Formosa MS SL0520-MH THRU SL0540-MH Low VF Chip Schottky Barrier Rectifier List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 1 DS-12160C Issued Date 2008/02/10 Revised Date Revision Page. 2010/03/10 D 7 Formosa MS SL0520-MH THRU SL0540-MH Low VF Chip Schottky Barrier Rectifier 0.5A Surface Mount Schottky Barrier Rectifiers - 20V-40V Package outline Features • Batch process design, excellent power dissipation offers SOD-123H better reverse leakage current and thermal resistance. • Low profile surface mounted application in order to optimize board space. • Tiny plastic SMD package. • Low power loss, high efficiency. • High current capability, low forward voltage drop. • High surge capability. • Guardring for overvoltage protection. • Ultra high-speed switching. • Silicon epitaxial planar chip, metal silicon junction. • Lead-free parts meet environmental standards of MIL-STD-19500 /228 • Suffix "-H" indicates Halogen free parts, ex. SL0520-ΜΗ-H 0.146(3.7) 0.130(3.3) 0.075(1.9) 0.060(1.5) Mechanical data • • • 0.012(0.3) Typ. 0.040(1.0) 0.024(0.6) Epoxy : UL94-V0 rated flame retardant 0.031(0.8) Typ. Case : Molded plastic, SOD-123H 0.031(0.8) Typ. Terminals :Plated terminals, solderable per MIL-STD-750, Method 2026 • • • Dimensions in inches and (millimeters) Polarity : Indicated by cathode band Mounting Position : Any Weight : Approximated 0.011 gram Maximum ratings (AT T A=25 oC unless otherwise noted) PARAMETER CONDITIONS Symbol MIN. TYP. MAX. UNIT IO 0.5 A 8.3ms single half sine-wave superimposed on rate load (JEDEC methode) I FSM 5.5 A Reverse current V R = V RRM T J = 25 OC IR 1.0 mA Thermal resistance Junction to ambient Diode junction capacitance f=1MHz and applied 4V DC reverse voltage Forward rectified current See Fig.2 Forward surge current Storage temperature 42 CJ 130 T STG *1 V RRM (V) V RMS*2 (V) *3 VR (V) SL0520-MH 20 14 20 0.38 SL0530-MH 30 21 30 0.40 SL0540-MH 40 28 40 0.40 SYMBOLS R θJA http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 *4 VF (V) Operating temperature T J, ( OC) -55 to +100 O C/W pF O +175 -65 C *1 Repetitive peak reverse voltage *2 RMS voltage *3 Continuous reverse voltage *4 Maximum forward voltage@I F=0.5A Document ID Page 2 DS-12160C Issued Date 2008/02/10 Revised Date Revision Page. 2010/03/10 D 7 Rating and characteristic curves (SL0520-MH THRU SL0540-MH) FIG.1-TYPICAL FORWARD FIG.2-TYPICAL FORWARD CURRENT DERATING CURVE AVERAGE FORWARD CURRENT,(A) CHARACTERISTICS 54 L0 /S 05 30 -M H 3.0 0M SL 05 20 -M H H 10 SL 1.0 0.6 0.5 0.4 Single Phase 0.3 Half Wave 60Hz Resistive Or Inductive Load 0.2 0.1 0 0 20 40 TJ=25 C 60 80 100 120 140 160 180 200 AMBIENT TEMPERATURE ( C) Pulse Width 300us 1% Duty Cycle 0.1 FIG.4-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT .01 .1 .3 .5 .7 .9 1.1 1.3 1.5 FORWARD VOLTAGE,(V) FIG.3 - TYPICAL REVERSE CHARACTERISTICS PEAK FORWAARD SURGE CURRENT,(A) INSTANTANEOUS FORWARD CURRENT,(A) 50 10 8 6 8.3ms Single Half TJ=25 C Sine Wave 4 JEDEC method 2 0 1 5 50 10 100 1000 FIG.5-TYPICAL JUNCTION CAPACITANCE 100 350 JUNCTION CAPACITANCE,(pF) REVERSE LEAKAGE CURRENT, (mA) NUMBER OF CYCLES AT 60Hz 10 TJ=75 C TJ=25 C 1 300 250 200 150 100 50 0 .1 0 20 40 60 80 .01 .1 .5 1 5 10 50 100 Revised Date Revision Page. 2010/03/10 D 7 REVERSE VOLTAGE,(V) PERCENTAGE RATED PEAK REVERSE VOLTAGE http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 .05 100 120 140 Document ID Page 3 DS-12160C Issued Date 2008/02/10 Formosa MS SL0520-MH THRU SL0540-MH Low VF Chip Schottky Barrier Rectifier Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Marking Type number Marking code SL0520-MH SL0530-MH SL0540-MH LA LB LC Suggested solder pad layout C A B Dimensions in inches and (millimeters) PACKAGE A B C SOD-123H 0.071 (1.80) 0.051 (1.30) 0.067 (1.70) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 4 DS-12160C Issued Date 2008/02/10 Revised Date Revision Page. 2010/03/10 D 7 Formosa MS SL0520-MH THRU SL0540-MH Low VF Chip Schottky Barrier Rectifier Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SOD-123H Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 2.00 3.85 1.10 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 5 DS-12160C Issued Date 2008/02/10 Revised Date Revision Page. 2010/03/10 D 7 Formosa MS SL0520-MH THRU SL0540-MH Low VF Chip Schottky Barrier Rectifier Reel packing PACKAGE REEL SIZE 7" SOD-123H REEL (pcs) COMPONENT SPACING (m/m) 4.0 3,000 BOX (pcs) 30,000 INNER BOX REEL DIA, CARTON SIZE CARTON APPROX. GROSS WEIGHT (m/m) (m/m) (m/m) (pcs) (kg) 183*183*123 178 382*262*387 240,000 8.5 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC/sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 oC/sec Time 25 oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 6 DS-12160C Issued Date 2008/02/10 Revised Date Revision Page. 2010/03/10 D 7 Formosa MS SL0520-MH THRU SL0540-MH Low VF Chip Schottky Barrier Rectifier High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T J=100 OC for 168 hrs. MIL-STD-750D METHOD-1026 4. Forward Operation Life Rated average rectifier current at T A=25 OC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 5. Intermittent Operation Life 6. Pressure Cooker JESD22-A102 15P SIG at T A=121 OC for 4 hrs. MIL-STD-750D METHOD-1051 7. Temperature Cycling -55 OC to +125 OC dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Thermal Shock 0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles. 9. Forward Surge 8.3ms single half sine-wave superimposed on rated load, one surge. 10. Humidity at T A=85 OC, RH=85% for 1000hrs. MIL-STD-750D METHOD-1038 11. High Temperature Storage Life at 175 OC for 1000 hrs. MIL-STD-750D METHOD-1031 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 MIL-STD-750D METHOD-4066-2 Document ID Page 7 MIL-STD-750D METHOD-1056 DS-12160C Issued Date 2008/02/10 Revised Date Revision Page. 2010/03/10 D 7