Formosa MS Chip Schottky Barrier Rectifier FM820-T3 THRU FM8200-T3 List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date DS-121637 2013/04/25 Revised Date - Revision A Page. 7 Formosa MS Chip Schottky Barrier Rectifier FM820-T3 THRU FM8200-T3 8.0A Surface Mount Schottky Barrier Rectifiers - 20V-200V Package outline Features SMC-T3 • Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. 0.264(6.7) 0.248(6.3) • Low profile surface mounted application in order to • • • • • • • • 0.020(0.5) Typ. optimize board space. Low power loss, high efficiency. High current capability, low forward voltage drop. High surge capability. Guardring for overvoltage protection. Ultra high-speed switching. Silicon epitaxial planar chip, metal silicon junction. Lead-free parts meet environmental standards of MIL-STD-19500 /228 Suffix "-H" indicates Halogen free parts, ex. FM820-Τ3-H. 0.185(4.7) 0.170(4.3) 0.067(1.7) 0.059(1.5) 0.047(1.2) Typ. 0.047(1.2) Typ. Mechanical data 0.120(3.05) 0.104(2.65) • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, DO-214AB / SMC-T3 • Terminals : Solder plated, solderable per 0.041(1.05) 0.026(0.65) 0.142(3.60) 0.126(3.20) MIL-STD-750, Method 2026 0.063(1.6) Typ. • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.1443gram Dimensions in inches and (millimeters) Maximum ratings and Electrical Characteristics (AT PARAMETER T A=25 oC unless otherwise noted) CONDITIONS Forward rectified current See Fig.1 Forward surge current 8.3ms single half sine-wave superimposed on rate load (JEDEC methode) V R = V RRM T J = 25 OC Reverse current Diode junction capacitance V R = V RRM T J = 100 OC f=1MHz and applied 4V DC reverse voltage Storage temperature Symbol *1 V RRM (V) V RMS*2 (V) *3 VR (V) FM820-T3 20 14 20 FM830-T3 30 21 30 *4 VF (V) Operating temperature T J, ( OC) 0.55 -55 to +125 FM840-T3 40 28 40 FM850-T3 50 35 50 FM860-T3 60 42 60 FM880-T3 80 56 80 FM8100-T3 100 70 100 FM8150-T3 150 105 150 0.90 FM8200-T3 200 140 200 0.92 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 TYP. MAX. UNIT IO 8.0 A I FSM 150 A 0.5 IR 50 mA 700 CJ T STG SYMBOLS MIN. -65 pF +175 O C *1 Repetitive peak reverse voltage *2 RMS voltage *3 Continuous reverse voltage 0.70 *4 Maximum forward voltage@I F=8.0A 0.85 -55 to +150 Page 2 Document ID Issued Date DS-121637 2013/04/25 Revised Date - Revision A Page. 7 Rating and characteristic curves (FM820-T3 THRU FM8200-T3) FIG.1-TYPICAL FORWARD CURRENT DERATING CURVE FIG.2-TYPICAL FORWARD 4 3 0-T 820 -T3 840 2 M ~F -T3 850 0 0 20 40 60 80 100 120 140 160 180 200 LEAD TEMPERATURE,(°C) FIG.3-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 150 V-2 00V 80V -10 0V 10 50V -60 V FM M ~F -T3 820 6 INSTANTANEOUS FORWARD CURRENT,(A) 8 20V -40 V 50 10 FM AVERAGE FORWARD CURRENT,(A) CHARACTERISTICS 12 1.0 TJ=25 C Pulse Width 300us 1% Duty Cycle 0.1 PEAK FORWARD SURGE CURRENT,(A) 250 .01 200 .1 .3 .5 .7 .9 1.1 1.3 1.5 FORWARD VOLTAGE,(V) 150 8.3ms Single Half TJ=25 C Sine Wave 100 JEDEC method 50 FIG.5 - TYPICAL REVERSE CHARACTERISTICS 0 1 5 50 10 100 100 NUMBER OF CYCLES AT 60Hz REVERSE LEAKAGE CURRENT, (mA) FIG.4-TYPICAL JUNCTION CAPACITANCE JUNCTION CAPACITANCE,(pF) 2800 2400 2000 1600 1200 800 10 TJ=75 C 1.0 .1 TJ=25 C 400 0 .01 .05 .1 .5 1 5 10 50 100 REVERSE VOLTAGE,(V) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 .01 0 20 40 60 80 100 120 140 PERCENT OF RATED PEAK REVERSE VOLTAGE,(%) Page 3 Document ID Issued Date DS-121637 2013/04/25 Revised Date - Revision A Page. 7 Formosa MS Chip Schottky Barrier Rectifier FM820-T3 THRU FM8200-T3 Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Marking Type number Marking code FM820-T3 FM830-T3 FM840-T3 FM850-T3 FM860-T3 FM880-T3 FM8100-T3 FM8150-T3 FM8200-T3 SS82 SS83 SS84 SS85 SS86 SS88 S810 S815 S820 Suggested solder pad layout SMC-T3 0.016(0.4) 0.112(2.85) 0.063(1.60) 0.142(3.60) 0.197(5.00) 0.063(1.60) 0.025(0.65) 0.175(4.45) Dimensions in inches and (millimeters) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date DS-121637 2013/04/25 Revised Date - Revision A Page. 7 Formosa MS Chip Schottky Barrier Rectifier FM820-T3 THRU FM8200-T3 Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SMC-T3 Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 4.85 6.95 1.85 1.50 330.00 50.00 178.00 62.00 13.00 1.75 5.50 8.00 4.00 2.00 0.23 12.00 18.00 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date DS-121637 2013/04/25 Revised Date - Revision A Page. 7 Formosa MS Chip Schottky Barrier Rectifier FM820-T3 THRU FM8200-T3 Reel packing PACKAGE SMC-T3 REEL SIZE 13" REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) 3,000 8.0 6,000 337*337*37 330 CARTON SIZE (m/m) 350*330*360 APPROX. GROSS WEIGHT (kg) CARTON (pcs) 17.2 48,000 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC/sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 oC/sec Time 25 oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date DS-121637 2013/04/25 Revised Date - Revision A Page. 7 Formosa MS Chip Schottky Barrier Rectifier FM820-T3 THRU FM8200-T3 High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T J=125 OC for 168 hrs. MIL-STD-750D METHOD-1038 4. Forward Operation Life Rated average rectifier current at T A=25 OC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 5. Intermittent Operation Life 6. Pressure Cooker JESD22-A102 15P SIG at T A=121 OC for 4 hrs. 7. Temperature Cycling -55 OC to +125 OC dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Thermal Shock 0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles. MIL-STD-750D METHOD-1056 9. Forward Surge 8.3ms single half sine-wave superimposed on rated load, one surge. MIL-STD-750D METHOD-4066-2 10. Humidity at T A=85 OC, RH=85% for 1000hrs. MIL-STD-750D METHOD-1021 11. High Temperature Storage Life at 175 OC for 1000 hrs. MIL-STD-750D METHOD-1031 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 7 MIL-STD-750D METHOD-1051 Document ID Issued Date DS-121637 2013/04/25 Revised Date - Revision A Page. 7