Formosa MS SMD Zener Diode BZT55 Series List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Electrical characteristics................................................................... 3~4 Rating and characteristic curves........................................................ 5 Pinning information........................................................................... 6 Suggested solder pad layout............................................................. 6 Packing information.......................................................................... 7 Reel packing.................................................................................... 8 Suggested thermal profiles for soldering processes............................. 8 High reliability test capabilities........................................................... 9 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 1 DS-221735 Issued Date Revised Date 2009/08/10 2010/05/10 Revision Page. C 9 Formosa MS SMD Zener Diode BZT55 Series 500mW Surface Mount Zener Diodes - 2.0V-51V Package outline Features • Silicon epitaxial planar chip structure. • Zener Breakdown Voltage Range , 2.4V to 51V ex.BZT55C2V4 • Zener Breakdown Voltage Range , 2.0V to 36V ex.BZT55B2V0 • Small package size for high density applications. • Ideally suited for automated assembly processes. • Pb-Free package is available. • Suffix "-H" indicates Halogen-free parts, ex.BZT55C2V4-H. 0.028(0.70) 0.019(0.50) 0.110(2.80) 0.098(2.50) 0.053(1.35) 0.037(0.95) 0.008(0.20)MAX 0.071(1.80) 0.055(1.40) SOD-123F Mechanical data • Epoxy : UL94-V0 rated flame retardant • Case : Molded plastic, SOD-123F • Terminals :Plated terminals, solderable per MIL-STD-750, 0.154(3.90) 0.141(3.60) Method 2026 Dimensions in inches and (millimeters) • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.010 gram Maximum ratings (at T =25 C unless otherwise noted) o A PARAMETER CONDITIONS Forward voltage @IF = 10mA Total power dissipation at T A=25 C Mounted on FR-5 board, note1 Thermal resistance Junction to ambient, note1 Junction to case, note1 MIN. TYP. VF o Storage temperature range Note1.Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.87mm with pad area 25mm PD R θJA R θJC Operating junction temperature range http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Symbol MAX. UNIT 0.9 V 500 mW O 305 200 O C/W C/W TJ -55 +150 o C T STG -55 +150 o C 2 Document ID Page 2 DS-221735 Issued Date Revised Date 2009/08/10 2010/05/10 Revision Page. C 9 Formosa MS SMD Zener Diode BZT55 Series Electrical characteristics (at T =25 C unless otherwise noted) o A Zener voltage Part No. Marking code Test current Zener impedance Leakage current Typical Temperature Typical Coefficent V Z @ I ZT I ZT Z ZT @ I ZT Z ZK @ I ZK I ZK IR VR Min.(V) Nom.(V) Max.(V) mA (Ω)Max (Ω)Max mA (uA)Max Volts @ I ZT (mV/ OC) BZT55C2V4 WX 2.2 2.4 2.6 5 100 600 1.0 50.0 1.0 -3.5 0 BZT55C2V7 W1 2.5 2.7 2.9 5 100 600 1.0 20.0 1.0 -3.5 0 BZT55C3V0 W2 2.8 3.0 3.2 5 95 600 1.0 10.0 1.0 -3.5 0 BZT55C3V3 W3 3.1 3.3 3.5 5 95 600 1.0 5.0 1.0 -3.5 0 BZT55C3V6 W4 3.4 3.6 3.8 5 90 600 1.0 5.0 1.0 -3.5 0 BZT55C3V9 W5 3.7 3.9 4.1 5 90 600 1.0 3.0 1.0 -3.5 0 BZT55C4V3 W6 4.0 4.3 4.6 5 90 600 1.0 3.0 1.0 -3.5 0 BZT55C4V7 W7 4.4 4.7 5.0 5 80 500 1.0 3.0 2.0 -3.5 0.2 BZT55C5V1 W8 4.8 5.1 5.4 5 60 480 1.0 2.0 2.0 -2.7 1.2 BZT55C5V6 W9 5.2 5.6 6.0 5 40 400 1.0 1.0 2.0 -2.0 2.5 BZT55C6V2 WA 5.8 6.2 6.6 5 10 150 1.0 3.0 4.0 0.4 3.7 BZT55C6V8 WB 6.4 6.8 7.2 5 15 80 1.0 2.0 4.0 1.2 4.5 BZT55C7V5 WC 7.0 7.5 7.9 5 15 80 1.0 1.0 5.0 2.5 5.3 BZT55C8V2 WD 7.7 8.2 8.7 5 15 80 1.0 0.7 5.0 3.2 6.2 BZT55C9V1 WE 8.5 9.1 9.6 5 15 100 1.0 0.5 6.0 3.8 7.0 BZT55C10 WF 9.4 10 10.6 5 20 150 1.0 0.2 7.0 4.5 8.0 BZT55C11 WG 10.4 11 11.6 5 20 150 1.0 0.1 8.0 5.4 9.0 BZT55C12 WH 11.4 12 12.7 5 25 150 1.0 0.1 8.0 6.0 10.0 BZT55C13 WI 12.4 13 14.1 5 30 170 1.0 0.1 8.0 7.0 11.0 BZT55C15 WJ 13.8 15 15.8 5 30 200 1.0 0.1 10.5 9.2 13.0 BZT55C16 WK 15.3 16 17.1 5 40 200 1.0 0.1 11.2 10.4 14.0 BZT55C18 WL 16.8 18 19.1 5 45 225 1.0 0.1 12.6 12.4 16.0 BZT55C20 WM 18.8 20 21.2 5 55 225 1.0 0.1 14.0 14.4 18.0 BZT55C22 WN 20.8 22 23.3 5 55 250 1.0 0.1 15.4 16.4 20.0 BZT55C24 WO 22.8 24 25.6 5 70 250 1.0 0.1 16.8 18.4 22.0 BZT55C27 WP 25.1 27 28.9 2 80 300 0.5 0.1 18.9 21.4 25.3 BZT55C30 WQ 28.0 30 32.0 2 80 300 0.5 0.1 21.0 24.4 29.4 BZT55C33 WR 31.0 33 35.0 2 80 325 0.5 0.1 23.1 27.4 33.4 BZT55C36 WS 34.0 36 38.0 2 90 350 0.5 0.1 25.2 30.4 37.4 BZT55C39 WT 37.0 39 41.0 2 130 350 0.5 0.1 27.3 33.4 41.2 BZT55C43 WU 40.0 43 46.0 2 100 700 1.0 0.1 32.0 10.0 12.0 BZT55C47 WV 44.0 47 50.0 2 100 750 1.0 0.1 35.0 10.0 12.0 BZT55C51 WW 48.0 51 54.0 2 100 750 1.0 0.1 38.0 10.0 12.0 Note: 1. Tested with pulses, period = 5ms, pulse width = 300us. 2. When provided, otherwise, parts are provided with date code only, and type number identifications appears on reel only. 3. f=1KHz. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 3 DS-221735 Issued Date Revised Date 2009/08/10 2010/05/10 Revision Page. C 9 Formosa MS SMD Zener Diode BZT55 Series Electrical characteristics (at T =25 C unless otherwise noted) o A Zener voltage Part No. Marking code Test current Zener impedance Leakage current I ZT Z ZT @ I ZT Z ZK @ I ZK I ZK IR VR Min.(V) Max.(V) mA (Ω)Max (Ω)Max mA (uA)Max Volts V Z @ I ZT BZT55B2V0 02 2.02 2.20 5 100 1000 0.5 120.0 0.5 BZT55B2V2 12 2.22 2.41 5 100 1000 0.5 120.0 0.7 BZT55B2V4 22 2.43 2.63 5 100 1000 0.5 100.0 1.0 BZT55B2V7 32 2.69 2.91 5 110 1000 0.5 100.0 1.0 BZT55B3V0 42 3.01 3.22 5 120 1000 0.5 50.0 1.0 BZT55B3V3 52 3.32 3.53 5 120 1000 0.5 20.0 1.0 BZT55B3V6 62 3.60 3.845 5 100 1000 1.0 10.0 1.0 BZT55B3V9 72 3.89 4.16 5 100 1000 1.0 5.0 1.0 BZT55B4V3 82 4.17 4.43 5 100 1000 1.0 5.0 1.0 BZT55B4V7 92 4.55 4.75 5 100 800 0.5 2.0 1.0 BZT55B5V1 A2 4.98 5.20 5 80 500 0.5 2.0 1.5 BZT55B5V6 C2 5.49 5.73 5 60 200 0.5 1.0 2.5 BZT55B6V2 E2 6.06 6.33 5 60 100 0.5 1.0 3.0 BZT55B6V8 F2 6.65 6.93 5 40 60 0.5 0.5 3.5 BZT55B7V5 H2 7.28 7.6 5 30 60 0.5 0.5 4.0 BZT55B8V2 J2 8.02 8.36 5 30 60 0.5 0.5 5.0 BZT55B9V1 L2 8.85 9.23 5 30 60 0.5 0.5 6.0 BZT55B10 05 9.77 10.21 5 30 60 0.5 0.1 7.0 BZT55B11 15 10.76 11.22 5 30 60 0.5 0.1 8.0 BZT55B12 25 11.74 12.24 5 30 80 0.5 0.1 9.0 BZT55B13 35 12.91 13.49 5 37 80 0.5 0.1 10.0 BZT55B15 45 14.34 14.98 5 42 80 0.5 0.1 11.0 BZT55B16 55 15.85 16.51 5 50 80 0.5 0.1 12.0 BZT55B18 65 17.56 18.35 5 65 80 0.5 0.1 13.0 BZT55B20 75 19.52 20.39 5 85 100 0.5 0.1 15.0 BZT55B22 85 21.54 22.47 5 100 100 0.5 0.1 17.0 BZT55B24 95 23.72 24.78 5 120 120 0.5 0.1 19.0 BZT55B27 A5 26.19 27.53 5 150 150 0.5 0.1 21.0 BZT55B30 C5 29.19 30.69 5 200 200 0.5 0.1 23.0 BZT55B33 E5 32.15 33.79 5 250 250 0.5 0.1 25.0 BZT55B36 F5 35.07 36.87 5 300 300 0.5 0.1 27.0 Note: 1. Tested with pulses, period = 5ms, pulse width = 300us. 2. When provided, otherwise, parts are provided with date code only, and type number identifications appears on reel only. 3. f=1KHz. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 4 DS-221735 Issued Date Revised Date 2009/08/10 2010/05/10 Revision Page. C 9 Rating and characteristic curves (BZT55 Series) FIG.1-TOTAL POWER DISSIPATION vs. AMBIENT TEMPERATURE TOTAL POWER DISSIPATION (Watt) 0.6 0.5 0.4 0.3 0.2 0. 1 0 0 25 50 75 100 125 150 AMBIENT TEMPERATURE ( oC) T A = 25 OC 22 20 18 16 15 13 11 12 10 8.2 9.1 7.5 6.8 6.2 5.1 5.6 FIG . 2 - ZENER VOLTAGE vs. ZENER CURRENT 100m 4.7 ZENER CURRENT : IZ (A) 10m 1m 100µ 10µ 1µ 0 4.3 3.3 3.0 2.4 2.7 10n 2.2 2.0 100n 5 10 15 20 25 30 35 40 ZENER VOLTAGE : VZ (V) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 5 DS-221735 Issued Date Revised Date 2009/08/10 2010/05/10 Revision Page. C 9 Formosa MS SMD Zener Diode BZT55 Series Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Suggested solder pad layout C A B Dimensions in inches and (millimeters) PACKAGE A B C SOD-123F 0.048 (1.22) 0.036 (0.91) 0.093 (2.36) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 6 DS-221735 Issued Date Revised Date 2009/08/10 2010/05/10 Revision Page. C 9 Formosa MS SMD Zener Diode BZT55 Series Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SOD-123F Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 2.00 3.85 1.10 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 7 DS-221735 Issued Date Revised Date 2009/08/10 2010/05/10 Revision Page. C 9 Formosa MS SMD Zener Diode BZT55 Series Reel packing PACKAGE SOD-123F REEL SIZE 7" REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) CARTON SIZE (m/m) CARTON (pcs) APPROX. GROSS WEIGHT (kg) 3,000 4.0 30,000 183*183*123 178 382*262*387 240,000 9.5 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%± 25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) o 150 C o 200 C 60~120sec Tsmax to T L -Ramp-upRate o <3 C /sec Time maintained above: -Temperature(T L ) -Time(t L ) o 217 C 60~260sec o o 255 C- 0/ + 5 C Peak Temperature(T P ) o Time within 5 C of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 C /sec o o Time 25 C to Peak Temperature http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 <6minutes Document ID Page 8 DS-221735 Issued Date Revised Date 2009/08/10 2010/05/10 Revision Page. C 9 Formosa MS SMD Zener Diode BZT55 Series High reliability test capabilities Item Test Conditions Reference O MIL-STD-750D METHOD-2031 O MIL-STD-202F METHOD-208 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16" ± 1/32" 2. Solderability at 245 ± 5 C for 5 sec. 3. High Temperature Reverse Bias V R=80% rate at T J=150 C for 168 hrs. 4. Pressure Cooker 15P SIG at T A=121 C for 4 hrs. 5. Temperature Cycling -55 C to +125 C dwelled for 30 min. and transferred for 5min. total 10 cycles. MIL-STD-750D METHOD-1038 O JESD22-A102 O O MIL-STD-750D METHOD-1051 O O 6. Humidity at T A=85 C , RH=85% for 1000hrs. MIL-STD-750D METHOD-1021 O 7. High Temperature Storage Life http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 at 175 C for 1000 hrs. MIL-STD-750D METHOD-1031 Document ID Page 9 DS-221735 Issued Date Revised Date 2009/08/10 2010/05/10 Revision Page. C 9