uClamp1211Z

uClamp1211Z
Ultra Small μClamp®
1-Line ESD Protection
PROTECTION PRODUCTS - Z-PakTM
Description
Features
μClamp TVS diodes are designed to protect sensitive
electronics from damage or latch-up due to ESD. They
are designed to replace 0201 size multilayer varistors
(MLVs) in portable applications such as cell phones, notebook computers, and other portable electronics. They
features large cross-sectional area junctions for conducting high transient currents. These devices offer desirable characteristics for board level protection including
fast response time, low operating and clamping voltage,
and no device degradation.
The μClamp®1211Z is in a 2-pin SLP0603P2X3 package. It measures 0.6 x 0.3 mm with a nominal height
of only 0.25mm. The leads are finished with lead-free
NiPdAu. Each device will protect one line operating at
12 volts. It gives the designer the flexibility to protect
single lines in applications where arrays are not practical. The combination of small size and high ESD surge
capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and
tablet PC’s.
 High ESD withstand Voltage: +/-30kV (Contact/Air)
®







per IEC 61000-4-2
Able to withstand over 1000 ESD strikes per IEC
61000-4-2 Level 4
1 pack
age
Ultra-small 020
0201
package
Protects one data or power line
Low reverse current: <50nA (VR=12V)
Working voltage: +/- 12V
Low capacitance: 25pF maximum
Solid-state silicon-avalanche technology
Mechanical Characteristics






SLP0603P2X3 package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 0.6 x 0.3 x 0.25 mm
Lead Finish: NiPdAu
Marking : Marking code + dot matrix date code
Packaging : Tape and Reel
Applications




Nominal Dimensions
Cellular Handsets & Accessories
Portable Instrumentation
12V Power Protection
Tablet PC
Schematic
0.62
0.22
1
0.32
0.16
0.355 BSC
2
0.25
SLP0603P2X3 (Bottom View)
Nominal Dimensions (mm)
Revision 03/7/2013
1
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uClamp1211Z
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Symbol
Value
Units
Peak Pulse Power (tp = 8/20μs)
Pp k
125
Watts
Maximum Peak Pulse Current (tp = 8/20μs)
Ip p
5
Amps
VESD
+/- 30
+/- 30
kV
TJ
-55 to +125
°C
TSTG
-55 to +150
°C
ESD p er IEC 61000-4-2 (Air)1
ESD p er IEC 61000-4-2 (Contact)1
Op erating Temp erature
Storage Temp erature
Electrical Characteristics (T=25oC)
Parameter
Symbol
Conditions
Reverse Stand-Off Voltage
VRWM
Pin 1 to 2 or 2 to 1
Reverse Breakdown Voltage
V BR
It = 1mA
Pin 1 to 2 or 2 to 1
Reverse Leakage Current
IR
VRWM = 12V, T=25°C
Pin 1 to 2 or 2 to 1
Clamp ing Voltage
VC
Clamp ing Voltage
Minimum
Maximum
Units
12
V
16
19
V
<10
50
nA
IPP = 1A, tp = 8/20μs
Pin 1 to 2 or 2 to 1
20
V
VC
IPP = 5A, tp = 8/20μs
Pin 1 to 2 or 2 to 1
25
V
Dynamic Resistance2, 3
RDYN
tlp = 0.2 / 100ns
0.30
Junction Cap acitance
Cj
VR = 0V, f = 1MHz
19
13.3
Typical
Ohms
25
pF
Notes
1)ESD gun return path connected to ESD ground reference plane.
2)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to
t2 = 90ns.
3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A
© 2013 Semtech Corporation
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uClamp1211Z
PROTECTION PRODUCTS
Typical Characteristics
Clamping Voltage vs. Peak Pulse Current (tp=8/20us)
Non-Repetitive Peak Pulse Power vs. Pulse Time
25
10
O
Clamping Voltage - VC (V)
Peak Pulse Power - P PP (kW)
TA = 25 C
1
0.1
DR040412-125
1
10
100
15
10
5
0
0.01
0.1
20
0
1000
1
2
Junction Capacitance vs. Reverse Voltage
4
5
6
25
30
TLP Characteristic
25
30
25
TLP Current (A)
20
Capacitance - Cj (pF)
3
Peak Pulse Current - Ipp (A)
Pulse Duration - tp (µs)
15
10
5
20
15
10
5
f = 1 MHz
0
0
0
2
4
6
8
10
12
14
0
5
10
Reverse Voltage - VR (V)
ESD Clamping (+8kV Contact per IEC 61000-4-2)
20
ESD Clamping (-8kV Contact per IEC 61000-4-2)
45
0
40
-5
35
-10
Clamping Voltage (V)
Clamping Voltage (V)
15
TLP Voltage (V)
30
25
20
15
10
-20
-25
-30
Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane
-35
Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane
5
-15
-40
0
-45
-10
0
10
20
30
40
50
60
70
80
-10
Time (ns)
© 2013 Semtech Corporation
0
10
20
30
40
50
60
70
80
Time (ns)
3
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uClamp1211Z
PROTECTION PRODUCTS
Applications Information
Assembly Guidelines
The small size of this device means that some care
must be taken during the mounting process to insure
reliable solder joint. The table below provides
Semtech's recommended assembly guidelines for
mounting this device. The figure at the right details
Semtech’s recommended aperture based on the
below recommendations. Note that these are only
recommendations and should serve only as a starting
point for design since there are many factors that
affect the assembly process. The exact manufacturing parameters will require some experimentation to
get the desired solder application.
Assembly Parameter
Stencil Aperture
Mounting Pad
Package
0.175
0.272
0.250
0.298
R ecommendation
0.270
Solder Stencil Design
Laser cut, Electro-polished
Aper ture shape
Rectangular with rounded
corners
Solder Stencil Thickness
Solder Paste Type
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
© 2013 Semtech Corporation
Recommended Mounting Pattern
0.100 mm (0.004")
Type 4 size sphere or smaller
Per JEDEC J-STD-020
N on-Solder mask defined
OSP OR N iAu
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uClamp1211Z
PROTECTION PRODUCTS
Outline Drawing - SLP0603P2X3
B
D
A
DIM
A
A1
b
D
E
e
L
N
aaa
bbb
E
TOP VIEW
DIMENSIONS
MILLIMETERS
MIN NOM MAX
0.235 0.25 0.265
0.000 0.02 0.025
0.22 0.24
0.20
0.585 0.62 0.655
0.285 0.32 0.355
0.355 BSC
0.14
0.16 0.18
2
0.08
0.10
A
SEATING
PLANE
aaa C
C
A1
e/2
bbb
bxN
C A B
2xL
e
BOTTOM VIEW
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
Land Pattern - SLP0603P2X3
DIMENSIONS
(C)
Z
G
DIM
C
G
X
Y
Z
MILLIMETERS
(0.425)
0.175
0.270
0.250
0.675
Y
X
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
© 2013 Semtech Corporation
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uClamp1211Z
PROTECTION PRODUCTS
Marking Code
Ordering Information
S
Part Number
Qty per
Reel
Reel
Size
uClamp 1211Z.TN T
10,000
7 Inch
Notes:
MicroClamp, uClamp and μClamp are trademarks of Semtech
Corporation
Notes:
Marking will also include dot matrix date code
Carrier Tape Specification
A0
B0
0.37 +/-0.03 mm
0.67 +/-0.03 mm
Device Orientation in Tape
K0
0.32 +/-0.02 mm
Note: All dimensions in mm unless otherwise specified
Date Code Location
(Towards Sprocket Holes)
© 2013 Semtech Corporation
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uClamp1211Z
PROTECTION PRODUCTS
Contact Information for Semtech International AG
Taiw an Branch
Korea Branch
Shanghai Office
Japan (Osaka)
Office
Tel: 886-2-2748-3380
Fax: 886-2-2748-3390
Japan (Tokyo) Office
Tel: 81-3-5719-7560
Fax: 81-3-5719-7561
Tel: 82-2-527-4377
Fax: 82-2-527-4376
Semtech Limited (U.K.)
Tel: 44-1794-527-600
Fax: 44-1794-527-601
Tel: 86-21-6391-0830
Fax: 86-21-6391-0831
Semtech France SARL
Tel: 33-(0)169-28-22-00
Fax: 33-(0)169-28-12-98
Semtech Germany GmbH
Tel: 49-(0)8161-140-123
Fax: 49-(0)8161-140-124
Tel: 81-6-6347-6570
Fax: 81-6-6347-6571
Semtech International AG is a wholly-owned subsidiary of
Semtech Corporation, which has its headquarters in the U.S.A.
© 2013 Semtech Corporation
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