SKM300GA12V Absolute Maximum Ratings Symbol Conditions Values Unit IGBT VCES IC Tj = 25 °C Tj = 175 °C 1200 V Tc = 25 °C 420 A Tc = 80 °C 319 A 300 A ICnom ICRM SEMITRANS® 4 VGES tpsc Tj ICRM = 3xICnom VCC = 720 V VGE ≤ 15 V VCES ≤ 1200 V 900 A -20 ... 20 V 10 µs -40 ... 175 °C Tc = 25 °C 353 A Tc = 80 °C 264 A 300 A Tj = 125 °C Inverse diode SKM300GA12V IF Tj = 175 °C IFnom Features • V-IGBT = 6. Generation Trench V-IGBT (Fuji) • CAL4 = Soft switching 4. Generation CAL-diode • Isolated copper baseplate using DBC technology (Direct Copper Bonding) • UL recognized, file no. E63532 • Increased power cycling capability • With integrated gate resistor • Low switching losses at high di/dt Typical Applications* • • • • AC inverter drives UPS Electronic welders Switched reluctance motor Remarks • Case temperature limited to Tc = 125°C max, recomm. Top = -40 ... +150°C, product rel. results valid for Tj = 150° IFRM IFRM = 3xIFnom 900 A IFSM tp = 10 ms, sin 180°, Tj = 25 °C 1548 A -40 ... 175 °C Tj Module It(RMS) Tterminal = 80 °C Tstg Visol AC sinus 50 Hz, t = 1 min 500 A -40 ... 125 °C 4000 V Characteristics Symbol IGBT VCE(sat) VCE0 Conditions IC = 300 A VGE = 15 V chiplevel chiplevel min. typ. max. Unit Tj = 25 °C 1.85 2.30 V Tj = 150 °C 2.25 2.55 V Tj = 25 °C 0.94 1.04 V Tj = 150 °C 0.88 0.98 V Tj = 25 °C 3.03 4.20 m 4.57 5.23 m 6 6.5 V 0.1 0.3 mA rCE VGE = 15 V chiplevel VGE(th) VGE=VCE, IC = 12 mA ICES VGE = 0 V VCE = 1200 V Cies Coes Cres QG RGint td(on) tr Eon td(off) tf Eoff Rth(j-c) VCE = 25 V VGE = 0 V Tj = 150 °C Tj = 25 °C Tj = 150 °C mA f = 1 MHz 18 nF f = 1 MHz 1.77 nF f = 1 MHz 1.768 nF 3310 nC VGE = - 8 V...+ 15 V VCC = 600 V IC = 300 A VGE = ±15 V RG on = 2.5 RG off = 2.5 di/dton = 7700 A/µs di/dtoff = 3500 A/µs du/dtoff = 7500 V/ µs per IGBT 5.5 2.50 Tj = 150 °C 340 ns Tj = 150 °C 48 ns Tj = 150 °C 23 mJ Tj = 150 °C 576 ns Tj = 150 °C 69 ns Tj = 150 °C 33 mJ 0.11 K/W GA © by SEMIKRON Rev. 3 – 15.08.2012 1 SKM300GA12V Characteristics Symbol Conditions Inverse diode VF = VEC IF = 300 A VGE = 0 V chiplevel VF0 chiplevel rF SEMITRANS® 4 IRRM Qrr Err Rth(j-c) SKM300GA12V • V-IGBT = 6. Generation Trench V-IGBT (Fuji) • CAL4 = Soft switching 4. Generation CAL-diode • Isolated copper baseplate using DBC technology (Direct Copper Bonding) • UL recognized, file no. E63532 • Increased power cycling capability • With integrated gate resistor • Low switching losses at high di/dt typ. max. Unit Tj = 25 °C 2.17 2.49 V Tj = 150 °C 2.11 2.42 V Tj = 25 °C 1.3 1.5 V Tj = 150 °C 0.9 1.1 V Tj = 25 °C 2.9 3.3 m 4.0 4.4 m Tj = 150 °C IF = 300 A Tj = 150 °C di/dtoff = 8500 A/µs T = 150 °C j VGE = ±15 V T j = 150 °C VCC = 600 V per diode 350 A 45 µC 21 mJ 0.17 K/W Module LCE RCC'+EE' Features chiplevel min. 15 terminal-chip Rth(c-s) per module Ms to heat sink M6 Mt to terminals 20 nH TC = 25 °C 0.18 m TC = 125 °C 0.22 m 0.038 K/W 3 0.02 5 Nm M6 2.5 5 Nm M4 1.1 2 Nm 330 g w Typical Applications* • • • • AC inverter drives UPS Electronic welders Switched reluctance motor Remarks • Case temperature limited to Tc = 125°C max, recomm. Top = -40 ... +150°C, product rel. results valid for Tj = 150° GA 2 Rev. 3 – 15.08.2012 © by SEMIKRON SKM300GA12V Fig. 1: Typ. output characteristic, inclusive RCC'+ EE' Fig. 2: Rated current vs. temperature IC = f (TC) Fig. 3: Typ. turn-on /-off energy = f (IC) Fig. 4: Typ. turn-on /-off energy = f (RG) Fig. 5: Typ. transfer characteristic Fig. 6: Typ. gate charge characteristic © by SEMIKRON Rev. 3 – 15.08.2012 3 SKM300GA12V Fig. 7: Typ. switching times vs. IC Fig. 8: Typ. switching times vs. gate resistor RG Fig. 9: Transient thermal impedance Fig. 10: Typ. CAL diode forward charact., incl. RCC'+ EE' Fig. 11: CAL diode peak reverse recovery current Fig. 12: Typ. CAL diode peak reverse recovery charge 4 Rev. 3 – 15.08.2012 © by SEMIKRON SKM300GA12V SEMITRANS 4 GA This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX * The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our staff. © by SEMIKRON Rev. 3 – 15.08.2012 5