SF2133E - Murata Manufacturing

RFM products are now
Murata products.
SF2133E
• Small Size
• Hermetic 7 X 5 mm Surface Mount Case
• No Matching Required
Input power Level
248.6 MHz
SAW Filter
maximum 20 dBm for <= 100 hours
maximum 10 dBm for <= 15 years
Input: unsymmetrical
Output: symmetrical
Terminating source impedance:
Zs = 50 ohm (no matching network)
Terminating load impedance:
ZI = 200 ohm (no matching network)
Low-Impedance Input: near 50 ohm
Low-Impedance Output: near 200 ohm
Operating Temperature
T = -20 to 80 [°C]
SMP-03
Electrical Characteristics
Characteristic
Sym
Notes
Nominal Center Frequency
fN
1
Minimal insertion attenuation
Min
a_min
3 dB Band Width
Typ
Amplitude ripple (p - p) [fn ±120 kHz]
10 MHz ....
4
0.3
dB
MHz
6.5
Group Delay ripple (p - p) [fn ±120 kHz]
Units
MHz
3.0
5.0
Relative attenuation (relative to amin)
Max
248.6
0.5
dB
0.3
µs
a_rel
(fn - 29,2 MHz)
45.0
50
dB
fn + 22,8 MHz
45.0
50
dB
fn + 52,0 MHz
45.0
50
dB
fn + 74,8 MHz
45.0
50
dB
fn + 104,0 MHz
45.0
50
dB
fn + 126,8 MHz
45.0
50
dB
Case Style
SMP-03 7 X 5 mm Nominal Footprint
Lid Symbolization (Y=year, WW=week, S=shift) See note 3
RFM SF1197B YWWS
CAUTION: Electrostatic Sensitive Device. Observe precautions for handling.
NOTES:
1.
2.
3.
Unless noted otherwise, all specifications apply over the operating temperature range with filter soldered to the specified demonstration board
with impedance matching to 50 Ω and measured with 50 Ω network analyzer. A dB offset exists for Murata because of the loss introduced by using
transformers on the Input and Output.
Rejection is measured as attenuation below the minimum IL point in the
passband. Rejection in final user application is dependent on PCB layout
and external impedance matching design. See Application Note No. 42
for details.
"LRIP" or "L" after the part number indicates "low rate initial production"
and "ENG" or "E" indicates "engineering prototypes."
©2010-2014 by Murata Electronics N.A., Inc.
SF1197B (R) 3/21/14
4.
5.
6.
7.
Page 1 of 5
The design, manufacturing process, and specifications of this filter are
subject to change.
Either Port 1 or Port 2 may be used for either input or output in the design.
However, impedances and impedance matching may vary between Port 1
and Port 2, so that the filter must always be installed in one direction per
the circuit design.
US and international patents may apply.
Murata, stylized Murata logo, and Murata N.A., Inc. are registered
trademarks of Murata Manufacturing Co., Ltd
www.murata.com
SF1197B Filter Response
BW:
SF1197B S11 and S22 Plots
©2010-2014 by Murata Electronics N.A., Inc.
SF1197B (R) 3/21/14
Page 2 of 5
www.murata.com
Tape and Reel Specifications
“B “
Nominal Size
"B" REF.
100 REF.
Inches
Quantity Per Reel
millimeters
7
178
500
13
330
2000
See Detail "A"
13.
0
12.0
20
.2
2.0
COMPONENT ORIENTATION and DIMENSIONS
Carrier Tape Dimensions
Ao
9.4 mm
Bo
7.4 mm
Ko
2.0 mm
Pitch
8.0 mm
W
16.0 mm
PIN #1
USER DIRECTION OF FEED
©2010-2014 by Murata Electronics N.A., Inc.
SF1197B (R) 3/21/14
Page 3 of 5
www.murata.com
SMP-03 Case
10-Terminal Ceramic Surface-Mount Case
7 x 5 mm Nominal Footprint
Case Dimensions
mm
Dimension
A
B
C
D
E
H
J
K
P
Inches
Min
Nom
Max
Min
Nom
Max
6.80
4.80
7.00
5.00
1.65
0.60
2.54
1.0
5.00
3.00
1.27
7.20
5.20
2.00
0.268
0.189
0.276
0.197
0.065
0.024
0.100
0.039
0.197
0.118
0.050
0.283
0.205
0.079
Electrical Connections
Connection
Port 1
Port 2
Terminals
Input or Return
10
Return or Input
1
Output or Return
5
Return or Output
6
Ground
All others
Single Ended Operation
Return is ground
Differential Operation
Return is hot
C
B
1
E
H
10
10
2
9
3
8
D
A
1
9
2
8
3
P
7
4
5
7
6
6
TOP VIEW
©2010-2014 by Murata Electronics N.A., Inc.
SF1197B (R) 3/21/14
4
5
BOTTOM VIEW
Page 4 of 5
www.murata.com
Solder Temperature Profile
The following figure shows the recommended temperature profile for reflow soldering SMP-03 and SMP53-S packages. The package
consists of a ceramic base with a metal lid that is attached with high-temperature solder. The filter package is hermetically sealed and the
solder seal must not be compromised with excessive heat in assembly. It is critical that the filter package is never heated above 250°C. It
is recommended that the package be heated no higher than 240°C for no more than 10 seconds.
Reflow Soldering Profile (SN63)
250
Peak temperature: 210 to 235 deg C
200
Temperature (deg C)
Liquidus: 183 deg C
150
Pre-drying: 120 to 150 deg C
100
50
Time above liquidus ~ 30 seconds
1
©2010-2014 by Murata Electronics N.A., Inc.
SF1197B (R) 3/21/14
2
3
Minutes
Page 5 of 5
4
5
www.murata.com