Formosa MS Chip Zener Diode ZS100B THRU ZS330B List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Electrical characteristics................................................................... 3 Rating and characteristic curves........................................................ 4 Pinning information........................................................................... 5 Suggested solder pad layout............................................................. 5 Packing information.......................................................................... 6 Reel packing.................................................................................... 7 Suggested thermal profiles for soldering processes............................. 7 High reliability test capabilities........................................................... 8 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date DS-121711 2008/02/10 Revised Date 2010/10/05 Revision Page. D 8 Formosa MS Chip Zener Diode ZS100B THRU ZS330B 1000mW Surface Mount Zener Diodes - 100V-330V Package outline Features SMA • Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. • Glass passivated chip junction. • Standard zener voltage tolerance ±5%. • Low inductance. • Low profile package. • Built-in strain relief. • Lead-free parts meet environmental standards of 0.196(4.9) 0.180(4.5) 0.012(0.3) Typ. 0.106(2.7) 0.091(2.3) MIL-STD-19500 /228 • Suffix "-H" indicates Halogen-free part, ex.ZS100B-H. 0.068(1.7) 0.060(1.5) Mechanical data • Epoxy : UL94-V0 rated flame retardant • Case : Molded plastic,JEDEC DO-214AC / SMA • Terminals :Plated terminals, solderable per MIL-STD-750, 0.032(0.8) Typ. 0.032 (0.8) Typ. Dimensions in inches and (millimeters) Method 2026 • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.05 gram Maximum ratings (at T =25 C unless otherwise noted) o A PARAMETER CONDITIONS Symbol MIN. TYP. MAX. UNIT Forward voltage I F = 200 mA VF 1.20 V Power Dissipation T L = 75 ° C PD 1000 mW Operating junction temperature range Storage temperature range http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 2 TJ -55 +150 o C T STG -65 +175 o C Document ID Issued Date DS-121711 2008/02/10 Revised Date 2010/10/05 Revision Page. D 8 Formosa MS Chip Zener Diode ZS100B THRU ZS330B Electrical characteristics (at T A=25 oC unless otherwise noted) Part No. Marking code Zener voltage Test current Zener impedance Min. V Z @ I ZT Nom. V Z @ I ZT Max. V Z @ I ZT I ZT Z ZT @ I ZT Z ZK @ I ZK Leakage current I ZK IR VR Volts Volts Volts mA ( Ω )Max ( Ω )Max mA (uA)Max Volts ZS100B Z100 95 100 105 5.0 750 5000 0.25 0.5 75 ZS105B Z105 99.75 105 110.25 5.0 750 5000 0.25 0.5 77 ZS110B Z110 104.5 110 115.5 5.0 750 5000 0.25 0.5 80 ZS115B Z115 109.25 115 120.75 5.0 750 5000 0.25 0.5 85 ZS120B Z120 114 120 126 5.0 850 5000 0.25 0.5 90 ZS130B Z130 123.5 130 136.5 5.0 1000 5000 0.25 0.5 95 ZS140B Z140 133 140 147 5.0 1200 5000 0.25 0.5 105 ZS150B Z150 142.5 150 157.5 5.0 1300 5000 0.25 0.5 110 ZS160B Z160 152 160 168 5.0 1500 5000 0.25 0.5 120 ZS170B Z170 161.5 170 178.5 5.0 2200 5000 0.25 0.5 130 ZS180B Z180 171 180 189 5.0 2200 5000 0.25 0.5 140 ZS190B Z190 180.5 190 199.5 5.0 2500 5000 0.25 0.5 150 ZS200B Z200 190 200 210 5.0 2500 8000 0.25 0.5 165 ZS210B Z210 199.5 210 220.5 5.0 5000 9000 0.25 0.5 165 ZS220B Z220 209 220 231 5.0 5000 9000 0.25 0.5 170 ZS230B Z230 218.5 230 241.5 5.0 5000 9000 0.25 0.5 175 ZS240B Z240 228 240 252 5.0 5000 9000 0.25 0.5 180 ZS250B Z250 237.5 250 262.5 5.0 5000 9000 0.25 0.5 190 ZS260B Z260 247 260 273 5.0 5000 9000 0.25 0.5 195 ZS270B Z270 256.5 270 283.5 5.0 5000 9000 0.25 0.5 200 ZS280B Z280 266 280 294 5.0 5000 9000 0.25 0.5 210 ZS290B Z290 275.5 290 304.5 5.0 5000 9000 0.25 0.5 215 ZS300B Z300 285 300 315 5.0 5000 9000 0.25 0.5 220 ZS310B Z310 294.5 310 325.5 5.0 5000 9000 0.25 0.5 225 ZS320B Z320 304 320 336 5.0 5000 9000 0.25 0.5 233 ZS330B Z330 313.5 330 346.5 5.0 5000 9000 0.25 0.5 240 Note : 5% tolerance of Zener voltage for suffix "B" ex: ZS110B http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 3 Document ID Issued Date DS-121711 2008/02/10 Revised Date 2010/10/05 Revision Page. D 8 Rating and characteristic curves (ZS100B THRU ZS330B) FIG.2-TYPICAL FORWARD CHARACTERISTICS 1200 INSTANTANEOUS FORWARD CURRENT,(A) 1000 800 600 400 200 0 0 40 80 120 160 200 o LEAD TEMPERATURE ( C) 10 1.0 TJ=25 C Pulse Width 300us 1% Duty Cycle 0.1 .01 FIG.3 - TYPICAL REVERSE .6 .7 .8 .9 1.0 1.1 1.2 1.3 FORWARD VOLTAGE,(V) CHARACTERISTICS 100 10 FIG.4 - TYPICAL TEMPERATURE COEFFICIENTS 1.0 TJ=25 C .1 .01 0 20 40 60 80 100 120 140 VZ TEMPERATURE COEFFICIENT @ IZT, mV/K REVERSE LEAKAGE CURRENT, (mA) REVERSE POWER DISSIPATION (mW) FIG.1-TOTAL POWER DISSIPATION VS. LEAD TEMPERATURE 1000 500 200 100 50 20 10 10 50 100 200 500 1000 VZ, ZENER VOLTAGE @ IZT, VOLTS PERCENTAGE RATED PEAK REVERSE VOLTAGE,(%) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 20 Page 4 Document ID Issued Date DS-121711 2008/02/10 Revised Date 2010/10/05 Revision Page. D 8 Formosa MS Chip Zener Diode ZS100B THRU ZS330B Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Suggested solder pad layout C A B Dimensions in inches and (millimeters) PACKAGE A B C SMA 0.110 (2.80) 0.063 (1.60) 0.087 (2.20) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date DS-121711 2008/02/10 Revised Date 2010/10/05 Revision Page. D 8 Formosa MS Chip Zener Diode ZS100B THRU ZS330B Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SMA Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 2.80 5.00 1.90 1.50 330.00 50.00 178.00 62.00 13.00 1.75 5.50 4.00 4.00 2.00 0.23 12.00 18.00 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date DS-121711 2008/02/10 Revised Date 2010/10/05 Revision Page. D 8 Formosa MS Chip Zener Diode ZS100B THRU ZS330B Reel packing PACKAGE REEL SIZE REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) CARTON SIZE (m/m) APPROX. GROSS WEIGHT (kg) CARTON (pcs) SMA 7" 2,000 4.0 20,000 183*155*183 178 382*356*392 160,000 16.0 SMA 13" 7,500 4.0 15,000 337*337*37 330 350*330*360 120,000 14.2 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%± 25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) o 150 C o 200 C 60~120sec Tsmax to T L -Ramp-upRate o <3 C /sec Time maintained above: -Temperature(T L ) -Time(t L ) o 217 C 60~260sec o o 255 C- 0/ + 5 C Peak Temperature(T P ) o Time within 5 C of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 C /sec o o Time 25 C to Peak Temperature http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 7 <6minutes Document ID Issued Date DS-121711 2008/02/10 Revised Date 2010/10/05 Revision Page. D 8 Formosa MS Chip Zener Diode ZS100B THRU ZS330B High reliability test capabilities Item Test Conditions Reference O MIL-STD-750D METHOD-2031 O MIL-STD-202F METHOD-208 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16" ± 1/32" 2. Solderability at 245 ± 5 C for 5 sec. 3. High Temperature Reverse Bias V R=80% rate at T J=150 C for 168 hrs. 4. Pressure Cooker 15P SIG at T A=121 C for 4 hrs. 5. Temperature Cycling -55 C to +125 C dwelled for 30 min. and transferred for 5min. total 10 cycles. MIL-STD-750D METHOD-1038 O JESD22-A102 O O MIL-STD-750D METHOD-1051 O MIL-STD-750D METHOD-1021 O 6. Humidity at T A=85 C , RH=85% for 1000hrs. MIL-STD-750D METHOD-1031 O 7. High Temperature Storage Life http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 at 175 C for 1000 hrs. Page 8 Document ID Issued Date DS-121711 2008/02/10 Revised Date 2010/10/05 Revision Page. D 8