Formosa MS Switching Diode 1N4148 List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings .............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Taping & bulk specifications for AXIAL devices.................................... 4 Suggested thermal profiles for soldering processes............................. 5 High reliability test capabilities...........................................................6 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date DS-222908 2008/02/10 Revised Date - Revision Page. A 6 Formosa MS Switching Diode 1N4148 150mA Leaded Type Switching Diode-100V Package outline Features DO-35G • Axial lead type devices for through hole design. • Fast speed switching. • Silicon epitaxial planar chip structruction. • Hermetically sealed glass. • Small surface mounting type. • Lead-free parts meet RoHS requirments. 0.022 (0.56) 0.018 (0.46) DIA. 1.02 (26.0) MIN. 0.165 (4.2) MAX. Mechanical data 0.079 (2.0) DIA. MAX. 1.02 (26.0) MIN. • Case : Glass, DO-35G • Lead : Axial leads, solderable per MIL-STD-202, Method 208 guaranteed • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.12 gram Dimensions in inches and (millimeters) Maximum ratings (AT T =25 C unless otherwise noted) o A PARAMETER CONDITIONS Symbol MIN. TYP. MAX. UNIT Repetitive peak reverse voltage V RRM 100 V Reverse voltage VR 75 V I FSM 2.0 A I FRM 500 mA IF 300 mA Peak forward surge current t p = 1 us Repetitive peak forward voltage Forward current Average forward current VR = 0 V I FAV 150 mA Power dissipation PV 500 mW Junction temperature Tj Storage temperature T STG Forward voltage Reverse current I F = 10 mA VF V R = 20 V V R = 20 V , T j = 150 oC -55 -65 0.86 +150 o C +175 o C 1.00 V IR 25 nA IR 50 uA 5.0 uA 4.0 pF V R = 100 V IR Breakdown current I R = 100uA , TP/T = 0.01 TP = 0.3ms V (BR) Diode capacitance V R = 0 V , f = 1MH z , V HF = 50m V CD Rectification efficiency V HF = 2 V , f = 100 MHz nR I F = IR = 10mA , IRR = 1mA t rr 8 ns I F = 10 mA , V R = 6V , I RR = 0.1 X I R , R L = 100 OHM t rr 4 ns Reverse recovery time http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 2 100 V % 45 Document ID Issued Date DS-222908 2008/02/10 Revised Date - Revision Page. A 6 Rating and characteristic curves (1N4148) FIG.3 - TYPICAL REVERSE FIG.1-TYPICAL FORWARD CHARACTERISTICS CHARACTERISTICS TJ=25 C 1000 100 REVERSE CURRENT, (nA) INSTANTANEOUS FORWARD CURRENT,(mA) 1000 TJ=25 C Pulse Width 300us 1% Duty Cycle 10 Scattering Limit Scattering Limit 100 10 1.0 1 0.1 0 .4 .8 1.2 1.6 1 2.0 10 100 REVERSE VOLTAGE FORWARD VOLTAGE,(V) FIG.4 - REVERSE CURRENT VS JUNCTION TEMPERATURE FIG.2 - TYPICAL DIODE CAPACITANCE 3.5 3 10 2 2.5 REVERSE CURRENT, (uA) DIODE CAPACITANCE,(pF) 3.0 2.0 1.5 1.0 0.5 0 10 V =75 VR 1 10 100 1000 REVERSE VOLTAGE,(V) .V 10 U AL ES ES 1 5V =7 VR /T U AL .V YP 0V =2 / L VA P. TY S UE VR -1 0.1 AX /M 10 -2 10 0 200 100 o JUNCTION TEMPERATURE ( C) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 3 Document ID Issued Date DS-222908 2008/02/10 Revised Date - Revision Page. A 6 Formosa MS Switching Diode 1N4148 Pinning information Pin Pin1 Pin2 Simplified outline cathode anode Symbol 1 2 1 2 Marking Type number 1N4148 Marking code 1N4148 Taping & bulk specifications for AXIAL devices 52.4mm/ 26.2mm 17mm DIA. 55mm Max. A 17mm DIA. 72mm DIA. 71mm Max. 355mm OFF Center both sids 1.0mm Max OFF Alignment 1.2mm 6.3mm REEL PACKING DEVICE Q'TY 1 COMPONENT CARTON Q'TY 2 APPROX. CASE (PCS / REEL) SPACING SIZE (PCS / CARTON) CROSS "A" in FIG. A (m/m) TYPE DO-35G/52mm WEIGHT(kg) 5 mm 360 * 360 * 395 Q'TY 1 INNER CARTON Q'TY 2 APPROX. (PCS / BOX) BOX SIZE SIZE (PCS / CARTON) CROSS (m/m) (m/m) 10,000 50,000 11. 4 AMMO PACKING DEVICE CASE TYPE WEIGHT(kg) DO-35G/26mm 5,000 250 * 78 *48 420 * 270 * 330 150,000 16.7 DO-35G/52mm 5,000 250 *7 8 *78 420 * 270 * 330 100,000 15.0 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date DS-222908 2008/02/10 Revised Date - Revision Page. A 6 Formosa MS Switching Diode 1N4148 BULK PACKING DEVICE Q'TY 1 INNER CARTON Q'TY 2 APPROX. CASE (PCS / BOX) BOX SIZE SIZE (PCS / CARTON) CROSS TYPE (m/m) DO-35G 96 * 80 * 4 2 2,000 WEIGHT(kg) (m/m) 120,000 410 * 335 * 265 17.4 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=10 oC~35 oC Humidity=65%±15% 2.Reflow soldering of surface-mount devices Critical Zone T L to T P tP TP Ramp-up TL tL Temperature T smax T smin TS ts Preheat 25 Ramp-down t25 oC to Peak Wave Soldering IR Reflow Time 3.Flow (wave)soldering (solder dipping) Profile Feature Soldering Condition Average ramp-up rate(T L to TP ) <3oC/sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 100oC 150oC 60~120sec Tsmax to TL -Ramp-upRate <3oC/sec Time maintained above: -Temperature(TL ) -Time(tL ) 183oC 60~150sec 255oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(tP ) 10~30sec Ramp-down Rate <6 oC/sec Time 25oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date DS-222908 2008/02/10 Revised Date - Revision Page. A 6 Formosa MS Switching Diode 1N4148 High reliability test capabilities Item Test Conditions Reference o 1. Solder Resistance at 260±5 C for 10±2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 oC for 5 sec. MIL-STD-202F METHOD-208 3. Pull Test 1kg in axial lead direction for 10 sec. MIL-STD-750D METHOD-2036 4. Bend Lead 0.5kg weight applied to each lead bending arc 90o±5 o for 3 times. MIL-STD-750D METHOD-2036 5. High Temperature Reverse Bias V R=80% rate at T J=150 oC for 168 hrs. MIL-STD-750D METHOD-1026 6. Forward Operation Life Rated average rectifier current at T=25 oC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min, on and off for 500 cycles. MIL-STD-750D METHOD-1036 7. Intermittent Operation Life 8. Pressure Cooker 9. Temperature Cycling 10. Thermal Shock 11. Forward Surge 12. Humidity 13. High Temperature Storage Life 14. Solvent Resistance http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 15P SIG at TA=121 oC for 4 hrs. MIL-STD-750D METHOD-1051 -55 oC to +125oC dwelled for 30 min. and transferred for 5min. total 10 cycles. MIL-STD-750D METHOD-1056 0 oC for 5 min. rise to 100 oC for 5 min. total 10 cycles. MIL-STD-750D METHOD-4066-2 8.3ms single half sine-wave superimposed on rated load, one surge. at TA=65 oC, RH=98% for 1000hrs. MIL-STD-750D METHOD-1038 at 175oC for 1000 hrs. MIL-STD-750D METHOD-1031 Dip into Freon at 25oC for 1 min. MIL-STD-202F METHOD-215 Page 6 Document ID Issued Date DS-222908 2008/02/10 Revised Date - Revision Page. A 6