RClamp3552T

RClamp3552T
Low Voltage RailClamp®
2-Line ESD Protection
PROTECTION PRODUCTS - RailClamp®
Description
Features
RClamp 3552T is a low voltage RailClamp which can
provide ESD protection to IEC 61000-4-2 on highspeed ports. It is manufactured using Semtech's
proprietary low voltage technology, designed to minimize both the ESD peak clamping and TLP clamping
voltage. These devices “snap-back” to a low on-state
voltage when the breakdown voltage of the device is
exceeded. This has the advantage of lowering the
overall ESD clamping voltage. When the device is in
the on-state, the dynamic resistance is typically 0.30
Ohms, further minimizing the ESD clamping. Maximum
capacitance is only 0.40pF allowing the RClamp3552T
to be used in applications operating in excess of 6GHz
without appreciable signal attenuation. Each device
will protect two lines operating at 3.5 volts.
RClamp3552T is in a 3-pin SLP1006N3T package. It
measures 1.0 x 0.6 mm with a nominal height of only
0.4mm. The leads are finished with lead-free NiPdAu.
The combination of low peak ESD clamping, low dynamic
resistance, and low capacitance makes this device suitable for applications such as USB 3.0, LVDS, audio, and
V-By-One interfaces.
®
 High ESD withstand Voltage: +/-17kV (Contact),
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+/-20kV (Air) per IEC 61000-4-2
Very small PCB area: 0.6mm2
Protects up to two data lines
Low capacitance: 0.40pF Maximum
Dynamic Resistance: 0.30 Ohms Typical
Low ESD clamping voltage
Operating voltage: 3.5V
Qualified to AEC-Q100
Solid-state silicon-avalanche technology
Mechanical Characteristics
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SLP1006N3T package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 1.0 x 0.6 x 0.40 mm
Lead Finish: NiPdAu
Molding compound flammability rating: UL 94V-0
Marking : Marking code + dot matrix date code
Packaging : Tape and Reel
Applications
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Dimensions
USB 3.0
V-By-One
LVDS
MIPI/MDDI
MyDP
Audio Ports
Schematic & PIN Configuration
1
1.00
0.68
1
2
2
0.60
0.40
3
Nominal Dimensions (mm)
Revision 04/09/2014
2-Line, Bidirectional
1
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RClamp3552T
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Symbol
Value
Units
Peak Pulse Current (tp = 8/20μs)
IP P
4
A
ESD per IEC 61000-4-2 (Air)1
ESD per IEC 61000-4-2 (Contact)1
VESD
+/- 20
+/- 17
kV
TJ
-40 to +125
°C
TSTG
-55 to +150
°C
Operating Temperature
Storage Temperature
Electrical Characteristics (T=25oC Unless Otherwise Specified)
Parameter
Symbol
Conditions
Reverse Stand-Off Voltage
VRWM
Any I/O to GN D
Breakdown Voltage
V BR
IBR = 10μA
Reverse Leakage Current
IR
Clamping Voltage
Minimum
Maximum
Units
3.5
V
8.8
9.8
V
VRWM = 3.5V, T=25oC
Any I/O to GN D
0.01
0.05
μA
VC
IPP = 1A, tp = 8/20μs
Any I/O to GN D
3.5
5
V
Clamping Voltage
VC
IPP = 4A, tp = 8/20μs
Any I/O to GN D
5
6.5
V
ESD Clamping Voltage2
VC
IPP = 16A,
tlp = 0.2/100ns
9.5
V
ESD Clamping Voltage2
VC
IPP = -16A,
tlp = 0.2/100ns
9.5
V
Dynamic Resistance (Positive)2,3
RD
tlp = 0.2/100ns
0.30
Ohms
Dynamic Resistance
(N egative)2,3
RD
tlp = 0.2/100ns
0.30
Ohms
Junction Capacitance
Cj
VR = 0V, f = 1MHz,
Any I/O to GN D
0.30
7.5
Typical
0.40
pF
Notes
1)Measured with a 20dB attenuator, 50 Ohm scope input impedance, 2GHz bandwidth. ESD gun return path connected to ESD
ground plane.
2)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns.
Parameters guaranteed by design.
3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A
© 2014 Semtech Corporation
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RClamp3552T
PROTECTION PRODUCTS
Typical Characteristics
Junction Capacitance vs. Reverse Voltage
(Between any I/O and Ground)
7.0
0.60
6.0
0.50
Capacitance - CJ (pF)
Clamping Voltage - VC (V)
Clamping Voltage vs. Peak Pulse Current
(Between any I/O and Ground)
5.0
4.0
3.0
2.0
Waveform
Parameters:
tr = 8µs
td = 20µs
1.0
0.40
0.30
0.20
0.10
0.0
f = 1 MHz
T=25oC
0.00
0.0
1.0
2.0
3.0
4.0
5.0
0.0
1.0
2.0
Peak Pulse Current - IPP (A)
ESD Clamping (+8kV Contact per IEC 61000-4-2)
(Between any I/O and Ground)
10
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
0
-10
Clamping Voltage - VC (V)
Clamping Voltage - VC (V)
60
50
40
30
20
10
-20
-30
-40
-50
-60
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
-70
0
-80
-10
-10
0
10
20
30
40
50
60
70
80
-10
90
0
10
20
Time (ns)
TLP Characteristic (Positive)
30
40
50
Time (ns)
60
70
80
90
TLP Characteristic (Negative)
5
30
Transmission Line Pulse Test (TLP)
Settings:
tp =100ns, tr=0.2ns,
ITLP and VTLP averaging window:
t1 =70ns to t 2=90ns
25
Transmission Line Pulse Test (TLP)
Settings:
tp =100ns, tr=0.2ns,
ITLP and VTLP averaging window:
t1 =70ns to t 2=90ns
0
-5
TLP Current (A)
20
TLP Current (A)
4.0
ESD Clamping (-8kV Contact per IEC 61000-4-2)
(Between any I/O and Ground)
80
70
3.0
Reverse Voltage - VR (V)
15
10
5
-10
-15
-20
-25
0
-30
-5
0
5
10
15
-20
20
Clamping Voltage (V)
© 2014 Semtech Corporation
-15
-10
-5
0
Clamping Voltage (V)
3
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RClamp3552T
PROTECTION PRODUCTS
Typical Characteristics
Typical Insertion Loss S21
Analog Crosstalk
0
0
‐10
‐20
‐30
-2
Cross Talk (dB)
Insertion Loss (dB)
-1
-3
-4
‐40
‐50
‐60
‐70
‐80
-5
‐90
-6
0.01
0.1
© 2014 Semtech Corporation
1
Frequency (GHz)
‐100
1.00E+07
10
4
1.00E+08
Frequency (Hz)
1.00E+09
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RClamp3552T
PROTECTION PRODUCTS
Applications Information
Device Operation
This device utilizes a multi-junction structure that is
designed to switch to a low voltage state when triggered by ESD, EOS, or other transient events. During
normal operation, the device will present a highimpedance to the circuit for voltage up to the working
voltage (VRWM) of the device. When the voltage across
the device terminals exceeds the breakdown voltage
(VBR), avalanche breakdown occurs in the blocking
junction causing the device to "snap-back" or switch to
a low impedance on-state. This has the advantage of
lowering the overall clamping voltage (VC) as ESD peak
pulse current (IPP) flows through the device. Once the
current subsides, the device will return to a highimpedance off-state. Since this device is bidirectional,
it will behave the same way for positive or negative
polarity transient events.
IPP
Symbol
Parameter
VRWM
Maximum Working Voltage
V T R IG
Trigger Voltage
VC
Clamping Voltage
IR
Reverse Leakage Current
IP P
Peak Pulse Current
“Snap‐Back”
IR
VC
VRWM
VTRIG
Characteristic Curve
© 2014 Semtech Corporation
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RClamp3552T
PROTECTION PRODUCTS
Applications Information
Device Connection Options
Example Pin Configuration
RClamp3552T is designed to protect two data lines
operating up to 3.5 volts. The device is bidirectional
and may be used on lines where the signal polarity is
above and below ground. The diagram at the right
shows an example pin configuration with pin 3
connected to ground. However, due to the device
symmetry, any pin may be connected to ground with
the remaining pins connected to the protected lines.
I/O 1 1
GND
I/O 2
Assembly Guidelines
The small size of this device means that some care
must be taken during the mounting process to insure
reliable solder joint. The table below provides
Semtech's recommended assembly guidelines for
mounting this device. The figure at the right details
Semtech’s recommended aperture based on the
below recommendations. Note that these are only
recommendations and should serve only as a starting
point for design since there are many factors that
affect the assembly process. Exact manufacturing
parameters will require some experimentation to get
the desired solder application.
Recommended Mounting Pattern
Stencil Opening (220x460 mm)
Land Pad (200x400 mm)
Assembly Parameter
Solder Stencil Design
Aper ture shape
R ecommendation
Laser cut, Electro-polished
Rectangular
.850
Solder Stencil Thickness
Solder Paste Type
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
0.100 mm (0.004")
Type 4 size sphere or smaller
Per JEDEC J-STD-020
N on-Solder mask defined
1.000
OSP OR N iAu
All Dimensions are in mm.
Land Pad.
© 2014 Semtech Corporation
6
Stencil opening
Component
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RClamp3552T
PROTECTION PRODUCTS
Outline Drawing - SLP1006N3T
A
D
DIMENSIONS
MILLIMETERS
MIN NOM MAX
B
PIN 1
INDICATOR
(LASER MARK)
DIM
E
A
SEATING
PLANE
aaa C
C
A1
A2
e
A
A1
A2
b
b1
D
E
e
L
N
aaa
bbb
0.37 0.40 0.43
0.00 0.02 0.05
(0.13)
0.145 0.17 0.195
0.175 0.20 0.225
0.90 1.00 1.10
0.50 0.60 0.70
0.68 BSC
0.225 0.25 0.275
3
0.08
0.10
R0.05
e/2
1
2
LxN
E/2
N
bbb
b1xN
C A B
bxN
bbb
C A B
D/2
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
Land Pattern - SLP1006N3T
X
DIMENSIONS
(C)
DIM
C
G
P
X
Y
Z
Z
Y
G
P/2
MILLIMETERS
(0.45)
0.05
0.68
0.20
0.40
0.85
P
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
© 2014 Semtech Corporation
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RClamp3552T
PROTECTION PRODUCTS
Marking Code
Ordering Information
35
Part Number
Qty per
Reel
Reel
Size
RClamp3552T.TN T
10,000
7 Inch
Notes:
RailClamp and RClamp are trademarks of Semtech Corporation
Notes:
Marking will also include line matrix date code
Carrier Tape Specification
Bo
Ao
Ko
Device Orientation in Tape
A0
0.70 +/-0.05 mm
B0
1.15 +/-0.05 mm
K0
0.55 +/-0.05 mm
35
35
35
35
35
Note: All dimensions in mm unless otherwise specified
Pin 1 Location
(Towards Sprocket Holes)
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
© 2014 Semtech Corporation
8
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