uClamp0511Z

uClamp0511Z
Ultra Small μClamp®
1-Line ESD protection
PROTECTION PRODUCTS - Z-PakTM
Description
Features
μClamp TVS diodes are designed to protect sensitive
electronics from damage or latch-up due to ESD. It is
designed to replace 0201 size multilayer varistors (MLVs)
in portable applications such as cell phones, notebook
computers, and other portable electronics. It features
large cross-sectional area junctions for conducting high
transient currents. This device offers desirable characteristics for board level protection including fast response
time, low operating and clamping voltage, and no device
degradation.
The μClamp®0511Z is in a 2-pin SLP0603P2X3 package. It measures 0.6 x 0.3 mm with a nominal height
of only 0.25mm. The leads are finished with lead-free
NiAu. Each device will protect one line operating at 5
volts. It gives the designer the flexibility to protect
single lines in applications where arrays are not practical. The combination of small size and high ESD surge
capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and
MP3 players.
®
‹ High ESD withstand Voltage: ±15kV (air), ±8kV
(contact) per IEC 61000-4-2
‹ Able to withstand over 1000 ESD strikes per IEC
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61000-4-2 Level 4
1 pack
age
Ultra-small 020
0201
package
Protects one data or power line
Low reverse current: <10nA typical (VR=5V)
Working voltage: +/- 5V
Low capacitance: 4pF typical
Solid-state silicon-avalanche technology
Mechanical Characteristics
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SLP0603P2X3 package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 0.6 x 0.3 x 0.25 mm
Lead Finish: NiAu
Molding compound flammability rating: UL 94V-0
Marking : Marking code + dot matrix date code
Packaging : Tape and Reel
Applications
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Dimensions
Cellular Handsets & Accessories
Keypads, Side Keys, Audio Ports
Portable Instrumentation
Digital Lines
MP3 Players
Schematic & PIN Configuration
0.62
0.22
1
0.32
0.16
0.355 BSC
2
0.25
Nominal Dimensions (mm)
Revision 11/3/2010
SLP0603P2X3 (Bottom View)
1
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uClamp0511Z
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
ESD p er IEC 61000-4-2 (Air)
ESD p er IEC 61000-4-2 (Contact)
Op erating Temp erature
Storage Temp erature
Symbol
Value
Units
VESD
+/- 15
+/- 8
kV
TJ
-55 to +125
°C
TSTG
-55 to +150
°C
Electrical Characteristics (T=25oC)
Parameter
Symbol
Conditions
Reverse Stand-Off Voltage
VRWM
Pin 1to 2 or 2 to 1
Reverse Breakdown Voltage
V BR
It = 1mA
Pin 1 to 2 or 2 to 1
Reverse Leakage Current
IR
VRWM = 5V, T=25°C
Pin 1 to 2 or 2 to 1
Clamp ing Voltage
VC
IPP = 1A, tp = 8/20μs
Pin 1 to 2 or 2 to 1
Junction Cap acitance
Cj
VR = 0V, f = 1MHz
Minimum
6
Typical
Maximum
Units
5
V
8.2
9.5
V
3
50
nA
15
V
7
pF
4
Note: Device is electrically symmetrical
© 2010 Semtech Corp.
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uClamp0511Z
PROTECTION PRODUCTS
Non-Repetitive Peak Pulse Power vs. Pulse Time
Clamping Voltage vs. Peak Pulse Current
16.0
10
Clamping Voltage - VC (V)
Peak Pulse Power - PPP (kW)
14.0
1
0.1
12.0
10.0
8.0
6.0
Waveform
Parameters:
tr = 8μs
td = 20μs
4.0
2.0
0.0
0.01
0.1
1
10
0
100
0.2
0.4
Pulse Duration - tp (us)
0.6
0.8
1
Peak Pulse Current - IPP (A)
Typical Insertion Loss (S21)
Normalized Junction Capacitance vs. Reverse Voltage
CH1 S21
LOG
6 dB / REF 0 dB
1.6
1: -1.4102 dB
800 MHz
f = 1 MHz
1.4
Cj(VR) / Cj(VR=0V)
1.2
1.2
0 dB
1
-6 dB
0.8
-12 dB
2: -1.6058 dB
900 MHz
5
12
3
4
3: -4.2613 dB
1.8 GHz
4: -6.1403 dB
2.5 GHz
-18 dB
0.6
-24 dB
0.4
-30 dB
0.2
-36 dB
0
0
1
2
3
4
Reverse Voltage - VR (V)
5
6
1
MHz
10
MHz
100
MHz
START . 030 MHz
ESD Clamping
(+8kV Contact per IEC 61000-4-2)
STOP 3000. 000000 MHz
ESD Clamping
(-8kV Contact per IEC 61000-4-2)
Note: Data is taken with a 10x attenuator
© 2010 Semtech Corp.
3
1
GHz GHz
Note: Data is taken with a 10x attenuator
3
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uClamp0511Z
PROTECTION PRODUCTS
Applications Information
Device Connection Options
Circuit Diagram
This device is designed to protect one data,
I/O, or power supply line. The device is bidirectional
and may be used on lines where the signal polarity can
go above and below ground.
Assembly Guidelines
The small size of this device means that some care
must be taken during the mounting process to insure
reliable solder joint. The table below provides
Semtech's recommended assembly guidelines for
mounting this device. The figure at the right details
Semtech’s recommended aperture based on the
below recommendations. Note that these are only
recommendations and should serve only as a starting
point for design since there are many factors that
affect the assembly process. The exact manufacturing parameters will require some experimentation to
get the desired solder application.
Assembly Parameter
Laser cut, Electro-polished
Aper ture shape
Rectangular with rounded
corners
Solder Paste Type
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
Stencil Aperture
R ecommendation
Solder Stencil Design
Solder Stencil Thickness
Recommended Mounting Pattern
Mounting Pad
Package
0.175
0.100 mm (0.004")
Type 4 size sphere or smaller
0.272
Per JEDEC J-STD-020
0.250
N on-Solder mask defined
0.298
OSP OR N iAu
0.270
© 2010 Semtech Corp.
4
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uClamp0511Z
PROTECTION PRODUCTS
Outline Drawing - SLP0603P2X3
A
D
B
DIM
A
A1
b
D
E
e
L
N
aaa
bbb
E
TOP VIEW
DIMENSIONS
MILLIMETERS
MIN NOM MAX
0.235 0.25 0.265
0.00
0.02 0.025
0.20
0.22 0.24
0.585 0.62 0.655
0.32
0.285
0.355
0.355 BSC
0.16 0.18
0.14
2
0.08
0.10
A
SEATING
PLANE
aaa C
C
A1
bbb
bxN
C A B
2xL
e
BOTTOM VIEW
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
Land Pattern - SLP0603P2X3
DIMENSIONS
(C)
Z
G
DIM
C
G
X
Y
Z
MILLIMETERS
(0.425)
0.175
0.270
0.250
0.675
Y
X
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
© 2010 Semtech Corp.
5
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uClamp0511Z
PROTECTION PRODUCTS
Marking Code
Ordering Information
A
Part Number
Qty per
Reel
Reel
Size
uClamp 0511Z.TN T
10,000
7 Inch
Notes:
MicroClamp, uClamp and μClamp are trademarks of Semtech
Corporation
Notes:
1)Dots represent date code matrix
Carrier Tape Specification
Bo
Max
Ko
Ao
Device Orientation in Tape
A
Note: All dimensions in mm unless otherwise specified
A
0.29 +/-0.05 mm
A
0.71 +/-0.05 mm
K0
A
0.40 +/-0.05 mm
B0
A
A0
Date Code Location
(Away from Sprocket Holes)
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
© 2010 Semtech Corp.
6
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uClamp0511Z
PROTECTION PRODUCTS
Contact Information for Semtech International AG
Taiw an Branch
Tel: 886-2-2748-3380
Fax: 886-2-2748-3390
Semtech Sw itz erland GmbH
Japan Branch
Tel: 81-3-6408-0950
Fax: 81-3-6408-0951
Tel: 82-2-527-4377
Fax: 82-2-527-4376
Semtech Limited (U.K.)
Tel: 44-1794-527-600
Fax: 44-1794-527-601
Tel: 86-21-6391-0830
Fax: 86-21-6391-0831
Semtech France SARL
Tel: 33-(0)169-28-22-00
Fax: 33-(0)169-28-12-98
Semtech International AG is a wholly-owned subsidiary of
Semtech Corporation, which has its headquarters in the U.S.A.
Semtech Germany GmbH
Tel: 49-(0)8161-140-123
Fax: 49-(0)8161-140-124
© 2010 Semtech Corp.
7
Korea Branch
Shanghai Office
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