µClamp0501Z

µClamp0501Z
Ultra Small µClamp®
1-Line, 5V ESD Protection
PROTECTION PRODUCTS - µClamp®
Description
Features
µClamp® TVS diodes are designed to protect sensitive
electronics from damage or latch-up due to ESD. They
are designed to replace 0201 size multilayer varistors
(MLVs) in portable applications such as cell phones,
notebook computers, and other portable electronics. It
features large cross-sectional area junctions for conducting high transient currents. This device offers desirable
characteristics for board level protection including fast
response time, low operating and clamping voltage, and
no device degradation.
µClamp®0501Z features extremely good ESD protection
characteristics highlighted by low typical dynamic resistance, and low peak ESD clamping voltage. Each device
will protect one data or power line operating at +5 Volts.
µClamp0501Z is in a 2-pin SLP0603P2X3 package. It
measures 0.6 x 0.3 mm with a nominal height of only
0.25mm. Leads are finished with NiAu. The small package gives the designer the flexibility to protect single
lines in applications where arrays are not practical. The
combination of small size and high ESD surge capability
makes them ideal for use in portable applications such
as cellular phones, digital cameras, and tablet PC’s.
u Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
u Ultra-small package
u Protects one data or power line
u Low ESD clamping voltage
u Working voltage: +5V
u Low capacitance: 10pF maximum
u Low leakage current
u Solid-state silicon-avalanche technology
Mechanical Characteristics
u
u
u
u
u
u
SLP0603P2X3 package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 0.6 x 0.3 x 0.25 mm
Lead Finish: NiAu
Marking: Marking Code
Packaging: Tape and Reel
Applications
u
u
u
u
u
Package Dimensions
Cellular Handsets & Accessories
Notebook Computers
Tablet PC
Portable Instrumentation
Peripherals
Schematic & Pin Configuration
0.62
0.22
0.32
0.16
0.355 BSC
0.25
Nominal Dimensions in mm
10/30/2014
SLP0603P2X3 (Bottom View)
1
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µClamp0501Z
PROTECTION PRODUCTS
Absolute Maximum Ratings
Rating
Symbol
Value
Units
Peak Pulse Power (tp = 8/20µs)
PPK
12
W
Peak Pulse Current (tp = 8/20µs)
IPP
1
A
VESD
±15
±8
kV
TJ
-55 to +125
O
TSTG
-55 to +150
O
(1)
ESD per IEC 61000-4-2 (Air)
ESD per IEC 61000-4-2 (Contact)(1)
Operating Temperature
Storage Temperature
C
C
Electrical Characteristics (T=25OC unless otherwise specified)
Parameter
Symbol
Conditions
VRWM
Pin 1 to 2
VBR
IBR = 1mA
Pin 1 to 2
Reverse Leakage Current
IR
VRWM = 5V
Pin 1 to 2
Clamping Voltage
VC
IPP = 1A, tp = 8/20µs
Forward Voltage
VF
IF = 10mA
Pin 2 to 1
1
ESD Clamping Voltage2
VC
IPP = +4A
tp = 0.2/100ns
11
V
ESD Clamping Voltage2
VC
IPP = +16A
tp = 0.2/100ns
22
V
Dynamic Resistance2, 3
RDYN
tp = 100ns
0.9
Ohms
Junction Capacitance
CJ
Reverse Stand-Off Voltage
Reverse breakdown Voltage
I/O pin to GND
f = 1MHz
Min.
6.5
VR = 0V
Typ.
Max.
Units
5
V
7.5
9
V
3
50
nA
12
V
1.2
V
8
10
pF
Notes
1)Measured with a 20dB attenuator, 50 Ohm scope input impedance, 2GHz bandwidth. ESD gun return path connected to ESD ground plane.
2)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and V TLP averaging window: t1 = 70ns to t2 = 90ns.
3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A
 2014 Semtech Corporation.
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µClamp0501Z
PROTECTION PRODUCTS
Typical Characteristics
ESD Clamping (8kV Contact per IEC 61000-4-2)
ESD Clamping (-8kV Contact per IEC 61000-4-2)
45
5
Measuredwith50Ohmscopeinput
impedance,2GHzbandwidth.Corrected
for50Ohm,20dBattenuator.ESDgun
returnpathconnectedtoESDgroundplane.
40
0
-5
Clamping Voltage - VC (V)
Clamping Voltage - VC (V)
35
30
25
20
15
10
-10
-15
-20
-25
Measuredwith50Ohmscopeinput
impedance,2GHzbandwidth.Corrected
for50Ohm,20dBattenuator.ESDgun
returnpathconnectedtoESDgroundplane.
5
-30
0
-35
-5
-10
0
10
20
30
40
50
60
70
-10
80
0
10
20
Time (ns)
TLP Characteristic (Positive Pulse)
60
70
80
5
TransmissionLinePulseTest
(TLP)Settings:
tp =100ns,tr =0.2ns,
ITLP andVTLP averagingwindow:
t1 =70nstot2 =90ns
0
TransmissionLinePulseTest
(TLP)Settings:
tp =100ns,tr =0.2ns,
ITLP andVTLP averagingwindow:
t1 =70nstot2 =90ns
-5
15
TLP Current (A)
TLP Current (A)
50
TLP Characteristic (Negative Pulse)
25
20
30
40
Time (ns)
10
5
-10
-15
-20
0
-25
-5
0
5
10
15
20
25
-30
30
-20
-15
Clamping Voltage (V)
Clamping Voltage vs. Peak Pulse Current (tp=8/20us)
-5
0
Junction Capacitance vs. Reverse Voltage
10
15
9
13
8
Capacitance - Cj (pF)
Clamping Voltage - VC (V)
-10
Clamping Voltage (V)
11
9
7
5
Waveform
Parameters:
tr = 8ȝs
td = 20ȝs
3
7
6
5
4
3
2
1
1
f = 1 MHz
0
0.2
0.4
0.6
0.8
1
0
1.2
0
Peak Pulse Current - IPP (A)
 2014 Semtech Corporation.
3
1
2
3
Reverse Voltage - VR (V)
4
5
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µClamp0501Z
PROTECTION PRODUCTS
Applications Information
Assembly Guidelines
The small size of this device means that some care must
be taken during the mounting process to insure reliable
solder joint. The table below provides Semtech’s recommended assembly guidelines for mounting this device.
The figure at the right details Semtech’s recommended
aperture based on the below recommendations. Note
that these are only recommendations and should serve
only as a starting point for design since there are many
factors that affect the assembly process. The exact
manufacturing parameters will require some experimentation to get the desired solder application.
Assembly Parameter
Stencil Aperture
Mounting Pad
Package
0.175
0.272
0.250
Recommendation
0.298
Solder Stencil Design
Laser cut, Electro-polished
Aperture shape
Rectangular with rounded
corners
Solder Stencil Thickness
Solder Paste Type
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
 2014 Semtech Corporation.
0.270
Recommended Mounting Pattern
0.100 mm (0.004")
Type 4 size sphere or smaller
Per JEDEC J-STD-020
Non-Solder mask defined
OSP OR NiAu
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µClamp0501Z
PROTECTION PRODUCTS
Outline Drawing - SLP0603P2X3
A
B
D
DIMENSIONS
MILLIMETERS
DIM
MIN NOM MAX
A
A1
b
D
E
e
L
N
aaa
bbb
E
TOP VIEW
0.235 0.25 0.265
0.00
0.02 0.025
0.22 0.24
0.20
0.585 0.62 0.655
0.285 0.32 0.355
0.355 BSC
0.16 0.18
0.14
2
0.08
0.10
A
SEATING
PLANE
aaa C
C
A1
bxN
C A B
bbb
2xL
e
BOTTOM VIEW
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
Land Pattern - SLP0603P2X3
DIMENSIONS
(C)
Z
G
DIM
C
G
X
Y
Z
MILLIMETERS
(0.425)
0.175
0.270
0.250
0.675
Y
X
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
 2014 Semtech Corporation.
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µClamp0501Z
PROTECTION PRODUCTS
Marking
Ordering Information
Part Number
Qty per Reel
Reel Size
µClamp0501Z.TNT
10000
7”
Notes:
1) MicroClamp, uClamp and µClamp are trademarks of
Semtech Corporation.
Notes:
Dots represent date code matrix
Bar is pin 1 location
B
B
B
Tape and Reel Specification
Pin 1 Located Towards
Sprocket Holes
Contact Information for Semtech International AG
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Tel: 886-2-2748-3380
Fax: 886-2-2748-3390
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Tel: 82-2-527-4377
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Tel: 44-1794-527-600
Fax: 44-1794-527-601
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Fax: 86-21-6391-0831
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Fax: 81-6-6347-6571
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Tel: 49-(0)8161-140-123
Fax: 49-(0)8161-140-124
Semtech International AG is a wholly-owned subsidiary of Semtech Corporation, which has its headquarters in the
U.S.A.
 2014 Semtech Corporation.
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