Chip Silicon Rectifier Formosa MS FM4001-S THRU FM4007-S List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 1 DS-121121 Issued Date 2008/02/10 Revised Date 2010/03/08 Revision D Page. 7 Chip Silicon Rectifier Formosa MS FM4001-S THRU FM4007-S 1.0A Surface Mount General Purpose Rectifiers - 50V-1000V Package outline Features SMA-S • Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. 0.216(5.4) 0.200(5.0) • Low profile surface mounted application in order to • • • • • • optimize board space. T iny plastic SMD package. High current capability. High surge capability. Glass passivated chip junction. Lead-free parts meet environmental standards of MIL-STD-19500 /228 Suffix "-H" indicates Halogen-free parts, ex. FM4001-S-H. 0.063(1.6) 0.012(0.3) Typ. 0.106(2.7) 0.091(2.3) 0.055(1.4) Mechanical data 0.071(1.8) 0.060(1.5) • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, DO-214AC / SMA-S • Terminals : Solder plated, solderable per 0.040(1.0) Typ. 0.040 (1.0) Typ. Dimensions in inches and (millimeters) MIL-STD-750, Method 2026 • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.05 gram Maximum ratings (AT o T A=25 C unless otherwise noted) PARAMETER CONDITIONS Forward rectified current See Fig.1 Forward surge current 8.3ms single half sine-wave superimposed on rate load (JEDEC methode) Symbol MIN. TYP. 1.0 A I FSM 30 A Thermal resistance Junction to ambient Diode junction capacitance Reverse recovery time 60 f=1MHz and applied 4V DC reverse voltage CJ 15 I F = 0.5A, I R = 1.0A, I RR = 0.25A T rr *1 V RRM (V) T STG V RMS*2 (V) *3 VR (V) FM4001-S 50 35 50 FM4002-S 100 70 100 FM4003-S 200 140 200 FM4004-S 400 280 400 FM4005-S 600 420 600 FM4006-S 800 560 800 FM4007-S 1000 700 1000 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 *4 VF (V) μA 50 R θJA Storage temperature SYMBOLS 5.0 IR O V R = V RRM T A = 100 C UNIT IO O V R = V RRM T A = 25 C Reverse current MAX. O C/W pF μA 2.0 +175 -65 O C Operating temperature T J, ( OC) *1 Repetitive peak reverse voltage *2 RMS voltage 1.10 -55 to +150 *3 Continuous reverse voltage *4 Maximum forward voltage@IF=1.0A Document ID Page 2 DS-121121 Issued Date 2008/02/10 Revised Date 2010/03/08 Revision D Page. 7 Rating and characteristic curves (FM4001-S THRU FM4007-S) FIG.1-TYPICAL FORWARD FIG.2-TYPICAL FORWARD CURRENT DERATING CURVE AVERAGE FORWARD CURRENT,(A) CHARACTERISTICS 10 3.0 1.0 1.2 1.0 0.8 Single Phase 0.6 Half Wave 60Hz Resistive Or Inductive Load 0.4 0.2 0 0 20 40 TJ=25 C 60 80 100 120 140 160 180 200 AMBIENT TEMPERATURE ( C) Pulse Width 300us 1% Duty Cycle 0.1 FIG.4-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT .01 .6 .7 .8 .9 1.0 1.1 1.2 1.3 FORWARD VOLTAGE,(V) FIG.3 - TYPICAL REVERSE CHARACTERISTICS PEAK FORWAARD SURGE CURRENT,(A) INSTANTANEOUS FORWARD CURRENT,(A) 50 50 40 30 8.3ms Single Half TJ=25 C Sine Wave 20 JEDEC method 10 0 1 100 5 50 10 100 NUMBER OF CYCLES AT 60Hz FIG.5-TYPICAL JUNCTION CAPACITANCE 35 TJ=100 C JUNCTION CAPACITANCE,(pF) REVERSE LEAKAGE CURRENT, (mA) 10 1.0 TJ=25 C .1 30 25 20 15 10 5 .01 0 0 20 40 60 80 .01 .1 .5 1 5 10 50 100 Revision Page. REVERSE VOLTAGE,(V) PERCENTAGE RATED PEAK REVERSE VOLTAGE http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 .05 100 120 140 Document ID Page 3 DS-121121 Issued Date 2008/02/10 Revised Date 2010/03/08 D 7 Chip Silicon Rectifier Formosa MS FM4001-S THRU FM4007-S Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Marking Type number Marking code FM4001-S FM4002-S FM4003-S FM4004-S FM4005-S FM4006-S FM4007-S A1 A2 A3 A4 A5 A6 A7 Suggested solder pad layout C A B Dimensions in inches and (millimeters) PACKAGE A B C SMA-S 0.063 (1.60) 0.059 (1.50) 0.110 (2.80) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 4 DS-121121 Issued Date 2008/02/10 Revised Date 2010/03/08 Revision D Page. 7 Chip Silicon Rectifier Formosa MS FM4001-S THRU FM4007-S Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SMA-S Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 2.90 5.50 2.10 1.50 330.00 50.00 178.00 62.00 13.00 1.75 5.50 4.00 4.00 2.00 0.23 12.00 18.00 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 5 DS-121121 Issued Date 2008/02/10 Revised Date 2010/03/08 Revision D Page. 7 Chip Silicon Rectifier Formosa MS FM4001-S THRU FM4007-S Reel packing PACKAGE SMA-S REEL SIZE 7" REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) 2,000 4.0 20,000 183*170*183 178 CARTON SIZE (m/m) CARTON (pcs) 382*356*387 APPROX. GROSS WEIGHT (kg) 15.5 160,000 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) o 150 C o 200 C 60~120sec Tsmax to T L -Ramp-upRate o <3 C /sec Time maintained above: -Temperature(T L ) -Time(t L ) o 217 C 60~260sec o o 255 C- 0/ + 5 C Peak Temperature(T P ) o Time within 5 C of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 C /sec o o Time 25 C to Peak Temperature http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 <6minutes Document ID Page 6 DS-121121 Issued Date 2008/02/10 Revised Date 2010/03/08 Revision D Page. 7 Chip Silicon Rectifier Formosa MS FM4001-S THRU FM4007-S High reliability test capabilities Item Test Conditions Reference O MIL-STD-750D METHOD-2031 O MIL-STD-202F METHOD-208 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16" ± 1/32" 2. Solderability at 245 ± 5 C for 5 sec. 3. High Temperature Reverse Bias V R=80% rate at T J=150 C for 168 hrs. 4. Forward Operation Life Rated average rectifier current at T=25 C for 500hrs. MIL-STD-750D METHOD-1026 O MIL-STD-750D METHOD-1027 O O 5. Intermittent Operation Life 6. Pressure Cooker 7. Temperature Cycling 8. Thermal Shock 9. Forward Surge 10. Humidity 11. High Temperature Storage Life http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 T A = 25 C, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 JESD22-A102 O 15P SIG at T A=121 C for 4 hrs. O MIL-STD-750D METHOD-1051 O -55 C to +125 C dwelled for 30 min. and transferred for 5min. total 10 cycles. O MIL-STD-750D METHOD-1056 O 0 C for 5 min. rise to 100 C for 5 min. total 10 cycles. MIL-STD-750D METHOD-4066-2 8.3ms single half sine-wave superimposed on rated load, one surge. MIL-STD-750D METHOD-1038 O at T A=85 C , RH=85% for 1000hrs. MIL-STD-750D METHOD-1031 O at 175 C for 1000 hrs. Document ID Page 7 DS-121121 Issued Date 2008/02/10 Revised Date 2010/03/08 Revision D Page. 7