Formosa MS Chip General Purpose Mini Bridge Rectifier LBS05-QH THRU LBS10-QH List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing .................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date DS-141146 2014/06/30 Revised Date - Revision Page. A 7 Formosa MS Chip General Purpose Mini Bridge Rectifier LBS05-QH THRU LBS10-QH 1.0A Miniature Glass Passivated Single-Phase Surface Mount Bridge Rectifiers-50V-1000V Package outline QFNB Features .221(5.6) .213(5.4) • Low profile package : 1.00 mm (typ.) • Glass passivated chip junction. • Flat lead plastic package. • Ideally suited for automatic assembly. • Ultra thin profile package for space constrained utilization. • Low forward voltage drop. • Lead-free parts meet RoHS requirments. • Suffix "-H" indicates Halogen-free part, ex.LBS05-QH-H. .256(6.5) .249(6.3) .249(6.3) .241(6.1) .010(0.25) .006(0.15) .044(1.10) .036(0.90) Mechanical data .0256(0.65) .0217(0.55) .0335(0.85) .0296(0.75) • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, QFNB • Terminals : Solder plated, solderable per MIL-STD-202, Method 208 • Polarity : marked on body • Mounting Position : Any • Weight : Approximated 0.098 gram .006(0.15) .002(0.05) .1595(4.05) .1556(3.95) Dimensions in inches and (millimeters) Maximum ratings (AT o T A=25 C unless otherwise noted) SYMBOLS LBS05-QH Maximum repetitive peak reverse voltage VRRM 50 Maximum RMS voltage VRMS Maximum DC blocking voltage VDC Maximum average forward rectified current IO 1.0 A Peak forward surge current 8.3ms single half sine-wave(JEDEC method) IFSM 30 A Maximum Rating for fusing ( t < 8 . 3 ms ) I 2t 3.7 A 2s Operating junction temperature range TJ -55 to +150 °C Storage temperature range TSTG -65 to +175 °C PARAMETER Electrical characteristics (AT PARAMETER LBS1-QH LBS2-QH LBS4-QH LBS6-QH 100 200 400 600 800 1000 V 35 70 140 280 420 560 700 V 50 100 200 400 600 800 1000 V LBS8-QH LBS10-QH UNIT o T A=25 C unless otherwise noted) SYMBOLS LBS05-QH LBS1-QH LBS2-QH LBS4-QH LBS6-QH LBS8-QH LBS10-QH UNIT Maximum forward voltage at I F =1.0A VF 1.1 V Maximum DC reverse current at rated DC blocking voltage IR 5.0 500 uA uA at T J =25 ° C at T J =125 ° C Thermal characteristics PARAMETER Typical thermal resistance j unction to ambient (1) Typical thermal resistance j unction to case (1) SYMBOLS LBS05-QH LBS1-QH LBS2-QH LBS4-QH LBS6-QH LBS8-QH LBS10-QH 55 35 RθJA RθJC UNIT °C/W °C/W per leg Note 1: Mounted on Aluminum substrate 15 x 15 x 1.7mm. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 2 Document ID Issued Date DS-141146 2014/06/30 Revised Date - Revision Page. A 7 Rating and characteristic curves (LBS05-QH THRU LBS10-QH) Mounted on Aluminum substrate 15 x 15 x 1.7mm. CASE TEMPERATURE, ℃ 2 1 0.1 TJ=25°C 0.01 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 3 0. 4 0. 5 0. 6 0.7 0. 8 0.9 1. 0 Document ID Issued Date DS-141146 2014/06/30 1. 1 1. 2 Revised Date - Revision Page. A 7 Formosa MS Chip General Purpose Mini Bridge Rectifier LBS05-QH THRU LBS10-QH Pinning information Simplified outline Symbol Marking Type number Marking code LBS05-QH LBS1 -QH LBS2 -QH LBS4 -QH LBS6 -QH LBS8 -QH LBS10 -QH Example LBS05 LBS1 LBS2 LBS4 LBS6 LBS8 LBS10 Polarity: LBSXX Positive output terminal – Negative output terminal Marking code: XX: 05,1,2,4,6,8 or 10 Suggested solder pad layout A D B C Dimensions in inches and (millimeters) PACKAGE QFNB http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 A 0.032 (0.80)MIN B C D 0.044 (1.10)MIN 0.158(4.00)REF 0.182 (4.60)REF Page 4 Document ID Issued Date DS-141146 2014/06/30 Revised Date - Revision Page. A 7 Formosa MS Chip General Purpose Mini Bridge Rectifier LBS05-QH THRU LBS10-QH Packing information C D D1 D2 W1 unit:mm Item Symbol Tolerance Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 t W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.05 0.1 0.1 0.05 0.1 0.3 1.0 QFNB 5.75 6.65 1.25 1.50 330.00 50.00 13.00 1.75 5.50 8.00 4.00 2.00 0.30 12.00 12~14.4 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date DS-141146 2014/06/30 Revised Date - Revision Page. A 7 Formosa MS Chip General Purpose Mini Bridge Rectifier LBS05-QH THRU LBS10-QH Reel packing PACKAGE REEL SIZE 13" QFNB REEL (pcs) COMPONENT SPACING (m/m) 5,000 8.0 BOX (pcs) 10,000 INNER BOX (m/m) REEL DIA, (m/m) 360*340*45 330 CARTON SIZE (m/m) CARTON (pcs) APPROX. GROSS WEIGHT (kg) 80,000 14.0 380*365*400 Suggested thermal profiles for soldering processes o o 1.Storage environment: Temperature=5 C ~40 C Humidity=55%± 25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC /sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC- 0/ + 5 oC Peak Temperature(T P ) o Time within 5 C of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate o <6 C /sec o Time 25 C to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date DS-141146 2014/06/30 Revised Date - Revision Page. A 7 Formosa MS Chip General Purpose Mini Bridge Rectifier LBS05-QH THRU LBS10-QH High reliability test capabilities Item Test Conditions Reference O MIL-STD-750D METHOD-2031 O MIL-STD-202F METHOD-208 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16" ± 1/32" 2. Solderability at 245 ± 5 C for 5 sec. 3. High Temperature Reverse Bias V R=80% rate at T J=150 C for 168 hrs. 4. Forward Operation Life Rated average rectifier current at T A=25 C for 500hrs. MIL-STD-750D METHOD-1038 O MIL-STD-750D METHOD-1027 O O 5. Intermittent Operation Life 6. Pressure Cooker T A = 25 C, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 JESD22-A102 O 15P SIG at T A=121 C for 4 hrs. O O 7. Temperature Cycling -55 C to +125 C dwelled for 30 min. and transferred for 5min. total 10 cycles. MIL-STD-750D METHOD-1051 8. Forward Surge 8.3ms single half sine-wave , one surge. MIL-STD-750D METHOD-4066-2 9. Humidity at T A=85 C , RH=85% for 1000hrs. 10. High Temperature Storage Life at 175 C for 1000 hrs. MIL-STD-750D METHOD-1021 O http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 MIL-STD-750D METHOD-1031 O Page 7 Document ID Issued Date DS-141146 2014/06/30 Revised Date - Revision Page. A 7