µClamp3321ZA Ultra Small µClamp® 1-Line, 3.3V ESD Protection PROTECTION PRODUCTS - µClamp® Description Features µClamp® TVS diodes are designed to protect sensitive electronics from damage or latch-up due to ESD. They are designed to replace 0201 size multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and other portable electronics. They feature large cross-sectional area junctions for conducting high transient currents. This device offers desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. µClamp®3321ZA features extremely good ESD protection characteristics highlighted by low typical dynamic resistance of 0.33 Ohms, low peak ESD clamping voltage, and high ESD withstand voltage (+/-15kV contact per IEC 61000-4-2). Low maximum capacitance (5pF at VR=0V) minimizes loading on sensitive cirucuits. Each device will protect one data line operating at 3.3 Volts. µClamp3321ZA is in a 2-pin SLP0603P2X3F package. It measures 0.6 x 0.3 mm with a nominal height of only 0.25mm. Leads are finished with NiAu. The small package gives the designer the flexibility to protect single lines in applications where arrays are not practical. The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and tablet PC’s. High ESD withstand Voltage: +/-15kV (Contact) and +/- 17kV (Air) per IEC 61000-4-2 Ultra-small package Protects one data line Low ESD clamping voltage Working voltage: 3.3V Low capacitance: 5pF maximum Low leakage current Extremely low dynamic resistance: 0.33 Ohms (Typ) Solid-state silicon-avalanche technology Mechanical Characteristics Applications Package Dimensions Cellular Handsets & Accessories Notebook Computers Tablet PC Portable Instrumentation Peripherals Schematic & Pin Configuration 0.600 0.220 SLP0603P2X3F package Pb-Free, Halogen Free, RoHS/WEEE Compliant Nominal Dimensions: 0.6 x 0.3 x 0.25 mm Lead Finish: NiAu Marking: Marking code Packaging: Tape and Reel 1 0.300 0.160 0.355 BSC 2 0.250 Nominal Dimensions in mm 01/08/2015 SLP0603P2X3F (Bottom View) 1 www.semtech.com µClamp3321ZA PROTECTION PRODUCTS Absolute Maximum Ratings Rating Symbol Value Units Peak Pulse Power (tp = 8/20µs) PPK 40 W Peak Pulse Current (tp = 8/20µs) IPP 4 A VESD ±17 ±15 kV TJ -40 to +125 O TSTG -55 to +150 O ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact)(1) (1) Operating Temperature Storage Temperature C C Electrical Characteristics (T=25OC unless otherwise specified) Parameter Symbol Conditions VRWM Pin 1 to 2 or Pin 2 to 1 VPT IPT = 50µA Pin 1 to 2 or Pin 2 to 1 Reverse Leakage Current IR VRWM = 3.3V Pin 1 to 2 or Pin 2 to 1 Clamping Voltage VC IPP = 4A, tp = 8/20µs ESD Clamping Voltage2 VC IPP = 4A tp = 0.2/100ns 6.5 V ESD Clamping Voltage2 VC IPP = 16A tp = 0.2/100ns 10.5 V Dynamic Resistance2, 3 RDYN tp = 100ns 0.33 Ohms Junction Capacitance CJ Reverse Stand-Off Voltage Punch-Through Voltage I/O pin to GND f = 1MHz Min. VR = 0V 3.7 Typ. Max. Units 3.3 V 4.0 4.7 V 1 50 nA 8.5 V 4.2 5 pF Notes 1)Measured with a 20dB attenuator, 50 Ohm scope input impedance, 2GHz bandwidth. ESD gun return path connected to ESD ground plane. 2)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and V TLP averaging window: t1 = 70ns to t2 = 90ns. 3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A 2015 Semtech Corporation. 2 www.semtech.com µClamp3321ZA PROTECTION PRODUCTS Typical Characteristics ESD Clamping (8kV Contact per IEC 61000-4-2) 45 5 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane. 40 0 -5 Clamping Voltage - VC (V) 35 Clamping Voltage - VC (V) ESD Clamping (-8kV Contact per IEC 61000-4-2) 30 25 20 15 10 5 -15 -20 -25 -30 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane. -35 -40 0 -5 -10 -10 0 10 20 30 40 50 60 70 -45 80 -10 0 10 20 Time (ns) TLP Characteristic (Positive Pulse) 30 70 80 0 -5 15 10 5 -10 -15 -20 0 -5 60 5 TLP Current (A) TLP Current (A) 20 50 TLP Characteristic (Negative Pulse) Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns 25 30 40 Time (ns) Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns -25 0 5 10 15 -30 20 -15 -10 Clamping Voltage (V) -5 0 Clamping Voltage (V) Clamping Voltage vs. Peak Pulse Current (tp=8/20us) Junction Capacitance vs. Reverse Voltage 6 10 5 8 Junction Capacitance - CJ (pF) Peak Clamping Voltage - VC (V) 9 7 6 5 4 3 2 TA = 25OC Waveform: tp= 8x20us 1 0 4 3 2 1 0 0 1 2 3 Peak Pulse Current - IPP (A) 2015 Semtech Corporation. 4 5 f = 1MHz T=25oC 0 1 2 3 4 Voltage (V) 3 www.semtech.com µClamp3321ZA PROTECTION PRODUCTS Applications Information Assembly Guidelines The small size of this device means that some care must be taken during the mounting process to insure reliable solder joint. The table below provides Semtech’s recommended assembly guidelines for mounting this device. The figure at the right details Semtech’s recommended aperture based on the below recommendations. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. The exact manufacturing parameters will require some experimentation to get the desired solder application. Assembly Parameter Laser cut, Electro-polished Aperture shape Rectangular with rounded corners Solder Paste Type Solder Reflow Profile PCB Solder Pad Design PCB Pad Finish 2015 Semtech Corporation. 0.175 0.272 Recommendation Solder Stencil Design Solder Stencil Thickness Stencil Aperture Mounting Pad Package 0.250 0.298 0.270 Recommended Mounting Pattern 0.100 mm (0.004") Type 4 size sphere or smaller Per JEDEC J-STD-020 Non-Solder mask defined OSP OR NiAu 4 www.semtech.com µClamp3321ZA PROTECTION PRODUCTS Outline Drawing - SLP0603P2X3F A B D DIM A A1 b D E e L N aaa bbb E TOP VIEW A 0.235 0.250 0.265 0.000 0.010 0.050 0.200 0.220 0.240 0.580 0.600 0.620 0.280 0.300 0.320 0.355 BSC 0.140 0.160 0.180 2 0.08 0.10 SEATING PLANE aaa C C A1 bbb DIMENSIONS MILLIMETERS MIN NOM MAX e/2 R0.025 TYP bxN C A B 2X L e BOTTOM VIEW NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP0603P2X3F DIMENSIONS DIM G X Y Z Z G MILLIMETERS 0.177 0.272 0.247 0.671 Y X NOTES: CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 2015 Semtech Corporation. 5 www.semtech.com µClamp3321ZA PROTECTION PRODUCTS Marking Ordering Information h Part Number Qty per Reel Reel Size µClamp3321ZATFT 15000 7” Notes: 1) MicroClamp, uClamp and µClamp are trademarks of Semtech Corporation. Notes: Device is Electrically Symmetrical Tape and Reel Specification h h h Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 2015 Semtech Corporation. 6 www.semtech.com