APPENDIX D Screening Guides The following screening procedures are suggested guides for assemblies and their components: HRP 101: HRP 102: HRP 103: HRP 104: HRP 105: HRP 106: Screening Guide for Discrete Diodes Screening Guide for Finished Bridge Rectifier Assemblies Screening Guide for Capacitors Used in Multiplier Assemblies Screening Guide for Resistors Used in Multiplier Assemblies Screening Guide for Multiplier Assemblies Screening Guide for Hi-rel Hybrid Multiplier Assemblies HRP 101: Discrete Diodes The following screening for discrete diodes is a guide for a suggested procedure. It can be modified or adjusted to suit requirements. This is taken from MIL-PRF-19500 Table IV, JANTX screening. 1) High Temperature Life (non-operating life/ stabilization bake MIL-STD-750) Method 1032 48 hrs @ +175°C 2) Temperature Cycling MIL-STD-750 Method 1051 Condition C 20 Cycles -65°C to +175°C 15 min. extremes No dwell @25°C 3) Interim Electrical 4) High Temperature Reverse Bias (HTRB) Forward Voltage Drop Leakage Current Method 1038 Condition A MIL-STD-750 5) Final Electrical MIL-STD-750 96 hrs min. @ TA=150°C and min. applied voltage at 80% of rated VR (TC or TL is optional) Method Method Method Method 4011 4016 4031 4021 295 Forward Voltage Drop Leakage Current Reverse Recovery Time Peak Inverse Voltage 14