uClamp0552T Ultra Small μClamp® 2-Line ESD Protection PROTECTION PRODUCTS - MicroClamp® Description Features μClamp TVS diodes are designed to protect sensitive electronics from damage or latch-up due to ESD. They are designed to replace multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and other portable electronics. They feature large cross-sectional area junctions for conducting high transient currents. This device offers desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. The μClamp®0552T is in a 3-pin SLP1006N3T package. It measures 1.0 x 0.6 mm with a nominal height of only 0.4mm. The leads are finished with lead-free NiPdAu. Each device will protect two lines operating at 5 volts. It gives the designer the flexibility to replace multiple single line devices in space constrained applications. They may be used to meet the ESD immunity requirements of IEC 61000-4-2. The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and MP3 players. ® High ESD withstand Voltage: +/-17kV (Contact) per IEC 61000-4-2 Very small PCB area: 0.6mm2 Protects up to two data lines Low reverse current: <5nA typical (VR=5V) Working voltage: +/- 5V Low capacitance: <9pF (VR=0V) Low dynamic resistance: 0.55 Ohms (Typ) Solid-state silicon-avalanche technology Mechanical Characteristics SLP1006N3T package Pb-Free, Halogen Free, RoHS/WEEE Compliant Nominal Dimensions: 1.0 x 0.6 x 0.40 mm Lead Finish: NiPdAu Molding compound flammability rating: UL 94V-0 Marking : Marking code + dot matrix date code Packaging : Tape and Reel Applications Dimensions Cellular Handsets & Accessories Keypads, Side Keys Audio Ports LCD Connectors Digital Lines Schematic & PIN Configuration 1 1.00 0.68 1 2 2 0.60 0.40 3 Nominal Dimensions (mm) Revision 4/4/2012 2-Line, Bidirectional 1 www.semtech.com uClamp0552T PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20μs) Pp k 30 Watts Maximum Peak Pulse Current (tp = 8/20μs) Ip p 2 Amps VESD +/- 19 +/- 17 kV TJ -55 to +125 °C TSTG -55 to +150 °C ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) Op erating Temp erature Storage Temp erature Electrical Characteristics (T=25oC) Parameter Symbol Conditions Reverse Stand-Off Voltage VRWM Any I/O Pin to GN D Reverse Breakdown Voltage V BR It = 1mA Any I/O Pin to GN D Reverse Leakage Current IR VRWM = 5V, T=25°C Any I/O Pin to GN D Clamp ing Voltage VC IPP = 2A, tp = 8/20μs Any I/O Pin to GN D ESD Clamp ing Voltage VC IPP = 16A, tlp = 0.2/100ns 17 V Dynamic Resistance RDyn tp = 100ns 0.55 Ohms Cj VR = 0V, f = 1MHz Any I/O Pin to GN D 7 Junction Cap acitance © 2012 Semtech Corporation 2 Minimum 6 Typical Maximum Units 5 V 8.2 9.5 V 3 50 nA 15 V 9 pF www.semtech.com uClamp0552T PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Clamping Voltage vs. Peak Pulse Current (tp=8/20us) 14 1 Clamping Voltage -VC (V) Peak Pulse Power - P PP (kW) 12 0.1 0.01 10 8 6 4 Waveform Parameters: tr = 8µs td = 20µs 2 0 DR040412-30 0.001 0 0.1 1 10 Pulse Duration - tp (µs) 0.5 1 1.5 2 2.5 100 Peak Pulse Current - IPP (A) Junction Capacitance vs. Reverse Voltage TLP Characteristic 30 10 9 25 Capacitance - Cj (pf) 8 TLP Current (A) 7 6 5 4 3 20 RDYN = 0.55 Ohms 15 10 TLP Parameters: tp = 100ns tr = 200ps 2 5 1 f = 1 MHz 0 0 1 2 3 4 0 5 0 Reverse Voltage - VR (V) ESD Clamping (+8kV Contact per IEC 61000-4-2) 10 15 TLP Voltage (V) 20 25 ESD Clamping (-8kV Contact per IEC 61000-4-2) 100 10 90 0 80 -10 70 -20 Voltage (V) Voltage (V) 5 60 50 40 -30 -40 -50 30 20 -60 10 -70 0 -80 -10 0 10 20 30 40 50 60 70 80 -10 Time (ns) © 2012 Semtech Corporation 0 10 20 30 40 50 60 70 80 Time (ns) 3 www.semtech.com uClamp0552T PROTECTION PRODUCTS Typical Characteristics Typical Insertion Loss S21 CH1 S21 LOG Analog Crosstalk 6 dB / REF 0 dB CH1 S21 1: - 4.5788 dB 800 MHz 2: - 6.4356 dB 900 MHz 0 dB 1 4 2 -12 dB 20dB / REF 0 dB 0 dB 5 -6 dB LOG 3: - 9.0583 dB 1.8 GHz -20 dB 3 4: - 4.9673 dB 2.5 GHz -18 dB -40 dB -60 dB 5: - 4.5224 dB 2.7 GHz -24 dB -80 dB -30 dB -100 dB -36 dB -120 dB -42 dB -140 dB -48 dB 1 MHz 10 MHz 100 MHz 3 1 GHz GHz -160 dB START. 030 MHz STOP 3 000. 000000 MHz STOP 3000. 000000 MHz START . 030 MHz Reverse Leakage Current (IR) vs. Temperature Reverse Leakage Current (nA) 100 10 1 0 25 50 75 100 125 150 Temperature (oC) © 2012 Semtech Corporation 4 www.semtech.com uClamp0552T PROTECTION PRODUCTS Applications Information Device Connection Options Example Pin Configuration The μClamp0552T is designed to protect two data lines operating up to 5 volts. The device is bidirectional and may be used on lines where the signal polarity is above and below ground. The diagram at the right shows an example pin configuration with pin 3 connected to ground. However, due to the device symmetry, any pin may be connected to ground with the remaining pins conneted to the protected lines. I/O 1 1 GND I/O 2 Assembly Guidelines The small size of this device means that some care must be taken during the mounting process to insure reliable solder joint. The table below provides Semtech's recommended assembly guidelines for mounting this device. The figure at the right details Semtech’s recommended aperture based on the below recommendations. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. The exact manufacturing parameters will require some experimentation to get the desired solder application. Recommended Mounting Pattern Stencil Opening (220x460 mm) Land Pad (200x400 mm) Assembly Parameter Solder Stencil Design Aper ture shape R ecommendation Laser cut, Electro-polished Rectangular .850 Solder Stencil Thickness Solder Paste Type Solder Reflow Profile PCB Solder Pad Design PCB Pad Finish 0.100 mm (0.004") Type 4 size sphere or smaller Per JEDEC J-STD-020 N on-Solder mask defined 1.000 OSP OR N iAu All Dimensions are in mm. Land Pad. © 2012 Semtech Corporation 5 Stencil opening Component www.semtech.com uClamp0552T PROTECTION PRODUCTS Outline Drawing - SLP1006N3T A D DIMENSIONS MILLIMETERS MIN NOM MAX B PIN 1 INDICATOR (LASER MARK) DIM E A SEATING PLANE aaa C C A1 A2 e A A1 A2 b b1 D E e L N aaa bbb 0.37 0.40 0.43 0.00 0.02 0.05 (0.13) 0.145 0.17 0.195 0.175 0.20 0.225 0.90 1.00 1.10 0.50 0.60 0.70 0.68 BSC 0.225 0.25 0.275 3 0.08 0.10 R0.05 e/2 1 2 LxN E/2 N bbb b1xN C A B bxN bbb C A B D/2 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP1006N3T X DIMENSIONS (C) DIM C G P X Y Z Z Y G P/2 MILLIMETERS (0.45) 0.05 0.68 0.20 0.40 0.85 P NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. © 2012 Semtech Corporation 6 www.semtech.com uClamp0552T PROTECTION PRODUCTS Marking Code Ordering Information 52 Part Number Qty per Reel Reel Size uClamp 0552T.TN T 10,000 7 Inch Notes: MicroClamp, uClamp and μClamp are trademarks of Semtech Corporation Notes: Marking will also include line matrix date code Carrier Tape Specification Bo Ao Ko Device Orientation in Tape A0 0.70 +/-0.05 mm B0 1.15 +/-0.05 mm K0 0.55 +/-0.05 mm Note: All dimensions in mm unless otherwise specified 52 52 52 52 52 Pin 1 Location (Towards Sprocket Holes) Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 © 2012 Semtech Corporation 7 www.semtech.com