RFM products are now Murata products. SF2133E • Small Size • Hermetic 7 X 5 mm Surface Mount Case • No Matching Required Input power Level 248.6 MHz SAW Filter maximum 20 dBm for <= 100 hours maximum 10 dBm for <= 15 years Input: unsymmetrical Output: symmetrical Terminating source impedance: Zs = 50 ohm (no matching network) Terminating load impedance: ZI = 200 ohm (no matching network) Low-Impedance Input: near 50 ohm Low-Impedance Output: near 200 ohm Operating Temperature T = -20 to 80 [°C] SMP-03 Electrical Characteristics Characteristic Sym Notes Nominal Center Frequency fN 1 Minimal insertion attenuation Min a_min 3 dB Band Width Typ Amplitude ripple (p - p) [fn ±120 kHz] 10 MHz .... 4 0.3 dB MHz 6.5 Group Delay ripple (p - p) [fn ±120 kHz] Units MHz 3.0 5.0 Relative attenuation (relative to amin) Max 248.6 0.5 dB 0.3 µs a_rel (fn - 29,2 MHz) 45.0 50 dB fn + 22,8 MHz 45.0 50 dB fn + 52,0 MHz 45.0 50 dB fn + 74,8 MHz 45.0 50 dB fn + 104,0 MHz 45.0 50 dB fn + 126,8 MHz 45.0 50 dB Case Style SMP-03 7 X 5 mm Nominal Footprint Lid Symbolization (Y=year, WW=week, S=shift) See note 3 RFM SF1197B YWWS CAUTION: Electrostatic Sensitive Device. Observe precautions for handling. NOTES: 1. 2. 3. Unless noted otherwise, all specifications apply over the operating temperature range with filter soldered to the specified demonstration board with impedance matching to 50 Ω and measured with 50 Ω network analyzer. A dB offset exists for Murata because of the loss introduced by using transformers on the Input and Output. Rejection is measured as attenuation below the minimum IL point in the passband. Rejection in final user application is dependent on PCB layout and external impedance matching design. See Application Note No. 42 for details. "LRIP" or "L" after the part number indicates "low rate initial production" and "ENG" or "E" indicates "engineering prototypes." ©2010-2014 by Murata Electronics N.A., Inc. SF1197B (R) 3/21/14 4. 5. 6. 7. Page 1 of 5 The design, manufacturing process, and specifications of this filter are subject to change. Either Port 1 or Port 2 may be used for either input or output in the design. However, impedances and impedance matching may vary between Port 1 and Port 2, so that the filter must always be installed in one direction per the circuit design. US and international patents may apply. Murata, stylized Murata logo, and Murata N.A., Inc. are registered trademarks of Murata Manufacturing Co., Ltd www.murata.com SF1197B Filter Response BW: SF1197B S11 and S22 Plots ©2010-2014 by Murata Electronics N.A., Inc. SF1197B (R) 3/21/14 Page 2 of 5 www.murata.com Tape and Reel Specifications “B “ Nominal Size "B" REF. 100 REF. Inches Quantity Per Reel millimeters 7 178 500 13 330 2000 See Detail "A" 13. 0 12.0 20 .2 2.0 COMPONENT ORIENTATION and DIMENSIONS Carrier Tape Dimensions Ao 9.4 mm Bo 7.4 mm Ko 2.0 mm Pitch 8.0 mm W 16.0 mm PIN #1 USER DIRECTION OF FEED ©2010-2014 by Murata Electronics N.A., Inc. SF1197B (R) 3/21/14 Page 3 of 5 www.murata.com SMP-03 Case 10-Terminal Ceramic Surface-Mount Case 7 x 5 mm Nominal Footprint Case Dimensions mm Dimension A B C D E H J K P Inches Min Nom Max Min Nom Max 6.80 4.80 7.00 5.00 1.65 0.60 2.54 1.0 5.00 3.00 1.27 7.20 5.20 2.00 0.268 0.189 0.276 0.197 0.065 0.024 0.100 0.039 0.197 0.118 0.050 0.283 0.205 0.079 Electrical Connections Connection Port 1 Port 2 Terminals Input or Return 10 Return or Input 1 Output or Return 5 Return or Output 6 Ground All others Single Ended Operation Return is ground Differential Operation Return is hot C B 1 E H 10 10 2 9 3 8 D A 1 9 2 8 3 P 7 4 5 7 6 6 TOP VIEW ©2010-2014 by Murata Electronics N.A., Inc. SF1197B (R) 3/21/14 4 5 BOTTOM VIEW Page 4 of 5 www.murata.com Solder Temperature Profile The following figure shows the recommended temperature profile for reflow soldering SMP-03 and SMP53-S packages. The package consists of a ceramic base with a metal lid that is attached with high-temperature solder. The filter package is hermetically sealed and the solder seal must not be compromised with excessive heat in assembly. It is critical that the filter package is never heated above 250°C. It is recommended that the package be heated no higher than 240°C for no more than 10 seconds. Reflow Soldering Profile (SN63) 250 Peak temperature: 210 to 235 deg C 200 Temperature (deg C) Liquidus: 183 deg C 150 Pre-drying: 120 to 150 deg C 100 50 Time above liquidus ~ 30 seconds 1 ©2010-2014 by Murata Electronics N.A., Inc. SF1197B (R) 3/21/14 2 3 Minutes Page 5 of 5 4 5 www.murata.com