Formosa MS Chip Zener Diode ZGFM5921B THRU ZGFM5949B List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Electrical characteristics................................................................... 3 Rating and characteristic curves........................................................ 4 Pinning information........................................................................... 5 Suggested solder pad layout............................................................. 5 Packing information.......................................................................... 6 Reel packing.................................................................................... 7 Suggested thermal profiles for soldering processes............................. 7 High reliability test capabilities........................................................... 8 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date Revised Date DS-121742 2009/08/10 2011/12/15 Revision D Page. 8 Formosa MS Chip Zener Diode ZGFM5921B THRU ZGFM5949B 1.5W Surface Mount Zener Diodes - 6.8V-100V Package outline Features SMA • Batch process design, excellent power dissipation offers 0.196(4.9) 0.180(4.5) better reverse leakage current and thermal resistance. • Wide zener reverse voltage range 6.8V to 100V. • Small package size for high density applications. • Ideally suited for automated assembly processes. • Lead-free parts meet environmental standards of • 0.012(0.3) Typ. 0.106(2.7) 0.091(2.3) MIL-STD-19500 /228 Suffix "-H" indicates Halogen-free part, ex.ZGFM5921B-H. 0.068(1.7) 0.060(1.5) Mechanical data 0.032(0.8) Typ. • Epoxy : UL94-V0 rated flame retardant • Case : Molded plastic, DO-214AC/ SMA • Terminals :Plated terminals, solderable per MIL-STD-750, 0.032 (0.8) Typ. Dimensions in inches and (millimeters) Method 2026 • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.05gram Maximum ratings (at T =25 C unless otherwise noted) o A PARAMETER CONDITIONS Power Dissipation at T L=75°C Forward voltage MIN. TYP. PD I F = 200 mA VF Operating temperature Storage temperature http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Symbol Page 2 MAX. UNIT 1.5 W 1.5 V TJ -55 +150 o C T STG -65 +175 o C Document ID Issued Date Revised Date DS-121742 2009/08/10 2011/12/15 Revision D Page. 8 Formosa MS Chip Zener Diode ZGFM5921B THRU ZGFM5949B Electrical characteristics (at T =25 C unless otherwise noted) o A Part No. Marking code Zener voltage Test current Zener impedance V Z @ I ZT (Volts) I ZT Z ZT @ I ZT Z ZK @ I ZK Leakage current I ZK IR VR Min. Nom. Max. mA (Ω)Max (Ω)Max mA (uA)Max Volts ZGFM5921B 5921 6.46 6.8 7.14 55.1 2.5 200 1.00 5 5.2 ZGFM5922B 5922 7.13 7.5 7.88 50.0 3.0 400 0.50 5 6.0 ZGFM5923B 5923 7.79 8.2 8.61 45.7 3.5 400 0.50 5 6.5 ZGFM5924B 5924 8.65 9.1 9.56 41.2 4.0 500 0.50 5 7.0 ZGFM5925B 5925 9.50 10 10.50 37.5 4.5 500 0.25 5 8.0 ZGFM5926B 5926 10.45 11 11.55 34.1 5.5 550 0.25 1 8.4 ZGFM5927B 5927 11.40 12 12.60 31.2 6.5 550 0.25 1 9.1 ZGFM5928B 5928 12.35 13 13.65 28.8 7 550 0.25 1 9.9 ZGFM5929B 5929 14.25 15 15.75 25.0 9 600 0.25 1 11.4 ZGFM5930B 5930 15.20 16 16.80 23.4 10 600 0.25 1 12.2 ZGFM5931B 5931 17.10 18 18.90 20.8 12 650 0.25 1 13.7 ZGFM5932B 5932 19.00 20 21.00 18.7 14 650 0.25 1 15.2 ZGFM5933B 5933 20.90 22 23.10 17.0 18 650 0.25 1 16.7 ZGFM5934B 5934 22.80 24 25.20 15.6 19 700 0.25 1 18.2 ZGFM5935B 5935 25.65 27 28.35 13.9 23 700 0.25 1 20.6 ZGFM5936B 5936 28.50 30 31.50 12.5 26 750 0.25 1 22.8 ZGFM5937B 5937 31.35 33 34.65 11.4 33 800 0.25 1 25.1 ZGFM5938B 5938 34.20 36 37.80 10.4 38 850 0.25 1 27.4 ZGFM5939B 5939 37.05 39 40.95 9.6 45 900 0.25 1 29.7 ZGFM5940B 5940 40.85 43 45.15 8.7 53 950 0.25 1 32.7 ZGFM5941B 5941 44.65 47 49.35 8.0 67 1000 0.25 1 35.8 ZGFM5942B 5942 48.45 51 53.55 7.3 70 1100 0.25 1 38.8 ZGFM5943B 5943 53.20 56 58.80 6.7 86 1300 0.25 1 42.6 ZGFM5944B 5944 58.90 62 65.10 6.0 100 1500 0.25 1 47.1 ZGFM5945B 5945 64.60 68 71.40 5.5 120 1700 0.25 1 51.7 ZGFM5946B 5946 71.25 75 78.75 5.0 140 2000 0.25 1 56.0 ZGFM5947B 5947 77.90 82 86.10 4.6 160 2500 0.25 1 62.2 ZGFM5948B 5948 86.45 91 95.55 4.1 200 3000 0.25 1 69.2 ZGFM5949B 5949 95.00 100 105.0 3.7 250 3100 0.25 1 76.0 Note : 5% tolerance of Zener voltage http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 3 Document ID Issued Date Revised Date DS-121742 2009/08/10 2011/12/15 Revision D Page. 8 Rating and characteristic curves (ZGFM5921B THRU ZGFM5949B) FIG.2 ZENER VOLTAGE TO 12 VOLTS è VZ, TEMPERATURE COEFICENT, (mV/ OC) P D, MAXIMUM POWER DISSIPATION, (W) FIG.1 STEADY STATE POWER DERATING 2.5 2.0 1.5 1 0.5 0 0 20 40 60 80 100 120 140 150 180 10 V Z@I ZT 8 6 4 2 0 -2 -4 2 4 T L, LEAD TEMPERATURE, ( OC) 8 10 12 V Z, ZENER VOLTAGE, (V) FIG.4 EFFECT OF ZENER CURRENT Z Z, DYNAMIC IMPEDANCE, (OHMS) θVZ, TEMPERATURE COEFFICIENT (mV/°C) FIG.3 ZENER VOLTAGE 12 TO 68 VOLTAGE O T J = 25 C I Z(RMS) = 0.1 I Z(dc) I Z, ZENER TEST CURRENT, (mA) V Z, ZENER VOLTAGE, (V) FIG.5 EFFECT OF ZENER VOLTAGE FIG.6 MAXIMUM SURGE POWER 200 1K I Z(dc) = 1mA 100 P PK, PEAKSURGE POWER, (W) Z Z, DYNAMIC IMPEDANCE, (OHMS) 6 70 50 30 20 10mA 10 I Z(rms) = 0.1 I Z(dc) 7 5 3 2 20mA 5 7 10 RECTANGULAR NONREPETITIVE WAVEFORM T J=25 °C PRIOR TO INTIAL PULSE 500 3000 200 100 50 30 20 10 20 30 40 50 60 70 100 0.1 0.2 0.3 0.5 1 2 5 10 50 100 Revision Page. PW, PULSE WIDTH, (ms) V Z, ZENER VOLTAGE, (V) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date Revised Date DS-121742 2009/08/10 2011/12/15 D 8 Formosa MS Chip Zener Diode ZGFM5921B THRU ZGFM5949B FIG.7 V Z = 6.8 THRU 10 VOLTAGE FIG.8 V Z = 12 THRU 82VOLTAGE I Z, ZENER CURRENT, (mA) I Z, ZENER CURRENT, (mA) 100 10 5 1 0.5 0.1 0 1 2 3 4 5 6 7 8 9 10 V Z, ZENER VOLTAGE, (V) V Z, ZENER VOLTAGE, (V) Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Suggested solder pad layout C A B Dimensions in inches and (millimeters) PACKAGE A B C SMA 0.110 (2.80) 0.063 (1.60) 0.087 (2.20) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date Revised Date DS-121742 2009/08/10 2011/12/15 Revision D Page. 8 Formosa MS Chip Zener Diode ZGFM5921B THRU ZGFM5949B Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SMA Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 2.80 5.00 1.90 1.50 330.00 50.00 178.00 62.00 13.00 1.75 5.50 4.00 4.00 2.00 0.23 12.00 18.00 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date Revised Date DS-121742 2009/08/10 2011/12/15 Revision D Page. 8 Formosa MS Chip Zener Diode ZGFM5921B THRU ZGFM5949B Reel packing PACKAGE REEL SIZE REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) CARTON SIZE (m/m) CARTON (pcs) APPROX. GROSS WEIGHT (kg) SMA 7" 2,000 4.0 20,000 183*170*183 178 382*356*387 160,000 16.0 SMA 13" 7,500 4.0 15,000 337*337*37 330 350*330*360 120,000 14.2 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC/sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 oC/sec Time 25 oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 7 Document ID Issued Date Revised Date DS-121742 2009/08/10 2011/12/15 Revision D Page. 8 Formosa MS Chip Zener Diode ZGFM5921B THRU ZGFM5949B High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T J=150 OC for 168 hrs. MIL-STD-750D METHOD-1038 4. Pressure Cooker 15P SIG at T A=121 OC for 4 hrs. JESD22-A102 5. Temperature Cycling -55 OC to +125 OC dwelled for 30 min. and transferred for 5min. total 10 cycles. MIL-STD-750D METHOD-1051 0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles. MIL-STD-750D METHOD-1056 at T A=85 OC, RH=85% for 1000hrs. MIL-STD-750D METHOD-1021 at 175 OC for 1000 hrs. MIL-STD-750D METHOD-1031 6. Thermal Shock 7. Humidity 8. High Temperature Storage Life http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 8 Document ID Issued Date Revised Date DS-121742 2009/08/10 2011/12/15 Revision D Page. 8