WT- 206DV06(A) Zener Diode Chips for ESD Protection 1. Feature: 1-2 Silicon Zener diode chips for electrostatic discharge (ESD) protection application. 2. Structure: 2-1 Planar type: Silicon Diode 2-2 Electrodes: Top side:Aluminum Alloy. Back side:Gold Layer. 3. Size: 3-1. Wafer Form Die Size : 7mils x 7mils (180µm x 180µm ). 3-2. Chip Form Die Size : 5.98mils x 5.98mils (152µm x 152µm ). 3-3. Pad Size : 5.12mils x 5.12mils (130µm x 130µm ). 3-4. Chip Thickness : 4mils (102µm ). 3-5. Pattern drawing : Refer to the attached drawing. 4. Electrical Characteristics (Ta=25ºC) Parameter Symbol Condition Min. Typ. Max. Unit Zener Voltage VZF VZR IZ=5mA 5.5 5.3 - 7.0 6.8 V Leakage Current IDF IDR VR=4V - - 100 100 nA ESD HBM MIL-STD 883 8.0 - - KV Electrostatic Discharge 5. Drawing: Pad Size Top side Passivation LED N P Protection Zener EPI Layer N-sub Back side WEITRON TECHNOLOGY CO., LTD. TEL:886-2-29148158 FAX:886-2-29106796 Http://www.weitron.com.tw 09-Jun-10