Datasheet

DATA SHEET
ANTI-SULFURATED CHIP RESISTORS
AF series
5%, 1%
sizes 0402/0603/0805/1206
Product specification – Jan 07, 2011 V.0
RoHS compliant & Halogen free
Product specification
Chip Resistor Surface Mount
AF
8
SCOPE
ORDERING INFORMATION - GLOBAL PART NUMBER
This specification describes
AF0402 to AF1206 chip resistors
with anti-sulfuration capabilities.
Part number is identified by the series name, size, tolerance, packaging
type, temperature coefficient, taping reel and resistance value.
APPLICATIONS
z Environments exposed to high
levels of contamination, such
as industrial control systems
z
Car electronics, sensors,
electric instrumentation and
communication base stations
2
0402 to 1206
SERIES
GLOBAL PART NUMBER
AF XXXX X X X XX XXXX L
(1)
(2) (3) (4)
(5)
(6)
(7)
(1) SIZE
0402 / 0603 / 0805 / 1206
(2) TOLERANCE
F = ±1%
J = ±5%
FEATURES
z Superior resistance against
sulfur containing atmosphere
z
z
(3) PACKAGING TYPE
R = Paper taping reel
Halogen free product and
production
(4) TEMPERATURE COEFFICIENT OF RESISTANCE
RoHS compliant
(5) TAPING REEL
-
-
Products with lead free
terminations meet RoHS
requirements
Pb-glass contained in electrodes,
resistor element and glass are
exempted by RoHS
z
Reduces environmentally
hazardous waste
z
High component and equipment
reliability
z
Saving of PCB space
– = Base on spec
07 = 7 inch dia. Reel
10 = 10 inch dia. Reel
13 = 13 inch dia. Reel
7D = 7 inch Dia. Reel with double quantity
(6) RESISTANCE VALUE
1 Ω to 22 MΩ
There are 2~4 digits indicated the resistance value. Letter R/K/M is decimal point, no
need to mention the last zero after R/K/M, e.g.1K2, not 1K20.
Detailed resistance rules are displayed in the table of “Resistance rule of global part
number”.
(7) DEFAULT CODE
Letter L is system default code for ordering only (Note)
Resistance rule of global part
number
Resistance coding rule
Example
XRXX
(1 to 9.76 Ω)
1R = 1 Ω
1R5 = 1.5 Ω
9R76 = 9.76 Ω
XXRX
(10 to 97.6 Ω)
10R = 10 Ω
97R6 = 97.6 Ω
XXXR
(100 to 976 Ω)
100R = 100 Ω
XKXX
(1 to 9.76 KΩ)
1K = 1,000 Ω
9K76 = 9760 Ω
XMXX
(1 to 9.76 MΩ)
1M = 1,000,000 Ω
9M76= 9,760,000 Ω
ORDERING EXAMPLE
The ordering code for an AF0402
chip resistor, value 100 KX with
±1% tolerance, supplied in 7-inch
tape reel with 10Kpcs quantity is:
AF0402FR-07100KL.
NOTE
1. All our RSMD products are RoHS
compliant and Halogen free. "LFP" of the
internal 2D reel label states "Lead-Free
Process"
2. On customized label, "LFP" or specific
symbol can be printed
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Jan 07, 2011 V.0
Product specification
Chip Resistor Surface Mount
AF
SERIES
3
8
0402 to 1206
MARKING
AF0402
ynsc007
No marking
Fig. 1
AF0603 / AF0805 / AF1206
03
YNSC001
Fig. 2
Value=10 KΩ
E-24 series: 3 digits, ±5%, ≥10 X
First two digits for significant figure and 3rd digit for number of zeros
AF0603
0
YNSC
Fig. 3
Fig. 4
Value = 24 Ω
Value = 12.4 KΩ
E-24 series: 3 digits, ±1%
One short bar under marking letter
E-96 series: 3 digits, ±1%
First two digits for E-96 marking rule and 3rd letter for number of zeros
AF0805 / AF1206
00
YNSC004
Fig. 5 Value = 10 KΩ
Both E-24 and E-96 series: 4 digits, ±1%
First three digits for significant figure and 4th digit for number of zeros
NOTE
For further marking information, please see special data sheet “Chip resistors marking”. Marking of AF series is the same as RC series
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Jan 07, 2011 V.0
Product specification
Chip Resistor Surface Mount
AF
4
8
0402 to 1206
SERIES
CONSTRUCTION
The resistors are constructed on top of a high grade
ceramic body. Internal metal electrodes are added at
each end and connected by a resistive glaze. The
resistive glaze is covered by a lead-free glass.
The composition of the glaze is adjusted to give the
approximate required resistance value and laser trimming
of this resistive glaze achieves the value within tolerance.
The whole element is covered by a protective overcoat.
Size 0603 and bigger is marked with the resistance value
on top. Finally, the two external terminations (Ni / matte
tin) are added. See fig.6
OUTLINES
For dimensions see Table 1
marking layer
overcoat
primary glass layer
resistive layer
(Jumper chip is a conductor)
inner electrode
termination(Ni/matte tin)
inner electrode
H
ceramic substrate
I2
overcoat
I1
DIMENSIONS
Table 1 For outlines see fig. 6
TYPE
L (mm) W (mm)
H (mm)
I1 (mm)
I2 (mm)
AF0402
1.00 ±0.05 0.50 ±0.05 0.32 ±0.05 0.20 ±0.10 0.25 ±0.10
AF0603
1.60 ±0.10 0.80 ±0.10 0.45 ±0.10 0.25 ±0.15 0.25 ±0.15
AF0805
2.00 ±0.10 1.25 ±0.10 0.50 ±0.10 0.35 ±0.20 0.35 ±0.20
AF1206
3.10 ±0.10 1.60 ±0.10 0.55 ±0.10 0.45 ±0.20 0.40 ±0.20
W
YNSC086
L
Fig. 6 Chip resistor outlines
ELECTRICAL CHARACTERISTICS
Table 2
CHARACTERISTICS
TYPE
RESISTANCE RANGE
Max.
Max.
Dielectric
Operating
Working Overload Withstanding
Temperature Range
Voltage
Voltage
Voltage
AF0402
AF0603
AF0805
±5% (E24), 1 Ω to 22 MΩ
±1% (E24/E96), 1 Ω to 10 MΩ
–55 °C to +155 °C
Zero Ohm Jumper < 0.05 Ω
AF1206
50 V
100 V
100 V
50 V
100 V
100 V
150 V
300 V
300 V
200 V
400 V
500 V
Temperature Coefficient
of Resistance
1 Ω≤ R ≤ 10 Ω, ±200 ppm/°C
10 Ω< R ≤ 10 MΩ, ±100 ppm/°C
10 MΩ< R ≤ 22 MΩ, ±200 ppm/°C
FOOTPRINT AND SOLDERING PROFILES
For recommended footprint and soldering profiles of AF-series is the same as RC-series. Please see the special
data sheet “Chip resistors mounting”.
PACKING STYLE AND PACKAGING QUANTITY
Table 3 Packing style and packaging quantity
PACKING STYLE
Paper taping reel (R)
REEL DIMENSION
AF0402
AF0603
AF0805
AF1206
7" (178 mm)
10,000/20,000
5,000
5,000
5,000
10" (254 mm)
20,000
10,000
10,000
10,000
13" (330 mm)
50,000
20,000
20,000
20,000
NOTE
1. For paper/embossed tape and reel specification/dimensions, please see the special data sheet “Chip resistors packing”.
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Jan 07, 2011 V.0
Product specification
Chip Resistor Surface Mount
AF
SERIES
5
8
0402 to 1206
FUNCTIONAL DESCRIPTION
OPERATING TEMPERATURE RANGE
handbook, halfpage
Range: –55 °C to +155 °C
P
(%Prated )
POWER RATING
100
Each type rated power at 70 °C:
AF0402=1/16 W (0.0625W)
AF0603=1/10 W (0.1W)
AF0805=1/8 W (0.125W)
AF1206=1/4 W (0.25W)
50
0
RATED VOLTAGE
The DC or AC (rms) continuous working voltage
corresponding to the rated power is determined by
the following formula:
MLB206_2
55
0
50
70
100
155
o
Tamb ( C)
Fig. 7 Maximum dissipation (Pmax) in percentage of rated power
as a function of the operating ambient temperature (Tamb )
V = √(P X R)
Where
V = Continuous rated DC or AC (rms) working voltage (V)
P = Rated power (W)
R = Resistance value (X)
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Jan 07, 2011 V.0
Product specification
Chip Resistor Surface Mount
AF
SERIES
6
8
0402 to 1206
TESTS AND REQUIREMENTS
Table 4 Test condition, procedure and requirements
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
Temperature
Coefficient of
Resistance
(T.C.R.)
IEC 60115-1 4.8
At +25/–55 °C and +25/+125 °C
Refer to table 2
Formula:
R2–R1
T.C.R= ------------------------- ×106 (ppm/°C)
R1(t2–t1)
Where
t1=+25 °C or specified room temperature
t2=–55 °C or +125 °C test temperature
R1=resistance at reference temperature in ohms
R2=resistance at test temperature in ohms
IEC 60115-1 4.25
MIL-STD-202 Method 108
At 70±2 °C for 1,000 hours, RCWV applied for
1.5 hours on, 0.5 hour off, still air required
High
Temperature
Exposure/
Endurance at
Upper Category
Temperature
MIL-STD-202 Method 108
1,000 hours at 155±5 °C, unpowered
Moisture
Resistance
MIL-STD-202 Method 106
Life/Endurance
±(1.0%+0.05 Ω)
<100 mΩ for Jumper
±(1.0%+0.05 Ω) for 1% tol.
±(1.0%+0.05 Ω) for 5% tol.
<100 mΩ for Jumper
Each temperature / humidity cycle is defined at 8
hours, 3 cycles / 24 hours for 10d. with 25 °C /
65 °C 95% R.H, without steps 7a & 7b,
unpowered
±(0.5%+0.05 Ω) for 1% tol.
±(1.0%+0.05 Ω) for 5% tol.
<100 mΩ for Jumper
Parts mounted on test-boards, without
condensation on parts
Thermal Shock
MIL-STD-202 Method 107
–55 / +125 °C
±(0.5%+0.05 Ω) for 1% tol.
Number of cycles required is 300. Devices
unmounted
±(1%+0.05 Ω) for 5% tol.
<100 mΩ for Jumper
Maximum transfer time is 20 seconds. Dwell time
is 15 minutes
Short Time
Overload
IEC60115-1 4.13
Bending
IEC 60115-1 4.33
IEC 60068-2-21
2.5 times of rated voltage or maximum overload
voltage whichever is less for 5 seconds at room
temperature
±(1.0%+0.05 Ω)
Chips mounted on a 90 mm glass epoxy resin
PCB (FR4)
±(1.0%+0.05 Ω)
Bending: 0402: 5 mm
0603/0805: 3 mm
1206: 2 mm
No visible damage
No visible damage
<100 mΩ for Jumper
Bending time: 60±5 seconds
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Jan 07, 2011 V.0
Product specification
Chip Resistor Surface Mount
AF
SERIES
7
8
0402 to 1206
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
Biased Humidity
(steady state)
IEC 60115-1 4.37
MIL-STD-202 Method 103
1,000 hours at 85 °C / 85% R.H.
±(3.0%+0.05 Ω)
10% operating power
Measurement at 24±2 hours after test
conclusion
Solderability
- Resistance to
Soldering Heat
- Wetting
IEC 60115-1 4.18
MIL-STD-202 Method 215
J-STD-002
Condition B, no pre-heat of samples
±(0.5%+0.05 Ω) for 1% tol.
Lead-free solder, 260±5 °C, 10±1 seconds
immersion time
±(1.0%+0.05 Ω) for 5% tol.
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
No visible damage
<50 mΩ for Jumper
Electrical test not required
Well tinned (≥95% covered)
Magnification 10X
No visible damage
SMD conditions:
(a) Method B, aging 4 hours at 155 °C
dry heat, lead-free solder bath at 245 °C
(b) Method B, dipping at 215 °C for 3 seconds
ESD
AEC-Q200-002
Human body model,
±(3.0%+0.05 Ω)
1 pos. + 1 neg. discharges:
0402/0603: 1 KV
0805/1206: 2 KV
Terminal Strength
IEC 60115-1 4.32
IEC 60068-2-21
A force of 5N applied for 10±1 seconds
±(1.0%+0.05 Ω)
FOS
ASTM-B-809-95
Sulfur (saturated vapor) 1,000 hours, 60±2 °C,
±(1.0%+0.05 Ω)
91-93% R.H., unpowered
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Jan 07, 2011 V.0
Product specification
Chip Resistor Surface Mount
AF
SERIES
8
8
0402 to 1206
REVISION HISTORY
REVISION
DATE
CHANGE NOTIFICATION
DESCRIPTION
Version 0
Jan 07, 2011
-
- First issue of this specification
“ Yageo reserves all the rights for revising the content of this datasheet without further notification, as long as the products are unchanged. Any
product change will be announced by PCN.”
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Jan 07, 2011 V.0