XC6126 Series ETR0214-005a Ultra Small, Highly Accurate, Single Voltage Detector ■GENERAL DESCRIPTION The XC6126 series is an ultra small, highly accurate CMOS single voltage detector with very low power consumption. The device includes a highly accurate reference voltage source and uses laser trimming technologies, it maintains high accuracy over the full operation temperature range. The device is available in both CMOS and N-channel open drain output configurations. Ultra small package USPN-4B02 is ideally suited for small design of portable devices and high densely mounting applications. The conventional package SSOT-24 is also available for upper compatible replacements. ■APPLICATIONS ■FEATURES ● Microprocessor logic reset circuitry High Accuracy Temperature Characteristics Low Power Consumption : : : ±0.8% (25℃) ±50ppm /℃ (TYP.) Operating Voltage Range Detect Voltage Range Output Configuration : : : Detect Logic Packages Environmentally Friendly : : : 0.7V~6.0V 1.5V~5.5V (0.1V increments) N-channel open drain output CMOS output Active Low Reset USPN-4B02, SSOT-24 EU RoHS Compliant, Pb Free ● Memory battery back-up circuits ● Power-on reset circuits ● Power failure detection ■TYPICAL APPLICATION CIRCUIT 0.6μA (TYP.) (Detect: VDF=1.8V, VIN=1.62V) 0.7μA (TYP.) (Release: VDF=1.8V, VIN=1.98V) ■ TYPICAL PERFORMANCE CHARACTERISTICS ●Detect Voltage vs. Ambient Temperature XC6126x27Ax 2.76 Detect Voltage: VDFL (V) ● System battery life and charge voltage monitors 2.74 2.72 2.70 2.68 2.66 2.64 -50 -25 0 25 50 75 100 Ambient Temperature: Ta (℃) 1/16 XC6126 Series ■PIN CONFIGURATION VIN VOUT 4 3 VIN VSS 4 1 NC 3 2 VOUT 2 1 NC USPN-4B02 (BOTTOM VIEW) VSS SSOT-24 (TOP VIEW) ■PIN ASSIGNMENT PIN NUMBER USPN-4B02 SSOT-24 1 2 3 4 4 3 1 2 PIN NAME FUNCTIONS VIN VOUT NC VSS Power Input Signal Output (Active Low) No connection Ground ■PRODUCT CLASSIFICATION ●Ordering Information XC6126①②③④⑤⑥-⑦(*1) DESIGNATOR ITEM ① Output Configuration ②③ ④ (*1) ⑤⑥-⑦ (*1) 2/16 SYMBOL DESCRIPTION C CMOS Output N N-ch Open Drain Output Detect Voltage 15~55 e.g. 2.7V → ②=2, ③=7 Detect Accuracy A Packages (Order Unit) ±0.8% 7R-G USPN-4B02 (5,000/Reel) NR-G SSOT-24 (3,000/Reel) The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant. XC6126 Series ■BLOCK DIAGRAMS * Diodes inside the circuits are ESD protection diodes and parasitic diodes. * Diodes inside the circuits are ESD protection diodes. ■ABSOLUTE MAXIMUM RATINGS Ta=25℃ PARAMETER SYMBOL RATING UNITS Input Voltage Output Current XC6126C (*1) Output Voltage XC6126N (*2) USPN-4B02 Power Dissipation SSOT-24 Operating Temperature Range Storage Temperature Range VIN IOUT VSS-0.3~+6.5 20 VSS-0.3~VIN+0.3≦6.5 VSS-0.3~+6.5 100 V mA VOUT Pd Topr Tstg 150 -40~+85 -55~+125 V mW o o C C Note: (*1) CMOS Output (*2) N-ch Open Drain Output 3/16 XC6126 Series ■ELECTRICAL CHARACTERISTICS Ta=25℃ XC6126 Series PARAMETER SYMBOL Operating Voltage VIN Detect Voltage VDFL CONDITIONS MIN. TYP. (*3) VDF(T)(*1)=1.5~5.5V (*2) 0.7 VDF(T)=1.5~5.5V VDF(T) ×0.992 VDF(T) MAX. UNITS CIRCUIT 6.0 V - VDF(T) ×1.008 V ① V ① μA ② μA ② mA ③ ③ (*4) Hysteresis Width VDFL ×0.02 E-1 VDFL ×0.05 VDFL ×0.08 - 0.6 0.7 0.9 1.3 1.5 1.85 - 0.7 0.8 1.0 1.55 1.75 2.25 VIN=0.7V,VOUT=0.5V(N-ch) 0.008 0.2 - VIN=1.0V, VOUT=0.5V(N-ch) 0.6 1.5 - VIN=2.0V(*6), VOUT=0.5V(N-ch) 4.5 7.0 - VIN=3.0V(*7),VOUT=0.5V(N-ch) 7.0 10.0 - VIN=4.0V(*8),VOUT=0.5V(N-ch) 8.5 11.5 - VIN=5.0V(*9),VOUT=0.5V(N-ch) 9.5 13.0 - VIN=6.0V,VOUT=5.5V(P-ch) - -4.6 -2.8 mA VIN=VDFL×0.9,VOUT=0V - -0.01 - μA VIN=6.0V,VOUT=6.0V - 0.01 0.15 μA -40℃≦Topr≦85℃ - ±50 - ppm/℃ ① VIN=VDFL×1.1(*5)→VDFL×0.9 VIN=VDFL×0.9→VDFL×1.1(*5) - 30 20 100 50 μs μs ④ ④ VHYS Supply Current 1 ISS1 Supply Current 2 ISS2 VIN=VDFL×0.9 VDF(T)=1.5~1.8V VDF(T)=1.9~3.0V VDF(T)=3.1~5.5V VIN=VDFL×1.1(*5) VDF(T)=1.5~1.8V VDF(T)=1.9~3.0V VDF(T)=3.1~5.5V IOUT1 Output Current IOUT2 (*10) Leakage Current CMOS Output N-ch Open Drain Output ILEAK Temperature Characteristics ∆VDFL/ (∆Topr・VDFL) Detect Delay Time(*11) Release Delay Time(*12) tDF tDR ③ Note: (*1) VDF(T): Nominal detect voltage (*2) For the N-ch Open Drain, Rpull=1MΩ, Vpull-Up=VIN. Rpull:An External Pull-up resistor Vpull-Up:Pull-up Voltage (*3)VIN voltage for VOUT≦0.3V is under detect state. (*4)For the detail value, please refer to “Voltage Table” in next page. (*5) VIN=6.0V where VDF(T)= 5.5V. (*6) For VDF(T)>2.0V products. (*7) For VDF(T)>3.0V products. (*8) For VDF(T)>4.0V products. (*9) For VDF(T)>5.0V products. (*10)For the XC6126C (CMOS output) (*11) A time between VIN=VDFL and VOUT=VDFL×0.45 when VIN falls. (*12) A time between VIN=VDFL+VHYS and VOUT=VDFL×0.55 when VIN rises. 4/16 XC6126 Series ■ELECTRICAL CHARACTERISTICS (Continued) Voltage Table 1 NOMINAL DETECT VOLTAGE (V) VDF(T) Voltage Table 2 DETECT VOLTAGE (V) E-1 VDFL MIN. MAX. 1.50 1.4880 1.5120 1.60 1.5872 1.70 NOMINAL DETECT VOLTAGE (V) VDF(T) DETECT VOLTAGE (V) E-1 VDFL MIN. MAX. 4.10 4.0672 4.1328 1.6128 4.20 4.1664 4.2336 1.6864 1.7136 4.30 4.2656 4.3344 1.80 1.7856 1.8144 4.40 4.3648 4.4352 1.90 1.8848 1.9152 4.50 4.4640 4.5360 2.00 1.9840 2.0160 4.60 4.5632 4.6368 2.10 2.0832 2.1168 4.70 4.6624 4.7376 2.20 2.1824 2.2176 4.80 4.7616 4.8384 2.30 2.2816 2.3184 4.90 4.8608 4.9392 2.40 2.3808 2.4192 5.00 4.9600 5.0400 2.50 2.4800 2.5200 5.10 5.0592 5.1408 2.60 2.5792 2.6208 5.20 5.1584 5.2416 2.70 2.6784 2.7216 5.30 5.2576 5.3424 2.80 2.7776 2.8224 5.40 5.3568 5.4432 2.90 2.8768 2.9232 5.50 5.4560 5.5440 3.00 2.9760 3.0240 3.10 3.0752 3.1248 3.20 3.1744 3.2256 3.30 3.2736 3.3264 3.40 3.3728 3.4272 3.50 3.4720 3.5280 3.60 3.5712 3.6288 3.70 3.6704 3.7296 3.80 3.7696 3.8304 3.90 3.8688 3.9312 4.00 3.9680 4.0320 5/16 XC6126 Series ■OPERATIONAL EXPLANATION ●Typical Application Circuit (Unused for the CMOS output products) ●Timing Chart The above uses a timing chart to explain the operation of the circuit indicated in the operation explanation circuit schematic. (1) In the initial state, an input voltage (VIN) higher than the release voltage (VDR) is applied, and VIN gradually drops. When a voltage higher than the detect voltage (VDFL) is applied to the input voltage (VIN), the output voltage (VOUT) is equal to the input voltage (VIN). *On the N-ch open drain output product, the VOUT pin is in a high impedance state, and when the output is pulled up, the output voltage (VOUT) is equal to the pull-up voltage. (2) When the input voltage (VIN) drops below the detect voltage (VDFL), the output voltage (VOUT) is equal to the ground voltage (VSS). (Detection state) *This also applies to the N-ch open drain output product. (3) If the input voltage (VIN) drops below the minimum operating voltage (0.7V), the output becomes unstable. *If the output pin on the N-ch open drain output product is pulled up, the pull-up voltage may be output as the output voltage (VOUT). (4) The output voltage (VOUT) remains at the ground voltage as the input voltage (VIN) rises past the minimum operating voltage (0.7V) and reaches the release voltage (VDR). (5) If the input voltage (VIN) rises higher than the release voltage (VDR), the output voltage (VOUT) is equal to the input voltage (VIN). *On the N-ch open drain output product, the VOUT pin is in a high impedance state, and if the output is pulled up, the pull-up voltage is output as the output voltage (VOUT) as in (1). (6) The difference between the release voltage (VDR) and the detect voltage (VDFL) is the hysteresis width (VHYS). Note: For simplicity, the above explanation omits the circuit operation time. 6/16 XC6126 Series ■NOTE ON USE 1. Please use this IC within the stated maximum ratings. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be exceeded. 2. Note that there is a possibility of malfunctioning if the input voltage changes sharply or undergoes repeated, cyclical changes. 3. If the resistance RIN is connected between the VIN pin and the power supply VDD, the voltage drop due to the flow through current in the internal circuit and RIN may cause oscillation when release takes place. When using the CMOS output product, oscillation due to RIN and the flow through current may occur without relation to release and detection, and thus RIN should not be connected. 4. Please use N-ch open drains configuration, when a resistor RIN is connected between the VIN pin and the power supply VDD. In such cases, please ensure that RIN is less than 33kΩ. Vpull-Up RIN≦33kΩ XC6126N Series VIN VDD Rpull VOUT VOUT VSS [Figure 1: Circuit connected with the input resistor fro N-ch open drain] N-chオープンドレイン品で入力抵抗を接続する場合の回路例 5. When N-ch open drain output is used, the VOUT voltage at detection is determined by the pull-up resistance connected to the output pin. Select the resistance based on the following considerations: At detection: VOUT = (Vpull-Up)/(1+Rpull/RON) Vpull-Up: Voltage after pull-up RON(*1): ON resistance of N-ch driver (calculated from VOUT/IOUT1 based on electrical characteristics) (*3) Example: When VIN = 2.0V (*2), RON = 0.5/4.5×10-3≒111Ω(MAX.). If it is desired to make the VOUT voltage at detection 0.1V or less when Vpull-Up is 3.0 V, Rpull = (Vpull-Up /VOUT-1)×RON=(3/0.1-1)×111 ≒ 3.2kΩ Therefore, to make the output voltage at detection 0.1 V or less under the above conditions, the pull-up resistance must be 3.2kΩ or higher. (*1) Note that RON becomes larger as VIN becomes smaller. (*2) For VIN in the calculation, use the lowest value of the input voltage range you will use. (*3) IOUT1 in the electrical characteristics is at Ta = 25℃. IOUT1 varies depending on the ambient temperature. To select a pull-up resistance taking ambient temperature into account, consult us. At release: VOUT = (Vpull-Up)/(1+Rpull/ROFF) Vpull-Up: Voltage after pull-up ROFF: 40MΩ (MIN.) resistance when N-ch driver is OFF (calculated from VOUT/ILEAK based on electrical characteristics) Example: Making VOUT 5.99 V or higher when Vpull-Up is 6.0 V: Rpull = (Vpull-Up/VOUT-1)×ROFF = (6/5.99-1)×40×106 ≒ 66 kΩ Therefore, to make the output voltage at release 5.99 V or higher under the above conditions, the pull-up resistance must be 66kΩ or less. 6. Torex places an importance on improving our products and its reliability. However, by any possibility, we would request user fail-safe design and post-aging treatment on system or equipment. 7/16 XC6126 Series ■TEST CIRCUITS Circuit 1 (Unused for the CMOS output products) Circuit 2 Circuit 3 Circuit 4 (Unused for the CMOS output products) Measurement of waveform 8/16 XC6126 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (1) Supply Current vs. Input Voltage (2) Supply Current vs. Ambient Temperature VDF(T)=1.5V VDF(T)=1.5V 1.4 VIN=0V→6.0V→0V 1.2 Supply Current : ISS (μA) Supply Current : ISS (μA) 1.4 1.0 0.8 0.6 -40℃ 0.4 25℃ 0.2 85℃ 0.0 0 1 2 3 4 Input Voltage : VIN (V) 5 1.2 1.0 VIN=VDFL*1.1V 0.8 0.6 0.4 0.2 0.0 -50 6 VIN=VDFL*0.9V -25 1.4 1.4 1.2 VIN=0V→6.0V→0V Supply Current : ISS (μA) Supply Current : ISS (μA) 100 VDF(T)=2.7V VDF(T)=2.7V 1.0 0.8 0.6 -40℃ 0.4 25℃ 0.2 85℃ 0 1 2 3 4 Input Voltage : VIN (V) 5 1.2 6 VIN=VDFL*0.9V 1.0 VIN=VDFL*1.1V 0.8 0.6 0.4 0.2 0.0 -50 0.0 -25 VDF(T)=5.5V 0 25 50 75 Ambient Temperature : (℃) 100 VDF(T)=5.5V 1.4 1.4 1.2 VIN=0V→6.0V→0V Supply Current : ISS (μA) Supply Current : ISS (μA) 0 25 50 75 Ambient Temperature : (℃) 1.0 0.8 0.6 0.4 -40℃ 25℃ 0.2 1.2 1.0 0.8 0.6 VIN=VDFL*0.9V 0.4 VIN=6.0V 0.2 85℃ 0.0 0 1 2 3 4 Input Voltage : VIN (V) 5 6 0.0 -50 -25 0 25 50 75 Ambient Temperature : (℃) 100 9/16 XC6126 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (3) Output Voltage vs. Input Voltage1 (4) Detect Voltage, Release Voltage vs. Ambient Temperature VDF(T)=1.5V VDF(T)=1.5V VIN=1.4V~1.8V 1.8 Detect Voltage, Release Voltage : VDFL, VDR (V) 1.8 Output Voltage : VOUT(V) 1.6 1.4 1.2 1.0 0.8 -40℃ 0.6 25℃ 0.4 85℃ 0.2 0.0 1.4 1.5 1.6 1.7 Input Voltage : VIN (V) VDFL 1.7 VDR 1.6 1.5 1.4 1.3 -50 1.8 -25 0 25 50 75 Ambient Temperature : (℃) VDF(T)=2.7V 100 VDF(T)=2.7V VIN=2.4V~ 3.0 Detect Voltage, Release Voltage : VDFL, VDR (V) Output Voltage : VOUT(V) 3.2 2.8 2.4 2.0 1.6 1.2 -40℃ 0.8 25℃ 0.4 85℃ 0.0 2.4 2.6 2.8 3 Input Voltage : VIN (V) VDFL 2.9 VDR 2.8 2.7 2.6 2.5 -50 3.2 -25 0 25 50 75 Ambient Temperature : (℃) VDF(T)=5.5V 100 VDF(T)=5.5V VIN=4.8V~ 6.0 Detect Voltage, Release Voltage : VDFL, VDR (V) Output Voltage : VOUT(V) 6.0 5.0 4.0 3.0 -40℃ 2.0 25℃ 1.0 85℃ 0.0 4.8 10/16 5 5.2 5.4 5.6 Input Voltage : VIN (V) 5.8 6 5.9 VDFL 5.8 VDR 5.7 5.6 5.5 5.4 -50 -25 0 25 50 75 Ambient Temperature : (℃) 100 XC6126 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (5) Output Voltage vs. Input Voltage2(VIN≦1.4V) CMOS Output N-ch Open Drain Output 7 1.6 6 Output Voltage : VOUT(V) Output Voltage : VOUT(V) Vpull-Up=6.5V, Rpull=100kΩ 1.8 1.4 1.2 1 0.8 -40℃ 0.6 25℃ 0.4 85℃ 0.2 0 5 4 3 -40℃ 2 25℃ 85℃ 1 0 0 0.2 0.4 0.6 0.8 1 Input Voltage : VIN (V) 1.2 1.4 (6) Output Current (Nch Driver) vs. Input Voltage 0 0.2 0.4 0.6 0.8 1 Input Voltage : VIN (V) VDF(T)=1.5V 7 20 16 VOUT=0.5V Output Current : IOUT(mA) -40℃ Output Current : IOUT(mA) 1.4 (7) Output Current (Pch Driver) vs. Input Voltage VDF(T)=5.5V 25℃ 85℃ 12 8 4 0 0 1 2 3 4 Input Voltage : VIN (V) 5 VOUT=VIN-0.5V 25℃ 5 85℃ 4 3 2 1 0 1 2 3 4 Input Voltage : VIN (V) 5 6 (9) Release Delay Time vs. Ambient Temperature 50 Release Delay Time : tDR (μs) 100 VDF(T)=1.5V 80 VDF(T)=5.5V 60 40 20 0 -50 -40℃ 6 0 6 (8) Detect Delay Time vs. Ambient Temperature Detect Delay Time : tDF (μs) 1.2 -25 0 25 50 75 Ambient Temperature : (℃) 100 VDF(T)=1.5V 40 VDF(T)=5.5V 30 20 10 0 -50 -25 0 25 50 75 Ambient Temperature : (℃) 100 11/16 XC6126 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (10) Leakage Current vs. Ambient temperature N-ch Open Drain Output Leakage Current : ILeak (μA) 0.05 VIN=VOUT=6.0V 0.04 0.03 0.02 0.01 0 25 12/16 35 45 55 65 75 Ambient Temperature : (℃) 85 XC6126 Series ■PACKAGING INFORMATION ●USPN-4B02 (unit:mm) 0.75±0.05 1pin INDENT 0.18±0.05 1 2 4 3 (0.4) ●USPN-4B02 Pattern Layout (unit : mm) ●USPN-4B02Reference 参考パターンレイアウト (unit:mm) 0.23 0.14 ●USPN-4B02 Metal Mask Design (unit : mm) ●USPN-4B02 Reference 参考メタルマスクデザイン (unit:mm) 0.23 0.4 0.18 0.14 0.115 0.18 0.4 0.115 13/16 XC6126 Series ■MARKING RULE SSOT-24 (With the orientation bar at the top) 3 ② ④ ① ③ 4 1 2 ① represents product series, detect voltage range and output configuration. OUTPUT DETECT VOLTAGE MARK PRODUCT SERIES CONFIGURATION RANGE[V] 1 CMOS 1.5~2.5 XC6126C15A**-G ~ XC6126C25A**-G 2 CMOS 2.6~5.5 XC6126C26A**-G ~ XC6126C55A**-G 3 Nch 1.5~2.5 XC6126N15A**-G ~ XC6126N25A**-G 4 Nch 2.6~5.5 XC6126N26A**-G ~ XC6126N55A**-G ② represents detect voltage. MARK DETECT VOLTAGE (V) 0 1 2 3 4 5 6 7 8 9 - 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 MARK A B C D E F H K L M DETECT VOLTAGE (V) 1.5 ③④ represents production lot number 01 to 09, 0A to 0Z, 11 to 9Z, A1 to A9, AA to AZ, B1 to ZZ repeated (G, I, J, O, Q, W excluded) *No character inversion used. 14/16 3.6 3.7 3.8 3.9 4.0 4.1 4.2 4.3 4.4 4.5 MARK N P R S T U V X Y Z DETECT VOLTAGE (V) 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 4.6 4.7 4.8 4.9 5.0 5.1 5.2 5.3 5.4 5.5 XC6126 Series ■MARKING RULE (Continued) USPN-4B02 4 ① 3 ② ③ 1 2 ① represents product series, detect voltage range and output configuration. OUTPUT DETECT VOLTAGE MARK PRODUCT SERIES CONFIGURATION RANGE[V] 4 CMOS 1.5~2.5 XC6126C15A**-G ~ XC6126C25A**-G 5 CMOS 2.6~5.5 XC6126C26A**-G ~ XC6126C55A**-G 6 Nch 1.5~2.5 XC6126N15A**-G ~ XC6126N25A**-G 7 Nch 2.6~5.5 XC6126N26A**-G ~ XC6126N55A**-G ② represents detect voltage. MARK DETECT VOLTAGE (V) 0 1 2 3 4 5 6 7 8 9 - 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 MARK A B C D E F H K L M DETECT VOLTAGE (V) 1.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2 4.3 4.4 4.5 MARK N P R S T U V X Y Z DETECT VOLTAGE (V) 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 4.6 4.7 4.8 4.9 5.0 5.1 5.2 5.3 5.4 5.5 ③ represents production lot number 0 to 9, A to Z repeated. (G, I, J, O, Q, W excluded) *No character inversion used. 15/16 XC6126 Series 1. The products and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infringement of patents, patent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not developed, designed, or approved for use with such equipment whose failure of malfunction can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transport; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this datasheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD. 16/16