1N5820 THRU 1N5822

Formosa MS
Schottky Barrier Rectifier
1N5820 THRU 1N5822
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings .............................................................................. 2
Rating and characteristic curves........................................................ 3
Pinning information........................................................................... 4
Marking........................................................................................... 4
Taping & bulk specifications for AXIAL devices.................................... 4
Suggested thermal profiles for soldering processes............................. 5
High reliability test capabilities...........................................................6
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TEL:886-2-22696661
FAX:886-2-22696141
Page 1
Document ID
Issued Date
DS-222648
2008/02/10
Revised Date
-
Revision
Page.
A
6
Formosa MS
Schottky Barrier Rectifier
1N5820 THRU 1N5822
3.0A Leaded Type Schottky Barrier
Rectifiers - 20V-40V
Package outline
Features
DO-201AD
• Axial lead type devices for through hole design
• Low power loss, high efficiency.
• High current capability, low forward voltage drop.
• High surge capability.
• Guardring for overvoltage protection.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
• Lead-free parts meet environmental standards of
1.0(25.4)
MIN.
.220(5.6)
.197(5.0)
DIA.
.375(9.5)
MIL-STD-19500 /228
.285(7.2)
Mechanical data
1.0(25.4)
MIN.
.052(1.3)
.048(1.2)
DIA.
• Epoxy : UL94-V0 rated flame retardant
• Case : Molded plastic, DO-201AD
• Lead : Axial leads, solderable per MIL-STD-202,
Dimensions in inches and (millimeters)
Method 208 guaranteed
• Polarity: Color band denotes cathode end
• Mounting Position : Any
• Weight : Approximated 1.10 gram
Maximum ratings (AT
T A=25 oC unless otherwise noted)
PARAMETER
CONDITIONS
See Fig.2
Forward surge current
8.3ms single half sine-wave superimposed on
rate load (JEDEC methode)
V R = V RRM T A = 25 OC
Junction to ambient
f=1MHz and applied 4V DC reverse voltage
Storage temperature
SYMBOLS
*1
V RRM
(V)
I FSM
V RMS*2
(V)
*3
VR
(V)
*4
VF
(V)
1N5820
20
14
20
0.475
1N5821
30
21
30
0.500
1N5822
40
28
40
0.525
Operating
temperature
T J, ( OC)
-55 to +125
MAX.
A
30
A
10
50
CJ
110
-65
UNIT
3.0
0.5
R èJA
T STG
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TYP.
IR
V R = V RRM T A = 100 OC
Thermal resistance
Diode junction capacitance
MIN.
IO
Forward rectified current
Reverse current
Symbol
mA
O
C/W
pF
+175
O
C
*1 Repetitive peak reverse voltage
*2 RMS voltage
*3 Continuous reverse voltage
*4 Maximum forward voltage
Page 2
Document ID
Issued Date
DS-222648
2008/02/10
Revised Date
-
Revision
Page.
A
6
Rating and characteristic curves (1N5820 THRU 1N5822)
FIG.1-TYPICAL FORWARD
FIG.2-TYPICAL FORWARD CURRENT DERATING CURVE
AVERAGE FORWARD CURRENT,(A)
CHARACTERISTICS
10
3.0
1.0
3.0
2.5
2.0
Single Phase
1.5
Half Wave 60Hz
Resistive Or Inductive Load
1.0
0.375"(9.5mm) Lead Length
0.5
0
20
40
TJ=25 C
60
80
100
120
140
160
180
200
AMBIENT TEMPERATURE ( C)
Pulse Width 300us
1% Duty Cycle
0.1
FIG.4-MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
.01
.1
.3
.5
.7
.9
1.1
1.3
1.5
FORWARD VOLTAGE,(V)
FIG.3 - TYPICAL REVERSE
CHARACTERISTICS
PEAK FORWAARD SURGE CURRENT,(A)
INSTANTANEOUS FORWARD CURRENT,(A)
50
100
80
60
8.3ms Single Half
TJ=25 C
Sine Wave
40
JEDEC method
20
0
1
100
5
50
10
100
FIG.5-TYPICAL JUNCTION CAPACITANCE
10
700
1.0
JUNCTION CAPACITANCE,(pF)
REVERSE LEAKAGE CURRENT, (mA)
NUMBER OF CYCLES AT 60Hz
TJ=75 C
TJ=25 C
.1
600
500
400
300
200
100
.01
0
0
20
40
60
80
.01
.1
.5
1
5
10
50
100
Revision
Page.
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6
REVERSE VOLTAGE,(V)
PERCENTAGE RATED PEAK REVERSE VOLTAGE
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.05
100 120 140
Page 3
Document ID
Issued Date
DS-222648
2008/02/10
Revised Date
-
Formosa MS
Schottky Barrier Rectifier
1N5820 THRU 1N5822
Pinning information
Pin
Pin1
Pin2
Simplified outline
cathode
anode
Symbol
1
2
1
2
Marking
Type number
1N5820
1N5821
1N5822
Marking code
1N5820
1N5821
1N5822
Taping & bulk specifications for AXIAL devices
52.4mm
17mm DIA.
55mm Max.
A
17mm DIA.
72mm DIA.
71mm Max.
355mm
OFF Center
both sids
1.0mm
Max OFF
Alignment
1.2mm
6.3mm
REEL PACKING
DEVICE
Q'TY 1
COMPONENT
CARTON
Q'TY 2
APPROX.
CASE
(PCS / REEL)
SPACING
SIZE
(PCS / CARTON)
CROSS
"A" in FIG. A
(m/m)
10 mm
360 * 340 * 370
TYPE
DO-201AD
1,200
WEIGHT(kg)
4,800
9.1
AMMO PACKING
DEVICE
Q'TY 1
INNER
CARTON
Q'TY 2
APPROX.
CASE
(PCS / BOX)
BOX SIZE
SIZE
(PCS / CARTON)
CROSS
(m/m)
(m/m)
TYPE
DO-201AD
1,200
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260 * 83 * 160
440 * 270 * 340
Page 4
WEIGHT(kg)
12,000
Document ID
Issued Date
DS-222648
2008/02/10
17.0
Revised Date
-
Revision
Page.
A
6
Formosa MS
Schottky Barrier Rectifier
1N5820 THRU 1N5822
BULK PACKING
DEVICE
Q'TY 1
INNER
CARTON
Q'TY 2
APPROX.
CASE
(PCS / BOX)
BOX SIZE
SIZE
(PCS / CARTON)
CROSS
TYPE
(m/m)
DO-201AD
305 * 7 3 * 40
500
WEIGHT(kg)
(m/m)
12,000
347 * 320 * 271
16.4
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=10 oC~35 oC Humidity=65%±15%
2.Reflow soldering of surface-mount devices
Critical Zone
T L to T P
tP
TP
Ramp-up
TL
tL
Temperature
T smax
T smin
TS
ts
Preheat
25
Ramp-down
t25 oC to Peak
Wave Soldering
IR Reflow
Time
3.Flow (wave)soldering (solder dipping)
Profile Feature
Soldering Condition
Average ramp-up rate(T L to TP )
<3oC/sec
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t s )
100oC
150oC
60~120sec
Tsmax to TL
-Ramp-upRate
<3oC/sec
Time maintained above:
-Temperature(TL )
-Time(tL )
183oC
60~150sec
255oC-0/+5 oC
Peak Temperature(T P )
Time within 5 oC of actual Peak
Temperature(tP )
10~30sec
Ramp-down Rate
<6 oC/sec
Time 25oC to Peak Temperature
<6minutes
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TEL:886-2-22696661
FAX:886-2-22696141
Page 5
Document ID
Issued Date
DS-222648
2008/02/10
Revised Date
-
Revision
Page.
A
6
Formosa MS
Schottky Barrier Rectifier
1N5820 THRU 1N5822
High reliability test capabilities
Item Test
Conditions
Reference
o
1. Solder Resistance
at 260±5 C for 10±2sec.
immerse body into solder 1/16"±1/32"
MIL-STD-750D
METHOD-2031
2. Solderability
at 245±5 oC for 5 sec.
MIL-STD-202F
METHOD-208
3. Pull Test
1kg in axial lead direction for 10 sec.
MIL-STD-750D
METHOD-2036
4. Bend Lead
0.5kg weight applied to each lead bending
arc 90o±5 o for 3 times.
MIL-STD-750D
METHOD-2036
5. High Temperature Reverse Bias
V R=80% rate at T J=125 oC for 168 hrs.
MIL-STD-750D
METHOD-1026
6. Forward Operation Life
Rated average rectifier current at T=25 oC for 500hrs.
MIL-STD-750D
METHOD-1027
T A = 25 OC, I F = I O
On state: power on for 5 min.
off state: power off for 5 min,
on and off for 500 cycles.
MIL-STD-750D
METHOD-1036
7. Intermittent Operation Life
8. Pressure Cooker
9. Temperature Cycling
10. Thermal Shock
11. Forward Surge
12. Humidity
13. High Temperature Storage Life
14. Solvent Resistance
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15P SIG at TA=121 oC for 4 hrs.
MIL-STD-750D
METHOD-1051
-55 oC to +125oC dwelled for 30 min.
and transferred for 5min. total 10 cycles.
MIL-STD-750D
METHOD-1056
0 oC for 5 min. rise to 100 oC for 5 min. total 10 cycles.
MIL-STD-750D
METHOD-4066-2
8.3ms single half sine-wave superimposed
on rated load, one surge.
at TA=65 oC, RH=98% for 1000hrs.
MIL-STD-750D
METHOD-1038
at 175oC for 1000 hrs.
MIL-STD-750D
METHOD-1031
Dip into Freon at 25oC for 1 min.
MIL-STD-202F
METHOD-215
Page 6
Document ID
Issued Date
DS-222648
2008/02/10
Revised Date
-
Revision
Page.
A
6