Formosa MS Chip Zener Diode ZGFM5341B THRU ZGFM5378B List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Electrical characteristics................................................................... 3 Rating and characteristic curves........................................................ 4 Pinning information........................................................................... 5 Suggested solder pad layout............................................................. 5 Packing information.......................................................................... 6 Reel packing.................................................................................... 7 Suggested thermal profiles for soldering processes............................. 7 High reliability test capabilities........................................................... 8 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 1 DS-121743 Issued Date Revised Date Revision Page. 2009/08/10 2012/07/24 D 8 Formosa MS Chip Zener Diode ZGFM5341B THRU ZGFM5378B 5.0W Surface Mount Zener Diodes-6.2V-100V Package outline Features SMC • Batch process design, excellent power dissipation offers • • • • • 0.272(6.9) 0.248(6.3) better reverse leakage current and thermal resistance. Wide zener reverse voltage range 6.2V to 100V. Small package size for high density applications. Ideally suited for automated assembly processes. Lead-free parts meet environmental standards of MIL-STD-19500 /228 Suffix "-H" indicates Halogen-free part, ex.ZGFM5341B-H. 0.012(0.3) Typ. 0.189(4.8) 0.165(4.2) 0.098(2.5) 0.075(1.9) Mechanical data • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, DO-214AB / SMC • Terminals : Solder plated, solderable per 0.048(1.2) Typ. MIL-STD-750, Method 2026 0.048 (1.2) Typ. Dimensions in inches and (millimeters) • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.19 gram Maximum ratings (at T =25 C unless otherwise noted) o A PARAMETER Symbol Power Dissipation PD Operating temperature TJ Storage temperature T STG MIN. TYP. MAX. 5.0 -55 -65 UNIT W +150 o C +175 o C Thermal Characteristics Symbol Limit UNIT Typical thermal resistance junction to lead R θJL 23 °C/W Typical thermal resistance junction to ambient R θJA 50 °C/W PARAMETER Note：1. Mounted on FR-4 PCB http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 2 DS-121743 Issued Date Revised Date Revision Page. 2009/08/10 2012/07/24 D 8 Formosa MS Chip Zener Diode ZGFM5341B THRU ZGFM5378B Electrical characteristics (at T =25 C unless otherwise noted) o A Part No. Marking code Zener voltage Test current Zener impedance Leakage current V Z @ I ZT (Volts) I ZT Z ZT @ I ZT Z ZK @ I ZK I ZK (Ω)Max mA IR VR Min. Nom. Max. mA (Ω)Max (uA)Max ZGFM5341B 5341 5.89 6.2 6.51 200.0 1 200 1.00 10.0 3.0 ZGFM5342B 5342 6.46 6.8 7.14 175.0 1 200 1.00 10.0 5.2 ZGFM5343B 5343 7.13 7.5 7.88 175.0 1.5 200 1.00 10.0 5.7 ZGFM5344B 5344 7.79 8.2 8.61 150.0 1.5 200 1.00 10.0 6.2 ZGFM5345B 5345 8.27 8.7 9.14 150.0 2 200 1.00 10.0 6.6 ZGFM5346B 5346 8.65 9.1 9.56 150.0 2 150 1.00 7.5 6.9 Volts ZGFM5347B 5347 9.50 10 10.50 125.0 2 125 1.00 5.0 7.6 ZGFM5348B 5348 10.45 11 11.55 125.0 2.5 125 1.00 5.0 8.4 ZGFM5349B 5349 11.4 12 12.60 100.0 2.5 125 1.00 2.0 9.1 ZGFM5350B 5350 12.35 13 13.65 100.0 2.5 100 1.00 1.0 9.9 ZGFM5351B 5351 13.30 14 14.70 100.0 2.5 75 1.00 1.0 10.6 ZGFM5352B 5352 14.25 15 15.75 75.0 2.5 75 1.00 1.0 11.5 ZGFM5353B 5353 15.20 16 16.80 75.0 2.5 75 1.00 1.0 12.2 ZGFM5354B 5354 16.15 17 17.85 70.0 2.5 75 1.00 0.5 12.9 ZGFM5355B 5355 17.10 18 18.90 65.0 2.5 75 1.00 0.5 13.7 ZGFM5356B 5356 18.05 19 19.95 65.0 3 75 1.00 0.5 14.4 ZGFM5357B 5357 19.00 20 21.00 65.0 3 75 1.00 0.5 15.2 ZGFM5358B 5358 20.90 22 23.10 50.0 3.5 75 1.00 0.5 16.7 ZGFM5359B 5359 22.80 24 25.20 50.0 3.5 100 1.00 0.5 18.2 ZGFM5360B 5360 23.75 25 26.25 50.0 4 110 1.00 0.5 19.0 ZGFM5361B 5361 25.65 27 28.35 50.0 5 120 1.00 0.5 20.6 ZGFM5362B 5362 26.60 28 29.40 50.0 6 130 1.00 0.5 21.2 ZGFM5363B 5363 28.50 30 31.50 40.0 8 140 1.00 0.5 22.8 ZGFM5364B 5364 31.35 33 34.65 40.0 10 150 1.00 0.5 25.1 ZGFM5365B 5365 34.20 36 37.80 30.0 11 160 1.00 0.5 27.4 ZGFM5366B 5366 37.05 39 40.95 30.0 14 170 1.00 0.5 29.7 ZGFM5367B 5367 40.85 43 45.15 30.0 20 190 1.00 0.5 32.7 ZGFM5368B 5368 44.65 47 49.35 25.0 25 210 1.00 0.5 35.8 ZGFM5369B 5369 48.45 51 53.55 25.0 27 230 1.00 0.5 38.8 ZGFM5370B 5370 53.20 56 58.80 20.0 35 280 1.00 0.5 42.6 ZGFM5371B 5371 57.00 60 63.00 20.0 40 350 1.00 0.5 45.5 ZGFM5372B 5372 58.90 62 65.10 20.0 42 400 1.00 0.5 47.1 ZGFM5373B 5373 64.60 68 71.40 20.0 44 500 1.00 0.5 51.7 ZGFM5374B 5374 71.25 75 78.75 20.0 45 620 1.00 0.5 56.0 ZGFM5375B 5375 77.90 82 86.10 15.0 65 720 1.00 0.5 62.2 ZGFM5376B 5376 82.65 87 91.35 15.0 75 760 1.00 0.5 66.0 ZGFM5377B 5377 86.45 91 95.55 15.0 75 760 1.00 0.5 69.2 ZGFM5378B 5378 95.00 100 105.0 12.0 90 800 1.00 0.5 76.0 Note : 5% tolerance of Zener voltage http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 3 DS-121743 Issued Date Revised Date Revision Page. 2009/08/10 2012/07/24 D 8 θV ZTEMPERATURE COEFFICIENT, (mV/ C)@I ZT Rating and characteristic curves (ZGFM5341B THRU ZGFM5378B) 10 o P D, MAXIMUM POWER DISSIPATION, (W) FIG.1 POWER TEMPERATURE DERATING CURVE 8 6 4 2 0 0 20 40 60 80 100 120 140 160 180 300 100 50 Range 10 5 0 T L, LEAD TEMPERATURE, ( OC) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 FIG.2 TEMPERATURE COEFFICIENT-RANGE FOR UNITS 10 TO 100 VOLTAGES 20 40 60 80 100 V Z, ZENER VOLTAGE, (V) Document ID Page 4 DS-121743 Issued Date Revised Date Revision Page. 2009/08/10 2012/07/24 D 8 Formosa MS Chip Zener Diode ZGFM5341B THRU ZGFM5378B Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Suggested solder pad layout C A B Dimensions in inches and (millimeters) PACKAGE A B C SMC 0.189 (4.80) 0.063 (1.60) 0.158 (4.00) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 5 DS-121743 Issued Date Revised Date Revision Page. 2009/08/10 2012/07/24 D 8 Formosa MS Chip Zener Diode ZGFM5341B THRU ZGFM5378B Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SMC Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 5.10 7.20 2.50 1.50 330.00 50.00 178.00 62.00 13.00 1.75 5.50 8.00 4.00 2.00 0.23 12.00 18.00 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 6 DS-121743 Issued Date Revised Date Revision Page. 2009/08/10 2012/07/24 D 8 Formosa MS Chip Zener Diode ZGFM5341B THRU ZGFM5378B Reel packing PACKAGE SMC REEL SIZE 13" REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) 3,000 8.0 6,000 337*337*37 330 CARTON SIZE (m/m) 350*330*360 CARTON (pcs) APPROX. GROSS WEIGHT (kg) 17.2 48,000 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC/sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 oC/sec Time 25 oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 7 DS-121743 Issued Date Revised Date Revision Page. 2009/08/10 2012/07/24 D 8 Formosa MS Chip Zener Diode ZGFM5341B THRU ZGFM5378B High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T J=150 OC for 168 hrs. MIL-STD-750D METHOD-1038 4. Pressure Cooker 15P SIG at T A=121 OC for 4 hrs. JESD22-A102 5. Temperature Cycling -55 OC to +125 OC dwelled for 30 min. and transferred for 5min. total 10 cycles. MIL-STD-750D METHOD-1051 0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles. MIL-STD-750D METHOD-1056 at T A=85 OC, RH=85% for 1000hrs. MIL-STD-750D METHOD-1021 at 175 OC for 1000 hrs. MIL-STD-750D METHOD-1031 6. Thermal Shock 7. Humidity 8. High Temperature Storage Life http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 8 DS-121743 Issued Date Revised Date Revision Page. 2009/08/10 2012/07/24 D 8