µClamp0501Z Ultra Small µClamp® 1-Line, 5V ESD Protection PROTECTION PRODUCTS - µClamp® Description Features µClamp® TVS diodes are designed to protect sensitive electronics from damage or latch-up due to ESD. They are designed to replace 0201 size multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and other portable electronics. It features large cross-sectional area junctions for conducting high transient currents. This device offers desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. µClamp®0501Z features extremely good ESD protection characteristics highlighted by low typical dynamic resistance, and low peak ESD clamping voltage. Each device will protect one data or power line operating at +5 Volts. µClamp0501Z is in a 2-pin SLP0603P2X3 package. It measures 0.6 x 0.3 mm with a nominal height of only 0.25mm. Leads are finished with NiAu. The small package gives the designer the flexibility to protect single lines in applications where arrays are not practical. The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and tablet PC’s. u Transient protection for data lines to IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) u Ultra-small package u Protects one data or power line u Low ESD clamping voltage u Working voltage: +5V u Low capacitance: 10pF maximum u Low leakage current u Solid-state silicon-avalanche technology Mechanical Characteristics u u u u u u SLP0603P2X3 package Pb-Free, Halogen Free, RoHS/WEEE Compliant Nominal Dimensions: 0.6 x 0.3 x 0.25 mm Lead Finish: NiAu Marking: Marking Code Packaging: Tape and Reel Applications u u u u u Package Dimensions Cellular Handsets & Accessories Notebook Computers Tablet PC Portable Instrumentation Peripherals Schematic & Pin Configuration 0.62 0.22 0.32 0.16 0.355 BSC 0.25 Nominal Dimensions in mm 10/30/2014 SLP0603P2X3 (Bottom View) 1 www.semtech.com µClamp0501Z PROTECTION PRODUCTS Absolute Maximum Ratings Rating Symbol Value Units Peak Pulse Power (tp = 8/20µs) PPK 12 W Peak Pulse Current (tp = 8/20µs) IPP 1 A VESD ±15 ±8 kV TJ -55 to +125 O TSTG -55 to +150 O (1) ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact)(1) Operating Temperature Storage Temperature C C Electrical Characteristics (T=25OC unless otherwise specified) Parameter Symbol Conditions VRWM Pin 1 to 2 VBR IBR = 1mA Pin 1 to 2 Reverse Leakage Current IR VRWM = 5V Pin 1 to 2 Clamping Voltage VC IPP = 1A, tp = 8/20µs Forward Voltage VF IF = 10mA Pin 2 to 1 1 ESD Clamping Voltage2 VC IPP = +4A tp = 0.2/100ns 11 V ESD Clamping Voltage2 VC IPP = +16A tp = 0.2/100ns 22 V Dynamic Resistance2, 3 RDYN tp = 100ns 0.9 Ohms Junction Capacitance CJ Reverse Stand-Off Voltage Reverse breakdown Voltage I/O pin to GND f = 1MHz Min. 6.5 VR = 0V Typ. Max. Units 5 V 7.5 9 V 3 50 nA 12 V 1.2 V 8 10 pF Notes 1)Measured with a 20dB attenuator, 50 Ohm scope input impedance, 2GHz bandwidth. ESD gun return path connected to ESD ground plane. 2)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and V TLP averaging window: t1 = 70ns to t2 = 90ns. 3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A 2014 Semtech Corporation. 2 www.semtech.com µClamp0501Z PROTECTION PRODUCTS Typical Characteristics ESD Clamping (8kV Contact per IEC 61000-4-2) ESD Clamping (-8kV Contact per IEC 61000-4-2) 45 5 Measuredwith50Ohmscopeinput impedance,2GHzbandwidth.Corrected for50Ohm,20dBattenuator.ESDgun returnpathconnectedtoESDgroundplane. 40 0 -5 Clamping Voltage - VC (V) Clamping Voltage - VC (V) 35 30 25 20 15 10 -10 -15 -20 -25 Measuredwith50Ohmscopeinput impedance,2GHzbandwidth.Corrected for50Ohm,20dBattenuator.ESDgun returnpathconnectedtoESDgroundplane. 5 -30 0 -35 -5 -10 0 10 20 30 40 50 60 70 -10 80 0 10 20 Time (ns) TLP Characteristic (Positive Pulse) 60 70 80 5 TransmissionLinePulseTest (TLP)Settings: tp =100ns,tr =0.2ns, ITLP andVTLP averagingwindow: t1 =70nstot2 =90ns 0 TransmissionLinePulseTest (TLP)Settings: tp =100ns,tr =0.2ns, ITLP andVTLP averagingwindow: t1 =70nstot2 =90ns -5 15 TLP Current (A) TLP Current (A) 50 TLP Characteristic (Negative Pulse) 25 20 30 40 Time (ns) 10 5 -10 -15 -20 0 -25 -5 0 5 10 15 20 25 -30 30 -20 -15 Clamping Voltage (V) Clamping Voltage vs. Peak Pulse Current (tp=8/20us) -5 0 Junction Capacitance vs. Reverse Voltage 10 15 9 13 8 Capacitance - Cj (pF) Clamping Voltage - VC (V) -10 Clamping Voltage (V) 11 9 7 5 Waveform Parameters: tr = 8ȝs td = 20ȝs 3 7 6 5 4 3 2 1 1 f = 1 MHz 0 0.2 0.4 0.6 0.8 1 0 1.2 0 Peak Pulse Current - IPP (A) 2014 Semtech Corporation. 3 1 2 3 Reverse Voltage - VR (V) 4 5 www.semtech.com µClamp0501Z PROTECTION PRODUCTS Applications Information Assembly Guidelines The small size of this device means that some care must be taken during the mounting process to insure reliable solder joint. The table below provides Semtech’s recommended assembly guidelines for mounting this device. The figure at the right details Semtech’s recommended aperture based on the below recommendations. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. The exact manufacturing parameters will require some experimentation to get the desired solder application. Assembly Parameter Stencil Aperture Mounting Pad Package 0.175 0.272 0.250 Recommendation 0.298 Solder Stencil Design Laser cut, Electro-polished Aperture shape Rectangular with rounded corners Solder Stencil Thickness Solder Paste Type Solder Reflow Profile PCB Solder Pad Design PCB Pad Finish 2014 Semtech Corporation. 0.270 Recommended Mounting Pattern 0.100 mm (0.004") Type 4 size sphere or smaller Per JEDEC J-STD-020 Non-Solder mask defined OSP OR NiAu 4 www.semtech.com µClamp0501Z PROTECTION PRODUCTS Outline Drawing - SLP0603P2X3 A B D DIMENSIONS MILLIMETERS DIM MIN NOM MAX A A1 b D E e L N aaa bbb E TOP VIEW 0.235 0.25 0.265 0.00 0.02 0.025 0.22 0.24 0.20 0.585 0.62 0.655 0.285 0.32 0.355 0.355 BSC 0.16 0.18 0.14 2 0.08 0.10 A SEATING PLANE aaa C C A1 bxN C A B bbb 2xL e BOTTOM VIEW NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP0603P2X3 DIMENSIONS (C) Z G DIM C G X Y Z MILLIMETERS (0.425) 0.175 0.270 0.250 0.675 Y X NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 2014 Semtech Corporation. 5 www.semtech.com µClamp0501Z PROTECTION PRODUCTS Marking Ordering Information Part Number Qty per Reel Reel Size µClamp0501Z.TNT 10000 7” Notes: 1) MicroClamp, uClamp and µClamp are trademarks of Semtech Corporation. Notes: Dots represent date code matrix Bar is pin 1 location B B B Tape and Reel Specification Pin 1 Located Towards Sprocket Holes Contact Information for Semtech International AG Taiwan Branch Tel: 886-2-2748-3380 Fax: 886-2-2748-3390 Japan (Tokyo) Office Tel: 81-3-5719-7560 Fax: 81-3-5719-7561 Korea Branch Tel: 82-2-527-4377 Fax: 82-2-527-4376 Semtech Limited (U.K.) Tel: 44-1794-527-600 Fax: 44-1794-527-601 Shanghai Office Tel: 86-21-6391-0830 Fax: 86-21-6391-0831 Semtech France SARL Tel: 33-(0)169-28-22-00 Fax: 33-(0)169-28-12-98 Japan (Osaka) Office Tel: 81-6-6347-6570 Fax: 81-6-6347-6571 Semtech Germany GmbH Tel: 49-(0)8161-140-123 Fax: 49-(0)8161-140-124 Semtech International AG is a wholly-owned subsidiary of Semtech Corporation, which has its headquarters in the U.S.A. 2014 Semtech Corporation. 6 www.semtech.com