RClamp3331ZA

RClamp3331ZA
Ultra Small RailClamp®
1-Line, 3.3V ESD Protection
PROTECTION PRODUCTS - RailClamp®
Description
Features
 High ESD withstand Voltage: +/-18kV (Contact/Air)
RailClamp TVS diodes are ultra low capacitance devices
designed to protect sensitive electronics from damage
or latch-up due to ESD, EFT, and EOS. They are designed
for use on high speed ports in applications such as cell
phones, notebook computers, and other portable electronics. These devices offer desirable characteristics for
board level protection including fast response time, low
operating and clamping voltage, and no device degradation.
RClamp®3331ZA features extremely good ESD protection characteristics including a low typical dynamic resistance of 0.20 Ohms, low peak ESD clamping voltage,
and high ESD withstand voltage (+/-18kV contact per
IEC 61000-4-2). Low typical capacitance (0.35pF at
VR=0V) allows the RClamp3331ZA to be used in applications operating in excess of 5GHz without appreciable
signal attenuation. Each device will protect one high
speed data line operating at 3.3 Volts.
RClamp3331ZA is in a 2-pin SLP0603P2X3F package
measuring 0.6 x 0.3 mm with a nominal height of
0.25mm. Leads are finished with lead-free NiAu. The
small package gives the designer the flexibility to
protect single lines in applications where arrays are not
practical. The combination of low peak ESD clamping,
low dynamic resistance, and low capacitance makes
this device suitable for applications such as USB 3.0,
MIPI and V-By-One interfaces in portable devices.
®








per IEC 61000-4-2
Able to withstand over 1000 ESD strikes per
IEC 61000-4-2 Level 4
1 pack
age
Ultra-small 020
0201
package
Protects one high speed data line
Working voltage: +/- 3.3V
Low capacitance: 0.35pF typical
Extremely low dynamic resistance: 0.20 Ohms (Typ)
Low ESD clamping voltage
Solid-state silicon-avalanche technology
Mechanical Characteristics






SLP0603P2X3F Package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 0.6 x 0.3 x 0.25 mm
Lead Finish: NiAu
Marking: Marking Code
Packaging: Tape and Reel
Applications






Nominal Dimensions
USB 2.0 / USB 3.0
MIPI / MDDI
V-By-One
eDP
MHL
LVDS
Schematic
0.600
0.220
1
0.300
0.160
0.355 BSC
2
0.250
SLP0603P2X3F (Bottom View)
Nominal Dimensions (in mm)
Revision 3/23/2015
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RClamp3331ZA
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Symbol
Value
Units
Peak Pulse Power (tp = 8/20μs)
Pp k
30
Watts
Maximum Peak Pulse Current (tp = 8/20μs)
Ip p
4
Amps
VESD
+/- 18
+/- 18
kV
TJ
-40 to +85
°C
TSTG
-55 to +150
°C
ESD per IEC 61000-4-2 (Air)1
ESD per IEC 61000-4-2 (Contact)1
Operating Temperature
Storage Temperature
Electrical Characteristics (T=25oC)
Parameter
Symbol
Conditions
Reverse Stand-Off Voltage
VRWM
Pin 1 to 2 or 2 to 1
Breakdown Voltage
V BR
IBR = 10μA
Pin 1 to 2 or 2 to 1
Reverse Leakage Current
IR
Clamping Voltage
Minimum
Maximum
Units
3.3
V
8
10.5
V
VRWM = 3.3V, T=25°C
Pin 1 to 2 or 2 to 1
<1
50
nA
VC
IPP = 1A, tp = 8/20μs
Pin 1 to 2 or 2 to 1
3.8
5.5
V
Clamping Voltage
VC
IPP = 4A, tp = 8/20μs
Pin 1 to 2 or 2 to 1
5.5
7.5
V
ESD Clamping Voltage2
VC
IPP = 4A,
tlp = 0.2/100ns
4.5
V
ESD Clamping Voltage2
VC
IPP = 16A,
tlp = 0.2/100ns
7
V
Dynamic Resistance2, 3
RD
tp = 0.2/100ns
0.20
Ohms
Junction Capacitance
Cj
VR = 0V, f = 1MHz
0.35
5.5
Typical
0.45
pF
Notes
1)ESD gun return path connected to ESD ground reference plane.
2)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to
t2 = 90ns.
3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A
© 2015 Semtech Corporation
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RClamp3331ZA
PROTECTION PRODUCTS
Typical Characteristics
Clamping Waveform (tp=1.2/50us)
Non-Repetitive Peak Pulse Power vs. Pulse Time
1000
12
TA = 25OC
Waveform: tp= 1.2x50us
Rs = 2 Ohms
10
Clamping Votlage (V)
Peak Pulse Power - PPP (W)
TA = 25OC
100
10
8
6
4
2
DR040412-30
0
1
0.1
1
10
-5
100
5
15
Pulse Duration - tp (µs)
TLP Characteristic (Positive)
45
5
Transmission Line Pulse Test
(TLP) Settings:
tp = 100ns, tr = 0.2ns,
ITLP and VTLP averaging window:
t1 = 70ns to t2 = 90ns
25
0
-5
TLP Current (A)
20
TLP Current (A)
35
TLP Characteristic (Negative)
30
15
10
5
-10
-15
-20
Transmission Line Pulse Test
(TLP) Settings:
tp = 100ns, tr = 0.2ns,
ITLP and VTLP averaging window:
t1 = 70ns to t2 = 90ns
-25
0
-30
-5
-35
0
2
4
6
8
10
-12
12
-10
-8
Clamping Voltage (V)
70
-4
-2
0
ESD Clamping (-8kV Contact per IEC 61000-4-2)
10
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
60
-6
Clamping Voltage (V)
ESD Clamping (+8kV Contact per IEC 61000-4-2)
0
50
Clamping Voltage - VC (V)
Clamping Voltage - VC (V)
25
Time (us)
40
30
20
10
‐10
‐20
‐30
‐40
‐50
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
‐60
0
‐70
‐10
‐10
0
10
20
30
40
50
60
70
80
‐10
90
© 2015 Semtech Corporation
0
10
20
30
40
50
60
70
80
90
Time (ns)
Time (ns)
3
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RClamp3331ZA
PROTECTION PRODUCTS
Typical Characteristics
Typical Insertion Loss S21
0.8
0.0
0.7
‐0.5
0.6
‐1.0
Loss (dB)
Junction Capacitance - CJ (pF)
Junction Capacitance vs. Reverse Voltage
0.5
0.4
‐1.5
‐2.0
0.3
‐2.5
0.2
‐3.0
‐3.5
0.1
f = 1MHz
0
0
0.5
1
1.5
2
2.5
3
‐4.0
0.01
3.5
Voltage (V)
© 2015 Semtech Corporation
0.1
1
10
Frequency (GHz)
4
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RClamp3331ZA
PROTECTION PRODUCTS
Applications Information
Assembly Guidelines
The small size of this device means that some care
must be taken during the mounting process to insure
reliable solder joints. The figure at the right details
Semtech’s recommended aperture based on the
assembly guidelines detailed in the table below. Note
that these are only recommendations and should
serve only as a starting point for design since there
are many factors that affect the assembly process.
Exact manufacturing parameters will require some
experimentation to get the desired solder application.
0.273
0.205
0.220
Assembly Parameter
R ecommendation
Solder Stencil Design
Laser cut, Electro-polished
Aper ture shape
Rectangular with rounded
corners
Solder Stencil Thickness
0.320
Land Pad
Stencil opening
0.100 mm (0.004")
Component
Solder Paste Type
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
© 2015 Semtech Corporation
Type 4 size sphere or smaller
Recommended Mounting Pattern
Per JEDEC J-STD-020
N on-Solder mask defined
OSP OR N iAu
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RClamp3331ZA
PROTECTION PRODUCTS
Outline Drawing - SLP0603P2X3F
A
B
D
DIM
A
A1
b
D
E
e
L
N
aaa
bbb
E
TOP VIEW
DIMENSIONS
MILLIMETERS
MIN NOM MAX
0.235 0.250 0.265
0.000 0.010 0.050
0.200 0.220 0.240
0.580 0.600 0.620
0.280 0.300 0.320
0.355 BSC
0.140 0.160 0.180
2
0.08
0.10
A
SEATING
PLANE
aaa C
C
A1
e/2
R0.025
TYP
bxN
C A B
bbb
2X L
e
BOTTOM VIEW
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS(ANGLES IN DEGREES).
Land Pattern - SLP0603P2X3F
DIMENSIONS
(C)
Z
G
DIM
C
G
X
Y
Z
MILLIMETERS
(0.385)
0.181
0.273
0.205
0.590
Y
X
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES ).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY .
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY 'S MANUFACTURING GUIDELINES ARE MET .
© 2015 Semtech Corporation
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RClamp3331ZA
PROTECTION PRODUCTS
Marking Code
Ordering Information
m
Part Number
Qty per
Reel
Pocket
Pitch
Reel
Size
RClamp3331ZATFT
15,000
2mm
7 Inch
Notes:
RailClamp and RClamp are trademarks of Semtech Corporation
Note:
Device is electrically symmetrical
Carrier Tape Specification
m
m
m
Device Orientation in Tape
© 2015 Semtech Corporation
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RClamp3331ZA
PROTECTION PRODUCTS
Contact Information for Semtech International AG
Taiw an Branch
Korea Branch
Shanghai Office
Japan (Osaka)
Office
Tel: 886-2-2748-3380
Fax: 886-2-2748-3390
Japan (Tokyo) Office
Tel: 81-3-5719-7560
Fax: 81-3-5719-7561
Tel: 82-2-527-4377
Fax: 82-2-527-4376
Semtech Limited (U.K.)
Tel: 44-1794-527-600
Fax: 44-1794-527-601
Tel: 86-21-6391-0830
Fax: 86-21-6391-0831
Semtech France SARL
Tel: 33-(0)169-28-22-00
Fax: 33-(0)169-28-12-98
Semtech Germany GmbH
Tel: 49-(0)8161-140-123
Fax: 49-(0)8161-140-124
Tel: 81-6-6347-6570
Fax: 81-6-6347-6571
Semtech International AG is a wholly-owned subsidiary of
Semtech Corporation, which has its headquarters in the U.S.A.
© 2015 Semtech Corporation
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