SKM300GAR12E4 - TOTEM ELECTRO

SKM300GAR12E4
Absolute Maximum Ratings
Symbol
Conditions
Values
Unit
IGBT
VCES
IC
Tj = 25 °C
Tj = 175 °C
1200
V
Tc = 25 °C
422
A
Tc = 80 °C
324
A
300
A
ICnom
ICRM
SEMITRANS® 3
IGBT4 Modules
SKM300GAR12E4
VGES
tpsc
Tj
ICRM = 3xICnom
VCC = 800 V
VGE ≤ 15 V
VCES ≤ 1200 V
900
A
-20 ... 20
V
10
µs
-40 ... 175
°C
Tc = 25 °C
353
A
Tc = 80 °C
264
A
300
A
Tj = 150 °C
Inverse diode
IF
Tj = 175 °C
IFnom
Features
• IGBT4 = 4. generation medium fast
trench IGBT (Infineon)
• CAL4 = Soft switching 4. generation
CAL-diode
• Isolated copper baseplate using DBC
technology (Direct Bonded Copper)
• Increased power cycling capability
• With integrated gate resistor
• For higher switching frequenzies up to
12kHz
• UL recognized, file no. E63532
Typical Applications*
IFRM
IFRM = 3xIFnom
900
A
IFSM
tp = 10 ms, sin 180°, Tj = 25 °C
1548
A
-40 ... 175
°C
Tc = 25 °C
353
A
Tc = 80 °C
264
A
300
A
Tj
Freewheeling diode
IF
Tj = 175 °C
IFnom
IFRM
IFRM = 3xIFnom
900
A
IFSM
tp = 10 ms, sin 180°, Tj = 25 °C
1548
A
-40 ... 175
°C
Tj
Module
It(RMS)
Tterminal = 80 °C
• DC/DC – converter
• Brake chopper
• Switched reluctance motor
Tstg
Remarks
Characteristics
• Case temperature limited
to Tc = 125°C max.
• Recommended Top = -40 ... +150°C
• Product reliability results valid
for Tj = 150°C
Visol
Symbol
IGBT
VCE(sat)
VCE0
AC sinus 50 Hz, t = 1 min
Conditions
IC = 300 A
VGE = 15 V
chiplevel
chiplevel
min.
Tj = 25 °C
1.85
2.10
V
Tj = 150 °C
2.25
2.45
V
Tj = 25 °C
0.8
0.9
V
Tj = 150 °C
0.7
0.8
V
Tj = 25 °C
3.50
4.00
m
5.17
5.50
m
5.8
6.5
V
4.0
mA
VGE=VCE, IC = 12 mA
ICES
VGE = 0 V
VCE = 1200 V
Cres
QG
VGE = - 8 V...+ 15 V
RGint
Tj = 25 °C
V
Unit
VGE(th)
VCE = 25 V
VGE = 0 V
4000
max.
VGE = 15 V
chiplevel
Coes
A
°C
typ.
rCE
Cies
500
-40 ... 125
Tj = 150 °C
5
Tj = 25 °C
Tj = 150 °C
mA
f = 1 MHz
17.6
nF
f = 1 MHz
1.16
nF
f = 1 MHz
0.94
nF
1700
nC
2.5

GAR
© by SEMIKRON
Rev. 1 – 21.08.2013
1
SKM300GAR12E4
Characteristics
Symbol
td(on)
tr
Eon
td(off)
tf
Eoff
SEMITRANS® 3
IGBT4 Modules
SKM300GAR12E4
Rth(j-c)
rF
• IGBT4 = 4. generation medium fast
trench IGBT (Infineon)
• CAL4 = Soft switching 4. generation
CAL-diode
• Isolated copper baseplate using DBC
technology (Direct Bonded Copper)
• Increased power cycling capability
• With integrated gate resistor
• For higher switching frequenzies up to
12kHz
• UL recognized, file no. E63532
Typical Applications*
• DC/DC – converter
• Brake chopper
• Switched reluctance motor
Remarks
• Case temperature limited
to Tc = 125°C max.
• Recommended Top = -40 ... +150°C
• Product reliability results valid
for Tj = 150°C
Qrr
Err
Rth(j-c)
chiplevel
IRRM
Qrr
Err
Rth(j-c)
typ.
chiplevel
max.
Unit
220
ns
Tj = 150 °C
44
ns
Tj = 150 °C
27
mJ
Tj = 150 °C
520
ns
Tj = 150 °C
117
ns
Tj = 150 °C
39
mJ
0.11
K/W
Tj = 25 °C
2.17
2.49
V
Tj = 150 °C
2.11
2.42
V
Tj = 25 °C
1.3
1.5
V
Tj = 150 °C
0.9
1.1
V
Tj = 25 °C
2.9
3.3
m
4.0
4.4
m
Tj = 150 °C
IF = 300 A
Tj = 150 °C
di/dtoff = 7300 A/µs T = 150 °C
j
VGE = ±15 V
Tj = 150 °C
VCC = 600 V
per diode
Freewheeling diode
VF = VEC IF = 300 A
VGE = 0 V
chiplevel
VF0
chiplevel
rF
min.
Tj = 150 °C
per IGBT
Inverse diode
VF = VEC IF = 300 A
VGE = 0 V
chiplevel
VF0
chiplevel
IRRM
Features
Conditions
VCC = 600 V
IC = 300 A
VGE = ±15 V
RG on = 1.5 
RG off = 1.5 
di/dton = 6100 A/µs
di/dtoff = 3000 A/µs
345
A
54
µC
23
mJ
0.17
K/W
Tj = 25 °C
2.17
2.49
V
Tj = 150 °C
2.11
2.42
V
Tj = 25 °C
1.3
1.5
V
Tj = 150 °C
0.9
1.1
V
Tj = 25 °C
2.9
3.3
m
4.0
4.4
m
Tj = 150 °C
IF = 300 A
Tj = 150 °C
di/dtoff = 7300 A/µs T = 150 °C
j
VGE = ±15 V
Tj = 150 °C
VCC = 600 V
per Diode
345
A
54
µC
23
mJ
0.17
K/W
20
nH
Module
LCE
RCC'+EE'
15
terminal-chip
Rth(c-s)
per module
Ms
to heat sink M6
Mt
TC = 25 °C
0.25
TC = 125 °C
0.5
0.02
to terminals M6
m
m
0.038
K/W
3
5
Nm
2.5
5
Nm
Nm
w
325
g
GAR
2
Rev. 1 – 21.08.2013
© by SEMIKRON
SKM300GAR12E4
Fig. 1: Typ. output characteristic, inclusive RCC'+ EE'
Fig. 2: Rated current vs. temperature IC = f (TC)
Fig. 3: Typ. turn-on /-off energy = f (IC)
Fig. 4: Typ. turn-on /-off energy = f (RG)
Fig. 5: Typ. transfer characteristic
Fig. 6: Typ. gate charge characteristic
© by SEMIKRON
Rev. 1 – 21.08.2013
3
SKM300GAR12E4
Fig. 7: Typ. switching times vs. IC
Fig. 8: Typ. switching times vs. gate resistor RG
Fig. 9: Transient thermal impedance
Fig. 10: Typ. CAL diode forward charact., incl. RCC'+ EE'
Fig. 11: CAL diode peak reverse recovery current
Fig. 12: Typ. CAL diode peak reverse recovery charge
4
Rev. 1 – 21.08.2013
© by SEMIKRON
SKM300GAR12E4
SEMITRANS 3
GAR
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX
* The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested
for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is
subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our staff.
© by SEMIKRON
Rev. 1 – 21.08.2013
5