uClamp0552T

uClamp0552T
Ultra Small μClamp®
2-Line ESD Protection
PROTECTION PRODUCTS - MicroClamp®
Description
Features
μClamp TVS diodes are designed to protect sensitive
electronics from damage or latch-up due to ESD. They
are designed to replace multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and other portable electronics. They feature large
cross-sectional area junctions for conducting high transient currents. This device offers desirable characteristics for board level protection including fast response
time, low operating and clamping voltage, and no device
degradation.
The μClamp®0552T is in a 3-pin SLP1006N3T package. It measures 1.0 x 0.6 mm with a nominal height
of only 0.4mm. The leads are finished with lead-free
NiPdAu. Each device will protect two lines operating at
5 volts. It gives the designer the flexibility to replace
multiple single line devices in space constrained
applications. They may be used to meet the ESD
immunity requirements of IEC 61000-4-2. The combination of small size and high ESD surge capability
makes them ideal for use in portable applications such
as cellular phones, digital cameras, and MP3 players.
®
‹ High ESD withstand Voltage: +/-17kV (Contact) per
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IEC 61000-4-2
Very small PCB area: 0.6mm2
Protects up to two data lines
Low reverse current: <5nA typical (VR=5V)
Working voltage: +/- 5V
Low capacitance: <9pF (VR=0V)
Low dynamic resistance: 0.55 Ohms (Typ)
Solid-state silicon-avalanche technology
Mechanical Characteristics
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SLP1006N3T package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 1.0 x 0.6 x 0.40 mm
Lead Finish: NiPdAu
Molding compound flammability rating: UL 94V-0
Marking : Marking code + dot matrix date code
Packaging : Tape and Reel
Applications
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Dimensions
Cellular Handsets & Accessories
Keypads, Side Keys
Audio Ports
LCD Connectors
Digital Lines
Schematic & PIN Configuration
1
1.00
0.68
1
2
2
0.60
0.40
3
Nominal Dimensions (mm)
Revision 4/4/2012
2-Line, Bidirectional
1
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uClamp0552T
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Symbol
Value
Units
Peak Pulse Power (tp = 8/20μs)
Pp k
30
Watts
Maximum Peak Pulse Current (tp = 8/20μs)
Ip p
2
Amps
VESD
+/- 19
+/- 17
kV
TJ
-55 to +125
°C
TSTG
-55 to +150
°C
ESD p er IEC 61000-4-2 (Air)
ESD p er IEC 61000-4-2 (Contact)
Op erating Temp erature
Storage Temp erature
Electrical Characteristics (T=25oC)
Parameter
Symbol
Conditions
Reverse Stand-Off Voltage
VRWM
Any I/O Pin
to GN D
Reverse Breakdown Voltage
V BR
It = 1mA
Any I/O Pin
to GN D
Reverse Leakage Current
IR
VRWM = 5V, T=25°C
Any I/O Pin
to GN D
Clamp ing Voltage
VC
IPP = 2A, tp = 8/20μs
Any I/O Pin
to GN D
ESD Clamp ing Voltage
VC
IPP = 16A,
tlp = 0.2/100ns
17
V
Dynamic Resistance
RDyn
tp = 100ns
0.55
Ohms
Cj
VR = 0V, f = 1MHz
Any I/O Pin
to GN D
7
Junction Cap acitance
© 2012 Semtech Corporation
2
Minimum
6
Typical
Maximum
Units
5
V
8.2
9.5
V
3
50
nA
15
V
9
pF
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uClamp0552T
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Clamping Voltage vs. Peak Pulse Current (tp=8/20us)
14
1
Clamping Voltage -VC (V)
Peak Pulse Power - P PP (kW)
12
0.1
0.01
10
8
6
4
Waveform
Parameters:
tr = 8µs
td = 20µs
2
0
DR040412-30
0.001
0
0.1
1
10
Pulse Duration - tp (µs)
0.5
1
1.5
2
2.5
100
Peak Pulse Current - IPP (A)
Junction Capacitance vs. Reverse Voltage
TLP Characteristic
30
10
9
25
Capacitance - Cj (pf)
8
TLP Current (A)
7
6
5
4
3
20
RDYN = 0.55 Ohms
15
10
TLP
Parameters:
tp = 100ns
tr = 200ps
2
5
1
f = 1 MHz
0
0
1
2
3
4
0
5
0
Reverse Voltage - VR (V)
ESD Clamping (+8kV Contact per IEC 61000-4-2)
10
15
TLP Voltage (V)
20
25
ESD Clamping (-8kV Contact per IEC 61000-4-2)
100
10
90
0
80
-10
70
-20
Voltage (V)
Voltage (V)
5
60
50
40
-30
-40
-50
30
20
-60
10
-70
0
-80
-10
0
10
20
30
40
50
60
70
80
-10
Time (ns)
© 2012 Semtech Corporation
0
10
20
30
40
50
60
70
80
Time (ns)
3
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uClamp0552T
PROTECTION PRODUCTS
Typical Characteristics
Typical Insertion Loss S21
CH1 S21
LOG
Analog Crosstalk
6 dB / REF 0 dB
CH1 S21
1: - 4.5788 dB
800 MHz
2: - 6.4356 dB
900 MHz
0 dB
1
4
2
-12 dB
20dB / REF 0 dB
0 dB
5
-6 dB
LOG
3: - 9.0583 dB
1.8 GHz
-20 dB
3
4: - 4.9673 dB
2.5 GHz
-18 dB
-40 dB
-60 dB
5: - 4.5224 dB
2.7 GHz
-24 dB
-80 dB
-30 dB
-100 dB
-36 dB
-120 dB
-42 dB
-140 dB
-48 dB
1
MHz
10
MHz
100
MHz
3
1
GHz GHz
-160 dB
START. 030 MHz
STOP 3 000. 000000 MHz
STOP 3000. 000000 MHz
START . 030 MHz
Reverse Leakage Current (IR) vs. Temperature
Reverse Leakage Current (nA)
100
10
1
0
25
50
75
100
125
150
Temperature (oC)
© 2012 Semtech Corporation
4
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uClamp0552T
PROTECTION PRODUCTS
Applications Information
Device Connection Options
Example Pin Configuration
The μClamp0552T is designed to protect two data
lines operating up to 5 volts. The device is bidirectional
and may be used on lines where the signal polarity is
above and below ground. The diagram at the right
shows an example pin configuration with pin 3
connected to ground. However, due to the device
symmetry, any pin may be connected to ground with
the remaining pins conneted to the protected lines.
I/O 1 1
GND
I/O 2
Assembly Guidelines
The small size of this device means that some care
must be taken during the mounting process to insure
reliable solder joint. The table below provides
Semtech's recommended assembly guidelines for
mounting this device. The figure at the right details
Semtech’s recommended aperture based on the
below recommendations. Note that these are only
recommendations and should serve only as a starting
point for design since there are many factors that
affect the assembly process. The exact manufacturing parameters will require some experimentation to
get the desired solder application.
Recommended Mounting Pattern
Stencil Opening (220x460 mm)
Land Pad (200x400 mm)
Assembly Parameter
Solder Stencil Design
Aper ture shape
R ecommendation
Laser cut, Electro-polished
Rectangular
.850
Solder Stencil Thickness
Solder Paste Type
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
0.100 mm (0.004")
Type 4 size sphere or smaller
Per JEDEC J-STD-020
N on-Solder mask defined
1.000
OSP OR N iAu
All Dimensions are in mm.
Land Pad.
© 2012 Semtech Corporation
5
Stencil opening
Component
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uClamp0552T
PROTECTION PRODUCTS
Outline Drawing - SLP1006N3T
A
D
DIMENSIONS
MILLIMETERS
MIN NOM MAX
B
PIN 1
INDICATOR
(LASER MARK)
DIM
E
A
SEATING
PLANE
aaa C
C
A1
A2
e
A
A1
A2
b
b1
D
E
e
L
N
aaa
bbb
0.37 0.40 0.43
0.00 0.02 0.05
(0.13)
0.145 0.17 0.195
0.175 0.20 0.225
0.90 1.00 1.10
0.50 0.60 0.70
0.68 BSC
0.225 0.25 0.275
3
0.08
0.10
R0.05
e/2
1
2
LxN
E/2
N
bbb
b1xN
C A B
bxN
bbb
C A B
D/2
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
Land Pattern - SLP1006N3T
X
DIMENSIONS
(C)
DIM
C
G
P
X
Y
Z
Z
Y
G
P/2
MILLIMETERS
(0.45)
0.05
0.68
0.20
0.40
0.85
P
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
© 2012 Semtech Corporation
6
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uClamp0552T
PROTECTION PRODUCTS
Marking Code
Ordering Information
52
Part Number
Qty per
Reel
Reel
Size
uClamp 0552T.TN T
10,000
7 Inch
Notes:
MicroClamp, uClamp and μClamp are trademarks of Semtech
Corporation
Notes:
Marking will also include line matrix date code
Carrier Tape Specification
Bo
Ao
Ko
Device Orientation in Tape
A0
0.70 +/-0.05 mm
B0
1.15 +/-0.05 mm
K0
0.55 +/-0.05 mm
Note: All dimensions in mm unless otherwise specified
52
52
52
52
52
Pin 1 Location
(Towards Sprocket Holes)
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
© 2012 Semtech Corporation
7
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