HRP 107 - Molded Die - Voltage Multipliers, Inc.

Screening Guide
HRP 107: Screening Guide for Over-molded Die
The following screening for over-molded die is intended as a guideline. It can be modified or
adjusted to suit your requirements for a high-rel application.
1.
High Temperature Life
Mil-Std- 750
Method 1032
48 hours @ TA = 150°C
2.
Temperature Cycling
Mil-Std- 750
Method 1051
Condition F
20 cycles, -65°C to 150°C
t(EXTREMES) = 15 minutes
No Dwell Required @ 25°C
3.
Interim Electrical
Forward Voltage, per specification
Reverse Current, per specification
4.
High Temp Reverse Bias
Mil-Std- 750
5.
Final Electrical
Method 1038
Condition A
96 HRS @ TA = 125°C
VR = 80% of RATED
Forward Voltage, per specification
Reverse Current, per specification
6.
Solderability Verification
Sample Inspection
7.
Reverse Breakdown Voltage
Breakdown Voltage, per specification
Reverse Current, per specification
8.
Final Acceptance
Performed by QA/QC
Traveler
Test Data
9.
Final Acceptance
Performed by QA/QC
Markings
Workmanship