RClamp3331Y Ultra Small RailClamp® 1-Line, 3.3V ESD Protection PROTECTION PRODUCTS - RailClamp® Description Features High ESD withstand Voltage: +/-18kV (Contact/Air) RailClamp TVS diodes are ultra low capacitance devices designed to protect sensitive electronics from damage or latch-up due to ESD, EFT, and EOS. They are designed for use on high speed ports in applications such as cell phones, notebook computers, and other portable electronics. These devices offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. RClamp®3331Y features extremely good ESD protection characteristics including a low typical dynamic resistance of 0.27 Ohms, low peak ESD clamping voltage, and high ESD withstand voltage (+/-18kV contact per IEC 610004-2). Low typical capacitance (0.35pF at VR=0V) allows the RClamp3331Z to be used in applications operating in excess of 5GHz without appreciable signal attenuation. Each device will protect one high speed data line operating at 3.3 Volts. RClamp3331Y is in a 2-pin SLP0603P2X3E package measuring 0.6 x 0.3 mm with a nominal height of 0.25mm. Leads are finished with lead-free NiAu. The small package gives the designer the flexibility to protect single lines in applications where arrays are not practical. The combination of low peak ESD clamping, low dynamic resistance, and low capacitance makes this device suitable for applications such as USB 3.0, MIPI and V-By-One interfaces in portable devices. ® per IEC 61000-4-2 Able to withstand over 1000 ESD strikes per IEC 61000-4-2 Level 4 1 pack age Ultra-small 020 0201 package Protects one high speed data line Working voltage: +/- 3.3V Low capacitance: 0.35pF typical Extremely low dynamic resistance: 0.27 Ohms (Typ) Low ESD clamping voltage Solid-state silicon-avalanche technology Mechanical Characteristics SLP0603P2X3E Package Pb-Free, Halogen Free, RoHS/WEEE Compliant Nominal Dimensions: 0.6 x 0.3 x 0.25 mm Lead Finish: NiAu Marking: Marking Code Packaging: Tape and Reel Applications Nominal Dimensions USB 2.0 / USB 3.0 MIPI / MDDI V-By-One eDP MHL LVDS Schematic 0.600 0.220 1 0.300 0.160 0.355 BSC 2 0.250 SLP0603P2X3E (Bottom View) Nominal Dimensions (in mm) Revision 10/22/2013 1 www.semtech.com RClamp3331Y PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20μs) Pp k 30 Watts Maximum Peak Pulse Current (tp = 8/20μs) Ip p 4 Amps VESD +/- 18 +/- 18 kV TJ -40 to +85 °C TSTG -55 to +150 °C ESD per IEC 61000-4-2 (Air)1 ESD per IEC 61000-4-2 (Contact)1 Operating Temperature Storage Temperature Electrical Characteristics (T=25oC) Parameter Symbol Conditions Reverse Stand-Off Voltage VRWM Pin 1 to 2 or 2 to 1 Holding Voltage VHOLD IHOLD = 50mA Pin 1 to 2 or 2 to 1 Reverse Leakage Current IR Clamping Voltage Maximum Units 3.3 V 2.8 4.4 V VRWM = 3.3V, T=25°C Pin 1 to 2 or 2 to 1 <1 50 nA VC IPP = 1A, tp = 8/20μs Pin 1 to 2 or 2 to 1 3.8 5.5 V Clamping Voltage VC IPP = 4A, tp = 8/20μs Pin 1 to 2 or 2 to 1 5.5 7.5 V ESD Clamping Voltage2 VC IPP = 4A, tlp = 0.2/100ns 5 V ESD Clamping Voltage2 VC IPP = 16A, tlp = 0.2/100ns 8.3 V V T R IG tp = 0.2/100ns 8.8 V Dynamic Resistance2, 3 RD tp = 0.2/100ns 0.27 Ohms Junction Capacitance Cj VR = 0V, f = 1MHz 0.35 Trigger Voltage2 Minimum 1.2 Typical 0.45 pF Notes 1)ESD gun return path connected to ESD ground reference plane. 2)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns. 3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A © 2013 Semtech Corporation 2 www.semtech.com RClamp3331Y PROTECTION PRODUCTS Typical Characteristics Clamping Voltage vs. Peak Pulse Current (tp=8/20us) Non-Repetitive Peak Pulse Power vs. Pulse Time 6 1000 TA = 25OC Waveform: tp = 8x20us Peak Clamping Voltage - VC (V) Peak Pulse Power - PPP (W) TA = 25OC 100 10 5 4 3 2 1 DR040412-30 1 0 0.1 1 10 0 100 0.5 1 Pulse Duration - tp (µs) TLP Characteristic (Positive) 4 4.5 0 Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns 25 Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns ‐5 TLP Current (A) 20 15 10 5 ‐10 ‐15 ‐20 ‐25 0 ‐30 0 2 4 6 8 10 12 ‐14 14 ‐12 ‐10 ESD Clamping (+8kV Contact per IEC 61000-4-2) 70 ‐6 ‐4 ‐2 0 ESD Clamping (-8kV Contact per IEC 61000-4-2) 10 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane. 60 ‐8 Clamping Voltage (V) Clamping Voltage (V) 0 50 Clamping Voltage - VC (V) Clamping Voltage - VC (V) 3.5 TLP Characteristic (Negative) 30 TLP Current (A) 1.5 2 2.5 3 Peak Pulse Current - IPP (A) 40 30 20 10 ‐10 ‐20 ‐30 ‐40 ‐50 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane. ‐60 0 ‐70 ‐10 ‐10 0 10 20 30 40 50 60 70 80 ‐10 90 © 2013 Semtech Corporation 0 10 20 30 40 50 60 70 80 90 Time (ns) Time (ns) 3 www.semtech.com RClamp3331Y PROTECTION PRODUCTS Typical Characteristics Junction Capacitance vs. Reverse Voltage Junction Capacitance vs. Temperature 0.5 1.0 f = 1MHz 0.9 0.8 Junction Capacitance - CJ (pF) Junction Capacitance - CJ (pF) 0.4 0.3 0.2 0.1 f = 1MHz 0.0 0.7 VR = 3.3V 0.6 0.5 0.4 VR = 0V 0.3 0.2 0.1 0.0 0 0.5 1 1.5 2 2.5 3 ‐75 3.5 ‐50 ‐25 0 25 50 75 100 Temperature (OC) Voltage (V) Typical Insertion Loss S21 0.0 ‐0.5 Loss (dB) ‐1.0 ‐1.5 ‐2.0 ‐2.5 ‐3.0 ‐3.5 ‐4.0 0.01 0.1 1 10 Frequency (GHz) © 2013 Semtech Corporation 4 www.semtech.com RClamp3331Y PROTECTION PRODUCTS Applications Information Assembly Guidelines The small size of this device means that some care must be taken during the mounting process to insure reliable solder joints. The figure at the right details Semtech’s recommended aperture based on the assembly guidelines detailed in the table below. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. Exact manufacturing parameters will require some experimentation to get the desired solder application. 0.273 0.205 0.220 Assembly Parameter R ecommendation Solder Stencil Design Laser cut, Electro-polished Aper ture shape Rectangular with rounded corners Solder Stencil Thickness 0.320 Land Pad Stencil opening 0.100 mm (0.004") Component Solder Paste Type Solder Reflow Profile PCB Solder Pad Design PCB Pad Finish © 2013 Semtech Corporation Type 4 size sphere or smaller Recommended Mounting Pattern Per JEDEC J-STD-020 N on-Solder mask defined OSP OR N iAu 5 www.semtech.com RClamp3331Y PROTECTION PRODUCTS Outline Drawing - SLP0603P2X3E A B D DIM A A1 b D E e L N aaa bbb E TOP VIEW DIMENSIONS MILLIMETERS MIN NOM MAX 0.235 0.250 0.265 0.000 0.010 0.050 0.200 0.220 0.240 0.580 0.600 0.620 0.280 0.300 0.320 0.355 BSC 0.140 0.160 0.180 2 0.08 0.10 A SEATING PLANE aaa C C A1 e/2 R0.025 TYP bxN C A B bbb 2X L e BOTTOM VIEW NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS(ANGLES IN DEGREES). Land Pattern - SLP0603P2X3E DIMENSIONS (C) Z G DIM C G X Y Z MILLIMETERS (0.385) 0.181 0.273 0.205 0.590 Y X NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES ). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY . CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY 'S MANUFACTURING GUIDELINES ARE MET . © 2013 Semtech Corporation 6 www.semtech.com RClamp3331Y PROTECTION PRODUCTS Marking Code Ordering Information m Part Number Qty per Reel Pocket Pitch Reel Size RClamp3331Y.TFT 15,000 2mm 7 Inch Notes: RailClamp and RClamp are trademarks of Semtech Corporation Note: Device is electrically symmetrical Carrier Tape Specification m m m Device Orientation in Tape © 2013 Semtech Corporation 7 www.semtech.com RClamp3331Y PROTECTION PRODUCTS Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 © 2013 Semtech Corporation 8 www.semtech.com