Formosa MS Zener Diode MMBZ5221B THRU MMBZ5270B List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Electrical characteristics................................................................... 3 Rating and characteristic curves........................................................ 4 Pinning information........................................................................... 5 Suggested solder pad layout............................................................. 5 Packing information.......................................................................... 6 Reel packing.................................................................................... 7 Suggested thermal profiles for soldering processes............................. 7 High reliability test capabilities........................................................... 8 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date Revised Date Revision Page. DS-221744 2009/08/10 2010/04/12 B 8 Formosa MS Zener Diode MMBZ5221B THRU MMBZ5270B 225mW Surface Mount Zener Diodes - 2.4V-91V Package outline Features Mechanical data 0.020 (0.50) 0.034 (0.85) (B) 0.012 (0.30) .084(2.10) .068(1.70) 0.120 (3.04) 0.110 (2.80) 0.045 (1.15) SOT-23 • 225 mW Rating on FR–4 or FR–5 Board. • Silicon epitaxial planar chip strucuction. • Wide zener reverse voltage range 2.4V to 91V. • Small package size for high density applications. • Ideally suited for automated assembly processes. • Lead-free parts meet environmental standards of MIL-STD-19500 /228 • ESD Rating of Class 3 (>16 KV) per Human Body Model. • Suffix "-H" indicates Halogen-free part, ex.MMBZ5221B-H. (C) (A) 0.063 (1.60) 0.027 (0.67) 0.013 (0.32) 0.047 (1.20) 0.108 (2.75) 0.051 (1.30) 0.003 (0.09) 0.007 (0.18) 0.083 (2.10) • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, SOT-23 • Terminals : Solder plated, solderable per 0.035 (0.89) MIL-STD-750, Method 2026 • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.008 gram Dimensions in inches and (millimeters) Maximum ratings (at T =25 C unless otherwise noted) o A PARAMETER Forward Voltage CONDITIONS I F=10mA Power Dissipation Thermal resistance MIN. UNIT VF 0.9 V PD 225 R θJA Junction to ambient Operating temperature Storage temperature http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 MAX. Symbol Page 2 TYP. mW O 556 C/W TJ -55 +150 o C T STG -65 +175 o C Document ID Issued Date Revised Date Revision Page. DS-221744 2009/08/10 2010/04/12 B 8 Formosa MS Zener Diode MMBZ5221B THRU MMBZ5270B MMBZ5256B MMBZ5257B MMBZ5258B MMBZ5259B MMBZ5260B Note: 1. Zener voltage is measured with a pulse test current I Z at an ambient temperature of 25 ° C http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 3 Document ID Issued Date Revised Date Revision Page. DS-221744 2009/08/10 2010/04/12 B 8 Figure 1 . Temperature Coefficients ( Temperature Range −55°C to + 150°C ) 8 θ VZ , TEMPERATURE COEFFICIENT ( mV / ° C ) θ VZ , TEMPERATURE COEFFICIENT ( mV / ° C ) Rating and characteristic curves (MMBZ5221B THRU MMBZ5270B) TYPICAL T C VALUES FOR MMBZ5221B SERIES 7 6 5 4 3 2 1 0 -1 -2 -3 2 3 4 5 6 7 8 9 10 11 12 Figure 2 . Temperature Coefficients ( Temperature Range −55°C to + 150°C ) 100 TYPICAL T C VALUES FOR MMBZ5221B SERIES 10 1 10 100 VZ, NOMINAL ZENER VOLTAGE (V) VZ, NOMINAL ZENER VOLTAGE (V) 1000 Ω 75 V (MMBZ5267B) 91 V (MMBZ5270B) 100 10 150°C °C °C °C 1 1 10 100 0.4 0.5 0.6 VZ, NOMINAL ZENER VOLTAGE (V) 0.7 0.8 0.9 1.0 1.1 1.2 VF, FORWARD VOLTAGE (V) Figure 5. Typical Capacitance Figure 6. Typical Leakage Current 1000 μ =25°C 100 10 1 0.1 0.01 0.001 0.0001 0.00001 0 VZ, NOMINAL ZENER VOLTAGE (V) 10 20 30 40 50 60 80 90 =25°C =25°C VZ, ZENER VOLTAGE (V) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 70 VZ, NOMINAL ZENER VOLTAGE (V) VZ, ZENER VOLTAGE (V) Page 4 Document ID Issued Date Revised Date Revision Page. DS-221744 2009/08/10 2010/04/12 B 8 Formosa MS Zener Diode MMBZ5221B THRU MMBZ5270B Pinning information Pin Simplified outline Symbol (C) PinA PinB PinC no connection anode cathode (C) (A) (B) (B) (A) Suggested solder pad layout SOT-23 0.037(0.95) 0.037(0.95) 0.079(2.0) 0.035(0.90) 0.031(0.80) Dimensions in inches and (millimeters) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date Revised Date Revision Page. DS-221744 2009/08/10 2010/04/12 B 8 Formosa MS Zener Diode MMBZ5221B THRU MMBZ5270B Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SOT-23 Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 3.15 2.77 1.22 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date Revised Date Revision Page. DS-221744 2009/08/10 2010/04/12 B 8 Formosa MS Zener Diode MMBZ5221B THRU MMBZ5270B Reel packing PACKAGE SOT-23 REEL SIZE 7" REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) 3,000 4.0 30,000 REEL DIA, (m/m) INNER BOX (m/m) 183*183*123 CARTON SIZE (m/m) 178 CARTON (pcs) 382*262*387 APPROX. GROSS WEIGHT (kg) 11.6 240,000 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) o 150 C o 200 C 60~120sec Tsmax to T L -Ramp-upRate o <3 C /sec Time maintained above: -Temperature(T L ) -Time(t L ) o 217 C 60~260sec o o 255 C- 0/ + 5 C Peak Temperature(T P ) o Time within 5 C of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 C /sec o o Time 25 C to Peak Temperature http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 <6minutes Page 7 Document ID Issued Date Revised Date Revision Page. DS-221744 2009/08/10 2010/04/12 B 8 Formosa MS Zener Diode MMBZ5221B THRU MMBZ5270B High reliability test capabilities Item Test Conditions Reference O MIL-STD-750D METHOD-2031 O MIL-STD-202F METHOD-208 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16" ± 1/32" 2. Solderability at 245 ± 5 C for 5 sec. 3. High Temperature Reverse Bias V R=80% rate at T J=150 C for 168 hrs. 4. Pressure Cooker 15P SIG at T A=121 C for 4 hrs. 5. Temperature Cycling -55 C to +125 C dwelled for 30 min. and transferred for 5min. total 10 cycles. JESD22-A102 O O MIL-STD-750D METHOD-1051 O O 6. Thermal Shock MIL-STD-750D METHOD-1038 O MIL-STD-750D METHOD-1056 O 0 C for 5 min. rise to 100 C for 5 min. total 10 cycles. MIL-STD-750D METHOD-1021 O 7. Humidity at T A=85 C , RH=85% for 1000hrs. MIL-STD-750D METHOD-1031 O 8. High Temperature Storage Life http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 at 175 C for 1000 hrs. 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