RClamp3346P Low Capacitance RClamp® 6-Line ESD protection PROTECTION PRODUCTS - RailClamp® Description PRELIMINARY Features The RClamp 3346P provides ESD protection for highspeed data interfaces. It features a high maximum ESD withstand voltage of ±17kV contact and ±20kV air discharge per IEC 61000-4-2. RClamp3346P is designed to minimize both the ESD peak clamping and the TLP clamping. Package inductance is reduced at each pin resulting in lower peak ESD clamping voltage. The dynamic resistance is among the industry’s lowest at 0.15 Ohms (typical). Maximum capacitance on each line to ground is 0.65pF allowing the RClamp3346P to be used in applications operating in excess of 5GHz without signal attenuation. Each device will protect up to six lines (three high-speed pairs). The RClamp3346P is in a 7-pin SGP2708N7 package measuring 2.7 x 0.8mm with a nominal height of 0.50mm. The leads have a nominal pin-to-pin pitch of 0.40mm. Flow- through package design simplifies PCB layout and maintains signal integrity on high-speed lines. The combination of low peak ESD clamping, low dynamic resistance, and innovative package design enables this device to provide the highest level of ESD protection for applications such as USB 3.0, eSATA, and DisplayPort. ® ESD protection for high-speed data lines to IEC 61000-4-2 (ESD) ±20kV (air), ±17kV (contact) IEC 61000-4-5 (Lightning) 5A (8/20μs) IEC 61000-4-4 (EFT) 40A (5/50ns) Package design optimized for high speed lines Flow-Through design Protects six high-speed lines Low capacitance: 0.65pF Maximum (I/O to Ground) Low ESD clamping voltage Low dynamic resistance: 0.15 Ohms (Typ) Qualified to AEC-Q100 Solid-state silicon-avalanche technology Mechanical Characteristics SGP2708N7 7-pin package (2.7 x 0.8 x 0.50mm) Pb-Free, Halogen Free, RoHS/WEEE Compliant Lead Pitch: 0.4mm (intra-pair) Lead finish: NiPdAu Marking: Marking Code Packaging: Tape and Reel Applications Dimensions USB 3.0 eSATA Display Port LVDS Circuit Diagram 0.80 BSC 0.40 BSC 0.80 Pin 1 Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 2.70 Pin 2 0.50 Nominal Dimensions in mm (Bottom View) Revision 11/12/2013 6-Line Protection 1 www.semtech.com RClamp3346P PRELIMINARY PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Current (tp = 8/20μs) IP P 4.5 A ESD per IEC 61000-4-2 (Air)1 ESD per IEC 61000-4-2 (Contact)1 VESD +/- 20 +/- 17 kV TJ -55 to +125 °C TSTG -55 to +150 °C Operating Temperature Storage Temperature Electrical Characteristics (T=25oC) Parameter Symbol Conditions Reverse Stand-Off Voltage VRWM Any I/O to GN D Trigger Voltage2 V T R IG tlp = 0.2/100ns 8 IR VRWM = 3.3V, T=25oC Any I/O to GN D 0.01 Reverse Leakage Current Minimum Typical VRWM = 3.3V, T=125oC Any I/O to GN D Maximum Units 3.3 V V 0.05 μA 0.150 μA Clamping Voltage VC IPP = 1A, tp = 8/20μs Any I/O to GN D 2.5 3.5 V Clamping Voltage VC IPP = 4.5A, tp = 8/20μs Any I/O to GN D 3.5 4.5 V ESD Clamping Voltage2 VC IPP = 16A, tlp = 0.2/100ns 5.5 V ESD Clamping Voltage2 VC IPP = -16A, tlp = 0.2/100ns 3 V Dynamic Resistance (Positive)2,3 RD tlp = 0.2/100ns 0.15 Ohms Dynamic Resistance (N egative)2,3 RD tlp = 0.2/100ns 0.14 Ohms Junction Capacitance Cj VR = 0V, f = 1MHz, Any I/O to GN D 0.60 0.65 pF VR = 0V, f = 1MHz, Between I/O pins 0.30 0.4 pF Notes 1)Measured with a 20dB attenuator, 50 Ohm scope input impedance, 2GHz bandwidth. ESD gun return path connected to ESD ground plane. 2)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns. 3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A © 2013 Semtech Corporation 2 www.semtech.com RClamp3346P PRELIMINARY PROTECTION PRODUCTS Typical Characteristics Junction Capacitance vs. Reverse Voltage (Between any I/O and Ground) 4.0 1.00 3.5 0.90 0.80 3.0 Capacitance - CJ (pF) Clamping Voltage - VC (V) Clamping Voltage vs. Peak Pulse Current (Between any I/O and Ground) 2.5 2.0 1.5 1.0 Waveform Parameters: tr = 8µs td = 20µs 0.5 0.70 0.60 0.50 0.40 0.30 0.20 f = 1 MHz T=25oC 0.10 0.00 0.0 0 1 2 3 4 0.0 5 0.5 1.0 ESD Clamping (+8kV Contact per IEC 61000-4-2) (Between any I/O and Ground) 70 3.0 3.5 10 0 -10 60 -20 Voltage (V) Voltage (V) 2.5 ESD Clamping (-8kV Contact per IEC 61000-4-2) (Between any I/O and Ground) Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane. 80 2.0 Reverse Voltage - VR (V) Peak Pulse Current - IPP (A) 90 1.5 50 40 30 -30 -40 -50 20 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane. -60 10 -70 0 -80 -10 -10 0 10 20 30 40 50 60 70 -10 80 0 10 20 30 TLP Characteristic (Positive) 50 60 70 80 TLP Characteristic (Negative) 30 0 Transmission Line Pulse Test (TLP) Settings: tp=100ns, tr=0.2ns, ITLP and VTLP averaging window: t1=70ns to t2=90ns 25 Transmission Line Pulse Test (TLP) Settings: tp=100ns, tr=0.2ns, ITLP and VTLP averaging window: t1=70ns to t2=90ns -5 -10 TLP Current (A) 20 TLP Current (A) 40 Time (ns) Time (ns) 15 10 5 -15 -20 -25 0 -30 0 2 4 6 8 10 -10 Clamping Voltage (V) © 2013 Semtech Corporation -8 -6 -4 -2 0 Clamping Voltage (V) 3 www.semtech.com RClamp3346P PRELIMINARY PROTECTION PRODUCTS Typical Characteristics (Con’t) Analog Crosstalk 0 0 -1 ‐10 -2 ‐20 -3 ‐30 Cross Talk (dB) Insertion Loss - (IL) dB Typical Insertion Loss S21 -4 -5 -6 -7 Pin 1 to Pin 7 ‐40 ‐50 Pin 4 to Pin 5 ‐60 Pin 5 to Pin 7 ‐70 -8 ‐80 -9 ‐90 -10 ‐100 0 1 10 1.00E+07 Frequency (GHz) © 2013 Semtech Corporation 1.00E+08 1.00E+09 1.00E+10 Frequency (Hz) 4 www.semtech.com RClamp3346P PRELIMINARY PROTECTION PRODUCTS Applications Information Protecting USB 3.0 Ports RClamp3346P is designed to protect all six USB 3.0 SuperSpeed and high speed differential lines. PCB traces enter and exit each I/O pin and ground is connected at pin 2. For best results, it is recommended that the ground connection be made using a filled via-in-pad. The via should be filled with a conductive paste. This technique saves board space and reduces parasitic inductance in the ground path. Figures 2 and 3 are examples of how to route high speed differential traces through the RClamp3346P. Differential impedance of each pair can easily be controlled for USB 3.0 (85 Ohms +/-15%). The RClamp3346P should be placed as close to the connector as possible for optimum ESD performance. Internal construction of the RClamp3346P has been optimized to minimize series inductance within the package. This helps to reduce the ESD peak clamping voltage. Dynamic resistance is extremely low (typically 0.15 Ohms) further reducing the ESD clamping voltage. Figure 1 - USB 3.0 Eye Diagram with RClamp3346P USB 3.0 - Type B Device Connector USB 3.0 - Type A Device Connector SSRX- SSTX- GND SSTX+ D+ D- SSRX+ GND GND GND SSRX- RClamp3346P SSTX- VBus D+ D- RClamp3346P SSRX+ uClamp0541T uClamp0541T Figure 2 - Example USB 3.0 Layout (Type B Device Connector) © 2013 Semtech Corporation SSTX+ VBus Figure 3 - Example USB 3.0 Layout (Type A Device Connector) 5 www.semtech.com RClamp3346P PRELIMINARY PROTECTION PRODUCTS Applications Information Assembly Guidelines The small size of this device means that some care must be taken during the mounting process to insure reliable solder joint. Semtech's recommended assembly guidelines for mounting this device are shown in the Table 1. Figure 4 details Semtech’s recommended aperture. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. Exact manufacturing parameters will require some experimentation to get the desired solder application. Assembly Parameter R ecommendation Solder Stencil Design Laser cut, Electro-polished Aper ture shape Rectangular with rounded corners Solder Stencil Thickness 0.100 mm (0.004") Solder Paste Type Type 4 size sphere or smaller Solder Reflow Profile Per JEDEC J-STD-020 PCB Solder Pad Design N on-Solder mask defined PCB Pad Finish OSP OR N iAu Table 1 - Recommended Assembly Parameters 0.200 0.400 0.025 0.700 0.800 0.350 0.025 0.200 2.700 All Dimensions are in mm. Land Pad. Stencil opening Component Figure 4 - Recommended Mounting Pattern © 2013 Semtech Corporation 6 www.semtech.com RClamp3346P PRELIMINARY PROTECTION PRODUCTS Outline OutlineDrawing Drawing- -SO-8 SGP2708N7 D A DIMENSIONS MILLIMETERS MIN NOM MAX B PIN 1 INDICATOR (LASER MARK) DIM A A1 b D E e L N aaa bbb E 0.47 0.50 0.53 0.00 0.03 0.05 0.15 0.20 0.25 2.65 2.70 2.775 0.75 0.80 0.875 0.80 BSC 0.30 0.35 0.40 7 0.08 0.10 SEATING PLANE C e e/2 LxN E/2 (0.025-0.075) D/2 bxN bbb C A B NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES ). Land Pattern - SGP2708N7 DIMENSIONS Z 0.625 Y P/2 DIM P X Y Z MILLIMETERS 0.80 0.20 0.65 1.25 X P NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES ). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY . CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET . © 2013 Semtech Corporation 7 www.semtech.com RClamp3346P PRELIMINARY PROTECTION PRODUCTS Marking Code PIN1 INDICAT OR Ordering Information 3346P YYWW Part Number Qty per Reel Reel Size RClamp3346P.TN T 10,000 7 Inch RailClamp and RClamp are trademarks of Semtech Corporation. YYWW = Date Code Carrier Tape Specification Y YWW 3346 P Y YWW 3346 P Y YWW 3346 P Y YWW 3346 P Y YWW 3346 P Y YWW 3346 P Pin 1 Location (Towards Sprocket Holes ) User Direction of feed Device Orientation in Tape © 2013 Semtech Corporation 8 www.semtech.com RClamp3346P PRELIMINARY PROTECTION PRODUCTS Contact Information Semtech Corporation Protection Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 © 2013 Semtech Corporation 9 www.semtech.com