uClamp0511Z Ultra Small μClamp® 1-Line ESD protection PROTECTION PRODUCTS - Z-PakTM Description Features μClamp TVS diodes are designed to protect sensitive electronics from damage or latch-up due to ESD. It is designed to replace 0201 size multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and other portable electronics. It features large cross-sectional area junctions for conducting high transient currents. This device offers desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. The μClamp®0511Z is in a 2-pin SLP0603P2X3 package. It measures 0.6 x 0.3 mm with a nominal height of only 0.25mm. The leads are finished with lead-free NiAu. Each device will protect one line operating at 5 volts. It gives the designer the flexibility to protect single lines in applications where arrays are not practical. The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and MP3 players. ® High ESD withstand Voltage: ±15kV (air), ±8kV (contact) per IEC 61000-4-2 Able to withstand over 1000 ESD strikes per IEC 61000-4-2 Level 4 1 pack age Ultra-small 020 0201 package Protects one data or power line Low reverse current: <10nA typical (VR=5V) Working voltage: +/- 5V Low capacitance: 4pF typical Solid-state silicon-avalanche technology Mechanical Characteristics SLP0603P2X3 package Pb-Free, Halogen Free, RoHS/WEEE Compliant Nominal Dimensions: 0.6 x 0.3 x 0.25 mm Lead Finish: NiAu Molding compound flammability rating: UL 94V-0 Marking : Marking code + dot matrix date code Packaging : Tape and Reel Applications Dimensions Cellular Handsets & Accessories Keypads, Side Keys, Audio Ports Portable Instrumentation Digital Lines MP3 Players Schematic & PIN Configuration 0.62 0.22 1 0.32 0.16 0.355 BSC 2 0.25 Nominal Dimensions (mm) Revision 11/3/2010 SLP0603P2X3 (Bottom View) 1 www.semtech.com uClamp0511Z PROTECTION PRODUCTS Absolute Maximum Rating R ating ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) Op erating Temp erature Storage Temp erature Symbol Value Units VESD +/- 15 +/- 8 kV TJ -55 to +125 °C TSTG -55 to +150 °C Electrical Characteristics (T=25oC) Parameter Symbol Conditions Reverse Stand-Off Voltage VRWM Pin 1to 2 or 2 to 1 Reverse Breakdown Voltage V BR It = 1mA Pin 1 to 2 or 2 to 1 Reverse Leakage Current IR VRWM = 5V, T=25°C Pin 1 to 2 or 2 to 1 Clamp ing Voltage VC IPP = 1A, tp = 8/20μs Pin 1 to 2 or 2 to 1 Junction Cap acitance Cj VR = 0V, f = 1MHz Minimum 6 Typical Maximum Units 5 V 8.2 9.5 V 3 50 nA 15 V 7 pF 4 Note: Device is electrically symmetrical © 2010 Semtech Corp. 2 www.semtech.com uClamp0511Z PROTECTION PRODUCTS Non-Repetitive Peak Pulse Power vs. Pulse Time Clamping Voltage vs. Peak Pulse Current 16.0 10 Clamping Voltage - VC (V) Peak Pulse Power - PPP (kW) 14.0 1 0.1 12.0 10.0 8.0 6.0 Waveform Parameters: tr = 8μs td = 20μs 4.0 2.0 0.0 0.01 0.1 1 10 0 100 0.2 0.4 Pulse Duration - tp (us) 0.6 0.8 1 Peak Pulse Current - IPP (A) Typical Insertion Loss (S21) Normalized Junction Capacitance vs. Reverse Voltage CH1 S21 LOG 6 dB / REF 0 dB 1.6 1: -1.4102 dB 800 MHz f = 1 MHz 1.4 Cj(VR) / Cj(VR=0V) 1.2 1.2 0 dB 1 -6 dB 0.8 -12 dB 2: -1.6058 dB 900 MHz 5 12 3 4 3: -4.2613 dB 1.8 GHz 4: -6.1403 dB 2.5 GHz -18 dB 0.6 -24 dB 0.4 -30 dB 0.2 -36 dB 0 0 1 2 3 4 Reverse Voltage - VR (V) 5 6 1 MHz 10 MHz 100 MHz START . 030 MHz ESD Clamping (+8kV Contact per IEC 61000-4-2) STOP 3000. 000000 MHz ESD Clamping (-8kV Contact per IEC 61000-4-2) Note: Data is taken with a 10x attenuator © 2010 Semtech Corp. 3 1 GHz GHz Note: Data is taken with a 10x attenuator 3 www.semtech.com uClamp0511Z PROTECTION PRODUCTS Applications Information Device Connection Options Circuit Diagram This device is designed to protect one data, I/O, or power supply line. The device is bidirectional and may be used on lines where the signal polarity can go above and below ground. Assembly Guidelines The small size of this device means that some care must be taken during the mounting process to insure reliable solder joint. The table below provides Semtech's recommended assembly guidelines for mounting this device. The figure at the right details Semtech’s recommended aperture based on the below recommendations. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. The exact manufacturing parameters will require some experimentation to get the desired solder application. Assembly Parameter Laser cut, Electro-polished Aper ture shape Rectangular with rounded corners Solder Paste Type Solder Reflow Profile PCB Solder Pad Design PCB Pad Finish Stencil Aperture R ecommendation Solder Stencil Design Solder Stencil Thickness Recommended Mounting Pattern Mounting Pad Package 0.175 0.100 mm (0.004") Type 4 size sphere or smaller 0.272 Per JEDEC J-STD-020 0.250 N on-Solder mask defined 0.298 OSP OR N iAu 0.270 © 2010 Semtech Corp. 4 www.semtech.com uClamp0511Z PROTECTION PRODUCTS Outline Drawing - SLP0603P2X3 A D B DIM A A1 b D E e L N aaa bbb E TOP VIEW DIMENSIONS MILLIMETERS MIN NOM MAX 0.235 0.25 0.265 0.00 0.02 0.025 0.20 0.22 0.24 0.585 0.62 0.655 0.32 0.285 0.355 0.355 BSC 0.16 0.18 0.14 2 0.08 0.10 A SEATING PLANE aaa C C A1 bbb bxN C A B 2xL e BOTTOM VIEW NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP0603P2X3 DIMENSIONS (C) Z G DIM C G X Y Z MILLIMETERS (0.425) 0.175 0.270 0.250 0.675 Y X NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. © 2010 Semtech Corp. 5 www.semtech.com uClamp0511Z PROTECTION PRODUCTS Marking Code Ordering Information A Part Number Qty per Reel Reel Size uClamp 0511Z.TN T 10,000 7 Inch Notes: MicroClamp, uClamp and μClamp are trademarks of Semtech Corporation Notes: 1)Dots represent date code matrix Carrier Tape Specification Bo Max Ko Ao Device Orientation in Tape A Note: All dimensions in mm unless otherwise specified A 0.29 +/-0.05 mm A 0.71 +/-0.05 mm K0 A 0.40 +/-0.05 mm B0 A A0 Date Code Location (Away from Sprocket Holes) Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 © 2010 Semtech Corp. 6 www.semtech.com uClamp0511Z PROTECTION PRODUCTS Contact Information for Semtech International AG Taiw an Branch Tel: 886-2-2748-3380 Fax: 886-2-2748-3390 Semtech Sw itz erland GmbH Japan Branch Tel: 81-3-6408-0950 Fax: 81-3-6408-0951 Tel: 82-2-527-4377 Fax: 82-2-527-4376 Semtech Limited (U.K.) Tel: 44-1794-527-600 Fax: 44-1794-527-601 Tel: 86-21-6391-0830 Fax: 86-21-6391-0831 Semtech France SARL Tel: 33-(0)169-28-22-00 Fax: 33-(0)169-28-12-98 Semtech International AG is a wholly-owned subsidiary of Semtech Corporation, which has its headquarters in the U.S.A. Semtech Germany GmbH Tel: 49-(0)8161-140-123 Fax: 49-(0)8161-140-124 © 2010 Semtech Corp. 7 Korea Branch Shanghai Office www.semtech.com