Formosa MS Glass Passivated Rectifier 1N4001G THRU 1N4007G List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings .............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Taping & bulk specifications for AXIAL devices.................................... 4 Suggested thermal profiles for soldering processes............................. 5 High reliability test capabilities...........................................................6 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date DS-222121 2008/02/10 Revised Date - Revision Page. A 6 Formosa MS Glass Passivated Rectifier 1N4001G THRU 1N4007G 1.0A Leaded Type Glass Passivated General Purpose Rectifiers - 50V-1000V Package outline Features DO-41 • Axial lead type devices for through hole design. • High current capability. • High surge capability. • Glass passivated chip junction inside • Lead-free parts meet environmental standards of 1.0(25.4) MIN. MIL-STD-19500 /228 .107(2.7) .080(2.0) DIA. .205(5.2) .166(4.2) Mechanical data 1.0(25.4) MIN. .034(.9) • Epoxy : UL94-V0 rated flame retardant • Case : Molded plastic, D0-41 • Lead : Axial leads, solderable per MIL-STD-202, .028(.7) DIA. Method 208 guranteed Dimensions in inches and (millimeters) • Polarity: Color band denotes cathode end • Mounting Position : Any • Weight : Approximated 0.33 gram Maximum ratings (AT T A=25 oC unless otherwise noted) PARAMETER CONDITIONS See Fig.2 Forward surge current 8.3ms single half sine-wave superimposed on rate load (JEDEC methode) V R = V RRM T A = 25 OC Junction to ambient, note 2 f=1MHz and applied 4V DC reverse voltage Storage temperature SYMBOLS *1 V RRM (V) I FSM *3 VR (V) 1N4001G 50 35 50 1N4002G 100 70 100 1N4003G 200 140 200 1N4004G 400 280 400 1N4005G 600 420 600 1N4006G 800 560 800 1N4007G 1000 700 1000 *4 VF (V) *5 T RR (µs) Operating temperature T J, ( OC) MAX. A 30 A 50 45 CJ 10 -65 UNIT 1.0 5.0 R èJA T STG V RMS*2 (V) TYP. IR V R = V RRM T A = 125 OC Thermal resistance Diode junction capacitance MIN. IO Forward rectified current Reverse current Symbol uA O C/W pF +175 O C *1 Repetitive peak reverse voltage *2 RMS voltage *3 Continuous reverse voltage 1.1 1.8 -55 to +150 *4 Maximum forward voltage *8 Typical reverse recovery time, note 1 Note 1. Reverse recovery time test condition, IF =0.5A, IR =1.0A, IRR =0.25A 2. Thermal resistance from junction to ambient http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 2 Document ID Issued Date DS-222121 2008/02/10 Revised Date - Revision Page. A 6 1.2 Fig.1 - Forward Current Derating Curve RESISTIVE OR INDUCTIVE LOAD 1.0 0.8 0.6 0.4 0.2 0 20 40 60 80 100 120 140 Peak Forward Surge Current (A) Average Forward Current (A) Rating and characteristic curves (1N4001G THRU 1N4007G) 160 Fig. 2 - Maximum Non-Repetitive Peak Forward Surge Current 100 10 8.3mS single half sine-wave (JEDEC Method) 1 1 100 T J =25°C 1.0 0.1 pulse width =300µS 1% duty cycle 0.01 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 Instantaneous Reverse Current (µA) Instantaneous Forward Current (A) Fig. 3 - Typical Instantaneour Forward Characteristics 10 10 100 Number of Cycles at 60 Hz Lead Temperature ( °C) 2.0 Fig. 4 - Typical Reverse Characteristics 10 1.0 T J=125°C 0.1 T J=75°C T J=25°C 0.01 0.001 0 20 40 60 80 100 Percent of Rated Peak Reverse Voltage ( %) Instantaneous Forward Voltage (Volts) Fig. 5 - Typical Junction Capacitance Junction Capacitance (pF) 100 10 1 0.01 0.1 1.0 10 100 Reverse Voltage (Volts) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 3 Document ID Issued Date DS-222121 2008/02/10 Revised Date - Revision Page. A 6 Formosa MS Glass Passivated Rectifier 1N4001G THRU 1N4007G Pinning information Pin Pin1 Pin2 Simplified outline cathode anode Symbol 1 2 1 2 Marking Type number 1N4001G 1N4002G 1N4003G 1N4004G 1N4005G 1N4006G 1N4007G Marking code 1N4001G 1N4002G 1N4003G 1N4004G 1N4005G 1N4006G 1N4007G Taping & bulk specifications for AXIAL devices 52.4mm 17mm DIA. 55mm Max. A 17mm DIA. 72mm DIA. 71mm Max. 355mm OFF Center both sids 1.0mm Max OFF Alignment 1.2mm 6.3mm REEL PACKING DEVICE Q'TY 1 COMPONENT CARTON Q'TY 2 APPROX. CASE (PCS / REEL) SPACING SIZE (PCS / CARTON) CROSS TYPE "A" in FIG. A DO-41 5,000 WEIGHT(kg) 5 mm 360 * 340 * 370 20,000 10.8 AMMO PACKING DEVICE Q'TY 1 INNER CARTON Q'TY 2 APPROX. CASE (PCS / BOX) BOX SIZE SIZE (PCS / CARTON) CROSS (m/m) (m/m) TYPE DO-41 5,000 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 260 * 83 * 160 440 * 270 * 340 Page 4 WEIGHT(kg) 50,000 Document ID Issued Date DS-222121 2008/02/10 20.0 Revised Date - Revision Page. A 6 Formosa MS Glass Passivated Rectifier 1N4001G THRU 1N4007G BULK PACKING DEVICE Q'TY 1 INNER CARTON Q'TY 2 APPROX. CASE (PCS / BOX) BOX SIZE SIZE (PCS / CARTON) CROSS TYPE (m/m) DO-41 194 * 8 4 * 20 1,000 WEIGHT(kg) (m/m) 50,000 465 * 220 * 260 20.6 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=10 oC~35 oC Humidity=65%±15% 2.Reflow soldering of surface-mount devices Critical Zone T L to T P tP TP Ramp-up TL tL Temperature T smax T smin TS ts Preheat 25 Ramp-down t25 oC to Peak Wave Soldering IR Reflow Time 3.Flow (wave)soldering (solder dipping) Profile Feature Soldering Condition Average ramp-up rate(T L to TP ) <3oC/sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 100oC 150oC 60~120sec Tsmax to TL -Ramp-upRate <3oC/sec Time maintained above: -Temperature(TL ) -Time(tL ) 183oC 60~150sec 255oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(tP ) 10~30sec Ramp-down Rate <6 oC/sec Time 25oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date DS-222121 2008/02/10 Revised Date - Revision Page. A 6 Formosa MS Glass Passivated Rectifier 1N4001G THRU 1N4007G High reliability test capabilities Item Test Conditions Reference o 1. Solder Resistance at 260±5 C for 10±2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 oC for 5 sec. MIL-STD-202F METHOD-208 3. Pull Test 1.0kg in axial lead direction for 10 sec. I F=I O MIL-STD-202F METHOD-211A 4. Bend Lead 1.0kg weight applied to each lead bending arc 90o±5 o for 3 times, I F=I O MIL-STD-202F METHOD-211A V R=80% rate at T J=150 oC for 168 hrs. MIL-STD-750D METHOD-1026 5. High Temperature Reverse Bias Rated average rectifier current at T=25 oC for 500hrs. MIL-STD-750D METHOD-1027 6. Forward Operation Life 7. Intermittent Operation Life T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min, on and off for 500 cycles. MIL-STD-750D METHOD-1036 15P SIG at TA=121 oC for 4 hrs. 8. Pressure Cooker 9. Temperature Cycling -55 oC to +125oC dwelled for 30 min. and transferred for 5min. total 10 cycles. MIL-STD-750D METHOD-1051 0 oC for 5 min. rise to 100 oC for 5 min. total 10 cycles. MIL-STD-750D METHOD-1056 10. Thermal Shock 11. Forward Surge 8.3ms single half sine-wave superimposed on rated load, one surge. MIL-STD-750D METHOD-4066-2 at TA=65 oC, RH=98% for 1000hrs. MIL-STD-750D METHOD-1038 12. Humidity at 175oC for 1000 hrs. MIL-STD-750D METHOD-1031 13. High Temperature Storage Life Dip into Freon at 25oC for 1 min. MIL-STD-202F METHOD-215 14. Solvent Resistance http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date DS-222121 2008/02/10 Revised Date - Revision Page. A 6