rlz series

Formosa MS
GLASS MINI-MELF Zener Diode
RLZ SERIES
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Electrical characteristics................................................................... 3~4
Rating and characteristic curves........................................................ 4~5
Pinning information........................................................................... 6
Suggested solder pad layout............................................................. 6
Packing information.......................................................................... 7
Reel packing.................................................................................... 8
Suggested thermal profiles for soldering processes............................. 8
High reliability test capabilities........................................................... 9
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TEL:886-2-22696661
FAX:886-2-22696141
Page 1
Document ID
Issued Date
Revised Date
DS-221725
2008/02/10
2011/09/16
Revision
D
Page.
9
Formosa MS
GLASS MINI-MELF Zener Diode
RLZ SERIES
500mW Surface Mount Zener
Diodes - 2.0V-39V
Package outline
SOD-80
Features
• For use as low voltage stabilizer or voltage reference
• Silicon epitaxial planar chip struction
• High reliability
• Glass sealed envelope
• Small surface mounting type
• Lead-free parts for green partner, meet RoHS
• Environment substance directive request
.146(3.7)
.130(3.3)
SOLDERABLE
ENDS
.019(.48)
.011(.28)
.063(1.6)
.055(1.4)
Mechanical data
• Case : Glass Mini-Melf / SOD-80
• Terminals :Plated terminals, solderable per MIL-STD-750,
Dimensions in inches and (millimeters)
Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.03 gram
Maximum ratings (at T =25 C unless otherwise noted)
o
A
PARAMETER
Forward voltage
CONDITIONS
I F = 100 mA
Power dissipation at 25°C
Thermal resistance
Symbol
MIN.
TYP.
MAX.
UNIT
VF
1.0
V
PD
500
mW
500
K/W
R θJA
Junction temperature
TJ
-65
+175
o
C
Storage Temperature
T STG
-65
+175
o
C
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Page 2
Document ID
Issued Date
Revised Date
DS-221725
2008/02/10
2011/09/16
Revision
D
Page.
9
Formosa MS
GLASS MINI-MELF Zener Diode
Electrical characteristics (at T =25 C unless otherwise noted)
o
A
Zener
voltage
Zener
impedance
Leakage
current
Type No.
Z ZT @ I ZT
V Z (Volt)@ I ZT
IR
Z ZK @ I ZK
Rank
Min.
Max.
I ZT (mA)
RLZ2.0
A
B
1.88
2.02
2.10
2.20
20
140
20
2000
1
120
0.5
RLZ2.2
A
B
2.12
2.22
2.30
2.41
20
120
20
2000
1
120
0.7
RLZ2.4
A
B
2.33
2.43
2.52
2.63
20
100
20
2000
1
120
1.0
RLZ2.7
A
B
2.54
2.69
2.75
2.91
20
100
20
1000
1
120
1.0
RLZ3.0
A
B
2.85
3.01
3.07
3.22
20
80
20
1000
1
50
1.0
RLZ3.3
A
B
3.16
3.32
3.38
3.53
20
70
20
1000
1
20
1.0
RLZ3.6
A
B
3.46
3.60
3.69
3.84
20
60
20
1000
1
10
1.0
RLZ3.9
A
B
3.74
3.89
4.01
4.16
20
50
20
1000
1
5
1.0
RLZ4.3
A
B
C
4.04
4.17
4.30
4.29
4.43
4.57
20
40
20
1000
1
5
1.0
RLZ4.7
A
B
C
4.44
4.55
4.68
4.68
4.80
4.93
20
25
20
900
1
5
1.0
RLZ5.1
A
B
C
4.81
4.94
5.09
5.07
5.20
5.37
20
20
20
800
1
5
1.5
RLZ5.6
A
B
C
5.28
5.45
5.61
5.55
5.73
5.91
20
13
20
500
1
5
2.5
RLZ6.2
A
B
C
5.78
5.96
6.12
6.09
6.27
6.44
20
10
20
300
1
5
3.0
RLZ6.8
A
B
C
6.29
6.49
6.66
6.63
6.83
7.01
20
8
20
150
0.5
2
3.5
RLZ7.5
A
B
C
6.85
7.07
7.29
7.22
7.45
7.67
20
8
20
120
0.5
0.5
4.0
RLZ8.2
A
B
C
7.53
7.78
8.03
7.92
8.19
8.45
20
8
20
120
0.5
0.5
5.0
RLZ9.1
A
B
C
8.29
8.57
8.83
8.73
9.01
9.30
20
8
20
120
0.5
0.5
6.0
RLZ10
A
B
C
D
9.12
9.41
9.70
9.94
9.59
9.90
10.20
10.44
20
8
20
120
0.5
0.2
7.0
RLZ11
A
B
C
10.18
10.50
10.82
10.71
11.05
11.38
10
10
10
120
0.5
0.2
8.0
RLZ12
A
B
C
11.13
11.44
11.74
11.71
12.03
12.35
10
12
10
110
0.5
0.2
9.0
RLZ13
A
B
C
12.11
12.55
12.99
12.75
13.21
13.66
10
14
10
110
0.5
0.2
10
RLZ15
A
B
C
13.44
13.89
14.35
14.13
14.62
15.09
10
16
10
110
0.5
0.2
11
RLZ16
A
B
C
14.80
15.25
15.69
15.57
16.04
16.51
10
18
10
150
0.5
0.2
12
RLZ18
A
B
C
16.22
16.82
17.42
17.06
17.70
18.33
10
23
10
150
0.5
0.2
13
A
B
C
D
18.20
18.63
19.23
19.72
18.96
19.59
20.22
20.72
10
28
10
200
0.5
0.2
15
RLZ20
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Max. (Ω)
I ZT (mA)
Page 3
Max. (Ω)
I ZK (mA)
Max. (uA)
Document ID
Issued Date
Revised Date
DS-221725
2008/02/10
2011/09/16
V R (Volts)
Revision
D
Page.
9
Formosa MS
GLASS MINI-MELF Zener Diode
Electrical characteristics (at T =25 C unless otherwise noted)
o
A
Zener
voltage
Zener
impedance
Leakage
current
Type No.
Z ZT @ I ZT
V Z (Volt)@ I ZT
IR
Z ZK @ I ZK
Rank
Min.
Max.
I ZT (mA)
I ZT (mA)
Max. (Ω)
I ZK (mA)
Max. (Ω)
Max. (uA)
V R (Volts)
RLZ22
A
B
C
D
20.15
20.64
21.08
21.52
21.20
21.71
22.17
22.63
5
30
5
200
0.5
0.2
17
RLZ24
A
B
C
D
22.05
22.61
23.12
23.63
23.18
23.77
24.13
24.85
5
35
5
200
0.5
0.2
19
RLZ27
A
B
C
D
24.26
24.97
25.63
26.29
25.52
26.26
26.95
27.64
5
45
5
250
0.5
0.2
21
RLZ30
A
B
C
D
26.99
27.70
28.36
29.02
28.39
29.13
29.82
30.51
5
55
5
250
0.5
0.2
23
RLZ33
A
B
C
D
29.68
30.32
30.90
31.49
31.22
31.88
32.50
33.11
5
65
5
250
0.5
0.2
25
RLZ36
A
B
C
D
32.14
32.79
33.40
34.01
33.79
34.49
35.13
35.77
5
75
5
250
0.5
0.2
27
RLZ39
A
B
C
D
34.68
35.36
36.00
36.63
36.47
37.19
37.85
38.52
5
85
5
250
0.5
0.2
30
Rating and characteristic curves (RLZ Series )
Power Dissipation Pd (mW)
Fig.1 - Power Dissipation Derating Curve
600
500
400
300
200
100
0
25
50
75
100
125 150 175
200
Ambient Temperature ( °C)
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TEL:886-2-22696661
FAX:886-2-22696141
Page 4
Document ID
Issued Date
Revised Date
DS-221725
2008/02/10
2011/09/16
Revision
D
Page.
9
Rating and characteristic curves (RLZ Series )
Fig. 2 - Zener Voltage vs Zener Current Curve
10 0
Zener Current Iz (mA)
10
1.0
0.1
0.01
2.0
3.0
5.6
0
4.3 4.7
11
6.8
3.9
2.7 3.3
2.4
3.6
6.2
7.5
8.2
13
9.1
5.1
10
5
10
12
16
15
15
18
20
22
24
20
27
30
25
33
30
36
39
35
40
Zener Voltage Vz (Volts)
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Page 5
Document ID
Issued Date
Revised Date
DS-221725
2008/02/10
2011/09/16
Revision
D
Page.
9
Formosa MS
GLASS MINI-MELF Zener Diode
RLZ SERIES
Pinning information
Pin
Pin1
Pin2
Simplified outline
cathode
anode
1
Symbol
2
1
2
Suggested solder pad layout
C
A
B
Dimensions in inches and (millimeters)
PACKAGE
A
B
C
SOD-80
0.071 (1.80)
0.035 (0.90)
0.102 (2.60)
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TEL:886-2-22696661
FAX:886-2-22696141
Page 6
Document ID
Issued Date
Revised Date
DS-221725
2008/02/10
2011/09/16
Revision
D
Page.
9
Formosa MS
GLASS MINI-MELF Zener Diode
RLZ SERIES
Packing information
P0
P1
d
E
F
B
A
W
P
D2
D1
T
C
W1
D
unit:mm
Symbol
Tolerance
Carrier width
Carrier length
Carrier depth
Sprocket hole
A
B
C
d
0.1
0.1
0.1
0.1
2.00
3.70
1.80
1.50
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
D
D1
D2
E
F
P
P0
P1
T
W
W1
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
178.00
50.00
13.00
1.75
3.50
4.00
4.00
2.00
0.23
8.00
11.40
Item
SOD-80
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
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TEL:886-2-22696661
FAX:886-2-22696141
Page 7
Document ID
Issued Date
Revised Date
DS-221725
2008/02/10
2011/09/16
Revision
D
Page.
9
Formosa MS
GLASS MINI-MELF Zener Diode
RLZ SERIES
Reel packing
PACKAGE
REEL SIZE
7"
SOD-80
REEL
(pcs)
COMPONENT
SPACING
(m/m)
4.0
2500
BOX
(pcs)
25,000
INNER
BOX
(m/m)
183*183*123
REEL
DIA,
(m/m)
178
CARTON
SIZE
(m/m)
CARTON
(pcs)
382*262*387
200,000
APPROX.
GROSS WEIGHT
(kg)
9.6
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Critical Zone
TL to TP
Tp
TP
Ramp-up
TL
TL
Tsmax
Temperature
Tsmin
tS
Preheat
Ramp-down
25
t25o C to Peak
Time
3.Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(T L to T P )
o
<3 C /sec
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t s )
150 oC
200 oC
60~120sec
Tsmax to T L
-Ramp-upRate
<3 oC/sec
Time maintained above:
-Temperature(T L )
-Time(t L )
217 oC
60~260sec
255 oC-0/+5 oC
Peak Temperature(T P )
Time within 5 oC of actual Peak
Temperature(t P )
10~30sec
Ramp-down Rate
<6 oC/sec
Time 25 oC to Peak Temperature
<6minutes
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TEL:886-2-22696661
FAX:886-2-22696141
Page 8
Document ID
Issued Date
Revised Date
DS-221725
2008/02/10
2011/09/16
Revision
D
Page.
9
Formosa MS
GLASS MINI-MELF Zener Diode
RLZ SERIES
High reliability test capabilities
Item Test
Conditions
Reference
O
1. Solder Resistance
at 260 ± 5 C for 10 ± 2sec.
immerse body into solder 1/16"±1/32"
MIL-STD-750D
METHOD-2031
2. Solderability
at 245±5 OC for 5 sec.
MIL-STD-202F
METHOD-208
3. High Temperature Reverse Bias
V R=80% rate at T J=175 OC for 168 hrs.
MIL-STD-750D
METHOD-1038
4. Pressure Cooker
15P SIG at T A=121 OC for 4 hrs.
JESD22-A102
5. Temperature Cycling
-55 OC to +125 OC dwelled for 30 min.
and transferred for 5min. total 10 cycles.
MIL-STD-750D
METHOD-1051
0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles.
MIL-STD-750D
METHOD-1056
at T A=85 OC, RH=85% for 1000hrs.
MIL-STD-750D
METHOD-1021
at 175 OC for 1000 hrs.
MIL-STD-750D
METHOD-1031
6. Thermal Shock
7. Humidity
8. High Temperature Storage Life
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TEL:886-2-22696661
FAX:886-2-22696141
Page 9
Document ID
Issued Date
Revised Date
DS-221725
2008/02/10
2011/09/16
Revision
D
Page.
9