transient protection for data lines to IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) Protects five I/O lines 1.7 x 1.7 x 0.6mm Ultra-small SC-89 package (1.7 0.6mm) 2 requires less than 2.9mm of PCB area Working voltage: 5V Low leakage current Low operating and clamping voltages Solid-state silicon-avalanche technology Mechanical Characteristics SC-89 (SOT-666) package Molding compound flammability rating: UL 94V-0 Marking : Marking Code and pin 1 indicator Weight: 2.9mg (typical) Lead Finish: Matte Tin Packaging : Tape and Reel per EIA 481 Applications Dimensions Cellular Handsets & Accessories Cordless Phones Personal Digital Assistants (PDA’s) Notebooks & Handhelds Portable Instrumentation Digital Cameras Peripherals MP3 Players Schematic & PIN Configuration 1.70 0.50 1.25 1.70 0.30 0.60 Maximum Dimensions (mm) Revision 06/23/04 SC-89 (Top View) 1 www.semtech.com uClamp0505A PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20µs) Pp k 100 Watts Maximum Peak Pulse Current ( tp = 8/20µs) Ip p 7 Amps ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) V PP +/- 20 +/- 12 kV Lead Soldering Temperature TL 260 (10 sec.) °C Operating Temperature TJ -55 to +125 °C TSTG -55 to +150 °C Storage Temperature Electrical Characteristics (T=25oC) Parameter Symbol Conditions Minimum Typical Maximum Units 5 V Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 5V, T=25°C 1 µA Reverse Leakage Current IR VRWM = 3V, T=25°C 0.500 µA Forward Voltage VF IF = 10mA Clamping Voltage VC IPP = 1A, tp = 8/20µs 10 V Clamping Voltage VC IPP = 7A, tp = 8/20µs 12 V Junction Capacitance Cj Between I/O Pins and Gnd VR = 0V, f = 1MHz 75 pF 2004 Semtech Corp. 2 6 V 0.80 60 V www.semtech.com uClamp0505A PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 110 10 100 % of Rated Power or I PP Peak Pulse Power - P PP (kW) 90 1 0.1 80 70 60 50 40 30 20 10 0 0.01 0.1 1 10 100 0 1000 25 50 Clamping Voltage vs. Peak Pulse Current 100 125 150 Forward Voltage vs. Forward Current 12 8 10 Forward Voltage - VF (V) Clamping Voltage - Vc (V) 75 Ambient Temperature - TA (oC) Pulse Duration - tp (µs) 8 6 4 Waveform Parameters: tr = 8us td = 20us 2 6 4 Waveform Parameters: tr = 8us td = 20us 2 0 0 0 1 2 3 4 5 6 7 0 8 5 Junction Capacitance vs. Reverse Voltage 15 Insertion Loss S21 CH1 S21 60 Capacitance - Cj (pF) 10 Forward Current - IF (A) Peak Pulse Current - Ipp (A) LOG 6 dB / REF 0 dB 50 40 30 20 0 1 2 3 Reverse Voltage - VR (V) 4 5 START. 030 MHz 2004 Semtech Corp. 3 STOP 3000. 000000 MHz www.semtech.com uClamp0505A PROTECTION PRODUCTS Typical Characteristics (Con’t.) ESD Clamping (8kV Contact per IEC 61000-4-2) ESD Clamping (-8kV Contact per IEC 61000-4-2) ESD Clamping (15kV air per IEC 61000-4-2) ESD Clamping (-15kV air per IEC 61000-4-2) 2004 Semtech Corp. 4 www.semtech.com uClamp0505A PROTECTION PRODUCTS Applications Information Circuit Diagram Device Connection for Protection of Five Data Lines These devices are designed to protect up to five unidirectional data lines. The device is connected as follows: 1 3 4 5 6 1. Unidirectional protection of five I/O lines is achieved by connecting pins 1, 3, 4, 5, and 6 to the data lines. Pin 2 is connected to ground. The ground connection should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. Circuit Board Layout Recommendations for Suppression of ESD. 2 Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: z Place the TVS near the input terminals or connectors to restrict transient coupling. z Minimize the path length between the TVS and the protected line. z Minimize all conductive loops including power and ground loops. z The ESD transient return path to ground should be kept as short as possible. z Never run critical signals near board edges. z Use ground planes whenever possible. Protection of Five Unidirectional Lines Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. 2004 Semtech Corp. 5 www.semtech.com uClamp0505A PROTECTION PRODUCTS Typical Applications uClamp0505A 2004 Semtech Corp. 6 www.semtech.com uClamp0505A PROTECTION PRODUCTS Outline Drawing - SC-89 (SOT-666) D A D N E /2 E1 E L 2 1 e c N xb B aaa C A -B D A D IM A b c D E E1 e L L1 N aaa C L1 D IM E N S IO N S IN C H E S M IL L IM E T E R S M IN N O M M A X M IN N O M M A X .0 1 9 .0 0 5 .0 0 3 .0 5 9 .0 6 1 .0 4 3 - .0 2 4 .0 1 2 .0 0 7 .0 6 7 .0 6 7 .0 4 9 .0 6 3 .0 6 3 .0 4 7 .0 2 0 B S C .0 0 3 .0 1 2 .0 0 8 .0 0 3 .0 0 6 .0 0 8 6 .0 0 4 0 .5 0 0 .1 5 0 .1 0 1 .5 0 1 .5 5 1 .1 0 - 0 .6 0 0 .3 0 0 .1 8 1 .7 0 1 .7 0 1 .2 5 1 .6 0 1 .6 0 1 .2 0 0 .5 0 B S C 0 .1 0 0 .3 0 0 .2 0 0 .1 0 0 .1 5 0 .2 0 6 0 .1 0 NO TES: 1. 2. C O N T R O L L IN G D IM E N S IO N S A R E IN M IL L IM E T E R S (A N G L E S IN D E G R E E S ). D IM E N S IO N S "E 1 " A N D " D " D O N O T IN C L U D E M O L D F L A S H , P R O T R U S IO N S OR G ATE BURRS. Land Pattern - SC-89 (SOT-666) X Y Z C G Y DIM C P G X Y Z DIMENSIONS INCHES MILLIMETERS (.057) .020 .024 .012 .033 .090 (1.45) 0.50 0.60 0.30 0.85 2.30 P NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 2004 Semtech Corp. 7 www.semtech.com uClamp0505A PROTECTION PRODUCTS Marking Code Ordering Information B Part Number Working Voltage uClamp 0505A.TCT 5V Device Qty per Marking Reel B 3,000 Reel Size 7 Inch MicroClamp, uClamp and µClamp are trademarks of Semtech Corporation Note: (1) Pin 1 Identified with a dot (2) Lead finish is matte tin Tape and Reel Specification B B B Tape Specification and Device Orientation Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 2004 Semtech Corp. 8 www.semtech.com