Formosa MS Zener Diode Z30-11B THRU Z30-330B List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings .............................................................................. 2 Electrical characteristics....................................................................3 Rating and characteristic curves........................................................ 4 Pinning information........................................................................... 5 Taping & bulk specifications for AXIAL devices.................................... 5 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities...........................................................7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date DS-222719 2008/02/10 Revised Date - Revision Page. T 7 Formosa MS Zener Diode Z30-11B THRU Z30-330B 3.0W Surface Mount Zener Diodes - 11V - 330V Package outline Features DO-41 • Power dissipation up to 3.0W.. • Glass passivated chip struction. • Wide zener reverse voltage range 11V to 330V. • Standard zener voltage tolerance ±5% with a "B" suffix. • Low zener impedance. • Lead-free parts meet environmental standards of 1.0(25.4) MIN. .107(2.7) .080(2.0) DIA. MIL-STD-19500 /228 .205(5.2) .166(4.2) Mechanical data 1.0(25.4) MIN. .034(.9) • Epoxy : UL94-V0 rated flame retardant • Case : Molded plastic, DO-41 • Terminals :Plated terminals, solderable per MIL-STD-750, .028(.7) DIA. Dimensions in inches and (millimeters) Method 2026 • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.33 gram MAXIMUM RATINGS (at T =25 C unless otherwise noted) o A PARAMETER Forward voltage CONDITIONS I F = 200 mA DC Power Dissipation Storage temperature TYP. MAX. UNIT VF 1.20 V 3.0 W TJ Page 2 MIN. PD T STG Operating temperature http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Symbol -65 -55 Document ID Issued Date DS-222719 2008/02/10 Revised Date - +175 o C +150 o C Revision Page. T 7 Part No. Marking code Zener voltage Test current Zener impedance V Z @ I ZT I ZT Z ZT @ I ZT Z ZK @ I ZK Leakage current I ZK IR VR Volts mA OHMs OHMs mA uA Volts Z30-11B Z30-11B 11 68 4.0 700 0.25 1.0 8.4 Z30-12B Z30-12B 12 63 4.5 700 0.25 1.0 9.1 Z30-13B Z30-13B 13 58 4.5 700 0.25 0.5 9.9 Z30-15B Z30-15B 15 50 5.5 700 0.25 0.5 11.4 Z30-16B Z30-16B 16 47 5.5 700 0.25 0.5 12.2 Z30-18B Z30-18B 18 42 6.0 750 0.25 0.5 13.7 Z30-20B Z30-20B 20 37 7.0 750 0.25 0.5 15.2 Z30-22B Z30-22B 22 34 8.0 750 0.25 0.5 16.7 Z30-24B Z30-24B 24 31 9.0 750 0.25 0.5 18.2 Z30-27B Z30-27B 27 28 10.0 750 0.25 0.5 20.6 Z30-30B Z30-30B 30 25 16.0 1000 0.25 0.5 22.5 Z30-33B Z30-33B 33 23 20.0 1000 0.25 0.5 25.1 Z30-36B Z30-36B 36 21 22.0 1000 0.25 0.5 27.4 Z30-39B Z30-39B 39 19 28.0 1500 0.25 0.5 29.7 Z30-43B Z30-43B 43 17 33.0 1500 0.25 0.5 32.7 Z30-47B Z30-47B 47 16 38.0 1500 0.25 0.5 35.8 Z30-51B Z30-51B 51 15 45.0 1500 0.25 0.5 38.8 Z30-56B Z30-56B 56 13 50.0 2000 0.25 0.5 42.6 Z30-62B Z30-62B 62 12 55.0 2000 0.25 0.5 47.1 Z30-68B Z30-68B 68 11 70.0 2000 0.25 0.5 51.7 Z30-75B Z30-75B 75 10 85.0 2000 0.25 0.5 56.0 Z30-82B Z30-82B 82 9.1 95.0 3000 0.25 0.5 62.2 Z30-91B Z30-91B 91 8.2 115 3000 0.25 0.5 69.2 Z30-100B Z30-100B 100 5 750 5000 0.25 0.5 75 Z30-110B Z30-110B 110 5 750 5000 0.25 0.5 80 Z30-115B Z30-115B 115 5 750 5000 0.25 0.5 85 Z30-120B Z30-120B 120 5 850 5000 0.25 0.5 90 Z30-130B Z30-130B 130 5 1000 5000 0.25 0.5 95 Z30-140B Z30-140B 140 5 1200 5000 0.25 0.5 105 Z30-150B Z30-150B 150 5 1300 5000 0.25 0.5 110 Z30-160B Z30-160B 160 5 1500 5000 0.25 0.5 120 Z30-170B Z30-170B 170 5 2200 5000 0.25 0.5 130 Z30-180B Z30-180B 180 5 2200 5000 0.25 0.5 140 Z30-190B Z30-190B 190 5 2500 5000 0.25 0.5 150 Z30-200B Z30-200B 200 5 2500 8000 0.25 0.5 165 Z30-210B Z30-210B 210 5 5000 9000 0.25 0.5 165 Z30-220B Z30-220B 220 5 5000 9000 0.25 0.5 170 Z30-230B Z30-230B 230 5 5000 9000 0.25 0.5 175 Z30-240B Z30-240B 240 5 5000 9000 0.25 0.5 180 Z30-250B Z30-250B 250 5 5000 9000 0.25 0.5 190 Z30-260B Z30-260B 260 5 5000 9000 0.25 0.5 195 Z30-270B Z30-270B 270 5 5000 9000 0.25 0.5 200 Z30-280B Z30-280B 280 5 5000 9000 0.25 0.5 210 Z30-290B Z30-290B 290 5 5000 9000 0.25 0.5 215 Z30-300B Z30-300B 300 5 5000 9000 0.25 0.5 220 Z30-310B Z30-310B 310 5 5000 9500 0.25 0.5 225 Z30-320B Z30-320B 320 5 5000 9500 0.25 0.5 233 Z30-330B Z30-330B 330 5 5000 9500 0.25 0.5 240 Note : 5% tolerance of Zener voltage http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 3 Document ID Issued Date DS-222719 2008/02/10 Revised Date - Revision Page. T 7 Rating and characteristic curves (Z30-111B THRU Z30-330B) FIG. 1-MAXIMUM CONTINUOUS POWER DISSIPARION REVERSE POWER DISSIPATION, WATTS FIG. 2-ZENER VOLTAGE VERSUS ZENER CURRENT 3 I Z, ZENER CURREN T(mA) 10 SINGLE PHASE HALF WAVF 60Hz RESISTIVE OR INDUCTIVE LOAD 0.375"(9.5mm) LEAD LENGTHS 5 2 1 0.5 0.2 0.1 100 0 25 50 75 100 125 150 150 250 300 350 400 450 V Z, ZENER VOLTAGE (VOLTS) LEAD TEMPERATURE, OC FIG. 3-TYPICAL INSTANTANEOUS FORWARD CHA RCTERISTICS INSTANTANEOUS FORWARD CURRENT, AMPERS 200 175 FIG. 4-TYPICAL REVERSE CHARACTERISTICS 10 INSTANTANEO US REVERSE CURRENT, MICROAMPER ES 10 1.0 0.1 4 1.0 .4 0.1 O T J=25 C .04 .01 T J=25 OC PULSE WIDTH=300us 1% DUTY CYCLE 0 20 40 60 80 100 120 140 PERCENT OF RATED ZENER VOLTAGE .01 .4 .6 .8 1.0 1.2 1.4 1.6 INSTANTANEOUS FORWARD VOLTAGE, VOLTS V Z, TEMPERATURE COEFFICIENT (mV/ OC) @ I ZT FIG. 5-TYPICAL TEMPERATURE COEFFICIENTS 1000 500 200 100 50 20 10 10 20 50 100 200 500 1000 V Z, ZENER VOLTAGE @ I ZT(VOLTS) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date DS-222719 2008/02/10 Revised Date - Revision Page. T 7 Formosa MS Zener Diode Z30-11B THRU Z30-330B Pinning information Pin Pin1 Pin2 Simplified outline cathode anode Symbol 1 2 1 2 Taping & bulk specifications for AXIAL devices 52.4mm 17mm DIA. 55mm Max. A 17mm DIA. 72mm DIA. 71mm Max. 355mm OFF Center both sids 1.0mm Max OFF Alignment 1.2mm 6.3mm REEL PACKING DEVICE Q'TY 1 COMPONENT CARTON Q'TY 2 APPROX. CASE (PCS / REEL) SPACING SIZE (PCS / CARTON) CROSS "A" in FIG. A (m/m) TYPE DO-41 5,000 5 mm 360 * 340 * 370 WEIGHT(kg) 20,000 10.8 AMMO PACKING DEVICE Q'TY 1 INNER CARTON Q'TY 2 APPROX. CASE (PCS / BOX) BOX SIZE SIZE (PCS / CARTON) CROSS (m/m) (m/m) TYPE DO-41 5,000 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 260 * 83 * 160 440 * 270 * 340 Page 5 WEIGHT(kg) 50,000 Document ID Issued Date DS-222719 2008/02/10 20.0 Revised Date - Revision Page. T 7 Formosa MS Zener Diode Z30-11B THRU Z30-330B BULK PACKING DEVICE Q'TY 1 INNER CARTON Q'TY 2 APPROX. CASE (PCS / BOX) BOX SIZE SIZE (PCS / CARTON) CROSS TYPE (m/m) DO-41 194 * 8 4 * 20 1,000 WEIGHT(kg) (m/m) 50,000 465 * 220 * 260 20.6 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=10 oC~35 oC Humidity=65%±15% 2.Reflow soldering of surface-mount devices Critical Zone T L to T P tP TP Ramp-up TL tL Temperature T smax T smin TS ts Preheat 25 Ramp-down t25 oC to Peak Wave Soldering IR Reflow Time 3.Flow (wave)soldering (solder dipping) Profile Feature Soldering Condition Average ramp-up rate(T L to TP ) <3oC/sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 100oC 150oC 60~120sec Tsmax to TL -Ramp-upRate <3oC/sec Time maintained above: -Temperature(TL ) -Time(tL ) 183oC 60~150sec 255oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(tP ) 10~30sec Ramp-down Rate <6 oC/sec Time 25oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date DS-222719 2008/02/10 Revised Date - Revision Page. T 7 Formosa MS Zener Diode Z30-11B THRU Z30-330B High reliability test capabilities Item Test Conditions Reference o 1. Solder Resistance at 260±5 C for 10±2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 oC for 5 sec. MIL-STD-202F METHOD-208 3. Pull Test 1kg in axial lead direction for 10 sec. MIL-STD-750D METHOD-2036 4. Bend Lead 0.5kg weight applied to each lead bending arc 90o±5 o for 3 times. MIL-STD-750D METHOD-2036 5. High Temperature Reverse Bias V=V Z rate at T J=150 oC for 168 hrs. MIL-STD-750D METHOD-1026 6. Forward Operation Life Rated zener current at T=25oC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25OC, IF = 200mA On state: power on for 5 min. off state: power off for 5 min, on and off for 500 cycles. MIL-STD-750D METHOD-1036 7. Intermittent Operation Life 8. Pressure Cooker 9. Temperature Cycling 10. Thermal Shock 11. Forward Surge 12. Humidity 13. High Temperature Storage Life 14. Solvent Resistance 15P SIG at TA=121 oC for 4 hrs. MIL-STD-750D METHOD-1051 -55 oC to +125oC dwelled for 30 min. and transferred for 5min. total 10 cycles. MIL-STD-750D METHOD-1056 0 oC for 5 min. rise to 100 oC for 5 min. total 10 cycles. MIL-STD-750D METHOD-4066-2 8.3ms single half sine-wave superimposed on rated load, one surge. at TA=65 oC, RH=98% for 1000hrs. MIL-STD-750D METHOD-1038 at 175oC for 1000 hrs. MIL-STD-750D METHOD-1031 Dip into Freon at 25oC for 1 min. MIL-STD-202F METHOD-215 rate at T J=150 oC for 168 hrs. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 7 Document ID Issued Date DS-222719 2008/02/10 Revised Date - Revision Page. T 7