Data Sheet

BCM® Bus Converter
BCM384y120x800AC1
®
S
US
C
C
NRTL
US
Fixed Ratio DC-DC Converter
Features
Product Ratings
• Up to 800 W continuous output power
• 1177 W/in3 power density
VIN = 384 V (260 – 410 V)
POUT = up to 800 W
VOUT = 12 V (8.13 – 12.81 V)
(NO LOAD)
K = 1/32
• 97.3% peak efficiency
• 4242 Vdc isolation
• Parallel operation for multi-kW arrays
• OV, OC, UV, short circuit and thermal protection
• 2361 through-hole ChiP package
n 2.402” x 0.990” x 0.286”
Product Description
The VI Chip® Bus Converter (BCM) is a high efficiency Sine
Amplitude Converter (SAC), operating from a 260 to 410 VDC
primary bus to deliver an isolated ratiometric output from
8.13 to 12.81 VDC.
(61.00 mm x 25.14 mm x 7.26 mm)
• PMBusTM management interface*
The BCM384y120x800AC1 offers low noise, fast transient
response, and industry leading efficiency and power density. In
addition, it provides an AC impedance beyond the bandwidth
of most downstream regulators, allowing input capacitance
normally located at the input of a POL regulator to be located at
the input of the BCM module. With a K factor of 1/32, that
capacitance value can be reduced by a factor of 1024x, resulting
in savings of board area, material and total system cost.
Typical Applications
• 380 DC Power Distribution
• High End Computing Systems
• Automated Test Equipment
• Industrial Systems
The BCM384y120x800AC1, combined with the D44TL1A0
Digital Supervisor and I13TL1A0 Digital Isolator, provide a
secondary referenced PMBus™ compatible telemetry and
control interface. This interface provides access to the BCM’s
internal controller configuration, fault monitoring, and other
telemetry functions.
• High Density Power Supplies
• Communications Systems
• Transportation
Leveraging the thermal and density benefits of Vicor’s ChiP
packaging technology, the BCM module offers flexible thermal
management options with very low top and bottom side
thermal impedances. Thermally-adept ChiP-based power
components, enable customers to achieve low cost power
system solutions with previously unattainable system size,
weight and efficiency attributes, quickly and predictably.
*When used with D44TL1A0 and I13TL1A0 chipset
BCM® Bus Converter
Rev 1.2
vicorpower.com
Page 1 of 23
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BCM384y120x800AC1
Typical Application
BCM
SER-OUT
SER-OUT
EN
SER-IN
enable/disable
switch
SER-IN
FUSE
V
IN
C
+IN
+OUT
–IN
–OUT
POL
I_BCM_ELEC
PRIMARY
SOURCE_RTN
SECONDARY
ISOLATION BOUNDRY
Digital Isolator
NC
Host μC
PRI_OUT_A
SEC_IN_A
PRI_OUT_B
SEC_IN_B
TXD
PRI_IN_C
SEC_OUT_C
RXD
PRI_COM
SEC_COM
VDDB
SER-IN
t
+
SER-OUT
Digital
Supervisor
SGND
VDD
–
V
EXT
SGND
PMBus
PMBus
SGND
SGND
SGND
BCM384y120x800AC1 + PRM + VTM, Adaptive Loop Configuration
BCM® Bus Converter
Rev 1.2
vicorpower.com
Page 2 of 23
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BCM384y120x800AC1
Pin Configuration
TOP VIEW
1
2
+OUT
A
A’ +OUT
-OUT
B
B’ -OUT
-OUT
C
C’ -OUT
+OUT
D
D’ +OUT
+OUT
E
E’
+OUT
-OUT
F
F’
-OUT
-OUT
G
G’ -OUT
+OUT
H
H’ +OUT
+IN
I
I’
SER-OUT
+IN
J
J’
EN
+IN
K
K’ SER-IN
+IN
L
L’
-IN
2361 ChiP Package
Pin Descriptions
Pin Number
Signal Name
Type
I1, J1, K1, L1
+IN
INPUT POWER
I’2
SER-OUT
OUTPUT
J’2
EN
INPUT
Enables and disables power supply; Primary side referenced signals
K’2
SER-IN
INPUT
UART receive pin; Primary side referenced signals
L’1
-IN
INPUT POWER
RETURN
Negative input power terminal
+OUT
OUTPUT POWER
Positive output power terminal
-OUT
OUTPUT POWER
RETURN
Negative output power terminal
A1, D1, E1,
H1, A’2, D’2,
E’2, H’2
B1, C1, F1,
G1, B’2, C’2,
F’2, G’2
Function
Positive input power terminal
UART transmit pin; Primary side referenced signals
BCM® Bus Converter
Rev 1.2
vicorpower.com
Page 3 of 23
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BCM384y120x800AC1
Part Ordering Information
Device
Input Voltage
Range
Package Type
Output
Voltage x 10
Temperature
Grade
Output
Power
Revision
Package
Size
Version
BCM
384
y
120
x
800
A
C
1
BCM = BCM
384 = 260 to 410 V
P = ChiP Through Hole
120 = 12 V
T = -40 to 125°C
M = -55 to 125°C
800 = 800 W
A
C = 2361
1
All products shipped in JEDEC standard high profile (0.400” thick) trays (JEDEC Publication 95, Design Guide 4.10).
Standard Models
Part Number
VIN
Package Type
VOUT
Temperature
Power
Package Size
BCM384P120T800AC1
260 to 410 V
ChiP Through Hole
12 V
8.13 to 12.81 V
-40°C to 125°C
800 W
2361
BCM384P120M800AC1
260 to 410 V
ChiP Through Hole
12 V
8.13 to 12.81 V
-55°C to 125°C
800 W
2361
Absolute Maximum Ratings
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause permanent damage to the device.
Parameter
Comments
+IN to –IN
Min
Max
Unit
-1
480
V
1000
V/ms
4242
V
VIN slew rate (operational)
Isolation voltage, input to output
Dielectric test applied to 100% production units
+OUT to –OUT
-1
15
V
SER-OUT to –IN
-0.3
4.6
V
EN to –IN
-0.3
5.5
V
SER-IN to –IN
-0.3
4.6
V
BCM® Bus Converter
Rev 1.2
vicorpower.com
Page 4 of 23
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BCM384y120x800AC1
Electrical Specifications
Specifications apply over all line and load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40°C ≤ TINTERNAL
≤ 125°C (T-Grade); All other specifications are at TINTERNAL = 25ºC unless otherwise noted.
Attribute
Symbol
Conditions / Notes
Min
Typ
Max
Unit
260
410
V
260
410
V
130
V
1000
V/ms
Powertrain
Input voltage range, continuous
Input voltage range, transient
VIN_DC
VIN_TRANS
Full current or power supported, 50 ms max,
10% duty cycle max
VIN µController Active
Input Voltage Slew Rate
Quiescent current
VµC_ACTIVE
dVIN/dt
VIN voltage where µC is initialized,
(ie VAUX = Low, powertrain inactive)
VIN_UVLO- ≤ VIN ≤ VIN_OVLO+
0.001
Disabled, EN Low, VIN = 384 V
IQ
2
TINTERNAL ≤ 100ºC
VIN = 384 V, TINTERNAL = 25ºC
No load power dissipation
Inrush current peak
DC input current
Transformation ratio
Output power (continuous)
Output power (pulsed)
Output current (continuous)
Output current (pulsed)
VIN = 384 V
PNL
IINR_P
IIN_DC
K
5
Efficiency (hot)
Efficiency (over load range)
Output resistance
Switching frequency
VIN = 260 V to 410 V
22
VIN = 410 V, COUT = 1000 µF,
RLOAD = 25% of full load current
Input inductance (parasitic)
Output inductance (parasitic)
10
15
At POUT = 800 W, TINTERNAL ≤ 100ºC
2.2
1/32
10 ms pulse, 25% Duty cycle, PTOTAL = 50% rated POUT_DC
IOUT_DC
10 ms pulse, 25% Duty cycle, ITOTAL = 50% rated IOUT_DC
96.2
hAMB
V/V
W
1100
W
68
A
91
A
97.2
VIN = 260 V to 410 V, IOUT = 68 A
95.7
VIN = 384 V, IOUT = 34 A
96.3
97
97
%
VIN = 384 V, IOUT = 68 A, TINTERNAL = 100°C
96
14 A < IOUT < 68 A, TINTERNAL ≤ 100ºC
90
ROUT_COLD
VIN = 384 V, IOUT = 68 A, TINTERNAL = -40°C
1.0
1.65
2.2
ROUT_AMB
VIN = 384 V, IOUT = 68 A
1.6
2.3
2.9
ROUT_HOT
VIN = 384 V, IOUT = 68 A, TINTERNAL = 100°C
2.3
2.9
3.4
Frequency of the Output Voltage Ripple = 2x FSW
0.97
1.03
1.09
VOUT_PP
LIN_PAR
LOUT_PAR
Input Series inductance (internal)
LIN_INT
Effective Input capacitance (internal)
CIN_INT
A
800
hHOT
h20%
FSW
W
A
TINTERNAL ≤ 100ºC
COUT = 0 F, IOUT = 68 A, VIN = 384 V,
Output voltage ripple
20
16
K = VOUT / VIN, at no load
IOUT_PULSE
13
VIN = 260 V to 410 V, TINTERNAL = 25ºC
VIN = 384 V, IOUT = 68 A
Efficiency (ambient)
9.3
POUT_DC
POUT_PULSE
mA
4
%
%
mΩ
MHz
210
20 MHz BW
mV
TINTERNAL ≤ 100ºC
Frequency 2.5 MHz (double switching frequency),
Simulated lead model
Frequency 2.5 MHz (double switching frequency),
Simulated lead model
Reduces the need for input decoupling
inductance in BCM arrays
Effective value at 384 VIN
BCM® Bus Converter
Rev 1.2
vicorpower.com
Page 5 of 23
05/2015
800 927.9474
300
7
nH
0.64
nH
0.56
µH
0.25
µF
BCM384y120x800AC1
Electrical Specifications (Cont.)
Specifications apply over all line and load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40°C ≤ TINTERNAL
≤ 125°C (T-Grade); All other specifications are at TINTERNAL = 25ºC unless otherwise noted.
Attribute
Symbol
Effective Output capacitance (internal)
COUT_INT
Effective Output capacitance (external)
COUT_EXT
Array Maximum external output
capacitance
COUT_AEXT
Auto Restart Time
Input overvoltage lockout threshold
tAUTO_RESTART
Conditions / Notes
Powertrain (Cont.)
Effective value at 12 VOUT
Excessive capacitance may drive module into
SC protection
Min
Typ
Max
104
µF
0
1000
µF
292.5
357.5
ms
V
COUT_AEXT Max = N * 0.5*COUT_EXT Max
Powertrain Protection
Startup into a persistent fault condition.
Non-Latching fault detection given VIN > VIN_UVLO+,
Module will ignore attempts to re-enable during time off
VIN_OVLO+
430
440
450
Input overvoltage recovery threshold
VIN_OVLO-
420
430
440
Input overvoltage lockout hysteresis
VIN_OVLO_HYST
Overvoltage lockout response time
tOVLO
Soft-Start time
tSOFT-START
Output overcurrent trip threshold
IOCP
Overcurrent Response Time Constant
tOCP
Short circuit protection trip threshold
ISCP
Short circuit protection response time
tSCP
Overtemperature shutdown threshold
tOTP
Unit
From powertrain active
Fast Current limit protection disabled during Soft-Start
75
Effective internal RC filter
V
10
µs
1
ms
85
110
3
A
ms
105
A
1
Temperature sensor located inside controller IC
V
10
µs
ºC
125
Powertrain Supervisory Limits
Input overvoltage lockout threshold
VIN_OVLO+
420
Input overvoltage recovery threshold
VIN_OVLO-
405
Input overvoltage lockout hysteresis
VIN_OVLO_HYST
Overvoltage lockout response time
Input undervoltage lockout threshold
434.5
450
424
440
10.5
tOVLO
100
µs
195
221
250
Input undervoltage recovery threshold
VIN_UVLO+
225
243
255
Input undervoltage lockout hysteresis
VIN_UVLO_HYST
Undervoltage lockout response time
tUVLO
Undervoltage startup delay
tUVLO+_DELAY
Output Overcurrent Trip Threshold
IOCP
Overcurrent Response Time Constant
tOCP
Overtemperature shutdown threshold
tOTP
Temperature sensor located inside controller IC
Undertemperature shutdown threshold
tUTP
Temperature sensor located inside controller IC
Startup into a persistent fault condition. Non-Latching
fault detection given VIN > VIN_UVLO+
Undertemperature restart time
80
tUTP_RESTART
Rev 1.2
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V
V
15
V
100
µs
20
ms
83
86
2
BCM® Bus Converter
V
V
VIN_UVLO-
From VIN = VIN_UVLO+ to powertrain active,
EN floating, (i.e One time Startup delay from
application of VIN to VOUT)
V
A
ms
125
ºC
-45
3
ºC
s
BCM384y120x800AC1
Output Power (W)
1000
800
600
400
200
0
35
45
55
65
75
85
95
105
115
125
Case Temperature (°C)
Top only at temperature
Top and leads at
temperature
Leads at temperature
Top, leads, & belly at
temperature
1200
108
1100
100
1000
92
Output Current (A)
Output Power (W)
Figure 1 — Specified thermal operating area
900
800
700
600
500
84
76
68
60
52
44
400
36
300
260
275
290
305
320
335
350
365
380
395
260
410
275
290
320
POUT_DC
POUT_PULSE
Figure 2 — Specified electrical operating area using rated ROUT_HOT
Output Capacitance
(% Rated COUT MAX)
335
350
365
Input Voltage (V)
Input Voltage (V)
POUT_DC
305
110
100
90
80
70
60
50
40
30
20
10
0
0
10
20
30
40
50
60
70
80
90
Load Current (% IOUT_AVG)
Figure 3 — Specified Primary start-up into load current and external capacitance
BCM® Bus Converter
Rev 1.2
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Page 7 of 23
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100 110
POUT_PULSE
380
395
410
BCM384y120x800AC1
Reported Characteristics
Specifications apply over all line, load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40°C ≤ TINTERNAL
≤ 125°C (T-Grade); All other specifications are at TINTERNAL = 25ºC unless otherwise noted.
Monitored Telemetry
• The BCM communication version is not intended to be used without a Digital Supervisor.
ACCURACY
(RATED RANGE)
FUNCTIONAL
REPORTING RANGE
UPDATE
PMBusTM READ COMMAND
Input voltage
(88h) READ_VIN
± 5%(LL - HL)
130 V to 450 V
100 µs
VACTUAL = VREPORTED x 10-1
Input current
(89h) READ_IIN
± 20%(10 - 20% of FL)
± 5%(20 - 133% of FL)
- 0.42 A to 2.9 A
100 µs
IACTUAL = IREPORTED x 10-3
Output voltage[1]
(8Bh) READ_VOUT
± 5%(LL - HL)
16.25 V to 56.25 V
100 µs
VACTUAL = VREPORTED x 10-1
Output current
(8Ch) READ_IOUT
± 20%(10 - 20% of FL)
± 5%(20 - 133% of FL)
- 13 A to 90.4 A
100 µs
IACTUAL = IREPORTED x 10-2
Output resistance
(D4h) READ_ROUT
± 5%(50 - 100% of FL) at NL
± 10%(50 - 100% of FL)(LL - HL)
0.5 mΩ to 5 mΩ
100 ms
RACTUAL = RREPORTED x 10-5
(8Dh) READ_TEMPERATURE_1
± 7°C(Full Range)
- 55ºC to 130ºC
100 ms
TACTUAL = TREPORTED
ATTRIBUTE
Temperature[2]
[1]
[2]
DIGITAL SUPERVISOR
RATE
REPORTED UNITS
Default READ Output Voltage returned when unit is disabled = -300 V.
Default READ Temperature returned when unit is disabled = -273°C.
Variable Parameter
• Factory setting of all below Thresholds and Warning limits are 100% of listed protection values.
• Variables can be written only when module is disabled either EN pulled low or VIN < VIN_UVLO-.
• Module must remain in a disabled mode for 3 ms after any changes to the below variables allowing ample time to commit changes to EEPROM.
ATTRIBUTE
DIGITAL SUPERVISOR
PMBusTM
COMMAND
[3]
Input / Output Overvoltage
Protection Limit
(55h) VIN_OV_FAULT_LIMIT
Input / Output Overvoltage
Warning Limit
(57h) VIN_OV_WARN_LIMIT
Input / Output Undervoltage
Protection Limit
(D7h) DISABLE_FAULTS
CONDITIONS / NOTES
ACCURACY
(RATED RANGE)
FUNCTIONAL
REPORTING
RANGE
DEFAULT
± 5%(LL - HL)
130 V to 435 V
100%
± 5%(LL - HL)
130 V to 435 V
100%
± 5%(LL - HL)
130 V or 260 V
100%
VIN_OVLO- is automatically 3%
lower than this set point
Can only be disabled to a preset
default value
VALUE
Input Overcurrent
Protection Limit
(5Bh) IIN_OC_FAULT_LIMIT
± 20%(10 - 20% of FL)
± 5%(20 - 133% of FL)
0.21 to 0.42 A
0.42 to 2.810 A
100%
Input Overcurrent
Warning Limit
(5Dh) IIN_OC_WARN_LIMIT
± 20%(10 - 20% of FL)
± 5%(20 - 133% of FL)
0.21 to 0.42 A
0.42 to 2.810 A
100%
Overtemperature Protection
Limit
(4Fh) OT_FAULT_LIMIT
± 7°C(Full Range)
0 to 125°C
100%
Overtemperature
Warning Limit
(51h) OT_WARN_LIMIT
± 7°C( Full Range)
0 to 125°C
100%
± 50 µs
0 to 100 ms
0 ms
Turn on Delay
[3]
(60h) TON_DELAY
Additional time delay to the
Undervoltage Startup Delay
Refer to Digital Supervisor datasheet for complete list of supported commands.
BCM® Bus Converter
Rev 1.2
vicorpower.com
Page 8 of 23
05/2015
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BCM384y120x800AC1
Signal Characteristics
Specifications apply over all line, load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40°C ≤ TINTERNAL
≤ 125°C (T-Grade); All other specifications are at TINTERNAL = 25ºC unless otherwise noted.
UART SER-IN / SER-OUT Pins
• Universal Asynchronous Receiver/Transmitter (UART) pins.
• The BCM communication version is not intended to be used without a Digital Supervisor.
• Isolated I2C communication and telemetry is available when using Vicor Digital Isolator and Vicor Digital Supervisor. Please see specific product data sheet
for more details.
• UART SER-IN pin is internally pulled high using a 1.5 kΩ to 3.3 V.
SIGNAL TYPE
STATE
GENERAL I/O
ATTRIBUTE
SYMBOL
Baud Rate
CONDITIONS / NOTES
BRUART
MIN
Rate
TYP
MAX
750
UNIT
Kbit/s
SER-IN Pin
VSER-IN_IH
2.3
V
SER-IN Input Voltage Range
VSER-IN_IL
DIGITAL
1
V
SER-IN rise time
tSER-IN_RISE
10% to 90%
400
ns
SER-IN fall time
tSER-IN_FALL
10% to 90%
25
ns
SER-IN RPULLUP
RSER-IN_PLP
Pull up to 3.3 V
1.5
kΩ
SER-IN External Capacitance
CSER-IN_EXT
INPUT
Regular
Operation
pF
SER-OUT Pin
VSER-OUT_OH
0 mA ≥ IOH ≥ -4 mA
VSER-OUT_OL
0 mA ≤ IOL ≤ 4 mA
SER-OUT rise time
tSER-OUT_RISE
10% to 90%
55
ns
SER-OUT fall time
tSER-OUT_FALL
10% to 90%
45
ns
SER-OUT Output Voltage
Range
DIGITAL
OUTPUT
400
SER-OUT source current
ISER-OUT
SER-OUT output impedance
ZSER-OUT
2.8
V
0.5
VSER-OUT = 2.8 V
6
120
V
mA
Ω
Enable / Disable Control
• The EN pin is a standard analog I/O configured as an input to an internal µC.
• It is internally pulled high to 3.3 V.
• When held low the BCM internal bias will be disabled and the powertrain will be inactive.
• In an array of BCMs, EN pins should be interconnected to synchronize startup and permit startup into full load conditions.
• Enable / disable command will have no effect if the EN pin is disabled.
SIGNAL TYPE
STATE
ATTRIBUTE
SYMBOL
CONDITIONS / NOTES
Startup
EN to Powertrain active time
tEN_START
VIN > VIN_UVLO+,
EN held low both conditions satisfied
for t > tUVLO+_DELAY
EN Voltage Threshold
VENABLE
EN Resistance (Internal)
REN_INT
ANALOG
INPUT
Regular
Operation
EN Disable Threshold
MIN
TYP
MAX
250
µs
2.3
Internal pull up resistor
VEN_DISABLE_TH
BCM® Bus Converter
Rev 1.2
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UNIT
V
1.5
kΩ
1
V
OUTPUT
BIDIR
INPUT
VOUT
EN
+IN
VμC
STARTUP
VIN_UVLO-
VIN_OVLO-
OVER VOLTAGE
VIN_OVLO+
VNOM
tUVLO+_DELAY
VIN_UVLO+
p
l -u
O N Pul
E
RN AL
AG
TU R N
N
T
L
O
E
TE
NVO
AG IN
E
R
IZ TUR
LT IN
L
E
O
IA
V EROV
IT U T
UT & S
I N TP
UT
P
P
U
c
I N EN
µ O
IN
BCM® Bus Converter
Rev 1.2
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Page 10 of 23
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tAUTO-RESTART
ENABLE CONTROL
OVER CURRENT
tWAIT ≥ tENABLE_OFF
tSCP
SHUTDOWN
F
OF
NT
NH
E
R
W G
EV
TU
LO HI
E
IT
T
D ED
G
R
U
E
A
A
L L LL
RC
LT
ST
U
CI
PU
RE
T
VO
E LE P
R
L
T
T
O
AB AB
PU
PU
SH
IN
IN
E N EN
BCM384y120x800AC1
BCM Module Timing diagram
BCM384y120x800AC1
High Level Functional State Diagram
Conditions that cause state transitions are shown along arrows. Sub-sequence activities listed inside the state bubbles.
Application
of VIN
VμC < VIN < VIN_UVLO+
STARTUP SEQUENCE
VIN > VIN_UVLO+
STANDBY SEQUENCE
EN High
EN High
Powertrain Stopped
Powertrain Stopped
ENABLE falling edge,
or OTP detected
tUVLO+_DELAY expired
ONE TIME DELAY
INITIAL STARTUP
Input OVLO or UVLO,
Output OCP,
or UTP detected
Fault
Autorecovery
ENABLE falling edge,
or OTP detected
FAULT
SEQUENCE
Input OVLO or UVLO,
Output OCP,
or UTP detected
EN High
Powertrain Stopped
SUSTAINED
OPERATION
EN High
Powertrain Active
Short Circuit detected
BCM® Bus Converter
Rev 1.2
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BCM384y120x800AC1
Application Characteristics
15
14
13
12
11
10
9
8
7
6
5
4
3
98.0
Full Load Efficiency (%)
260
277
293
310
327
343
360
377
393
97.5
97.0
96.5
96.0
-40
410
-20
- 40°C
25°C
54
96
48
94
42
36
PD
30
410 V
98
54
96
48
94
42
36
92
PD
90
30
12
6
82
6
0
13.6 20.4 27.2 34.0 40.8 47.6 54.4 61.2 68.0
80
12
82
80
0
0.0
6.8
13.6 20.4 27.2 34.0 40.8 47.6 54.4 61.2 68.0
Load Current (A)
260 V
384 V
Load Current (A)
VIN :
410 V
Figure 6 — Efficiency and power dissipation at TCASE = -40°C
54
96
48
94
42
92
36
PD
90
30
88
24
86
18
84
12
82
6
0
13.6 20.4 27.2 34.0 40.8 47.6 54.4 61.2 68.0
260 V
384 V
410 V
2
1
0
-40
-20
Load Current (A)
VIN :
384 V
3
Power Dissipation (W)
98
260 V
Figure 7 — Efficiency and power dissipation at TCASE = 25°C
ROUT (mΩ)
VIN :
Efficiency (%)
384 V
18
84
6.8
260 V
84
18
0.0
100
24
86
80
80
86
24
6.8
60
88
88
0.0
Power Dissipation (W)
Efficiency (%)
98
90
40
Figure 5 — Full load efficiency vs. temperature; VIN
Figure 4 — No load power dissipation vs. VIN
92
20
VIN:
90°C
Efficiency (%)
TTOP SURFACE CASE:
0
Case Temperature (ºC)
Input Voltage (V)
0
20
40
60
Case Temperature (°C)
410 V
Figure 8 — Efficiency and power dissipation at TCASE = 90°C
IOUT:
68 A
Figure 9 — ROUT vs. temperature; Nominal VIN
BCM® Bus Converter
Rev 1.2
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80
100
Power Dissipation (W)
Power Dissipation (W)
Product is mounted and temperature controlled via top side cold plate, unless otherwise noted. See associated figures for general trend data.
BCM384y120x800AC1
Voltage Ripple (mVPK-PK)
300
250
200
150
100
50
0
0.0
6.8
13.6 20.4 27.2 34.0 40.8 47.6 54.4 61.2 68.0
Load Current (A)
VIN:
384 V
Figure 10 — VRIPPLE vs. IOUT ; No external COUT. Board mounted
module, scope setting : 20 MHz analog BW
Figure 11 — Full load ripple, 270 µF CIN; No external COUT. Board
mounted module, scope setting : 20 MHz analog BW
Figure 12 — 0 A– 68 A transient response:
CIN = 270 µF, no external COUT
Figure 13 — 68 A – 0 A transient response:
CIN = 270 µF, no external COUT
Figure 14 — Start up from application of VIN = 384 V, 50% IOUT,
100% COUT
Figure 15 — Start up from application of EN with pre-applied
VIN = 384 V, 50% IOUT, 100% COUT
BCM® Bus Converter
Rev 1.2
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BCM384y120x800AC1
General Characteristics
Specifications apply over all line, load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40°C ≤ TINTERNAL
≤ 125°C (T-Grade); All other specifications are at TINTERNAL = 25ºC unless otherwise noted.
Attribute
Symbol
Conditions / Notes
Min
Typ
Max
Unit
Mechanical
Length
L
60.87 / [2.396] 61.00 / [2.402] 61.13 / [2.407] mm / [in]
Width
W
24.76 / [0.975] 25.14 / [0.990] 25.52 / [1.005] mm / [in]
Height
H
7.21 / [0.284] 7.26 / [0.286]
7.31 / [0.288] mm / [in]
Volume
Vol
11.13 / [0.679]
cm3/ [in3]
Weight
W
41 / [1.45]
g / [oz]
Without heatsink
Lead finish
Nickel
0.51
2.03
Palladium
0.02
0.15
Gold
0.003
0.051
BCM384P120T800AC1 (T-Grade)
-40
125
°C
BCM384P120M800AC1 (M-Grade)
Estimated thermal resistance to
maximum temperature internal
component from isothermal top
-55
125
°C
µm
Thermal
Operating temperature
Thermal resistance top side
Thermal resistance leads
Thermal resistance bottom side
TINTERNAL
fINT-TOP
fINT-LEADS
fINT-BOTTOM
Estimated thermal resistance to
maximum temperature internal
component from isothermal leads
Estimated thermal resistance to
maximum temperature internal
component from isothermal bottom
Thermal capacity
1.35
°C/W
2
°C/W
1.91
°C/W
34
Ws /°C
Assembly
Storage Temperature
TST
ESDHBM
ESD Withstand
ESDCDM
BCM384P120T800AC1 (T-Grade)
-55
125
°C
BCM384P120M800AC1 (M-Grade)
-65
125
°C
Human Body Model,
"ESDA / JEDEC JDS-001-2012" Class I-C (1kV to < 2 kV)
Charge Device Model,
"JESD 22-C101-E" Class II (200V to < 500V)
BCM® Bus Converter
Rev 1.2
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BCM384y120x800AC1
General Characteristics (Cont.)
Specifications apply over all line, load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40°C ≤ TINTERNAL
≤ 125°C (T-Grade); All other specifications are at TINTERNAL = 25ºC unless otherwise noted.
Attribute
Symbol
Conditions / Notes
Min
Typ
Max
Unit
135
°C
Soldering [1]
Peak temperature Top case
Safety
Isolation voltage
VHIPOT
4,242
IN to CASE
2,121
OUT to CASE
2,121
Isolation capacitance
CIN_OUT
Unpowered unit
620
Isolation resistance
RIN_OUT
At 500 Vdc
10
MTBF
Agency approvals / standards
[1]
IN to OUT
MIL-HDBK-217Plus Parts Count 25°C Ground Benign, Stationary,
Indoors / Computer
VDC
780
BCM® Bus Converter
Rev 1.2
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pF
MΩ
5.61
Telcordia Issue 2 - Method I Case III;
1.73
25°C Ground Benign, Controlled
cTUVus "EN 60950-1"
cURus "UL 60950-1"
CE Marked for Low Voltage Directive and RoHS Recast Directive, as applicable
Product is not intended for reflow solder attach.
940
MHrs
MHrs
SER-IN
1.5 kΩ
-VIN
EN
BCM® Bus Converter
Rev 1.2
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-Vcc
Startup /
Re-start Delay
Over-Temp
Under-Temp
Cntrl
SEPIC EN
Over Voltage
UnderVoltage
SER-IN
EN
SER-OUT
Current Flow detection
+ Forward IIN sense
1.5 kΩ
SER-OUT
3.3v
Linear
Regulator
Digital Controller
SEPIC
Modulator
Differential Current
Sensing
Fast Current
Limit
Slow Current
Limit
Soft-Start
Temperature
Sensor
+Vcc
Startup
Circuit
( +VIN /4 ) - X
On/Off
+VIN /4
Analog Controller
+VIN
Primary and
Secondary Gate
Drive Transformer
C10
C09
C08
Cr
C07
IIN
Lr
+VIN /4
C06
C05
C04
C03
C02
C01
Primary Stage
L01
Q08
Q07
Q06
Q05
Q04
Q03
Q02
Q01
Q09
Secondary Stage
Full-Bridge Synchronous
Rectification
Q10
COUT
-VOUT
+VOUT
BCM384y120x800AC1
BCM Module Block Diagram
BCM384y120x800AC1
System Diagram
-OUT
BCM
SER-OUT
-IN BCM
SEC-IN-B
TX D 1 ’
SEC-OUT-C
RXD1
PRI-OUT-B
PRI-IN-C
PRI-COM
RXD4
VDDB
RXD3
VDD
RXD2
SEC-COM
RXD1
TXD4
VDD
TXD3
Digital
Supervisor
D44TL1A0
SDA
5V EXT
NC
SEC-IN-A
PRI-OUT-A
SDA
NC
SER-IN
SCL
BCM EN
NC
Digital Isolator
I13TL1A0
SGND
SCL
3 kΩ
VDD
CP
NC
NC
NC
SSTOP
3 kΩ
D
Q
SGND
VCC
D
Flip-flop
FDG6318P
R2
10 kΩ
NC
SADDR
NC
NC
TXD2
TXD1
74LVC1G74DC
10 kΩ
EN Control
3.3V, at least 20mA
when using 4xDISO
Ref to Digital Isolator
datasheet for more details
SD
RD
Q
SDA
SCL
Host
μc
PMBus
R1
SGND
The BCM384y120x800AC1 bus converter provides accurate telemetry monitoring and reporting, threshold and warning limits
adjustment, in addition to corresponding status flags.
The BCM internal µC is referenced to primary ground. The Digital Isolator allows UART communication interface with the host Digital
Supervisor at typical speed of 750 KHz across the isolation barrier. One of the advantages of the Digital Isolator is its low power
consumption. Each transmission channel is able to draw its internal bias circuitry directly from the input signal being transmitted to
the output with minimal to no signal distortion.
The Digital Supervisor provides the host system µC with access to an array of up to 4 BCMs. This array is constantly polled for status
by the Digital Supervisor. Direct communication to individual BCM is enabled by a page command. For example, the page (0x00) prior
to a telemetry inquiry points to the Digital Supervisor data and pages (0x01 – 0x04) prior to a telemetry inquiry points to the array of
BCMs connected data. The Digital Supervisor constantly polls the BCM data through the UART interface.
The Digital Supervisor enables the PMBusTM compatible host interface with an operating bus speed of up to 400 kHz. The Digital
Supervisor follows the PMBus command structure and specification.
Please refer to the Digital Supervisor data sheet for more details.
BCM® Bus Converter
Rev 1.2
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BCM384y120x800AC1
Sine Amplitude Converter™ Point of Load Conversion
ROUT
0.124 nH
+
RCIN
31.8 mΩ
CIN
VIN
V
IN
–
mΩ
R2.3
OUT
IOUT
IOUT
LIN_LEADS = 7 nH
RCIN
CIN
0.25 µF
+
+
IIQQ
24 mA
–
+
RRC
COUT
OUT
122 mΩ
V•I
1/32 • IOUT
LOUT_LEADS = 0.64 nH
106 µΩ
1/32 • VIN
COUT
COUT
104 µF
VOUT
VOUT
–
K
LIN_INT = 0.56 µH
–
Figure 16 — BCM module AC model
The Sine Amplitude Converter (SAC™) uses a high frequency resonant
tank to move energy from input to output. (The resonant tank is
formed by Cr and leakage inductance Lr in the power transformer
windings as shown in the BCM module Block Diagram). The resonant
LC tank, operated at high frequency, is amplitude modulated as a
function of input voltage and output current. A small amount of
capacitance embedded in the input and output stages of the module is
sufficient for full functionality and is key to achieving high power
density.
The BCM384y120x800AC1 SAC can be simplified into the preceeding
model.
The use of DC voltage transformation provides additional interesting
attributes. Assuming that ROUT = 0 Ω and IQ = 0 A, Eq. (3) now becomes
Eq. (1) and is essentially load independent, resistor R is now placed in
series with VIN.
RRIN
VIN
Vin
+
–
SAC™
SAC
1/32
KK == 1/32
V
OUT
Vout
At no load:
VOUT = VIN • K
(1)
K represents the “turns ratio” of the SAC.
Rearranging Eq (1):
K=
Figure 17 — K = 1/32 Sine Amplitude Converter
with series input resistor
The relationship between VIN and VOUT becomes:
VOUT
VIN
(2)
VOUT = (VIN – IIN • RIN) • K
Substituting the simplified version of Eq. (4)
(IQ is assumed = 0 A) into Eq. (5) yields:
In the presence of load, VOUT is represented by:
VOUT = VIN • K – IOUT • ROUT
(3)
VOUT = VIN • K – IOUT • RIN • K2
and IOUT is represented by:
IOUT =
(5)
IIN – IQ
K
(4)
ROUT represents the impedance of the SAC, and is a function of the
RDSON of the input and output MOSFETs and the winding resistance of
the power transformer. IQ represents the quiescent current of the SAC
control, gate drive circuitry, and core losses.
BCM® Bus Converter
Rev 1.2
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BCM384y120x800AC1
This is similar in form to Eq. (3), where ROUT is used to represent the
characteristic impedance of the SAC™. However, in this case a real R on
the input side of the SAC is effectively scaled by K2 with respect
to the output.
Assuming that R = 1 Ω, the effective R as seen from the secondary side is
0.98 mΩ, with K = 1/32 .
A similar exercise should be performed with the addition of a capacitor
or shunt impedance at the input to the SAC. A switch in series with VIN
is added to the circuit. This is depicted in Figure 18.
A solution for keeping the impedance of the SAC low involves
switching at a high frequency. This enables small magnetic components
because magnetizing currents remain low. Small magnetics mean small
path lengths for turns. Use of low loss core material at high frequencies
also reduces core losses.
SS
VVin
IN
+
–
Low impedance is a key requirement for powering a high-current, lowvoltage load efficiently. A switching regulation stage should have
minimal impedance while simultaneously providing appropriate
filtering for any switched current. The use of a SAC between the
regulation stage and the point of load provides a dual benefit of scaling
down series impedance leading back to the source and scaling up shunt
capacitance or energy storage as a function of its K factor squared.
However, the benefits are not useful if the series impedance of the SAC
is too high. The impedance of the SAC must be low, i.e. well beyond the
crossover frequency of the system.
C
C
SAC™
SAC
K = 1/32
K = 1/32
VVout
OUT
The two main terms of power loss in the BCM module are:
n No load power dissipation (PNL): defined as the power
used to power up the module with an enabled powertrain
at no load.
n Resistive loss (ROUT): refers to the power loss across
the BCM® module modeled as pure resistive impedance.
Figure 18 — Sine Amplitude Converter with input capacitor
PDISSIPATED = PNL + PROUT
A change in VIN with the switch closed would result in a change in
capacitor current according to the following equation:
IC(t) = C
dVIN
dt
Therefore,
(7)
Assume that with the capacitor charged to VIN, the switch is opened
and the capacitor is discharged through the idealized SAC. In this case,
IC= IOUT • K
(10)
(8)
POUT = PIN – PDISSIPATED = PIN – PNL – PROUT
The above relations can be combined to calculate the overall module
efficiency:
h =
POUT = PIN – PNL – PROUT
PIN
PIN
substituting Eq. (1) and (8) into Eq. (7) reveals:
IOUT
C • dVOUT
=
K2
dt
(9)
The equation in terms of the output has yielded a K2 scaling factor for
C, specified in the denominator of the equation.
A K factor less than unity results in an effectively larger capacitance on
the output when expressed in terms of the input. With a K = 1/32 as
shown in Figure 18, C=1 μF would appear as C = 1024 μF when viewed
from the output.
(11)
=
VIN • IIN – PNL – (IOUT)2 • ROUT
VIN • IIN
= 1–
(
)
PNL + (IOUT)2 • ROUT
VIN • IIN
BCM® Bus Converter
Rev 1.2
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BCM384y120x800AC1
Input and Output Filter Design
Thermal Considerations
A major advantage of SAC™ systems versus conventional PWM
converters is that the transformer based SAC does not require external
filtering to function properly. The resonant LC tank, operated at
extreme high frequency, is amplitude modulated as a function of input
voltage and output current and efficiently transfers charge through the
isolation transformer. A small amount of capacitance embedded in the
input and output stages of the module is sufficient for full functionality
and is key to achieving power density.
The ChiP package provides a high degree of flexibility in that it presents
three pathways to remove heat from internal power dissipating
components. Heat may be removed from the top surface, the bottom
surface and the leads. The extent to which these three surfaces are
cooled is a key component for determining the maximum power that is
available from a ChiP, as can be seen from Figure 1.
This paradigm shift requires system design to carefully evaluate
external filters in order to:
n Guarantee low source impedance:
To take full advantage of the BCM module’s dynamic
response, the impedance presented to its input terminals
must be low from DC to approximately 5 MHz. The
connection of the bus converter module to its power
source should be implemented with minimal distribution
inductance. If the interconnect inductance exceeds
100 nH, the input should be bypassed with a RC damper
to retain low source impedance and stable operation. With
an interconnect inductance of 200 nH, the RC damper
may be as high as 1 μF in series with 0.3 Ω. A single
electrolytic or equivalent low-Q capacitor may be used in
place of the series RC bypass.
Since the ChiP has a maximum internal temperature rating, it is
necessary to estimate this internal temperature based on a real thermal
solution. Given that there are three pathways to remove heat from the
ChiP, it is helpful to simplify the thermal solution into a roughly
equivalent circuit where power dissipation is modeled as a current
source, isothermal surface temperatures are represented as voltage
sources and the thermal resistances are represented as resistors. Figure
19 shows the “thermal circuit” for a VI Chip® BCM module 2361 in an
application where the top, bottom, and leads are cooled. In this case,
the BCM power dissipation is PDTOTAL and the three surface
temperatures are represented as TCASE_TOP, TCASE_BOTTOM, and TLEADS. This
thermal system can now be very easily analyzed using a SPICE
simulator with simple resistors, voltage sources, and a current source.
The results of the simulation would provide an estimate of heat flow
through the various pathways as well as internal temperature.
Thermal Resistance Top
n Further reduce input and/or output voltage ripple without
sacrificing dynamic response:
Given the wide bandwidth of the module, the source
response is generally the limiting factor in the overall
system response. Anomalies in the response of the source
will appear at the output of the module multiplied by its
K factor.
n Protect the module from overvoltage transients imposed
by the system that would exceed maximum ratings and
induce stresses:
The module input/output voltage ranges shall not be
exceeded. An internal overvoltage lockout function
prevents operation outside of the normal operating input
range. Even when disabled, the powertrain is exposed
to the applied voltage and power MOSFETs must
withstand it.
Total load capacitance at the output of the BCM module shall not
exceed the specified maximum. Owing to the wide bandwidth and low
output impedance of the module, low-frequency bypass capacitance
and significant energy storage may be more densely and efficiently
provided by adding capacitance at the input of the module. At
frequencies <500 kHz the module appears as an impedance of ROUT
between the source and load.
Within this frequency range, capacitance at the input appears as
effective capacitance on the output per the relationship
defined in Eq. (13).
COUT =
CIN
MAX INTERNAL TEMP
1.35°C / W
Thermal Resistance Bottom
Thermal Resistance Leads
1.91°C / W
TCASE_BOTTOM(°C)
Power Dissipation (W)
2°C / W
+
–
TLEADS(°C)
+
–
TCASE_TOP(°C)
Figure 19 — Double side cooling and leads thermal model
Alternatively, equations can be written around this circuit and
analyzed algebraically:
TINT – PD1 • 1.24 = TCASE_TOP
TINT – PD2 • 1.24 = TCASE_BOTTOM
TINT – PD3 • 7 = TLEADS
PDTOTAL = PD1+ PD2+ PD3
Where TINT represents the internal temperature and PD1, PD2, and PD3
represent the heat flow through the top side, bottom side, and leads
respectively.
Thermal Resistance Top
MAX INTERNAL TEMP
1.35°C / W
Thermal Resistance Bottom
1.91°C / W
Power Dissipation (W)
TCASE_BOTTOM(°C)
Thermal Resistance Leads
2°C / W
TLEADS(°C)
+
–
TCASE_TOP(°C)
(13)
K2
This enables a reduction in the size and number of capacitors used in a
typical system.
+
–
Figure 20 — One side cooling and leads thermal model
BCM® Bus Converter
Rev 1.2
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+
–
BCM384y120x800AC1
Figure 20 shows a scenario where there is no bottom side cooling. In
this case, the heat flow path to the bottom is left open and the
equations now simplify to:
ZIN_EQ1
Vin
BCM®1
TINT – PD1 • 1.24 = TCASE_TOP
ZOUT_EQ1
Vout
R0_1
TINT – PD3 • 7 = TLEADS
PDTOTAL = PD1 + PD3
ZIN_EQ2
BCM®2
ZOUT_EQ2
R0_2
+ DC
Thermal Resistance Top
Load
MAX INTERNAL TEMP
1.35°C / W
Thermal Resistance Bottom
1.91°C / W
Power Dissipation (W)
TCASE_BOTTOM(°C)
Thermal Resistance Leads
2°C / W
TLEADS(°C)
TCASE_TOP(°C)
+
–
ZIN_EQn
BCM®n
ZOUT_EQn
R0_n
Figure 21 — One side cooling thermal model
Figure 22 — BCM module array
Figure 21 shows a scenario where there is no bottom side and leads
cooling. In this case, the heat flow path to the bottom is left open and
the equations now simplify to:
TINT – PD1 • 1.24 = TCASE_TOP
PDTOTAL = PD1
Please note that Vicor has a suite of online tools, including a simulator
and thermal estimator which greatly simplify the task of determining
whether or not a BCM thermal configuration is valid for a given
condition. These tools can be found at:
http://www.vicorpower.com/powerbench.
Fuse Selection
In order to provide flexibility in configuring power systems
VI Chip® modules are not internally fused. Input line fusing
of VI Chip products is recommended at system level to provide thermal
protection in case of catastrophic failure.
The fuse shall be selected by closely matching system
requirements with the following characteristics:
n Current rating
(usually greater than maximum current of BCM module)
n Maximum voltage rating
Current Sharing
(usually greater than the maximum possible input voltage)
The performance of the SAC™ topology is based on efficient transfer of
energy through a transformer without the need of closed loop control.
For this reason, the transfer characteristic can be approximated by an
ideal transformer with a positive temperature coefficient series
resistance.
This type of characteristic is close to the impedance characteristic of a
DC power distribution system both in dynamic (AC) behavior and for
steady state (DC) operation.
When multiple BCM modules of a given part number are connected in
an array they will inherently share the load current according to the
equivalent impedance divider that the system implements from the
power source to the point of load.
Some general recommendations to achieve matched array impedances
include:
n Dedicate common copper planes within the PCB
to deliver and return the current to the modules.
n Provide as symmetric a PCB layout as possible among modules
n An input filter is required for an array of BCMs in order to
n Ambient temperature
n Nominal melting I2t
n Recommend fuse: ≤ 5 A Bussmann PC-Tron
Reverse Operation
BCM modules are capable of reverse power operation. Once the unit is
started, energy will be transferred from secondary back to the primary
whenever the secondary voltage exceeds VIN • K. The module will
continue operation in this fashion for as long as no faults occur.
The BCM384y120x800AC1 has not been qualified for continuous
operation in a reverse power condition. Furthermore fault protections
which help protect the module in forward operation will not fully
protect the module in reverse operation.
Transient operation in reverse is expected in cases where there is
significant energy storage on the output and transient voltages appear
on the input. Transient reverse power operation of less than 10 ms, 10%
duty cycle is permitted and has been qualified to cover these cases.
prevent circulating currents.
For further details see AN:016 Using BCM Bus Converters
in High Power Arrays.
BCM® Bus Converter
Rev 1.2
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BCM384y120x800AC1
BCM Module Through Hole Package Mechanical Drawing and Recommended Land Pattern
SER-OUT
EN
SER-IN
BCM® Bus Converter
Rev 1.2
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BCM384y120x800AC1
Vicor’s comprehensive line of power solutions includes high density AC-DC and DC-DC modules and
accessory components, fully configurable AC-DC and DC-DC power supplies, and complete custom
power systems.
Information furnished by Vicor is believed to be accurate and reliable. However, no responsibility is assumed by Vicor for its use. Vicor makes no
representations or warranties with respect to the accuracy or completeness of the contents of this publication. Vicor reserves the right to make
changes to any products, specifications, and product descriptions at any time without notice. Information published by Vicor has been checked and
is believed to be accurate at the time it was printed; however, Vicor assumes no responsibility for inaccuracies. Testing and other quality controls are
used to the extent Vicor deems necessary to support Vicor’s product warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
Specifications are subject to change without notice.
Vicor’s Standard Terms and Conditions
All sales are subject to Vicor’s Standard Terms and Conditions of Sale, which are available on Vicor’s webpage or upon request.
Product Warranty
In Vicor’s standard terms and conditions of sale, Vicor warrants that its products are free from non-conformity to its Standard Specifications (the
“Express Limited Warranty”). This warranty is extended only to the original Buyer for the period expiring two (2) years after the date of shipment
and is not transferable.
UNLESS OTHERWISE EXPRESSLY STATED IN A WRITTEN SALES AGREEMENT SIGNED BY A DULY AUTHORIZED VICOR SIGNATORY, VICOR DISCLAIMS
ALL REPRESENTATIONS, LIABILITIES, AND WARRANTIES OF ANY KIND (WHETHER ARISING BY IMPLICATION OR BY OPERATION OF LAW) WITH
RESPECT TO THE PRODUCTS, INCLUDING, WITHOUT LIMITATION, ANY WARRANTIES OR REPRESENTATIONS AS TO MERCHANTABILITY, FITNESS FOR
PARTICULAR PURPOSE, INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT, OR ANY OTHER MATTER.
This warranty does not extend to products subjected to misuse, accident, or improper application, maintenance, or storage. Vicor shall not be liable
for collateral or consequential damage. Vicor disclaims any and all liability arising out of the application or use of any product or circuit and assumes
no liability for applications assistance or buyer product design. Buyers are responsible for their products and applications using Vicor products and
components. Prior to using or distributing any products that include Vicor components, buyers should provide adequate design, testing and
operating safeguards.
Vicor will repair or replace defective products in accordance with its own best judgment. For service under this warranty, the buyer must contact
Vicor to obtain a Return Material Authorization (RMA) number and shipping instructions. Products returned without prior authorization will be
returned to the buyer. The buyer will pay all charges incurred in returning the product to the factory. Vicor will pay all reshipment charges if the
product was defective within the terms of this warranty.
Life Support Policy
VICOR’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS
PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL COUNSEL OF VICOR CORPORATION. As used herein, life support
devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and whose failure to perform
when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the
user. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or system or to affect its safety or effectiveness. Per Vicor Terms and Conditions of Sale, the user of Vicor products
and components in life support applications assumes all risks of such use and indemnifies Vicor against all liability and damages.
Intellectual Property Notice
Vicor and its subsidiaries own Intellectual Property (including issued U.S. and Foreign Patents and pending patent applications) relating to the
products described in this data sheet. No license, whether express, implied, or arising by estoppel or otherwise, to any intellectual property rights is
granted by this document. Interested parties should contact Vicor's Intellectual Property Department.
The products described on this data sheet are protected by the following U.S. Patents Numbers:
5,945,130; 6,403,009; 6,710,257; 6,911,848; 6,930,893; 6,934,166; 6,940,013; 6,969,909; 7,038,917; 7,145,186; 7,166,898; 7,187,263;
7,202,646; 7,361,844; D496,906; D505,114; D506,438; D509,472; and for use under 6,975,098 and 6,984,965.
Vicor Corporation
25 Frontage Road
Andover, MA, USA 01810
Tel: 800-735-6200
Fax: 978-475-6715
email
Customer Service: [email protected]
Technical Support: [email protected]
BCM® Bus Converter
Rev 1.2
vicorpower.com
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05/2015
800 927.9474