Screening Guide HRP 107: Screening Guide for Over-molded Die The following screening for over-molded die is intended as a guideline. It can be modified or adjusted to suit your requirements for a high-rel application. 1. High Temperature Life Mil-Std- 750 Method 1032 48 hours @ TA = 150°C 2. Temperature Cycling Mil-Std- 750 Method 1051 Condition F 20 cycles, -65°C to 150°C t(EXTREMES) = 15 minutes No Dwell Required @ 25°C 3. Interim Electrical Forward Voltage, per specification Reverse Current, per specification 4. High Temp Reverse Bias Mil-Std- 750 5. Final Electrical Method 1038 Condition A 96 HRS @ TA = 125°C VR = 80% of RATED Forward Voltage, per specification Reverse Current, per specification 6. Solderability Verification Sample Inspection 7. Reverse Breakdown Voltage Breakdown Voltage, per specification Reverse Current, per specification 8. Final Acceptance Performed by QA/QC Traveler Test Data 9. Final Acceptance Performed by QA/QC Markings Workmanship