Formosa MS

Formosa MS
Chip Zener Diode
ZGFM206V8B THRU ZGFM20200B
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Electrical characteristics................................................................... 3
Rating and characteristic curves........................................................ 4~5
Pinning information........................................................................... 6
Suggested solder pad layout............................................................. 6
Packing information.......................................................................... 7
Reel packing.................................................................................... 8
Suggested thermal profiles for soldering processes............................. 8
High reliability test capabilities........................................................... 9
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Page 1
DS-121729
Issued Date
2009/02/10
Revised Date
2010/04/12
Revision
B
Page.
9
Formosa MS
Chip Zener Diode
ZGFM206V8B THRU ZGFM20200B
2.0W Surface Mount Zener
Diodes - 6.8V-200V
Package outline
Features
SMB
• Batch process design, excellent power dissipation offers
•
•
•
•
•
•
•
0.213(5.4)
0.197(5.0)
better reverse leakage current and thermal resistance.
Glass passivated chip junction.
Standard zener voltage tolerance ±5%.
Low inductance.
Low profile package.
Built-in strain relief.
Lead-free parts meet environmental standards of
MIL-STD-19500 /228
Suffix "-H" indicates Halogen-free part, ex.ZGFM206V8B-H.
0.016(0.4) Typ.
0.142(3.6)
0.126(3.2)
0.075(1.9)
0.067(1.7)
Mechanical data
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, DO-214AA / SMB
• Terminals : Solder plated, solderable per
0.032(0.8) Typ.
0.032 (0.8) Typ.
Dimensions in inches and (millimeters)
MIL-STD-750, Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.09 gram
Maximum ratings (at T =25 C unless otherwise noted)
o
A
PARAMETER
CONDITIONS
Symbol
MIN.
TYP.
MAX.
UNIT
Forward voltage
I F = 200 mA
VF
1.20
V
Power Dissipation
T L = 75 °C
PD
2.0
W
Operating temperature
Storage temperature
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FAX:886-2-22696141
TJ
-55
+150
o
C
T STG
-65
+175
o
C
Document ID
Page 2
DS-121729
Issued Date
2009/02/10
Revised Date
2010/04/12
Revision
B
Page.
9
Formosa MS
Chip Zener Diode
ZGFM206V8B THRU ZGFM20200B
Electrical characteristics (at T =25 C unless otherwise noted)
o
A
Part No.
Marking
code
Zener
voltage
Test
current
Zener
impedance
V Z @ I ZT (Volts)
I ZT
Z ZT @ I ZT
Z ZK @ I ZK
Leakage
current
I ZK
IR
VR
Min.
Nom.
Max.
mA
(Ω)Max
(Ω)Max
mA
(uA)Max
Volts
ZGFM206V8B
2Z6V8
6.46
6.8
7.14
73.5
2.0
700
1.00
5.0
4.0
ZGFM207V5B
2Z7V5
7.13
7.5
7.88
66.5
2.0
700
0.50
5.0
5.0
ZGFM208V2B
2Z8V2
7.79
8.2
8.61
61
2.0
700
0.50
5.0
6.0
ZGFM208V7B
2Z8V7
8.27
8.7
9.14
58
2.0
700
0.50
4.0
6.6
ZGFM209V1B
2Z9V1
8.65
9.1
9.56
55
3.0
700
0.50
3.0
7.0
ZGFM2010B
2Z10
9.50
10
10.50
50
4.0
700
0.50
3.0
7.6
ZGFM2011B
2Z11
10.45
11
11.55
45.5
4.0
700
0.25
1.0
8.4
ZGFM2012B
2Z12
11.40
12
12.60
41.5
4.5
700
0.25
1.0
9.1
ZGFM2013B
2Z13
12.35
13
13.65
38.5
5.0
700
0.25
0.5
9.9
ZGFM2015B
2Z15
14.25
15
15.75
33.4
7.0
700
0.25
0.5
11.4
ZGFM2016B
2Z16
15.20
16
16.80
31.2
8.0
700
0.25
0.5
12.2
ZGFM2018B
2Z18
17.10
18
18.90
27.8
10.0
750
0.25
0.5
13.7
ZGFM2020B
2Z20
19.00
20
21.00
25.0
11.0
750
0.25
0.5
15.2
ZGFM2022B
2Z22
20.90
22
23.10
22.8
12.0
750
0.25
0.5
16.7
ZGFM2024B
2Z24
22.80
24
25.20
20.8
13.0
750
0.25
0.5
18.2
20.6
ZGFM2027B
2Z27
25.65
27
28.35
18.5
18.0
750
0.25
0.5
ZGFM2030B
2Z30
28.50
30
31.50
16.6
20.0
1000
0.25
0.5
22.8
ZGFM2033B
2Z33
31.35
33
34.65
15.1
23.0
1000
0.25
0.5
25.4
ZGFM2036B
2Z36
34.20
36
37.80
13.9
25.0
1000
0.25
0.5
27.4
ZGFM2039B
2Z39
37.05
39
40.95
12.8
30.0
1500
0.25
0.5
29.7
32.7
ZGFM2043B
2Z43
40.85
43
45.15
11.6
35.0
1500
0.25
0.5
ZGFM2047B
2Z47
44.65
47
49.35
10.6
40.0
1500
0.25
0.5
35.8
ZGFM2051B
2Z51
48.45
51
53.55
9.8
48.0
1500
0.25
0.5
38.8
ZGFM2056B
2Z56
53.20
56
58.80
9.0
55.0
2000
0.25
0.5
42.6
ZGFM2062B
2Z62
58.90
62
65.10
8.1
60.0
2000
0.25
0.5
47.1
ZGFM2068B
2Z68
64.60
68
71.40
7.4
75.0
2000
0.25
0.5
51.7
ZGFM2075B
2Z75
71.25
75
78.75
6.7
90.0
2000
0.25
0.5
56.0
ZGFM2082B
2Z82
77.90
82
86.10
6.1
100
3000
0.25
0.5
62.2
ZGFM2091B
2Z91
86.45
91
95.55
5.5
125
3000
0.25
0.5
69.2
ZGFM20100B
2Z100
95.00
100
105.0
5.0
175
3000
0.25
0.5
76.0
ZGFM20110B
2Z110
104.50
110
115.5
4.5
250
4000
0.25
0.5
83.6
ZGFM20120B
2Z120
114.00
120
126.0
4.2
325
4500
0.25
0.5
91.2
ZGFM20130B
2Z130
123.50
130
136.5
3.8
400
5000
0.25
0.5
98.8
ZGFM20150B
2Z150
142.50
150
157.5
3.3
575
6000
0.25
0.5
114.0
ZGFM20160B
2Z160
152.00
160
168.0
3.1
650
6500
0.25
0.5
121.6
ZGFM20180B
2Z180
171.00
180
189.0
2.8
725
7000
0.25
0.5
136.8
ZGFM20200B
2Z200
190.00
200
210.0
2.5
900
8000
0.25
0.5
152.0
Note : 5% tolerance of Zener voltage for suffix "B" ex: ZGFM206V8B is 6.8V 5%
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Page 3
DS-121729
Issued Date
2009/02/10
Revised Date
2010/04/12
Revision
B
Page.
9
Rating and characteristic curves (ZGFM206V8B THRU ZGFM20200B)
JL ( t,D )TRANSIENT THERMAL RESISTANCE
JUNCTION-TO-LEAD ( J / W )
FIG.1 Typical Thermal Response L
30
20
D=0.5
10
7
0.2
PPK
5
0.1
t1
3
0.05
t2
1
NOTE BELOW 0.1 SECOND,
THERMAL RESPONSE
CURVE IS APPLICABLE TO
ANY LEAD LENGTH(L)
0.02
0.7
0.5
SINGLE PULSE TJL=JL(t)PPK
REPETITIVE LULSES TJL=JL(t,D)PPK
D=0
0.01
0.3
0.0001
DUTY CYCLE, D=t1 t2
0.0002
0.0005
0.001
0.002
0.005
0.01
0.02
0.05
0.1
0.2
Fig. 2 Maximum Surge Power
0.5
1
2
5
10
Fig. 3 Maximum Surge Power
IR, REVERSE LEADAGE, (uAdc)
@VR AS SPECIFIED IN ELEC. CHAR. TABLE
500
150
RECTANGULAR NONREPETITIVE
WAVEFORM TJ=25 PRIOR TO
INITIAL PULSE
100
50
30
20
10
0.1
0.05
0.03
0.02
0.01
0.005
0.003
0.002
0.001
0.0005
0.0003
0.0002
0.0001
1
2
5
10
20
50
100
200
500
1K
NOMINAL VZ, (V)
10
20
30
50
70
100
P.W. PULSE WIDTH, (ms)
FIG.4 Units To 200 Volts
Fig 5. Units To 12 Volts
200
8
100
VZ, TEMPERATURE
COEFFICIENT (mV/°C)@IZT
VZ, TEMPERATURE
COEFFICIENT, ( mV/°C )@IZT
PPK, PEAK SURGE POWER, ( W )
250
RANGE
50
40
30
20
6
4
2
0
-2
-4
10
0
20
40
60
80
100
120
140
160
180
200
VZ, ZENER VOLTAGE@IZT, (V)
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TEL:886-2-22696661
FAX:886-2-22696141
3
4
6
8
10
12
VZ, ZENER VOLTAGE@IZT, (V)
Document ID
Page 4
DS-121729
Issued Date
2009/02/10
Revised Date
2010/04/12
Revision
B
Page.
9
Rating and characteristic curves (ZGFM206V8B THRU ZGFM20200B)
FIG.6 VZ = 3.9 Thru 10 Volts
FIG.7 VZ = 12 Thru 82 Volts
100
100
50
30
20
IZ, ZENER CURRENT ( mA )
IZ, ZENER CURRENT ( mA )
50
10
5
3
2
1
0.5
0.3
30
20
10
5
3
2
1
0.5
0.3
0.2
0.2
0.1
0.1
0
1
2
3
4
5
6
7
8
9
0
10
10
20
30
40
VZ, ZENER VOLTAGE, (V)
50
60
70
80
90
100
VZ, ZENER VOLTAGE, (V)
Fig. 8 VZ = 100 Thru 200 Volts
Fig. 9 Typical Thermal Resistance
100
30
20
10
5
3
2
1
0.5
0.3
0.2
0.1
100
120
140
160
180
200
JL, JUNCTION-LEAD THERMAL
RESISTANCE ( J / W )
IZ, ZENER CURRENT ( mA )
50
80
PRIMARY PATH OF
CONDUCTION IS THROUGH
THE CATHODE LEAD
70
60
50
40
30
20
10
0
0
1/8
1/4
3/8
1/2
5/8
3/4
7/8
Revised Date
Revision
1
VZ, ZENER VOLTAGE, (V)
NOMINAL VZ, (V)
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FAX:886-2-22696141
Document ID
Page 5
DS-121729
Issued Date
2009/02/10
2010/04/12
B
Page.
9
Formosa MS
Chip Zener Diode
ZGFM206V8B THRU ZGFM20200B
Pinning information
Pin
Pin1
Pin2
Simplified outline
cathode
anode
1
Symbol
2
1
2
Suggested solder pad layout
C
A
B
Dimensions in inches and (millimeters)
PACKAGE
A
B
C
SMB
0.142 (3.60)
0.059 (1.50)
0.118 (3.00)
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TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Page 6
DS-121729
Issued Date
2009/02/10
Revised Date
2010/04/12
Revision
B
Page.
9
Formosa MS
Chip Zener Diode
ZGFM206V8B THRU ZGFM20200B
Packing information
P0
P1
d
E
F
B
A
W
P
D2
D1
T
C
W1
D
unit:mm
Item
Symbol
Tolerance
SMB
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
A
B
C
d
D
D1
D
D1
D2
E
F
P
P0
P1
T
W
W1
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
3.81
5.74
2.24
1.50
330.00
50.00
178.00
62.00
13.00
1.75
5.50
8.00
4.00
2.00
0.23
12.00
18.00
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Page 7
DS-121729
Issued Date
2009/02/10
Revised Date
2010/04/12
Revision
B
Page.
9
Formosa MS
Chip Zener Diode
ZGFM206V8B THRU ZGFM20200B
Reel packing
PACKAGE
SMB
REEL SIZE
13"
REEL
(pcs)
COMPONENT
SPACING
(m/m)
BOX
(pcs)
INNER
BOX
(m/m)
REEL
DIA,
(m/m)
4,000
8.0
8,000
337*337*37
330
CARTON
SIZE
(m/m)
350*330*360
CARTON
(pcs)
APPROX.
GROSS WEIGHT
(kg)
16.9
64,000
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Critical Zone
TL to TP
Tp
TP
Ramp-up
TL
TL
Tsmax
Temperature
Tsmin
tS
Preheat
Ramp-down
25
t25o C to Peak
Time
3.Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(T L to T P )
o
<3 C /sec
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t s )
150 oC
200 oC
60~120sec
Tsmax to T L
-Ramp-upRate
<3 oC/sec
Time maintained above:
-Temperature(T L )
-Time(t L )
217 oC
60~260sec
255 oC-0/+5 oC
Peak Temperature(T P )
Time within 5 oC of actual Peak
Temperature(t P )
10~30sec
Ramp-down Rate
<6 oC/sec
Time 25 oC to Peak Temperature
<6minutes
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TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Page 8
DS-121729
Issued Date
2009/02/10
Revised Date
2010/04/12
Revision
B
Page.
9
Formosa MS
Chip Zener Diode
ZGFM206V8B THRU ZGFM20200B
High reliability test capabilities
Item Test
Conditions
Reference
O
1. Solder Resistance
at 260 ± 5 C for 10 ± 2sec.
immerse body into solder 1/16"±1/32"
MIL-STD-750D
METHOD-2031
2. Solderability
at 245±5 OC for 5 sec.
MIL-STD-202F
METHOD-208
3. High Temperature Reverse Bias
V R=80% rate at T J=150 OC for 168 hrs.
MIL-STD-750D
METHOD-1038
4. Pressure Cooker
15P SIG at T A=121 OC for 4 hrs.
JESD22-A102
5. Temperature Cycling
-55 OC to +125 OC dwelled for 30 min.
and transferred for 5min. total 10 cycles.
MIL-STD-750D
METHOD-1051
0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles.
MIL-STD-750D
METHOD-1056
at T A=85 OC, RH=85% for 1000hrs.
MIL-STD-750D
METHOD-1021
at 175 OC for 1000 hrs.
MIL-STD-750D
METHOD-1031
6. Thermal Shock
7. Humidity
8. High Temperature Storage Life
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Page 9
DS-121729
Issued Date
2009/02/10
Revised Date
2010/04/12
Revision
B
Page.
9